JP2001044145A - Dicing blade and blade-holding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance efficiency of cooling at cut part and surely perform sealing for etching. SOLUTION: A dicing blade 10 is constituted by attaching a thin-bladed grinding wheel 3 on a pressing surface 11a of an aluminum hub 11. A surface roughness R4 of an opposite contacting surface 11b is smaller than the surface roughness R2 of the pressing surface 11a. On a side surface 11c, which continues to the contacting surface 11b, a tilting surface 14 is formed to press an O-ring 8 for sealing against etching, wherein its surface roughness R5 is set to 5 μm or larger, which is larger than R4. The dicing blade 10 is press-fit and fastened with a pressing nut 12 to a reference surface 4b of a mount 4. The mount 4 has a screw axis 4a, that penetrates the hub 11 and screw-fits with the pressing nut 12 and has the reference surface 4b on a periphery surrounding the axis.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing blade used for pelletizing a semiconductor silicon wafer and a holding device for the dicing blade.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 5, for example, a dicing blade 1 has an outer peripheral edge portion of a pressing surface 2a which is one surface having a larger diameter than a base metal (hub) 2 having a substantially annular plate shape in plan view. A thin blade whetstone 3 such as a metal bond whetstone or an electroformed whetstone is attached to the base 2, and the base metal 2 is sandwiched between a mount 4 having a screw shaft 4 a and a push nut 5.
Insert the screw shaft 4a into the through hole 7 of the base metal 2 and push the nut 5
Are screwed together and fixedly held. By connecting the holding device 6 of the dicing blade 1 having such a configuration to a driving source or the like and rotating it at a high speed, it is used for dicing a silicon wafer or the like to produce a large number of chips. The base metal 2 of the dicing blade 1 has a substantially trapezoidal shape when viewed in a vertical cross section, and has an inclined surface 2c as a side surface from the contact surface 2b with the push nut 5 toward the opposing pressing surface 2a. In order to form the base 2, the entire surface of the thin blade 3 is adhered to the pressing surface 2 a with respect to the disk-shaped base 2 A as shown by a dashed line in FIG. . Then, the outer peripheral surface 2Aa of the base metal substrate 2A is immersed in the etching solution 9 with the outer peripheral edge 2d of the contact surface 2b to be formed as a sealing area and the O-ring 8 in a ring shape is pressed against the base metal substrate 2A so that the base metal substrate 2A becomes When rotated around O, the base metal substrate 2
Since A is made of aluminum or aluminum alloy, it melts in the etching solution, but the thin blade 3 is hard to melt.
And the outer peripheral surface 2Aa is gradually removed to form an appropriate inclined surface 2c, and the outer edge portion of the thin blade 3 becomes inclined 2c.
The outer shape of the base metal 2 protruding radially outward from is formed.

[0003]

Next, when the dicing blade 1 is mounted on the holding device 6 shown in FIG.
The pressing surface 2a of the base metal 2 pressed against the reference surface 4b is mirror-finished in order to secure the mounting accuracy of the thin blade whetstone 3, and the contact surface 2b against which the pressing nut 5 is pressed is increased in surface roughness. The push nut 5 was prevented from slipping with respect to the base metal 2. In this case, when the push nut 5 is tightened, the base metal 2 is driven to rotate by friction, so that a scratch k1 occurs on the mirror-finished pressing surface 2a as shown in FIG. When the dicing blade 1 is mounted or replaced, the mounting position shifts or tilts because the chip n such as aluminum or aluminum alloy generated by the scratch k1 adheres to the reference surface 4b. And the setting accuracy was bad.

[0005] When the silicon wafer s is diced by such a dicing blade 1 as shown in FIG. 5, a cutting process is performed by the thin blade whetstone 3 of the dicing blade 1 while rotating the holding device 6 around the central axis O. At this time, the cutting process is performed while discharging a coolant c such as water from the lateral direction to the cutting region, and heat radiation during cutting and removal of chips from the cutting portion P are performed. However, in such a cutting process of the silicon wafer s, since the discharged coolant c collides with the outer peripheral edge 2d of the abutting surface 2b of the base metal 2 and collides with the coolant flow, the coolant is cut. The discharge to the processing part P was hindered, and the cooling efficiency was not good. The present invention has been made in view of the above problems, and has as its object to provide a dicing blade and a blade holding device capable of reliably sealing a base during etching. Another object of the present invention is to provide a dicing blade and a blade holding device capable of improving the cooling efficiency by coolant discharge.

[0005]

A dicing blade according to the present invention is a dicing blade having a blade portion on one end surface (pressing surface) of a base metal, wherein the other end surface (one end surface facing one end surface of the base metal) is provided. It is characterized in that the surface roughness of the abutting surface) is reduced and the sealing area located outside the other end face and pressing the sealing member is made large. At the time of etching to form the side surface of the base metal of the dicing blade, when the sealing member is pressed against the sealing region, the surface roughness of the sealing region is large, so that a plurality of convex portions come into close contact with the sealing member and are liquid-tight. Thus, the etching region can be reliably sealed from other regions.

Further, the dicing blade according to the present invention comprises:
In a dicing blade provided with a blade portion on one end surface of a base metal, a sealing region which is located outside the other end surface facing one end surface of the base metal and presses a sealing member is an inclined surface. It is characterized by. When this dicing blade is mounted on the holding device to cut the work material, when coolant such as water is discharged near the cutting part by the blade part, the coolant that collides with the seal area formed by the inclined surface is processed. Since it is guided in the part direction, it is promoted without hindering the cooling efficiency, and can be cooled more efficiently. In addition, the inclined surface in the seal region is formed so as to gradually incline toward one end face from the radially inner side to the outer side of the base metal.

[0007] A dicing blade according to the present invention is a dicing blade provided with a blade portion on one end surface of a base metal, the surface roughness of the other end surface facing one end surface of the base metal is reduced, and the other surface is reduced. The seal area which is located outside the end face and presses the seal member has a larger surface roughness and has an inclined surface. At the time of etching to form the side surface of the die of the dicing blade,
When the sealing member is pressed against the sealing region, the surface roughness of the sealing region is large, so that the liquid-tightness can reliably partition the etching region, and when the work material is cut with a dicing blade, When coolant such as water is discharged near the cutting part by the blade part, the coolant that collided with the inclined surface is guided in the direction of the cutting part, so it is promoted without hindering the cooling efficiency and can be cooled more efficiently .

[0008] A blade holding device according to the present invention is a blade formed by pressing the base of the dicing blade according to any one of claims 1 to 3 against a reference surface of a mount and clamping the mount by a mount and a fixing member. A holding device, wherein a friction resistance between the reference surface and the base metal is larger than a friction resistance between the base metal and the fixing member. When the blade is fixed by pinching the blade against the reference surface of the mount by rotation by the fixing member, the base does not rotate in conjunction with the operation of the fixing member, and between the base and the reference surface Since the frictional resistance is large, the relative rotation of the base metal with respect to the reference surface is suppressed, thereby making it possible to significantly suppress the occurrence of scratches and the like on the pressing surface of the base metal that is in contact with the reference surface. Moreover,
The projections of the scratches formed on the pressing surface of the base metal protrude from the pressing surface, and chips adhere to the reference surface, thereby preventing displacement or inclination of the mounting position of the blade with respect to the reference surface, thereby improving setting accuracy.

Further, a blade holding device according to the present invention is characterized in that a die of the dicing blade according to any one of claims 1 to 3 is pressed against a reference surface of a mount and held between the mount and a fixing member. The device is characterized in that the pressing surface of the base metal that contacts the reference surface has a larger surface roughness than the contact surface of the base metal and the fixing member. The base may be made of a material softer than the mount. The blade may be a dicing blade.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, and the same or similar parts and members as those of the above-described prior art will be described using the same reference numerals. FIG.
FIG. 2 is a cross-sectional view of the dicing blade holding device according to the first embodiment, FIG. 2 is a diagram showing an etched state of the dicing blade shown in FIG. 1 for forming a base metal, and FIG. It is a principal part expanded sectional view which shows the contact state of the reference | standard surface and the press surface of a base metal. In FIG.
The dicing blade 10 has a thin blade whetstone 3 such as a metal bond whetstone as a blade at the outer peripheral edge of a pressing surface 11a forming a bottom surface of a base metal (hub) 11 made of, for example, aluminum or an aluminum alloy. It is configured so as to partially protrude outward. The base metal 11 has, for example, a substantially trapezoidal shape in a vertical cross section, and a through hole 9 is formed in the center thereof. Contact surface 11 facing pressing surface 11a of base metal 11
b is formed in a plane parallel to the pressing surface 11a, and the pressing nut 12 is brought into contact therewith. Pressing surface 11a and contact surface 11
The ring-shaped side surface 11c of the outer periphery connecting the b is formed as a substantially inclined surface in a longitudinal sectional view, and is inclined so that the diameter thereof is gradually gradually increased from the contact surface 11b toward the pressing surface 11a. Side 11c
An annular dip 13 is formed in the center of the dip 13 and has a stepped shape that is concave in a V-shape in cross section. The inclined surface 14 connecting the upper inclined portion 13a on the contact surface 11b side of the dip 13 and the contact surface 11b is formed as a contact surface 11b. , So as to gradually increase in diameter in the direction of the pressing surface 11 a, and forms a seal area where the O-ring 8 is pressed against the base metal 11 when the base metal 11 is etched.

On the side surface 11c of the base metal 11, the lower inclined portion 13b on the pressing surface 11a side of the dip 13 extends longer than the upper inclined portion 13a, and the thin blade 3
It is connected to the. The mount 4 is made of, for example, a material having a hardness higher than that of the base metal 11, for example, titanium, and has a substantially U-shape in vertical cross section. A screw shaft 4a is formed in the center, and the tip end surface of the protruding portion surrounding the periphery is a reference surface. 4b. The push nut 12, which is a fixing member, is made of a material having a higher hardness than the base metal 11, for example, titanium, and has a female screw portion 15 formed in a central hole. And the through hole 9 of the base metal 11
The screw shaft 4a is fitted in the mount 4 and the push nut 12
And the female screw 15 of the push nut 12
Is fixedly held by being screwed into the screw shaft 4a to form the holding device 16. The holding device 16 of the dicing blade 10 is connected to a driving source or the like and is rotated at a high speed for use in dicing. The pressing surface 11a pressed against the mount 4 of the base metal 11 has, for example, an annular outer peripheral region 18 on which the thin blade grindstone 3 is mounted, and a surface roughness R1 of 0.3 to 1.5 μm.
And the thin blade whetstone 3 can be mounted with high precision. Then, the reference surface 4b of the mount 4 is pressed against the substantially circular rough surface region 19 inside the outer peripheral region 18 of the pressing surface 11a, and the rough surface region 19 has a higher surface roughness than the outer peripheral region 18. The surface roughness R2 is set to be large and the range of 2 μm ≦ R2 ≦ 10 μm is set, for example, R2 = 5 μm, while the surface roughness R3 of the reference surface 4b is set to R3 ≦ 1 μm.

The contact surface 1 which is the other surface of the base metal 11
1b is mirror-finished and its surface roughness R4 is 0.3
μm ≦ R4 ≦ 1.5 μm. Further, a lubricating layer 17 which is softer than metal and has a thickness of, for example, about 0.1 μm is formed on the press contact surface 12a of the push nut 12 pressed against the contact surface 11b.
Is installed. The lubricating layer 17 is made of a resin layer, for example, a Teflon resin film or sheet, and has a friction coefficient f ≦ 0.2. Therefore, mount 4
The contact friction resistance between the contact surface 11b of the base 11 and the lubricating layer 17 of the push nut 12 is set smaller than the contact friction resistance between the reference surface 4b and the pressing surface 11a of the base 11. The inclined surface 14 of the base metal 11 has a surface roughness R5 larger than that of the abutment surface 11b, for example, R5 = 5 μm or more. , It is set to a highly accurate liquid tightness.

Dicing blade 1 according to the present embodiment
Since the reference numeral 0 is configured as described above, first, the side surface 11Ac of the base metal 11 is formed into a shape (may be a simple disk shape) indicated by a dashed line in FIG. The thin blade whetstone 3 is mounted on the entire surface on the pressing surface 11Aa side. Then, the thin blade whetstone 3 and the contact surface 11b are masked (not shown), and the O-ring 8 is pressed against the inclined surface 14 so that the side surface 11Ac is immersed in the etching solution s in the bath 21 to rotate the base metal substrate 11A around the axis O. 2 to gradually remove the side surface 11Ac by etching to form the base metal 11 having a desired shape. The side surface 11c indicated by a solid line in FIG.
Is formed. At this time, the side surface 11 against which the O-ring 8 is pressed
Since the inclined surface 14 has a surface roughness R5 of 5 μm or more, fine irregularities are formed.
Therefore, the liquid-tightness of the O-ring 8 at the time of etching is improved, so that the etching solution E can be reliably sealed to other regions such as the contact surface 11b.

Next, the holding device 1 for the dicing blade 10
6, the screw shaft 4a of the mount 4 is inserted through the through hole 9 of the base metal 11 to press the pressing surface 11a of the base metal 11 against the reference surface 4b.
Is screwed into the screw shaft 4a, and the push nut 12 is tightened.
At this time, the lubricating layer 17 of the push nut 12 is brought into contact with the contact surface 11b of the base metal 11, and when the push nut 12 is further tightened, the contact surface 11b of the base metal 11 and the lubricating layer 17 of the push nut 12 are formed. The contact friction resistance with the reference surface 4b of the mount 4
The push nut 12 slides on the contact surface 11b with little rotation of the base 11 so that the push nut 12 is smaller than the contact frictional resistance between the base 11 and the pressing surface 11a of the base 11.
Is pressed against the reference surface 4 b of the mount 4 to position the thin plate grinding stone 3.

On the other hand, the pressing surface 11a of the base metal 11 has a surface roughness R.
2, the rotation of the push nut 12 is suppressed irrespective of the rotation of the push nut 12 due to the large size of the push nut 12. At this time, even if the base metal 11 is slightly rotated with respect to the reference surface 4b and a flaw k1 is generated on the pressing surface 11a, the base metal 11 is made of aluminum or an aluminum alloy and is softer than the mount 4. As shown in FIG. 3, the protrusion m of the wound k1 is raised by the rotational pressure of the base metal 11, and the concave portion 22 of the uneven portion 22 along the surface roughness R2 of the rough surface region 19 having a large surface roughness.
It can be pushed into a and plastically deformed and absorbed.
Since the debris such as aluminum caused by 1 is also prevented from adhering to the reference surface 4b, it is possible to prevent the pressing surface 11a of the base metal 11 from being inclined or displaced with respect to the reference surface 4b. Therefore, even if the dicing blade 10 is replaced and another is mounted on the holding device 16, the base 1
Since no debris such as aluminum does not adhere to the dicing blade 10, the setting accuracy is good and the dicing blade 10 can be prevented from falling down or misaligned. Also, even if the reference surface 4b is slightly damaged by the rotation of the base metal 11, the reference surface 4b can be absorbed in the concave portion 22a of the uneven portion 22 in the rough surface region 19 of the pressing surface 11a of the base metal 11, thereby improving setting accuracy. Has no adverse effect.

When cutting the silicon wafer s with the dicing blade 10 held by the holding device 16 in this way, as shown in FIG.
0 is cut substantially perpendicularly to the silicon wafer c, and cut at this time while discharging coolant such as water from the side of the dicing blade 10 to the cut portion P formed by the thin blade grindstone 3. At this time, a part of the coolant w collides with the inclined surface 14 of the side surface 11c of the base metal 11,
Since the inclined surface 14 is inclined so as to form an acute angle with respect to the dicing blade 10, the coolant w colliding with the inclined surface 14 is changed in the direction of the cutting portion P to be guided and promotes the cooling effect, and the coolant w Around the water is preferable because it does not hinder the jetting of water. In addition, the coolant stored in the dip 13 flows through the upper inclined portion 13b at any time during rotation and is supplied to the cutting portion P, so that the cooling efficiency can be increased.

As described above, according to the present embodiment, the surface roughness R5 of the inclined surface 14 of the side surface 11c against which the O-ring 8 is pressed during etching for forming the side surface 11c of the base metal 11 is increased to 5 μm or more. Because of the setting, the liquid-tightness with the O-ring 8 is high and a reliable seal can be performed. In addition, in the cutting process by the dicing blade 10, even if the coolant w collides with the inclined surface 14, the cutting portion P
The coolant w can be guided in the direction
The coolant w bounced back does not hinder the flow of the coolant to the cutting portion P, so that efficient cooling can be performed. Further, although the surface roughness of the inclined surface 14 of the base metal 11 is increased, the surface roughness of the subsequent contact surface 11 b is reduced to reduce the contact friction resistance with the push nut 12, and the base metal 11 Pressing surface 1
Since the surface roughness of 1a is increased to increase the contact friction resistance between the pressing surface 11a and the reference surface 4b of the mount 4, the dicing blade 10 does not easily rotate when the dicing blade 10 is mounted on the holding device 16, so that The scratch k1 is hardly generated between the reference surface 4b and the pressing surface 11a.
Further, even if the projection m due to the scratch k1 occurs on the pressing surface 11a, the projection m can be accommodated in the concave portion 22a of the uneven portion 22 due to the large surface roughness R2 of the rough surface region 19, and the chip n can be absorbed by the reference surface 4b. The dicing blade 10 can be prevented from adhering to the surface, and can be prevented from being displaced or tilted when the dicing blade 10 is mounted or replaced, and the setting accuracy can be increased.

In the above embodiment, the push nut 1
2, the lubricating layer 17 made of Teflon resin or the like was mounted on the pressing surface 12a. However, without being limited to this, the surface roughness R5 of the pressing surface 12a was set to, for example, 0.3 μm ≦ R
The mirror finish may be set to about 5 ≦ 5 μm. Accordingly, if the contact friction resistance between the push nut 12 and the base metal 11 is set smaller than the contact friction resistance between the mount 4 and the base metal 11, the same operation and effect can be obtained. Further, the large surface roughness R2 of the pressing surface 11a of the base metal 11 does not need to be set in the entire rough surface region 19, but may be at least only the region in contact with the reference surface 4b of the mount 4.

Next, FIG. 4 shows a modification of the dicing blade 10 according to the above-described embodiment, and the same or similar parts as those in the above-described embodiment will be described using the same reference numerals. In the dicing blade 30 according to this example, with respect to the base metal 31 on which the thin blade whetstone 3 is mounted, a region following the inclined surface 32 corresponding to the sealing region on the side surface 11c between the pressing surface 11a and the contact surface 11b is smaller than the inclined surface 32. The second inclined surface 33 is steeply inclined, and the thin blade whetstone 3 is connected to the end thereof. This second inclined surface 33 has a dip 13
Is not formed.

[0020]

As described above, the dicing blade according to the present invention reduces the surface roughness of the other end face of the base metal and seals the sealing member located outside the other end face to press the seal member. Has a large surface roughness,
When the seal member is pressed against the seal area during etching to form the side surface of the base metal, etc., the surface roughness of the seal area is large, so that a plurality of fine projections adhere to the seal member and liquid tightness And the etching region can be reliably sealed.

Further, the dicing blade according to the present invention comprises:
Since the sealing area located outside the other end face of the base metal and pressing the sealing member is an inclined surface, when cutting a work material by attaching a dicing blade to the holding device, the blade portion is required. When coolant such as water is discharged near the cutting part due to the coolant, the coolant colliding with the seal area formed by the inclined surface is guided in the direction of the cutting part, so it is promoted without hindering the cooling efficiency, and more efficiently Can be cooled.

In the dicing blade according to the present invention, the surface roughness of the other end surface of the base metal is reduced, and the sealing area located outside the other end surface and pressing the seal member is made larger in surface roughness. In addition, since the sealing member is pressed against the sealing region during etching, the sealing region has a large surface roughness so that the etching region can be partitioned with high liquid tightness. When cutting the work material at the time, when coolant such as water is discharged near the processing part by the blade part, the coolant that collided with the inclined surface is guided toward the processing part, so that cooling efficiency is not hindered. Accelerated and can be cooled more efficiently.

A blade holding device according to the present invention is a blade formed by pressing the base of the dicing blade according to any one of claims 1 to 3 against a reference surface of a mount and holding the mount between the mount and a fixing member. In the holding device, since the frictional resistance between the reference surface and the base metal is larger than the frictional resistance between the base metal and the fixing member, or on the reference surface rather than the contact surface between the base metal and the fixing member. Since the pressing surface of the abutment has larger surface roughness, when the fixing member presses the blade against the reference surface of the mount by rotation etc. and clamps and fixes it, the base metal interlocks with the operation of the fixing member It does not rotate, and the frictional resistance is large between the base metal and the reference surface, so that the relative rotation of the base metal with respect to the reference surface is suppressed, thereby causing a scratch on the pressing surface of the base metal in contact with the reference surface. Can be greatly reduced . Moreover, by preventing the projections of the scratches formed on the pressing surface of the base metal from protruding from the pressing surface and preventing chips from adhering to the reference surface, the setting and the misalignment of the blade mounting position with respect to the reference surface are prevented. The accuracy is improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a state where a silicon wafer is cut by a dicing blade according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state where a side surface of a base metal of the dicing blade shown in FIG. 1 is etched.

FIG. 3 is an enlarged sectional view of a main part showing a contact state between a reference surface of a mount and a pressing surface of a base metal in the sectional view shown in FIG. 1;

FIG. 4 is a partial sectional view showing a modified example of the inclined surface of the base metal.

FIG. 5 is a cross-sectional view of a relevant part showing a state in which a silicon wafer is cut by a conventional dicing blade.

6 is a cross-sectional view showing a state where the side surface of the base metal of the dicing blade shown in FIG. 5 is etched.

FIG. 7 is an enlarged sectional view of a main part showing a contact state between a reference surface of the mount and a pressing surface of the base metal in the sectional view shown in FIG. 5;

[Explanation of symbols]

 Reference Signs List 3 Thin blade whetstone (blade part) 4 Mount 4b Reference surface 8 Seal member 10 Dicing blade 11 Base metal 11a Pressing surface (one end surface) 11b Contact surface (other end surface) 11c Side surface 12 Push nut (fixing member) 14 Inclined surface 19 Rough surface area k1 scratch m protrusion

Claims (5)

[Claims] 1. A dicing blade having a blade on one end surface of a base metal, wherein the surface roughness of the other end surface facing the one end surface of the base metal is reduced and the dicing blade is positioned outside the other end surface. A dicing blade, wherein a sealing area for pressing a sealing member has a large surface roughness. 2. A dicing blade having a blade portion on one end surface of a base metal, wherein a seal region located outside the other end surface of the base metal facing one end surface and pressing a seal member is inclined. A dicing blade having a surface. 3. A dicing blade having a blade on one end face of a base metal, wherein the surface roughness of the other end face facing the one end face of the base metal is reduced, and the dicing blade is positioned outside the other end face. A dicing blade, wherein a sealing area for pressing a sealing member has a larger surface roughness and an inclined surface. 4. A blade holding device comprising a base of a dicing blade according to claim 1 pressed against a reference surface of a mount and held between a mount and a fixing member. A frictional resistance between the reference surface and the base metal is greater than a frictional resistance between the blade and the fixing member. 5. A blade holding device, wherein a base of the dicing blade according to claim 1 is pressed against a reference surface of a mount and held between the mount and a fixing member. And a pressing surface of the base metal that abuts on the reference surface has a larger surface roughness than a contact surface of the fixing member.