JP2001035870A - Conductive ball transfer device and transfer method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive ball transfer device of a structure, wherein conductive balls can be made to chuck to a transfer head rapidly and correctly, and a conductive ball transfer method. SOLUTION: In a conductive ball transfer device, which chucks conductive balls to transfer the balls to a transfer heads, a after the balls 4 arranged on an arrangement member 10 of a ball feeding part 9 are picked up by the transfer head 7, the balls 4 remaining on the member 10 are detected by an optical sensor consisting of light-emitting and light-receiving parts 29A and 29B. If the remained balls are detected, the above pickup is decided to be a mistake of a pickup by a decision part. As a result, the balls can be made to chuck to the head 7 rapidly and correctly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball transfer device for transferring a conductive ball to a workpiece by sucking the conductive ball.

[0002]

2. Description of the Related Art As a method of forming a metal bump on an electrode of a substrate or an electronic component, there is known a method of transferring a conductive ball such as a solder ball onto an electrode and soldering the electrode. For transferring the conductive balls, a method of vacuum-sucking the conductive balls by a transfer head is widely used. This method
The conductive balls are sucked into a large number of suction holes provided on the lower surface of the suction tool of the transfer head, the suction tool is moved onto the work, and the vacuum ball is released to transfer the conductive balls to the work. Things. As a method of adsorbing conductive balls on the lower surface of the suction tool, the suction tool is lowered to a ball tank that has stored a large number of conductive balls, and the lower surface of the suction tool is settled in the conductive ball layer. A method of vacuum suction from the suction hole has been used.

[0003]

However, the above-described method of directly attracting conductive balls from a ball tank to a suction tool directly has the following problems. First, since the conductive balls in the ball tank are in a randomly charged state in an irregular state, it is difficult to cause the conductive balls to be quickly and completely sucked into the suction holes on the lower surface of the suction tool. For this reason, means for promoting adsorption of the conductive ball, such as fluidizing the conductive ball by blowing gas into the conductive ball layer, or vibrating the suction tool relative to the conductive ball layer. Therefore, it takes a considerable time for the ball to be adsorbed by the conduction without being leaked into each of the suction holes.

Further, the suction tool that has sucked the conductive ball shifts to a transfer operation to the workpiece. The ball tank holds the ball until the suction head finishes the transfer operation and returns to the ball tank. No action was taken.
For this reason, it is difficult to shorten the tact time of the transfer operation of the conductive ball, and it is not possible to expect a significant improvement in productivity, in addition to the fact that the above-described ball suction operation itself requires time. In addition, in the suction operation by the suction tool, suction errors such as generation of suction holes in which the conductive balls are not sucked and extra conductive balls being sucked on the lower surface of the suction tool are likely to occur. This was a cause of transfer errors. As described above, the conventional conductive ball transfer apparatus has a problem that it is difficult to quickly and accurately attract the conductive ball to the transfer head.

Accordingly, an object of the present invention is to provide a conductive ball transfer apparatus and a transfer method capable of quickly and correctly adsorbing conductive balls to a transfer head.

[0006]

According to a first aspect of the present invention, there is provided an apparatus for transferring a conductive ball, wherein the conductive ball is transferred to a predetermined position while holding the conductive ball. An array member provided with a plurality of concave portions capable of accommodating the plurality of conductive balls in a predetermined arrangement, a transfer head for picking up and transferring a plurality of conductive balls arranged in the array member to a predetermined position, Residual ball detection means for detecting conductive balls remaining on the array member after the pick-up operation of the conductive balls by the transfer head, and pick-up error judgment for judging a pick-up error by the transfer head if the remaining balls are detected Means.

According to a second aspect of the present invention, there is provided an apparatus for transferring a conductive ball, comprising:
The remaining ball detecting means includes an optical sensor including a pair of a light emitting unit and a light receiving unit having an optical axis parallel to the upper surface of the array member, and a movement for relatively moving the optical axis along the upper surface of the array member. Means.

According to a third aspect of the present invention, there is provided an apparatus for transferring a conductive ball, comprising:
A linear groove parallel to the optical axis and intersecting the centers of the plurality of recesses was formed on the surface of the array member.

According to a fourth aspect of the present invention, there is provided an apparatus for transferring a conductive ball, comprising:
The remaining ball detection means includes a camera that images the upper surface of the array member, a moving unit that moves the camera along the upper surface of the array member, and an image processing unit that detects a conductive ball from an image captured by the camera. Equipped.

According to a fifth aspect of the present invention, there is provided an apparatus for transferring a conductive ball, comprising the steps of:
The moving means is integrally provided with a ball removing means for removing excess conductive balls on the upper surface of the array member.

According to a sixth aspect of the present invention, there is provided an apparatus for transferring a conductive ball, comprising the steps of:
The ball removing means is a plate-shaped squeegee for scraping the conductive balls.

A conductive ball transfer apparatus according to claim 7 is the conductive ball transfer apparatus according to claim 5,
The ball removing means is a brush that slides on the conductive ball.

The conductive ball transfer device according to claim 8 is the conductive ball transfer device according to claim 5,
The ball removing means is an air nozzle for injecting gas to the conductive balls.

According to a ninth aspect of the present invention, there is provided a method for transferring conductive balls to a predetermined position, wherein the plurality of conductive balls are formed in a predetermined arrangement on the upper surface of the arrangement member. Receiving the conductive balls one by one in the recessed portion, picking up the plurality of conductive balls contained in the recessed portion by the transfer head, and removing the conductive balls remaining in the recessed portion after the pickup operation. Detecting.

According to a tenth aspect of the present invention, there is provided a method for transferring a conductive ball, comprising the steps of:
When a conductive ball remaining in the concave portion is detected, it is determined that a pickup error has occurred by the transfer head.

The method for transferring conductive balls according to claim 11 is the method for transferring conductive balls according to claim 9, wherein
The optical axis of an optical sensor composed of a light emitting section and a light receiving section having an optical axis parallel to the array member is relatively moved along the upper surface of the array member. The conductive balls remaining in the recesses are detected.

According to a twelfth aspect of the present invention, there is provided a method for transferring a conductive ball, comprising the steps of:
A camera is provided for imaging the upper surface of the array member, and the conductive balls remaining in the recess are detected from the image captured by the camera.

According to the present invention, an arrangement member for arranging conductive balls, a remaining ball detecting means for detecting the conductive balls remaining on the arrangement member after the pick-up operation of the conductive balls by the transfer head, and a remaining ball Is provided with a pick-up error determining means for determining a pick-up error caused by the transfer head when the transfer ball is detected, whereby the conductive ball can be quickly and accurately adsorbed.

[0019]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an apparatus for transferring conductive balls according to an embodiment of the present invention, FIG. 2 is a perspective view of a ball supply unit of the apparatus for transferring conductive balls, and FIG. 4A is a partial plan view of an arrangement member of the ball supply unit, FIG. 4B is a cross-sectional view of an arrangement member of the ball supply unit, FIGS. 7 is an explanatory view of the operation of the conductive ball transfer device, FIG. 8 is an explanatory view of the remaining ball detection by the remaining ball detecting means, FIG.
FIG. 10 is a partial cross-sectional view of a ball supply unit of the conductive ball transfer device.

First, the structure of the conductive ball transfer device will be described with reference to FIG. In FIG. 1, X is located at the center of the base 1.
A transport path 2 is provided in the direction. The transport path 2 transports and positions the substrate 3. Two Y-axis tables 5 are arranged at both ends of the upper surface of the base 1. An X-axis table 6 is provided on the Y-axis table 5, and a transfer head 7 having a suction tool 8 is mounted on the X-axis table 6.
By driving the X-axis table 6 and the Y-axis table 5, the transfer head 7 moves horizontally.

A ball supply section 9 for the conductive balls 4 is provided in front of the transport path 2. The ball supply unit 9 is an arrangement member 1 that arranges the conductive balls 4 in a predetermined arrangement pattern.
0 is provided. The transfer head 7 is positioned on the arrangement member 10, and the transfer head 7 is lowered with respect to the arrangement member 10, whereby the conductive balls 4 arranged on the arrangement member 10 are moved by the suction tool 8. The conductive ball 4 is picked up by suction and transferred to a predetermined position on the substrate 3.

Next, the ball supply unit 9 will be described with reference to FIGS. In FIG. 2, the ball tank 12
Is a substantially box-shaped container with no bottom, and a box member 11 is disposed inside a ball tank 12. The arrangement member 10 is mounted on the upper part of the box member 11, and the inside of the box member 11 is a dark box formed in an airtight manner. FIG. 3 shows an AA cross section of FIG. 2, and an extension 12 a extending inward from four sides is provided at the upper part of the ball tank 12. The box member 11 is inserted into an opening formed by the end face of the extension 12a. The upper surface of the extending portion 12a is an inclined surface 12b inclined inward, and a recess formed by the side surface of the box member 11 and the inclined surface 12b is a storage portion 12c for storing the conductive balls 4. ing.

A rack member 14 is attached to the bottom surface of the box member 11 in a vertical direction, and a pinion 15 driven by a motor 16 is engaged with the rack member 14. The box member 11 is driven by driving the motor 16.
Moves up and down. When the box member 11 is lowered and the arrangement member 10 is located below the ball storage level of the storage part 12c, the conductive balls 4 in the storage part 12c
The upper part falls down and moves to the upper surface of the array member 10 (see FIG. 5A). That is, the motor 1 for vertically moving the storage part 12 c for storing the conductive balls 4 and the box member 11.
Reference numeral 6 denotes a ball supply means for supplying the conductive balls 4 on the array member 10.

The arrangement member 10 will now be described with reference to FIG. As shown in FIG. 4A, a plurality of circular concave portions 10a are provided on the upper surface of the array member 10 in a lattice shape. The arrangement pitches Px and Py of the concave portions 10a are set in a predetermined arrangement, that is, equal to the arrangement pitch of the suction holes 8a provided in the suction tool 8 of the transfer head 7. FIG.
(B) shows a BB cross section, and the diameter D and the depth d1 of the concave portion 10a are set to a size that can accommodate one conductive ball 4.

A through hole 10c penetrating through the array member 10 is provided on the bottom surface of the concave portion 10a, and the conductive ball 4 is present in the concave portion 10a, and the conductive hole is formed by vacuum suction from the through hole 10c. The ball 4 is held in the recess 10a. Therefore, the recess 10a and the through hole 10
c denotes a ball holding portion for holding the conductive ball 4. Further, a straight groove 10b is provided in the X direction so as to intersect with the center of each of the recesses 10a forming the concave row in the X direction.

The upper surface of the ball tank 12 is an overhang 13 protruding in both left and right directions (X direction), and a guide rail 17 is arranged on the upper surface of the overhang 13 in the Y direction. A slider 18 is slidably fitted in the guide rail 17 in the horizontal direction, and a nut 19 is fixed to a side surface of the slider 18 on the near side. A feed screw 20 rotationally driven by a motor 21 is screwed into the nut 19.

A gate-shaped frame 22 is provided on the two sliders 18. The squeegee 25 and the line light-emitting unit 2
Removal / inspection unit 23 with integrated 6
Is attached. The squeegee 25 is a plate-shaped member, and its lower end is located at a height position maintaining a slight gap from the upper surface of the arrayed member 10 that has been raised. By driving the motor 21, the squeegee 25 relatively horizontally moves along the upper surface of the array member 10. The conductive balls 4 on the array member 10
By moving the squeegee 25 along the upper surface of the arranging member 10 in the presence of the squeegee, the squeegee 25 moves while scraping the conductive ball 4 at the lower end, and the conductive ball 4 is provided on the arranging member 10. At the same time, the conductive balls 4 are moved into the recesses 10a, and the extra conductive balls 4 located outside the recesses 10a are moved and scraped off from the arrangement member 10 to be removed. That is, the squeegee 25 is a ball removing means for removing extra conductive balls on the array member 10.

A tube 36 is connected to a lower portion of the box member 11, and the tube 36 is connected to a vacuum suction source and an air supply source (not shown) via a switching valve 37. By switching the switching valve 37, the inside of the box member 11 can be vacuum-sucked, or positive-pressure air can be supplied to the inside. By vacuum-suctioning the inside of the box member 11 in a state where the conductive balls 4 are present in the concave portions 10a of the array member 10, the conductive balls 4 are held in the concave portions 10a by vacuum suction. Further, by supplying air into the inside of the box member 11, the conductive balls 4 in the concave portions 10a are discharged to the outside by air blow.

The line light emitting section 26 is connected to a light source device 28 via a cable 27. By driving the light source device 28 in a state where the line light emitting unit 26 is positioned on the arrangement member 10, light is emitted from above the arrangement member 10 to the recess 10 a. Therefore, the light source device 28 and the line light emitting section 26 are light emitting means. A dark room is formed below the arrangement member 10 of the box member 11, and a light shielding material for shielding light emitted from the line light emitting unit 26 is provided in the recess 10.
In the state where it does not exist in a, light penetrates through the through-hole 10c and enters the inside of the box member 11, and is reflected in the horizontal direction by the reflecting plate 31 disposed obliquely inside.

The reflected light enters an optical sensor 32 disposed on the inner surface of the box member 11. The optical sensor 32 is connected to the detection unit 34, and the detection unit 34 detects that light has entered the optical sensor 32. That is, the optical sensor 32
The detecting section 34 serves as detecting means for detecting light emitted from the line light emitting section 26 and passing through the through hole 10c.

A judging unit 35 is connected to the detecting unit 34, and the judging unit 35 judges the arrangement state of the conductive balls 4 based on a signal of the detection result of the detecting unit 34. That is, if light incident on the optical sensor 32 is detected, the array member 10
It is determined that the conductive ball 4 is not arranged in any of the concave portions 10a. Therefore, the judging section 35 serves as an alignment error determining means for determining an alignment error based on a signal from the detecting means. As described above, the line light emitting unit 26 is integrally attached to the squeegee 25, and the line light emitting unit 2 is driven by driving the motor 21.
6 moves on the arrangement member 10 integrally with the squeegee 25. Therefore, the removal of the ball by the squeegee 25 and the determination of the misalignment can be performed simultaneously by the same operation.

As shown in FIG. 2, the slider 18 is provided with an optical sensor in which a light emitting section 29A and a light receiving section 29B are combined as a pair. The optical axis a from which the light emitted from the light emitting section 29A reaches the light receiving section 29B has a height direction parallel to the upper surface of the array member 10 and a direction in the horizontal plane corresponding to the groove 1.
0b. And the height position is groove 1
0b (see FIG. 8). While driving the motor 21 to horizontally move the slider 18, light is emitted from the light emitting portion 29A, so that the optical axis a moves in the Y direction and sequentially coincides with the position of each groove 10b of the array member 10. The motor 21, the feed screw 20 and the nut 19 are moving means for relatively moving the optical axis a on the array member 10.

When the conductive ball 4 is present in the recess 10a during this movement, the optical axis a is shielded by the conductive ball 4, and the light intensity received by the light receiving section 29B decreases.
By detecting the decrease in the light intensity, the conductive ball 4 existing in the concave portion 10a can be detected. This ball detection is used for detecting the conductive balls remaining in the concave portion 10a of the array member 10, ie, the remaining balls, after the pick-up operation of picking up the conductive balls 4 arranged on the array member 10 by the transfer head 7. Can be
The light receiving unit 29B is connected to the detection unit 50 (FIG. 8).
When the detection unit 50 receives a signal from the light receiving unit 29B, the detection unit 50 detects a remaining ball based on a waveform of a graph described later. Therefore, the optical sensor including the light emitting section 29A and the light receiving section 29B and the detecting section 50 serve as a remaining ball detecting means. Then, when the remaining ball is detected, the determination unit 51 determines that a pickup error has occurred in the pickup operation by the transfer head 7. Therefore, the determination unit 51 is a pickup error determination unit.

In the present embodiment, the remaining ball is detected by providing the groove 10b intersecting the concave portion 10a and passing the optical axis a through the groove 10b.
Even when the groove 10b is not provided, the remaining ball can be detected by the same method. In this case, the recess 10
a is set so that the upper portion of the conductive ball 4 protrudes, and the optical axis a is scanned along the upper surface of the array member 10 so that the optical axis a The remaining ball may be detected based on whether or not the light is shielded. However, if the ball diameter of the conductive ball 4 becomes small, it becomes difficult to stably detect the presence or absence of light shielding by only the upper protruding portion. Therefore, it is desirable to provide the groove 10b.

As shown in FIG. 3, a vibrator 33 is mounted on the outer surface of the box member 11. By driving the vibrator 33, ultrasonic vibration is transmitted to the box member 11. By transmitting vibrations to the array member 10 via the box member 11, the ball that captures the conductive ball 4 by entering the concave portion 10a when the array member 10 is lowered into the ball layer of the storage portion 12c. This has the effect of promoting the capturing operation.

This device for transferring conductive balls is configured as described above. A ball supply operation for supplying conductive balls to the transfer head 7 by the ball supply unit 9 will be described below. Prior to the state shown in FIG.
A large number of conductive balls 4 are thrown into the inside, and are stored in the storage section 12c.

From this state, the box member 11 is lowered as shown in FIG. As a result, the arrangement member 10 sinks into the ball layer of the conductive balls 4 in the storage portion 12c, and the conductive balls 4 move onto the arrangement member 10 and move.
Supplied to At this time, the vibrator 33 is driven to
In addition to promoting the capture of the conductive balls 4 in the inside a, the inside of the box member 11 is evacuated through the tube 24 and evacuated through the through hole 10c. As a result, the conductive ball 4 captured in the recess 10a is held. At this time,
The ball removal / inspection unit 23 is located at a position retracted from above the array member 10.

Next, as shown in FIG.
Increase 1 Thereby, a part of the conductive ball 4 located on the arrangement member 10 falls into the storage portion 12c from the end of the arrangement member 10. Then, an undetermined number of conductive balls 4 remain on the array member 10. After this, FIG.
The ball removal / inspection unit 23 is moved in the direction of the arrow as shown in FIG. Thus, the squeegee 25 first scratches the conductive balls 4 on the array member 10 in the traveling direction. At this time, if there is a concave portion 10a in which the conductive ball 4 has not yet been captured, the conductive ball 4 is dropped into the non-captured concave portion 10a in this scraping operation. Then, the squeegee 25 moves further, and when it reaches the end of the arrangement member 10, the excess conductive balls 4 are scraped off from the arrangement member 10 and removed. The removed conductive balls 4 fall into the storage portion 12c.

In parallel with the ball removing operation by the squeegee 25, the light source device 28 is driven to
6 emits light to each recess 10a of the array member 10.
At this time, when there is a concave portion 10a in which the conductive ball 4 is not captured as shown in FIG. 6, the light emitted from the line light emitting portion 26 passes through the through hole 10c in the concave portion 10a, and the box member 11 enters the dark room inside, and the reflecting plate 31
The light beam L reflected on the optical sensor 32 enters the optical sensor 32. The light entering the optical sensor 32 is detected by the detection unit 34.
When the input is detected, the determination unit 35 determines that there is a ball alignment error. The first embodiment
Here, the line light emitting section 26 and the light source device 2 are used as light emitting means.
Although 8 is used, an LED (light emitting diode) arranged in a line may be used.

Thereafter, after the ball removing / inspection unit 23 has retreated from the arrangement member 10, the transfer head 7 is moved onto the arrangement member 10 as shown in FIG. After aligning the suction hole 8a with the concave portion 10a, the suction tool 8 is lowered with respect to the array member 10. When the lower surface of the suction tool 8 is lowered to a predetermined suction height position with respect to the upper surface of the array member 10, the lowering is stopped, vacuum suction is performed from the suction holes 8a, and the vacuum suction inside the box member 11 is released. .

Thus, the conductive balls 4 held in the concave portions 10a are vacuum-sucked into the suction holes 8a of the suction tool 8. At this time, the switching valve 37 may be switched to supply a slightly positive pressure air into the box member 11. This facilitates the separation of the conductive ball 4 from the recess 10a, and the conductive ball 4
It has the effect of promoting adsorption. Thereafter, as shown in FIG. 7B, the transfer head 7 is raised, and the transfer head 7 picking up the conductive balls 4 by the suction holes 8a of the suction tool 8 moves the transfer head 7 to a predetermined position on the substrate 3. The ball 4 is transferred.

As a result, the conductive ball 4 does not exist in the concave portion 10a of the array member 10. However, a suction error occurs in the suction hole 8a for some reason, and even after the pickup operation, FIG. As shown in a)
The conductive ball 4 may remain in the recess 10a.
Therefore, a ball detection operation for detecting such a remaining ball is performed.

That is, the motor 21 is driven to move the optical axis a from the light emitting section 29A to the light receiving section 29B in the Y direction, and scan the optical axis a at the height of the groove 10b. At this time, if there is no conductive ball 4 remaining in each of the concave portions 10a where the grooves 10b intersect, the light from the light emitting portion 29A is received by the light receiving portion 29B. By receiving the signal at the section 34, the detection section 34 obtains a graph of a waveform indicating the peak and the valley of the light intensity for each groove pitch Py (see FIGS. 8B and 8A).

On the other hand, when the conductive ball 4 remains in any of the recesses 10a, the light from the light emitting portion 29A is blocked by the conductive ball 4 and does not reach the light receiving portion 29B. Accordingly, in such a case, a graph is obtained in which a waveform of a mountain (a broken line indicated by an arrow in the figure) that should originally appear at a position corresponding to the recess row 10a to which the recess 10a belongs is missing (FIG. 8B). B)).

The detection of the remaining ball based on the graph waveform is as follows.
The detection is performed by receiving a signal from the light receiving unit 29 </ b> B by the detection unit 50. Based on the detection result of the remaining ball by the detection unit 50, the determination unit 51 determines whether or not there is a pickup error by the transfer head 7.

In this embodiment, the above-described optical sensor including the light emitting portion 29A and the light receiving portion 29B is used as the remaining ball detecting means. However, other configurations, for example, as shown in FIG. Above, a camera 39 which can be moved in a horizontal direction by a moving table 38 as moving means.
May be arranged, and the image of the array member 10 captured by the camera 39 may be processed by the image processing unit 40 to detect the remaining ball remaining in the concave portion 10a of the array member 10.

As a ball supply means for supplying the conductive balls onto the arrangement member 10, the conductive balls 4 are arranged by moving the ball scattering unit 41 on the arrangement member 10 as shown in FIG. You may make it spray on the member 10. The array member 10 can be formed by this method.
The conductive balls 4 scattered above enter the respective recesses 10 a and are caught. After that, the squeegee 25 is moved on the arrangement member 10 to remove the excess conductive balls 4 on the arrangement member 10. be able to.

Further, besides the method using a squeegee 25 as a ball removing means for removing the conductive balls 4 from the arrangement member 10, for example, as shown in FIG. A method may be used in which the conductive balls 4 are rubbed off with a brush 42 and removed by a brush 42 so that the leading ends of the conductive balls 4 are in sliding contact with the upper surface of the arrangement member 10. An air nozzle 43 provided with an air outlet on a slit is attached to the mounting member 24, and air is supplied from the air supply source 44 to the air nozzle 43 while moving the ball removing / inspection unit 23. A jet may be sprayed from the outlet toward the conductive balls 4 on the arrangement member 10 so that excess conductive balls 4 on the arrangement member 10 are blown off and removed.

As described above, according to the present embodiment, in the supply of the conductive balls to the transfer head in a state where the conductive balls are held on the arrangement member in the arrangement state, the supply of the conductive balls along the upper surface of the arrangement member Ball removing means for removing excess conductive balls on the arrangement member while relatively moving, and light emitting means for inspecting the arrangement state of the conductive balls on the arrangement member are integrally provided. In this operation, unnecessary conductive balls are removed and the ball arrangement state is determined. Accordingly, it is not necessary to provide a separate moving mechanism, so that the mechanism can be simplified and the operation time can be shortened.

Further, while the transfer head picking up the conductive balls performs the transfer operation to the work, the operation of arranging new conductive balls on the array member can be performed in parallel. Compared to the conventional method of conducting and unloading conductive balls using a single transfer head, the tact time required to transfer conductive balls can be greatly reduced, and productivity can be improved. it can.

The conductive balls arranged in this manner are supplied to the transfer head 7 only by sucking the conductive balls arranged in accordance with the suction holes of the suction tool. The conductive balls can be supplied to the transfer head in a very short time as compared with a method in which the conductive balls are directly lowered into the ball tank to attract the conductive balls.

Further, while the transfer head picking up the conductive balls performs the transfer operation to the work, the operation of arranging new conductive balls on the array member can be performed in parallel. Compared to the conventional method of conducting and unloading conductive balls using a single transfer head, the tact time required to transfer conductive balls can be greatly reduced, and productivity can be improved. it can.

[0053]

According to the present invention, the remaining ball detecting means for detecting the conductive balls remaining on the array member after the pick-up operation of the conductive balls by the transfer head, and the transfer when the remaining balls are detected. The provision of the pick-up error determining means for determining a pick-up error caused by the mounting head makes it possible to quickly and accurately attract the conductive ball.

[Brief description of the drawings]

FIG. 1 is a perspective view of a conductive ball transfer device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a ball supply unit of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 3 is a sectional view of a ball supply unit of the conductive ball transfer device according to one embodiment of the present invention;

4A is a partial plan view of an arrangement member of a ball supply unit according to an embodiment of the present invention. FIG. 4B is a cross-sectional view of an arrangement member of the ball supply unit according to an embodiment of the invention.

FIG. 5 is an operation explanatory view of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 6 is an explanatory diagram of the operation of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 7 is an operation explanatory view of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 8 is an explanatory diagram of detection of a remaining ball by a remaining ball detection unit according to one embodiment of the present invention;

FIG. 9 is a partial cross-sectional view of a ball supply unit of the conductive ball transfer device according to one embodiment of the present invention;

FIG. 10 is a partial sectional view of a ball supply unit of the conductive ball transfer device according to one embodiment of the present invention;

[Explanation of symbols]

 REFERENCE SIGNS LIST 3 substrate 4 conductive ball 7 transfer head 8 suction tool 9 ball supply unit 10 array member 10a recess 10b groove 10c through hole 11 box member 25 squeegee 26 line light emitting unit 28 light source device 29A light emitting unit 29B light receiving unit 32 optical sensor 34 detection Unit 35 Judgment unit

Claims (12)

[Claims] 1. A conductive ball transfer device for holding a conductive ball and transferring the conductive ball to a predetermined position, comprising a plurality of recesses in a predetermined arrangement capable of accommodating one conductive ball on an upper surface. An array member, a transfer head that picks up a plurality of conductive balls arrayed on the array member and transfers the conductive balls to a predetermined position, and remains on the array member after the conductive head is picked up by the transfer head An apparatus for transferring a conductive ball, comprising: a remaining ball detecting means for detecting a conductive ball; and a pick-up mistake judging means for judging a pick-up error by a transfer head when the remaining ball is detected. 2. The apparatus according to claim 1, wherein said remaining ball detecting means comprises an optical sensor comprising a pair of a light emitting portion and a light receiving portion having an optical axis parallel to the upper surface of said array member. 2. The conductive ball transfer device according to claim 1, further comprising a moving means for moving the conductive ball. 3. The conductive ball transfer device according to claim 2, wherein a linear groove parallel to the optical axis and intersecting the center of the plurality of recesses is formed on the surface of the arrangement member. 4. The remaining ball detecting means, a camera for imaging the upper surface of the array member, a moving means for moving the camera along the upper surface of the array member, and a conductive ball from the image captured by the camera. The conductive ball transfer device according to claim 1, further comprising an image processing unit. 5. The conductive ball transfer apparatus according to claim 4, wherein said moving means is integrally provided with a ball removing means for removing excess conductive balls on the upper surface of the arrangement member. 6. The conductive ball transfer apparatus according to claim 5, wherein said ball removing means is a plate-shaped squeegee for scraping off the conductive balls. 7. The conductive ball transfer device according to claim 5, wherein said ball removing means is a brush which slides on the conductive ball. 8. The conductive ball transfer apparatus according to claim 5, wherein said ball removing means is an air nozzle for injecting a gas to the conductive balls. 9. A method of transferring conductive balls to a predetermined position, wherein the conductive balls are accommodated one by one in a plurality of recesses formed in a predetermined arrangement on an upper surface of an arrangement member. Conducting, picking up a plurality of conductive balls contained in the concave portion by a transfer head, and detecting a conductive ball remaining in the concave portion after a pick-up operation. How to transfer a sex ball. 10. The method for transferring conductive balls according to claim 9, wherein when a conductive ball remaining in said concave portion is detected, it is determined that a pick-up error has occurred by said transfer head. 11. An optical sensor comprising a light emitting portion and a light receiving portion having an optical axis parallel to the arrangement member is relatively moved along an upper surface of the arrangement member, and the light receiving portion at this time receives light. The method for transferring conductive balls according to claim 9, wherein the conductive balls remaining in the recesses are detected based on a change in the amount of light. 12. The transfer of a conductive ball according to claim 9, further comprising a camera for picking up an image of an upper surface of the array member, and detecting a conductive ball remaining in the concave portion from an image picked up by the camera. Loading method.