JP2001068179A - Anisotropic conductive connection member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely position an electrode part of a semiconductor device and a conductive part of an anisotropic conductive connection member by installing an opening having a diameter larger than that of an electrode, integratedly installing a conductor having elasticity in the opening, and making the depth from the surface of an insulating sheet to the conductor shallower than the height of the electrode projected from the plane of the semiconductor device in the opening. SOLUTION: When the electrode is a semiconductor device to be inspected and projected from the plane of the semiconductor device, the projected electrode is inserted into each opening corresponding to the anisotropic conductive connection member, the electrode part of the semiconductor device and the conductive part of the anisotropic conductive connection member can correctly be positioned. In this state, when a normal pressure is applied, the electrode of the semiconductor device and the conductive part of the anisotropic conductive connection member can surely be electrically connected. Since the diameter of the bump-shaped electrode of the semiconductor device is smaller than that of the opening of the anisotropic conductive connection member, the inserted electrode comes in contact with the conductor whose tip has elasticity to be electrically connected, and deformation of the device can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical connection member of a semiconductor device having an electrode such as a BGA having a bump shape, a method for performing an electrical inspection of a semiconductor device using the same, and an inspection of the semiconductor device. It concerns the device. More specifically, an anisotropic conductive connection member made of the above-mentioned semiconductor element electrical connection member, and an anisotropic conductive connection member for inspecting the electrical performance of the semiconductor element with the anisotropic conductive connection member interposed therebetween. The present invention relates to a semiconductor device inspection apparatus capable of accurately aligning a conductive portion of a member with an electrode of a semiconductor element to be inspected and reducing deformation of an electrode of the semiconductor element to be inspected.

[0002]

2. Description of the Related Art Generally, the number of electrodes of a semiconductor device is increasing and the pitch between the electrodes is also becoming finer with the miniaturization and higher performance of equipment. In addition, a semiconductor element having a bump-shaped electrode formed on the back surface of the semiconductor element, such as a BGA, has become increasingly important in mounting on a device because its occupied area can be reduced. When conducting an electrical inspection or the like of such a semiconductor element, a member for connecting an electrode of the semiconductor element to a circuit device or an inspection device is used. As such a member, there is an anisotropic conductive connecting member. The anisotropic conductive connection member, for example, as shown in FIG.
A through hole is provided in the insulating sheet 20 in the thickness direction, and a metal bump 21 is formed in the through hole, as shown in FIG.
Rubber or the like may be used as the base material 22 of the insulating portion and may have an anisotropic conductive portion 23 formed using a spherical or rod-shaped conductive material, and both are effective in that an electrical connection can be obtained. Is the way.

[0003]

However, a BGA having a fine electrode pitch by using such an anisotropic conductive connecting member.
When conducting an electrical inspection of a semiconductor device such as a semiconductor device, it is important to align the fine and high-density electrodes of the semiconductor device with the conductive portions of the anisotropic conductive connection member sheet, and the pitch between the electrodes is fine and high-density. The more important it becomes. Also, as the pitch between the electrodes of the semiconductor element becomes finer,
Electrode diameters have been reduced and solder balls are becoming smaller. In order to reduce the diameter of the electrode of the semiconductor element, when the semiconductor element is held under a high pressure such as in a burn-in test and the inspection is performed while the semiconductor element is pressed from the upper surface, the deformation of the electrode due to the pressing in the inspection process becomes remarkable. Such deformation of the electrode section during the test may affect the mounting process after the test. Under such circumstances, in the conductive sheet using the metal bumps, the contact between the bumps and the electrodes of the semiconductor element becomes metal, and the electrodes of the element are easily deformed during the inspection of the electrical performance. It is in. Further, in the case of the anisotropic conductive connection member using the rubber as a base material of the insulating portion, a situation is likely to occur in which positional accuracy is affected by expansion of the rubber base material in a high temperature environment,
In these respects, technical measures have been required.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has an object to solve the problem that even if the pitch between the electrodes of a semiconductor device such as a BGA to be inspected is fine, the outer shape of the semiconductor device can be reduced. Even if there is some dimensional variation, warpage, electrode position deviation, etc., the alignment between the electrode part of the semiconductor element and the conductive part of the anisotropic conductive connection member can be performed reliably, and electrical connection is ensured. In addition, an object of the present invention is to provide an anisotropic conductive connecting member capable of sufficiently reducing the deformation even when the semiconductor electrode is minute and easily deformed by pressurization during inspection.

[0005]

That is, the present invention relates to a connecting member for a semiconductor element having electrodes protruding from the plane of the semiconductor element, wherein the insulating sheet has a position corresponding to each electrode of the semiconductor element to be connected. An opening having a diameter larger than the diameter of the electrode, an elastic conductor is integrally provided in the opening, and the depth from the surface of the insulating sheet to the conductor in the opening is smaller than that of the semiconductor element. The present invention provides an anisotropic conductive connecting member characterized by being shallower than the height of the electrode protruding from the plane. The present invention also provides an inspection device for a semiconductor device, wherein the above-described anisotropic conductive connection member is provided between a semiconductor device to be inspected and an electrical inspection device. According to the present invention, there is provided an inspection method of a semiconductor device, comprising providing the above-described anisotropic conductive connecting member between a semiconductor device to be inspected and an electrical inspection device, and electrically inspecting the semiconductor device to be inspected. Is provided.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, an anisotropic conductive connecting member is provided with an opening having a diameter larger than the diameter of an electrode at a position corresponding to each electrode of a semiconductor element to be connected on an insulating sheet. A conductor is integrally provided inside and at the bottom of the opening. In the opening of the sheet of the connection member, for example, when performing an electrical inspection of the semiconductor element with an anisotropic conductive connection member interposed therebetween, a part of the electrode of the semiconductor element to be inspected is inserted into the opening. Is joined or pressed to the elastic conductor of the anisotropic conductive connection member. As the anisotropic conductive connecting member, the whole surface may be electrically conductive in the thickness direction, or may be partially electrically conductive in the thickness direction. Preferred is an anisotropic conductive connection member having a conductor electrically conductive in the thickness direction at a position corresponding to each opening of the substrate.

The semiconductor element to which the present invention is applied is a bare chip LSI such as a flip chip, a package LSI such as a BGA, a module substrate or a circuit board on which a plurality of semiconductor elements such as an MCM are mounted. Is effective for bump-shaped ones protruding from the element plane. Further, it is particularly preferable that the bump has a ball shape, a column shape, and a prism shape. When such an electrode is a semiconductor device to be inspected projecting from the plane of the semiconductor element, each of the projecting electrodes is inserted into the corresponding opening of the anisotropic conductive connection member, thereby allowing the electrode section of the semiconductor element to be connected to the electrode. The conductive portion of the anisotropic conductive connection member can be accurately positioned. In this state, if pressure is applied to the extent normally performed in the electrical inspection of the semiconductor element, electrical connection between the electrode of the semiconductor element and the conductive portion of the anisotropic conductive connection member can be secured. Also, since the diameter of the bump-shaped electrode of the semiconductor element is smaller than the diameter of the opening of the anisotropic conductive connection member, the inserted electrode comes into contact with the one having the elasticity at the tip to obtain conduction, The deformation of the electrodes of the element can be sufficiently reduced.

The anisotropic conductive connection member of the present invention may be transparent or opaque, but is transparent in that the electrode portion of the semiconductor element can be visually confirmed when inserted into the opening. Something is preferred. Further, the anisotropic conductive connection member of the present invention has a structure in which a base material serving as an insulating portion and a conductive portion are integrated, and is preferably in a sheet shape.

In the anisotropic conductive connecting member of the present invention, the presence or absence of elasticity, heat resistance and flexibility can be appropriately selected as the performance of the material of the base material to be the insulating portion. The opening of the anisotropic conductive connection member of the present invention may have any diameter as long as the electrode of the semiconductor element can be inserted, and various shapes are possible. Further, the anisotropic conductive connecting member of the present invention,
As shown in FIG. 4, the surface of the conductive portion 2b corresponding to the side in contact with the semiconductor element electrode may be flat, have irregularities, or have a concave concave portion 14.
In the opening of the anisotropic conductive connection member, the depth from the member plane to the conductor may be smaller than the height of the electrode of the semiconductor element in the thickness direction of the connection member. There is no particular limitation. In addition, as shown in FIG. 5, the anisotropic conductive connecting member of the present invention takes into account the state, shape, and contactability of the electrodes to be connected, and, in addition to unevenness, smoothing and Surface treatment 15 such as surface treatment may be performed. Further, as shown in FIG. 6, rubbers 17 and 18 having different hardnesses can be combined to obtain characteristic characteristics such as elasticity and durability. In that case, either of the hardness of 17 and 18 may be high. Further, as shown in FIG. 7, processing such as metal thin film treatment 19 may be applied to the 18-part surface instead of rubber on the surface. Further, as shown in FIG. 8, conductive plating 16 may be applied to the opening of the insulating portion. In the connection member of the present invention, the conductor portion on the side opposite to the surface with respect to the semiconductor can take various forms as shown in FIG.

The conductor of the anisotropic conductive connection member is preferably a conductive rubber or elastomer. Particularly, a curable rubber is preferable, and a silicone rubber is particularly preferable. These are preferably those in which a conductive substance is blended in rubber or an elastomer. As such a conductive substance, carbon black, metal particles, metal fibers, and the like are preferable, and metal particles are particularly preferable. Among them, particles showing magnetism are preferred because they can be oriented by a magnetic field to improve conductivity.
Examples of the metal particles include nickel, iron, and particles of magnetism such as cobalt or particles of alloys thereof, or particles obtained by plating these particles with a highly conductive metal such as gold, silver, palladium, or rhodium. And inorganic particles such as non-magnetic metal particles or glass beads or polymer particles plated with a conductive magnetic material such as nickel or cobalt. Among these, particles obtained by plating gold or silver on the surface of nickel particles are preferable.

As a material for forming the insulating portion, rubber, elastomer, or resin is used. Of these, resins are preferred. Specific examples of these materials include, for example, a thermosetting resin such as a polyimide resin and an epoxy resin, and a polyester resin such as a polyethylene terephthalate resin and a polybutylene terephthalate resin, a vinyl chloride resin, a polystyrene resin, a polyacrylonitrile resin,
Thermoplastic resins such as polyethylene resin, polypropylene resin, acrylic resin, polybutadiene resin, polyphenylene ether, polyphenylene sulfide, polyamide, and polyoxymethylene are used. Among these, a thermosetting resin is preferred in terms of heat resistance and dimensional stability, and a polyimide resin is particularly preferred in terms of electrical characteristics.

The anisotropic conductive connecting member can be manufactured by forming a hole in the insulating material, filling the hole with the conductor, and molding. When a molding material containing the magnetic material is used as such a conductor, a parallel magnetic field is applied in a thickness direction of a layer formed using the molding material, and the magnetic particles move the conductive particles to cure the conductor. By doing so, a conductive portion can be formed in the opening of the material. In such a molding method, it is preferable to use liquid silicone rubber as the rubber.

Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 3 shows a specific example of a semiconductor device inspection apparatus using the anisotropic conductive connection member of the present invention and a semiconductor element to be inspected mounted thereon. The electrode 1 a of the semiconductor element 1 to be inspected protrudes from the surface of the element 1 and is inserted into the opening 2 a of the anisotropic conductive connection member 2. The depth d between the conductive portion surface 13c and the connection member surface 13b is lower than the height of the semiconductor element electrode 1a, and the anisotropic conductive sheet 2 has a plurality of electrically conductive portions in the thickness direction. , The conductive portion 2b is the electrode portion 3a of the inspection device substrate 3.
The position is regulated by the positioning pin 4 so as to be a position corresponding to. The electrode 1a of the semiconductor element 1 to be inspected, the electrode portion 3a of the inspection device substrate 3, and the conductive portion 2b of the anisotropic conductive connection member 2 are pressurized to a sufficient degree to obtain sufficient electrical connection via the pressing force 5. The electrodes 8 of the semiconductor element 1 are connected to the external electrical inspection and measurement device via the inspection device substrate 3 from the position corresponding to the conductive portion of the anisotropic conductive connection member. .

The thickness of the anisotropic conductive connecting member 2 is practically preferably 0.01 to 3 mm, more preferably 0.05 to 3 mm.
To 1 mm, more preferably about 0.1 to 0.8 mm. This thickness can be set in consideration of the protruding height of the electrode of the semiconductor element to be inspected. The thickness of the conductor (conductive portion) 2b is practically preferably 0.05 to 3 mm, more preferably 0.1 to 1 mm.
mm, more preferably 0.2 to 0.8 mm. Also, as shown in FIG. 10, when the height of the electrode protruding from the plane of the semiconductor element from the plane is t, and the depth from the surface of the anisotropic conductive connection member to the conductor is d. , D
The ratio of / t is preferably 0.5 to 0.99, more preferably 0.6 to 0.95, and particularly preferably 0.7 to 0.99.
0.9. The difference (t−d) between t and d is 0.1.
It is preferably from 01 to 1 mm, more preferably from 0.02 to 1 mm.
0.5, particularly preferably 0.05 to 0.4.

The opening 2a of the anisotropic conductive connecting member 2 is formed, for example, by making a hole at a predetermined position of a connecting member sheet made of the above-mentioned insulating portion forming material, and manufacturing the inside and the bottom integrally with the conductive material. it can.

Drilling of the opening is performed by NC (Numerical Cont.).
(rol) control using a drilling device or a laser processing device. It can also be manufactured by molding using a mold having a large number of pins. The opening shape of the insulating portion may be circular or square or irregular in shape according to the shape of the electrode portion.
Preferably, it is circular. Further, it is necessary to open the opening at a position corresponding to each electrode of the circuit board. For example, B
In the case of a GA, it is preferable to open it by arranging it in a grid shape (grid) corresponding to the electrode position.

[0017]

EXAMPLES Examples of the present invention will be described below, but the present invention is not limited to these examples. (Example 1) A method for forming an anisotropic conductive connection member will be described with reference to FIG. Glass epoxy plate 6 with a thickness of 0.2 mm
Then, an NC-controlled drilling device is used to measure 0.4 m at a position corresponding to a spherical (diameter 0.3 mm, thickness 0.25 mm) bump (0.5 mm pitch) of the package LSI to be inspected.
A large number of holes 7 having a diameter of m are formed, and as shown in FIG.
Set between two.

Next, conductive magnetic particles of gold-plated nickel having an average particle size of 40 μm were mixed with the thermosetting silicone rubber at a ratio of 12% by volume to prepare a conductive molding material. This molding material was filled into the opening 7 of the glass epoxy plate set in the mold.

This mold comprises an upper mold 31 and a lower mold 32 each composed of an electromagnet. The upper mold and the lower mold have a ferromagnetic portion 33 having a pattern corresponding to the electrode position of the semiconductor element to be inspected. And a magnetic pole plate having a non-magnetic portion 35 in contact with the molding material. Further, the upper mold is provided with a convex portion 34 for the purpose of adjusting the depth of the concave portion in the opening, and the distance from the surface of the anisotropic conductive connecting member to the upper surface position of the conductor is determined by the length of the convex portion. That is, the depth d of the opening to the conductor can be set. Also,
The upper and lower magnetic pole plates were aligned by setting guide pins at positions corresponding to the guide holes at the four corners of the imide film. In this state, the upper mold and the lower mold are sandwiched between the electromagnets, and a parallel magnetic field is applied in the thickness direction of the anisotropic conductive connection member to collect the conductive particles in the ferromagnetic portion in the mold, and They were arranged in the direction of the magnetic field. In this state, while applying pressure, the anisotropic conductive sheet material was cured at 100 ° C. for 1 hour to produce an anisotropic conductive connection member. By setting the guide pins at the four corners of the molding die as described above,
An anisotropic conductive connection member having guide holes for alignment at four corners was obtained.

Next, using the anisotropic conductive connection member obtained as described above, the configuration shown in FIG. 3 was used, and electrical inspection was performed on 100 randomly extracted semiconductor elements. The pitch between the electrodes of the semiconductor element is 0.5 mm
And the element was slightly warped, etc.,
The alignment was easy and accurate, and the electrical inspection of all the target elements could be performed with high accuracy.

Example 2 A BGA having a 0.3 mm-diameter solder ball as an electrode and a matrix-shaped electrode with an electrode pitch of 0.5 mm was used as an object to be inspected.
The inspection apparatus having the above-mentioned configuration was put in at a high temperature, and an electrical inspection was performed at a high temperature. As a result, an electrical test could be accurately performed on all of the ten randomly selected devices. In addition, although slight indentations were observed on the side surfaces of the electrodes of the test object after the test, the outer diameter and height of the solder balls did not change by 6% or more.

[0022]

According to the anisotropic conductive connecting member of the present invention,
By inserting each electrode portion of the semiconductor element into the opening of the connection member, accurate positioning can be performed. In this state, if pressure is applied to the semiconductor element, the electrode of the semiconductor element and the conductor of the anisotropic conductive connection member Electrical connection with the vehicle. Further, by forming the conductor from conductive rubber having elasticity, the deformation of the electrode of the semiconductor element can be minimized. For this reason, even a fine and high-density semiconductor element electrode can accurately conduct with an electrical inspection device (jig),
Inspection of semiconductor elements can be performed efficiently.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an example of a configuration of a conventional anisotropic conductive sheet.

FIG. 2 is an explanatory diagram illustrating an example of a configuration of a conventional anisotropic conductive sheet.

FIG. 3 is an explanatory diagram showing an example of a configuration of a semiconductor device inspection device of the present invention.

FIG. 4 is an example of the present invention.

FIG. 5 is an example of the present invention.

FIG. 6 is an example of the present invention.

FIG. 7 is an example of the present invention.

FIG. 8 is an example of the present invention.

FIG. 9 is an example showing the manufacturing method of the present invention.

FIG. 10 is an example of the present invention.

FIG. 11 is an example of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 1a Semiconductor element ball-shaped electrode 2 Conductive sheet base material 2a Opening 2b Conductive part 3 Electrical inspection device substrate 3a Electrode portion of electrical inspection device substrate 4 Positioning pin 5 Pressure force 6 Glass epoxy plate 7 Opening 8 Lead wire 13b Surface of opening 13c Surface of conductor 14 Concave 15 Surface treatment 16 Conductive plating 17 Rubber 18 Rubber 19 Metal thin film treatment 20 Through hole 21 Metal bump 22 Insulating part 23 Anisotropic conductive part 31 Upper mold 32 Lower mold 33 Ferromagnetic part 34 Convex part 35 Non-ferromagnetic part

Claims (7)

[Claims] 1. A connecting member for a semiconductor element having an electrode protruding from a plane of the semiconductor element, wherein a diameter of the insulating sheet is larger than the diameter of the electrode at a position corresponding to each electrode of the semiconductor element to be connected. An opening is provided, an elastic conductor is integrally provided in the opening, and the depth from the surface of the insulating sheet to the conductor in the opening is higher than the height of the electrode protruding from the plane of the semiconductor element. An anisotropic conductive connecting member characterized by being shallow. 2. The anisotropic conductive connecting member according to claim 1, which is an anisotropic conductive sheet. 3. An apparatus according to claim 1, wherein an electrode to be inspected having a protruding shape of the semiconductor element to be inspected is inserted into an opening of the anisotropic conductive connection member to have a mechanism for aligning the element electrode and the sheet connection member. The anisotropic conductive connection member according to claim 1, wherein 4. An electrode protruding from a plane of a semiconductor element.
When the height from the plane is t and the depth from the surface of the anisotropic conductive connection member to the conductor is d, the difference (t−d) between t and d is 0.01 to 1 mm. The anisotropic conductive connection member according to claim 1. 5. The anisotropic conductive connecting member according to claim 1, wherein the conductor has a thickness of 0.05 to 3 mm. 6. An inspection device for a semiconductor device, comprising the anisotropic conductive connection member according to claim 1 provided between a semiconductor device to be inspected and an electrical inspection device. 7. A semiconductor device, wherein the anisotropically conductive connecting member according to claim 1 is provided between a semiconductor device to be inspected and an electrical inspection device, and an electrical inspection of the semiconductor device to be inspected is performed. Inspection method.