JP2001053287A5 - - Google Patents

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Publication number
JP2001053287A5
JP2001053287A5 JP2000165617A JP2000165617A JP2001053287A5 JP 2001053287 A5 JP2001053287 A5 JP 2001053287A5 JP 2000165617 A JP2000165617 A JP 2000165617A JP 2000165617 A JP2000165617 A JP 2000165617A JP 2001053287 A5 JP2001053287 A5 JP 2001053287A5
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JP
Japan
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Application number
JP2000165617A
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Japanese (ja)
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JP4651777B2 (ja
JP2001053287A (ja
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Priority to JP2000165617A priority Critical patent/JP4651777B2/ja
Priority claimed from JP2000165617A external-priority patent/JP4651777B2/ja
Publication of JP2001053287A publication Critical patent/JP2001053287A/ja
Publication of JP2001053287A5 publication Critical patent/JP2001053287A5/ja
Application granted granted Critical
Publication of JP4651777B2 publication Critical patent/JP4651777B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2000165617A 1999-06-02 2000-06-02 半導体装置の作製方法 Expired - Fee Related JP4651777B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000165617A JP4651777B2 (ja) 1999-06-02 2000-06-02 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP15443299 1999-06-02
JP11-154432 1999-06-02
JP2000165617A JP4651777B2 (ja) 1999-06-02 2000-06-02 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010241878A Division JP5025781B2 (ja) 1999-06-02 2010-10-28 半導体装置

Publications (3)

Publication Number Publication Date
JP2001053287A JP2001053287A (ja) 2001-02-23
JP2001053287A5 true JP2001053287A5 (enrdf_load_stackoverflow) 2007-08-23
JP4651777B2 JP4651777B2 (ja) 2011-03-16

Family

ID=26482711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000165617A Expired - Fee Related JP4651777B2 (ja) 1999-06-02 2000-06-02 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP4651777B2 (enrdf_load_stackoverflow)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3608613B2 (ja) 2001-03-28 2005-01-12 株式会社日立製作所 表示装置
JP4926346B2 (ja) * 2001-08-10 2012-05-09 株式会社半導体エネルギー研究所 発光装置
JP3810725B2 (ja) 2001-09-21 2006-08-16 株式会社半導体エネルギー研究所 発光装置及び電子機器
JP3965323B2 (ja) * 2002-05-14 2007-08-29 旺宏電子股▲ふん▼有限公司 メモリ装置及びその製造方法
JP4095518B2 (ja) 2002-10-31 2008-06-04 セイコーエプソン株式会社 電気光学装置及び電子機器
JP4862936B2 (ja) * 2002-10-31 2012-01-25 セイコーエプソン株式会社 電気光学装置及び電子機器
JP4506133B2 (ja) * 2002-10-31 2010-07-21 セイコーエプソン株式会社 電気光学装置及び電子機器
KR100752950B1 (ko) 2004-04-30 2007-08-30 엘지.필립스 엘시디 주식회사 씨오티구조 액정표시장치 및 그 제조방법
CN102496346B (zh) * 2004-12-06 2015-05-13 株式会社半导体能源研究所 显示装置
JP5046529B2 (ja) * 2005-02-25 2012-10-10 株式会社半導体エネルギー研究所 半導体装置
JP5182600B2 (ja) * 2005-09-30 2013-04-17 セイコーエプソン株式会社 アレイ基板の製造方法
JP5090856B2 (ja) 2007-10-30 2012-12-05 株式会社ジャパンディスプレイイースト 有機ｅｌ表示装置
US20200185527A1 (en) * 2016-04-27 2020-06-11 Sharp Kabushiki Kaisha Thin-film transistor and method of producing thin-film transistor
US11508760B2 (en) * 2018-03-15 2022-11-22 Sharp Kabushiki Kaisha Active-matrix substrate and display device
CN112802943B (zh) * 2021-01-15 2023-03-14 东莞市中麒光电技术有限公司 一种led cob模块的修复方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2924506B2 (ja) * 1992-10-27 1999-07-26 日本電気株式会社 アクティブマトリックス型液晶表示装置の画素構造
JP3212060B2 (ja) * 1993-09-20 2001-09-25 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
JPH0945774A (ja) * 1995-07-28 1997-02-14 Sony Corp 薄膜半導体装置
JP3602279B2 (ja) * 1996-11-04 2004-12-15 株式会社半導体エネルギー研究所 アクティブマトリクス型表示回路およびその作製方法
JPH10223530A (ja) * 1997-02-07 1998-08-21 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法

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