JP2554424Y2 - Inner circumference grinding wheel - Google Patents
Inner circumference grinding wheelInfo
- Publication number
- JP2554424Y2 JP2554424Y2 JP1989034901U JP3490189U JP2554424Y2 JP 2554424 Y2 JP2554424 Y2 JP 2554424Y2 JP 1989034901 U JP1989034901 U JP 1989034901U JP 3490189 U JP3490189 U JP 3490189U JP 2554424 Y2 JP2554424 Y2 JP 2554424Y2
- Authority
- JP
- Japan
- Prior art keywords
- inner peripheral
- grindstone
- cutting
- base metal
- abrasive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【考案の詳細な説明】 「産業上の利用分野」 本考案は、半導体インゴットからのウェーハ切り出し
等に使用される内周刃砥石に係わり、特に、切り出した
ウェーハの反りを安定させるための改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an inner peripheral grindstone used for cutting a wafer from a semiconductor ingot, and more particularly to an improvement for stabilizing the warpage of the cut wafer. .
「従来の技術」 この種の内周刃砥石は、第3図に示すように薄肉円環
状の台金1の内周縁に、ダイヤモンド砥粒を金属めっき
相で固定した砥粒層2を形成してなるもので、円環状の
固定治具を介してその外周縁が駆動装置に装着され、使
用に供される。"Prior art" This kind of inner peripheral blade grindstone forms an abrasive grain layer 2 in which diamond abrasive grains are fixed by a metal plating phase on the inner peripheral edge of a thin annular base metal 1 as shown in FIG. The outer peripheral edge is mounted on a driving device via an annular fixing jig, and is used for use.
従来の内周刃砥石では、前記砥粒層2は第4図に示す
ように断面涙形をなし、砥粒層2の台金半径方向の幅W
は2〜3mm、その公差は0.2mm程度に設定されている。ま
た砥粒層の厚さTは通常、台金の厚さTD+0.15mm程度に
されている。In the conventional inner peripheral blade grindstone, the abrasive grain layer 2 has a tear-shaped cross section as shown in FIG.
Is set to 2 to 3 mm, and the tolerance is set to about 0.2 mm. The thickness T of the abrasive layer is usually set to about TD + 0.15 mm of the thickness of the base metal.
なお、この砥石を製造する場合には、これまで次のよ
うな方法が採られていた。すなわち、台金1の開口部に
円筒型の軸を挿通した後、この軸に幅2〜3mmの円環形
の治具をはめて台金1の内周縁に載せ、この治具の外周
縁に沿って台金1にマスキングテープを貼る。これを台
金1の両面について行ない、台金の内周縁から2〜3mm
幅に亙って露出部分を形成し、これら露出部分に砥粒層
2を電着する。このような製造方法を採っていたため、
精度上の制約から砥粒層2の幅Wおよび公差が前記の値
に制限されていたのである。In the case of manufacturing this grindstone, the following method has been employed so far. That is, after a cylindrical shaft is inserted into the opening of the base 1, an annular jig having a width of 2 to 3 mm is mounted on the shaft, and the jig is placed on the inner periphery of the base 1. Affix the masking tape to the base 1 along. Do this for both sides of the base 1 and 2-3mm from the inner periphery of the base
Exposed portions are formed over the width, and the abrasive layer 2 is electrodeposited on these exposed portions. Because of this manufacturing method,
The width W and the tolerance of the abrasive layer 2 were limited to the above values due to restrictions on accuracy.
「考案が解決しようとする課題」 ところで、内周刃砥石を用いて単結晶インゴットから
薄いウェーハを切り出す場合には、ウェーハが全て内周
刃砥石の側に向けて10μm以内の凸となる「マイナス反
り」になることが望まれるが、上記従来の内周刃砥石で
は、ウェーハの反りの程度にばらつきが生じるうえ、場
合によってはプラス反りになることもあった。ところ
が、このようにウェーハにプラス反りが生じると、切断
中に冷却液の回りが悪化し、切断中のウェーハから冷却
液が吹き出してウェーハが破損したり、内周刃砥石の台
金に傷が付いて砥石寿命を短くするなどの問題が生じ、
ウェーハ生産性を著しく阻害する欠点があった。"Problems to be solved by the invention" By the way, when cutting a thin wafer from a single crystal ingot using an inner peripheral grindstone, all the wafers are convex within 10 μm toward the inner peripheral grindstone. It is desired that the wafer be warped. However, in the above-described conventional inner peripheral edge grindstone, the degree of warpage of the wafer varies, and in some cases, the wafer may be warped positively. However, when the wafer is warped in this way, the coolant around the wafer deteriorates during the cutting, and the cooling liquid blows out from the wafer during the cutting, which damages the wafer and damages the base metal of the inner peripheral grindstone. This causes problems such as shortening the life of the grindstone,
There is a disadvantage that wafer productivity is significantly impaired.
そこで本考案者らは、上記現象について詳細な検討を
試み、内周刃砥石の各部の寸法を種々変更して切断実験
を繰り返した結果、特に、前記砥粒層2の幅Wを小さく
すると、ウェーハの反り具合が安定するという新規な事
実を発見するに至った。また、その場合には砥粒層幅W
の公差を小さくすることが必須であることが判明し、寸
法の割り出しを行なったところ、幅Wを0.5mm以下、公
差を50μm以下に設定すれば、極めて良好な反り安定化
効果が得られることがわかった。Therefore, the inventors of the present invention have conducted detailed studies on the above-described phenomenon, and as a result of repeating cutting experiments with variously changing the dimensions of each part of the inner peripheral grindstone, particularly when the width W of the abrasive layer 2 is reduced, This led to the discovery of a new fact that the warpage of the wafer is stabilized. In that case, the abrasive layer width W
It has been found that it is essential to reduce the tolerance of, and when the dimensions are determined, an extremely good warpage stabilizing effect can be obtained if the width W is set to 0.5 mm or less and the tolerance is set to 50 μm or less. I understood.
「課題を解決するための手段」 本考案は上記知見に基づいてなされたもので、砥粒層
の台金半径方向の幅を0.5mm以下に設定するとともに、
前記幅の公差を50μm以下に抑えたことを特徴とする。"Means for solving the problem" The present invention has been made based on the above findings, and the width of the abrasive layer in the base metal radial direction is set to 0.5 mm or less,
The width tolerance is suppressed to 50 μm or less.
「作用」 ウェーハの反りが安定化する理由は、次のように考え
られる。すなわち、砥粒層の半径方向の幅を従来より小
さくすることにより、砥粒層の表面のうち、切削に直接
かかわらない両側面部分の面積が小さくなるため、被削
材とこれら両側面部分との摩擦抵抗が減少する。同時
に、砥粒層と被削材との当接面積が小さくなるから、切
削によって切断面に生じた切粉が当接面から速やかに排
出されるようになり、当接面における切粉の残留による
摩擦抵抗の増加および不均一を防ぐことができる。した
がって、前記摩擦抵抗のバランス悪化によって生じる台
金のふらつきが低減され、砥石の切削進行方向が安定し
て、適正なマイナス反りをもつウェーハを切り出すこと
ができ、反りの不安定さに起因するウェーハの割れや砥
石寿命の短縮の問題を改善できる。[Operation] The reason why the warpage of the wafer is stabilized is considered as follows. In other words, by making the radial width of the abrasive layer smaller than before, the surface area of both side portions that are not directly involved in cutting on the surface of the abrasive layer becomes smaller, so that the work material and these both side portions are Frictional resistance is reduced. At the same time, the contact area between the abrasive layer and the work material is reduced, so that chips generated on the cut surface due to cutting can be quickly discharged from the contact surface, and the remaining chips on the contact surface This can prevent an increase in frictional resistance and unevenness. Therefore, the fluctuation of the base metal caused by the deterioration of the balance of the frictional resistance is reduced, the cutting direction of the grindstone is stabilized, and a wafer having an appropriate minus warpage can be cut out. The problems of cracking and shortening the life of the grinding wheel can be improved.
「実施例」 第1図は本考案に係わる内周刃砥石の砥粒層の断面図
である。Embodiment FIG. 1 is a cross-sectional view of an abrasive grain layer of an inner peripheral grindstone according to the present invention.
この内周刃砥石は、薄肉円環板状の台金10の内周縁に
ダイヤモンドまたはCBN等の超砥粒をNi等の金属めっき
相で固定してなる砥粒層11を、全周に亙って同一の断面
涙形となるように形成したものである。This inner peripheral blade grindstone has an abrasive grain layer 11 formed by fixing superabrasive grains such as diamond or CBN with a metal plating phase such as Ni on the inner peripheral edge of a thin annular plate-shaped base metal 10 over the entire circumference. Therefore, they are formed so as to have the same tear-shaped cross section.
砥粒層11の台金半径方向の幅Wは0.5mm以下に設定さ
れている。この幅Wが0.5mmより大では、切断中に台金1
0の振れが大きくなり、切り出したウェーハの反りが一
定にならない。なお、幅Wの下限は台金10に対する砥粒
層11の固着強度および砥石寿命を考慮して決定される。The width W of the abrasive layer 11 in the base metal radial direction is set to 0.5 mm or less. If the width W is larger than 0.5 mm, the die 1
The run-out of 0 becomes large, and the warpage of the cut wafer does not become constant. The lower limit of the width W is determined in consideration of the bonding strength of the abrasive layer 11 to the base metal 10 and the life of the grinding wheel.
また、前記幅Wの公差は、幅Wの縮小に伴い従来品よ
りも小さくすることが必要で、具体的には、50μm以下
に設定しなければならない。50μmよりも大きいと、切
削抵抗が周方向に不均一になり、台金10の振れが生じて
切断精度が低下する。Further, the tolerance of the width W is required to be smaller than that of the conventional product as the width W is reduced, and specifically, must be set to 50 μm or less. If it is larger than 50 μm, the cutting resistance becomes non-uniform in the circumferential direction, the run-out of the base metal 10 occurs, and the cutting accuracy decreases.
さらに、砥粒層11の内周縁から最厚点までの幅をW1、
最厚点から外周縁までの幅をW2とすると、両者の比率は
W1:W2=1:1〜1:3であることが望ましい。この範囲より
も最厚点が内周縁側または外周縁側に変位すると、いず
れの場合も切断中に切粉のはけが悪くなり切断精度が低
下する。Furthermore, the width from the inner peripheral edge of the abrasive grain layer 11 to the thickest point is W1,
Assuming that the width from the thickest point to the outer edge is W2, the ratio of both is
It is desirable that W1: W2 = 1: 1 to 1: 3. If the thickest point is displaced to the inner peripheral side or the outer peripheral side beyond this range, in any case, the chipping becomes poor during cutting and the cutting accuracy is reduced.
一方、砥粒層11の厚さTは、台金10の厚さTD+(0.12
〜0.20)mm程度が望ましい。この範囲よりも薄いと切断
中に被削材と台金10が接触して切削抵抗を増すおそれが
あり、前記範囲よりも厚いと被削材の切断しろが大きく
なって被削材の無駄が生じる。On the other hand, the thickness T of the abrasive layer 11 is equal to the thickness TD of the base metal 10+ (0.12
~ 0.20) mm is desirable. If the thickness is smaller than this range, the work material and the base metal 10 may come into contact with each other during cutting, and the cutting resistance may increase.If the thickness is larger than the above range, the cutting margin of the work material increases and waste of the work material is increased. Occurs.
なお、この内周刃砥石を製造するには、精度の低い従
来のマスキング方法の代わりに、次のような製造方法が
適している。In order to manufacture the inner peripheral grindstone, the following manufacturing method is suitable instead of the conventional masking method with low accuracy.
台金10の内周縁に粘着剤付きマスキングテープを貼付
し、カッタを装着したオートドラフタまたはNC加工装置
に台金をセットした後、砥粒層の外周縁に相当する位置
に沿ってマスキングテープをカッタで高精度に切断す
る。その際、カッタで台金10に傷を付けないように、切
り込み量を厳密に制御する必要がある。次いで台金10の
内周縁部のマスキングテープを剥がし、露出部分に砥粒
層11を電着する。After attaching a masking tape with an adhesive to the inner peripheral edge of the base metal 10 and setting the base metal on an auto drafter or an NC processing device equipped with a cutter, apply the masking tape along a position corresponding to the outer peripheral edge of the abrasive layer. Cutting with high precision using a cutter. At that time, it is necessary to strictly control the cut amount so as not to damage the base metal 10 with the cutter. Next, the masking tape on the inner peripheral edge of the base metal 10 is peeled off, and the abrasive layer 11 is electrodeposited on the exposed portion.
台金10にフォトレジストを塗布した後、これを露光装
置にセットし、紫外線で露光および現像して台金10の内
周縁部のみフォトレジストを除去し、この露出部分に砥
粒層11を電着する。After the photoresist is applied to the base 10, the photoresist is set in an exposure apparatus, exposed and developed with ultraviolet rays to remove the photoresist only at the inner peripheral edge of the base 10, and an abrasive layer 11 is applied to the exposed portion. To wear.
上記構成からなる内周刃砥石によれば、砥粒層11の半
径方向の幅を従来より小さくすることによって、第2図
に示すように砥粒層11の表面のうち、切削に直接かかわ
らない両側面部分Pの面積が小さくなるため、被削材と
これら両側面部分Pとの摩擦抵抗が低減する。同時に、
砥粒層11と被削材Hとの当接面積が小さくなるから、切
削によって生じた切粉が当接面から速やかに排出され、
当接面における切粉の残留による摩擦抵抗の増加および
不均一化を防ぐことができる。したがって、摩擦抵抗の
バランス悪化によって生じる台金10のふらつきが低減さ
れ、砥石の切削進行方向が安定して、適正なマイナス反
りをもつウェーハを切り出すことができ、次工程におけ
るウェーハの仕上げ加工を簡略化でき、その分、加工コ
スト低下が図れる。また、反りの不安定さに起因する切
断中のウェーハの割れを防ぎ、さらに台金に傷が付くの
を防止して砥石寿命を延長することが可能である。According to the inner peripheral grindstone having the above-described configuration, the radial width of the abrasive layer 11 is made smaller than in the related art, so that the surface of the abrasive layer 11 is not directly involved in cutting as shown in FIG. Since the area of the side portions P is reduced, the frictional resistance between the workpiece and the side portions P is reduced. at the same time,
Since the contact area between the abrasive layer 11 and the work material H is reduced, chips generated by cutting are quickly discharged from the contact surface,
It is possible to prevent an increase in frictional resistance and non-uniformity due to residual chips on the contact surface. Therefore, the fluctuation of the base metal 10 caused by the deterioration of the frictional resistance balance is reduced, the cutting direction of the grindstone is stabilized, and a wafer having an appropriate minus warpage can be cut out, and the finishing of the wafer in the next process is simplified. And the processing cost can be reduced accordingly. Further, it is possible to prevent the wafer from being cracked during cutting due to the instability of the warp, prevent the base metal from being damaged, and extend the life of the grindstone.
さらにこの内周刃砥石では、切削抵抗が減少する分、
砥石の回転駆動力が小さくて済み、摩擦熱の発生量も低
減できる利点も有する。Furthermore, with this inner peripheral blade, the cutting resistance is reduced,
There is also an advantage that the rotational driving force of the grindstone can be small and the amount of generated frictional heat can be reduced.
「考案の効果」 以上説明したように、本考案に係わる内周刃砥石によ
れば、砥粒層の表面のうち切削に直接かかわらない両側
両部分の面積が小さくなるため、被削材とこれら両側面
部分との摩擦抵抗が減少する。同時に、砥粒層と被削材
との当接面積が小さくなるから、切削によって生じた切
粉が当接面から速やかに排出され、切粉の残留による摩
擦抵抗の増加および不均一化を防ぐことができる。した
がって、摩擦抵抗のバランス悪化によって生じる台金の
ふらつきが低減され、砥石の切削進行方向が安定して、
適正なマイナス反りをもつウェーハを切り出すことがで
き、次工程におけるウェーハの仕上げ加工を簡略化し
て、その分、加工コスト低下が図れる。また、反りの不
安定さに起因する切断中のウェーハの割れを防ぎ、さら
に台金に傷が付くのを防止して砥石寿命を延長すること
が可能である。[Effects of the Invention] As described above, according to the inner peripheral grindstone according to the present invention, since the area of both sides of the surface of the abrasive grain layer that are not directly involved in cutting is reduced, the work material and the Friction resistance with both side parts is reduced. At the same time, the contact area between the abrasive grain layer and the work material is reduced, so that chips generated by cutting are quickly discharged from the contact surface, thereby preventing an increase in frictional resistance and non-uniformity due to residual chips. be able to. Therefore, the fluctuation of the base metal caused by the deterioration of the balance of the frictional resistance is reduced, and the cutting progress direction of the grindstone is stabilized,
A wafer having an appropriate minus warpage can be cut out, and the finishing of the wafer in the next step can be simplified, and the processing cost can be reduced accordingly. Further, it is possible to prevent the wafer from being cracked during cutting due to the instability of the warp, prevent the base metal from being damaged, and extend the life of the grindstone.
さらにこの内周刃砥石では、切削抵抗が減少する分、
砥石の回転駆動力が小さくて済み、摩擦熱の発生量も低
減できる利点も有する。Furthermore, with this inner peripheral blade, the cutting resistance is reduced,
There is also an advantage that the rotational driving force of the grindstone can be small and the amount of generated frictional heat can be reduced.
第1図は本考案に係わる内周刃砥石の砥粒層の断面図、
第2図は同砥石の効果を示す断面図、第3図は一般的な
内周刃砥石の平面図、第4図は従来の内周刃砥石の砥粒
層の断面図である。 10……台金、11……砥粒層、W……砥粒層の台金半径方
向の幅。FIG. 1 is a sectional view of an abrasive layer of an inner peripheral grindstone according to the present invention,
FIG. 2 is a cross-sectional view showing the effect of the grindstone, FIG. 3 is a plan view of a general inner peripheral grindstone, and FIG. 4 is a cross-sectional view of an abrasive layer of a conventional inner peripheral grindstone. 10: base metal, 11: abrasive layer, W: width of the abrasive layer in the base metal radial direction.
Claims (1)
属めっき相で固定してなる砥粒層を電着形成した内周刃
砥石において、 前記砥粒層の台金半径方向の幅を0.5mm以下に設定する
とともに、前記幅の公差を50μm以下に抑えたことを特
徴とする内周刃砥石。1. An inner peripheral grindstone in which an abrasive layer formed by fixing superabrasive grains with a metal plating phase is electrodeposited on an inner peripheral edge of a thin annular base metal, wherein the base metal radius of the abrasive layer An inner peripheral grinding wheel characterized in that the width in the direction is set to 0.5 mm or less and the width tolerance is suppressed to 50 μm or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989034901U JP2554424Y2 (en) | 1989-03-28 | 1989-03-28 | Inner circumference grinding wheel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989034901U JP2554424Y2 (en) | 1989-03-28 | 1989-03-28 | Inner circumference grinding wheel |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02126762U JPH02126762U (en) | 1990-10-18 |
JP2554424Y2 true JP2554424Y2 (en) | 1997-11-17 |
Family
ID=31539781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989034901U Expired - Lifetime JP2554424Y2 (en) | 1989-03-28 | 1989-03-28 | Inner circumference grinding wheel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2554424Y2 (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5821039B2 (en) * | 1975-09-26 | 1983-04-26 | 株式会社東芝 | Inner peripheral diamond blade |
-
1989
- 1989-03-28 JP JP1989034901U patent/JP2554424Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02126762U (en) | 1990-10-18 |
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