JP2001067998A - 保護素子およびその製造方法 - Google Patents
保護素子およびその製造方法Info
- Publication number
- JP2001067998A JP2001067998A JP23707099A JP23707099A JP2001067998A JP 2001067998 A JP2001067998 A JP 2001067998A JP 23707099 A JP23707099 A JP 23707099A JP 23707099 A JP23707099 A JP 23707099A JP 2001067998 A JP2001067998 A JP 2001067998A
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- resistor
- insulating substrate
- electrode
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 230000004907 flux Effects 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 17
- 230000008569 process Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 2
- 229910000743 fusible alloy Inorganic materials 0.000 abstract description 47
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 229920005989 resin Polymers 0.000 abstract description 9
- 239000011347 resin Substances 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 abstract description 9
- 238000002844 melting Methods 0.000 description 28
- 230000008018 melting Effects 0.000 description 27
- 229910045601 alloy Inorganic materials 0.000 description 22
- 239000000956 alloy Substances 0.000 description 22
- 239000000463 material Substances 0.000 description 21
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 12
- 229910052744 lithium Inorganic materials 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 239000000155 melt Substances 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000001788 irregular Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23707099A JP2001067998A (ja) | 1999-08-24 | 1999-08-24 | 保護素子およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23707099A JP2001067998A (ja) | 1999-08-24 | 1999-08-24 | 保護素子およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001067998A true JP2001067998A (ja) | 2001-03-16 |
| JP2001067998A5 JP2001067998A5 (enExample) | 2006-09-28 |
Family
ID=17009981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23707099A Withdrawn JP2001067998A (ja) | 1999-08-24 | 1999-08-24 | 保護素子およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001067998A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104508783A (zh) * | 2012-08-01 | 2015-04-08 | 迪睿合电子材料有限公司 | 保护元件及电池组 |
-
1999
- 1999-08-24 JP JP23707099A patent/JP2001067998A/ja not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104508783A (zh) * | 2012-08-01 | 2015-04-08 | 迪睿合电子材料有限公司 | 保护元件及电池组 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060811 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060811 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20080514 |