JP3661499B2 - Conductive ball supply apparatus and method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a conductive ball supply device and a supply method for supplying conductive balls in an arrayed state.
[0002]
[Prior art]
As a method of forming metal bumps on electrodes of a substrate or an electronic component, a method is known in which a conductive ball such as a solder ball is transferred onto the electrode and soldered. For transferring the conductive ball, a method of vacuum-sucking the conductive ball with a suction head is widely used. In this method, a conductive ball is attracted to a large number of suction holes provided on the lower surface of the suction head, the suction head is moved onto the workpiece, and the vacuum suction is released to transfer the conductive ball to the workpiece. Is. As a method of attracting conductive balls to the lower surface of the suction head, the suction head is lowered with respect to a ball tank storing a large number of conductive balls, and the lower surface of the suction head is lowered into the conductive ball layer. The method of vacuum suction from the suction hole was used.
[0003]
[Problems to be solved by the invention]
However, the above-described method of directly adsorbing conductive balls from the ball tank to the adsorption tool has the following problems. First, since the conductive balls in the ball tank are in an irregular state charged randomly, it is difficult to quickly absorb the conductive balls into the respective suction holes on the lower surface of the suction tool. For this reason, means for promoting the adsorption of the conductive ball, such as blowing the gas into the conductive ball layer to fluidize the conductive ball or vibrating the suction tool relative to the conductive ball layer Therefore, it took a considerable amount of time for the conductive balls to be adsorbed to each adsorbing hole.
[0004]
In addition, the suction tool that has attracted the conductive ball moves to the transfer operation to the workpiece, but until the suction head finishes this transfer operation and returns to the ball tank again, there is no operation for the ball suction in the ball tank. It was not done. For this reason, coupled with the time required for the above-described ball adsorbing operation itself, it is difficult to shorten the tact time of the transfer operation of the conductive ball, and a significant improvement in productivity cannot be expected. Furthermore, in the suction operation by the suction tool, suction holes that do not attract the conductive balls are likely to occur, or suction mistakes such as excessive conductive balls are attracted to the lower surface of the suction tool. It was a cause of transfer mistakes. Thus, the conventional conductive ball transfer device has a problem that it is difficult to quickly and accurately attract the conductive ball to the transfer head.
[0005]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a conductive ball supply device that can quickly and accurately supply a conductive ball to a transfer head.
[0008]
[Means for Solving the Problems]
The conductive ball supply device according to claim 1, wherein the conductive ball supply device supplies the conductive balls in an arrayed state, and a concave portion capable of accommodating one conductive ball is arranged on the upper surface in a predetermined array. A plurality of array members, a container having a slit-like opening through which conductive balls can pass on the lower surface and housing a plurality of conductive balls, and the container in a state where the openings are closed by the array member Moving means for relatively moving along the upper surface of the array member, and the orientation of the slit-shaped openings is inclined with respect to the vertical and horizontal arrays of the recesses of the array member.
[0009]
The conductive ball supply device according to claim 2, wherein the conductive ball supply device supplies the conductive balls in an arrayed state, and a concave portion capable of accommodating one conductive ball is arranged on the upper surface in a predetermined array. A plurality of array members, a container having a slit-like opening through which conductive balls can pass on the lower surface and housing a plurality of conductive balls, and the container in a state where the openings are closed by the array member Moving means for relatively moving along the upper surface of the array member, and the direction of the slit-shaped opening is inclined with respect to the direction of relative movement of the container with respect to the array member.
[0011]
According to a third aspect of the present invention, there is provided a conductive ball supply method comprising: an array member having a plurality of recesses in a predetermined arrangement on the upper surface capable of accommodating one conductive ball; and a slit-like shape through which the conductive ball can pass on the lower surface. A conductive ball supply method comprising: a container having an opening and storing a plurality of conductive balls; and the conductive balls stored in the container are stored in the recesses and supplied in an arrayed state. The container and the array member are slid relative to each other in a state where the opening is closed by the upper surface of the array member, and the container and the array member are moved relative to each other. to slide and the step of retracting the vessel is above the recess, is inclined orientation of the slit-shaped openings with respect to the direction of relative movement sequences member of the container, this by the relative movement Moving the conductive balls in the mouth in the longitudinal direction of the opening.
[0012]
According to the present invention, the conductive ball is accommodated in the concave portion of the array member by moving the container containing the plurality of conductive balls on the lower surface, having a slit-like opening through which the conductive ball can pass. By doing so, the conductive balls can be supplied promptly and accurately.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a conductive ball transfer apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a ball supply unit of the conductive ball transfer apparatus, and FIG. FIG. 4A is a partial plan view of a ball supply unit of the conductive ball transfer device, and FIG. 4B is a ball supply of the conductive ball transfer device. 5A is a partial plan view of the array member of the ball supply unit, FIG. 5B is a cross-sectional view of the array member of the ball supply unit, FIG. 6, FIG. 7, and FIG. 8 and 9 are explanatory diagrams of the ball supply operation of the conductive ball transfer device, FIG. 10 is an explanatory diagram of the residual ball detection by the residual ball detection means, and FIG. 11 is an explanatory diagram of the ball supply operation.
[0014]
First, the structure of the conductive ball transfer device will be described with reference to FIG. In FIG. 1, a transport path 2 is disposed in the center of the base 1 in the X direction. The transport path 2 transports and positions the substrate 3. Two Y-axis tables 5 are disposed at both ends of the upper surface of the base 1. An X-axis table 6 is installed on the Y-axis table 5, and a transfer head 7 including a suction tool 8 is attached to the X-axis table 6. The transfer head 7 moves horizontally by driving the X-axis table 6 and the Y-axis table 5.
[0015]
In front of the conveyance path 2, a ball supply unit 9 (conductive ball supply device) for the conductive balls 4 is disposed. The ball supply unit 9 includes an arrangement member 10 that arranges the conductive balls 4 in a predetermined arrangement pattern. By moving the transfer head 7 above the array member 10 and lowering the transfer head 7 with respect to the array member 10, the transfer head 7 attracts the conductive balls 4 arrayed on the array member 10 with a suction tool. The conductive ball 4 is picked up by being picked up by 8 and transferred to a predetermined position on the substrate 3.
[0016]
Next, the ball supply unit 9 will be described with reference to FIGS. 2, 3, and 4. 2, 3, and 4, the array member 10 is mounted on the upper portion of the box member 11, and the lower portion of the array member 10 of the box member 11 is an airtight dark room. Overhanging portions 11 a and 11 b that extend in the Y direction and have an upper surface at the same level as the upper surface of the array member 10 are provided on the upper portion of the box member 11. A slider 50 is fixed to the bottom surface of the box member 11, and the slider 50 is slidably fitted to a guide rail 51 disposed in the Y direction on the upper surface of the base 1.
[0017]
Here, the array member 10 will be described with reference to FIG. As shown in FIG. 5 (a), a plurality of circular recesses 10a are provided in a lattice shape on the upper surface of the array member 10. As shown in FIG. The arrangement pitches Px and Py of the recesses 10a are set to be a predetermined arrangement, that is, equal to the arrangement pitch of the suction holes 8a provided in the suction tool 8 of the transfer head 7. FIG. 5B shows a BB cross section, and the diameter D and the depth d1 of the recess 10a are set to a size that can accommodate one conductive ball 4.
[0018]
A through-hole 10c that penetrates the array member 10 is provided on the bottom surface of the recess 10a. When the conductive ball 4 is present in the recess 10a, the conductive ball 4 is drawn by vacuum suction from the through-hole 10c. It is held in the recess 10a. Therefore, the concave portion 10 a and the through hole 10 c are ball holding portions that hold the conductive balls 4. Further, linear grooves 10b are provided in the X direction so as to intersect with the centers of the respective recesses 10a forming the X-direction recess rows.
[0019]
As shown in FIG. 3, a tube 53 is connected to the lower portion of the box member 11, and the tube 53 is connected to a vacuum suction source and an air supply source (not shown) via a switching valve 37. By switching the switching valve 37, the inside of the box member 11 can be vacuum-sucked, or positive pressure air can be supplied to the inside. By sucking the inside of the box member 11 in a state where the conductive balls 4 are present in the concave portions 10a of the array members 10, the conductive balls 4 are held in the concave portions 10a by vacuum suction. Further, by supplying air into the box member 11, the conductive balls 4 in the recess 10a are discharged to the outside by air blow.
[0020]
As shown in FIG. 3, a feed screw 61 that is rotationally driven by a motor 62 is screwed into the nut 60 fixed to the bottom surface of the box member 11. By driving the motor 62, the box member 11 moves horizontally in the Y direction. As shown in FIG. 2, on the movement range of the box member 11, a support column 59 is erected on the base 1 across the guide rail 51, and a plurality of plate members 58 are supported on the support plate 59 on the horizontal plate member 58. A container 54 for storing the conductive ball 4 is provided.
[0021]
As shown in FIG. 4A, the bottom portion 55 of the container 54 is provided with a slit-shaped opening 55a. The opening 55a is formed over the width direction range B2 covering the width B1 in the X direction of the ball arrangement range A in which the recesses 10a are provided in the arrangement member 10, and the longitudinal direction of the opening 55a is the arrangement member 10 This is a direction inclined by an angle α with respect to the vertical and horizontal arrangement directions (XY directions) of the concave portions 10a. That is, the opening 55a is provided so as to be inclined by the angle α with respect to the relative movement direction (Y direction) of the container 54 with respect to the arrangement member 10.
[0022]
FIG. 4B shows a CC cross section of the opening 55a. The cross-sectional shape of the opening 55a is a shape having a tapered surface 55b that expands toward the upper surface, and the width B3 of the lower portion of the opening 55a is wider than the width of one conductive ball 4, and 2 It is set narrower than the width of each piece. Therefore, at the same position, only one conductive ball 4 passes through the opening 55a at the same time.
[0023]
The bottom surface of the bottom portion 55 is in contact with the top surfaces of the array member 10 and the overhang portions 11a and 11b or is kept facing a distance equal to or less than the radius of the conductive ball 4, and can be relatively slid while maintaining this state. ing. In the state where the box member 11 has advanced in the Y direction (the state shown in FIG. 2), the overhanging portion 11a is located below the bottom 55, and in the state where the box member 11 has been retracted in the Y direction (arrow b direction) Below the bottom portion 55, the array member 10 and the overhang portion 11b are located. In this moving operation, the lower surface of the opening 55a is closed by the upper surface of the array member 10, and therefore the motor 62, the feed screw 61, and the nut 60 that move the box member 11 pass through the guide hole 55a. It is a moving means for relatively moving the container 54 along the upper surface of the array member 10 in a state where it is closed by the array member 10.
[0024]
As shown in FIG. 2, an optical sensor in which the light emitting unit 29 </ b> A and the light receiving unit 29 </ b> B are combined in pairs is attached to the upper surface of the plate member 58. The optical axis a from which the light emitted from the light emitting unit 29A reaches the light receiving unit 29B has a height direction parallel to the upper surface of the array member 10 and a direction in a horizontal plane parallel to the groove 10b. And the height position corresponds with the height position of the groove | channel 10b (refer FIG. 10). By driving the motor 62 and moving the box member 11 horizontally, the optical axis a that is emitted from the light emitting portion 29A and reaches the light receiving portion 29B moves relative to the array member 10 of the box member 11, and the light The axis a scans the height position of the groove 10 b of the array member 10. Therefore, the above-mentioned moving means for moving the box member 11 is also a moving means for moving the optical axis a in parallel with the upper surface of the array member 10.
[0025]
In this movement, when the conductive ball 4 is present in the recess 10a, the optical axis a is shielded by the conductive ball 4, and the light intensity received by the light receiving unit 29B decreases. By detecting this decrease in light intensity, the conductive ball 4 present in the recess 10a can be detected. This ball detection is used to detect the conductive balls remaining in the recesses 10a of the array member 10 after the pickup operation of picking up the conductive balls 4 arrayed on the array member 10 by the transfer head 7, that is, the remaining balls. It is done.
[0026]
The light receiving unit 29B is connected to the detection unit 70 (FIG. 10), and when the detection unit 70 receives a signal from the light reception unit 29B, the detection unit 70 detects a remaining ball based on a waveform of a graph to be described later. Therefore, the light sensor 29A and the light sensor composed of the light receiving unit 29B and the detecting unit 70 are the remaining ball detecting means. If a remaining ball is detected, the determination unit 71 (FIG. 10) determines that there has been a pickup error in the pickup operation by the transfer head 7. Therefore, the determination unit 71 is a pickup error determination unit.
[0027]
In the present embodiment, a groove 10b intersecting with the recess 10a is provided, and the remaining ball is detected by passing the optical axis a through the groove 10b. However, in the case where the groove 10b is not provided. The remaining ball can be detected by the same method. In this case, the depth dimension of the recess 10a is set to such a depth that the upper part of the conductive ball 4 protrudes, and the optical axis a is scanned along the upper surface of the array member 10 so that the optical axis a The remaining ball may be detected based on whether the amount of light is reduced by being shielded by the upper part of the conductive ball 4. However, if the ball diameter of the conductive ball 4 is reduced, it is difficult to stably detect the presence or absence of light shielding by only the upper protruding portion, and therefore a method of providing the groove 10b is desirable.
[0028]
A ball supply unit 56 is provided obliquely behind the container 54, and the conductive ball 4 is supplied into the container 54 through a supply port 57 positioned on the container 54. A line light emitting unit 26 is disposed on the front side surface of the container 54. The line light emitting unit 26 is connected to a light source device 28 via a cable 27 in which optical fibers are bundled. By turning on the lamp in the light source device 28 in a state where the line light emitting unit 26 is positioned on the array member 10, light is emitted from above the array member 10 to the recess 10 a. Therefore, the light source device 28 and the line light emitting unit 26 are light emitting means. In the present embodiment, the line light emitting unit 26 is used as the light emitting means, but LEDs (light emitting diodes) arranged in a line may be used.
[0029]
A dark room is formed below the array member 10 of the box member 11, and in a state where there is no light blocking object in the recess 10 a that blocks the light emitted from the line light emitting unit 26, the box passes through the through hole 10 c. Light enters the inside of the member 11 and is reflected in the horizontal direction by the reflecting plate 31 disposed obliquely inside. The reflected light is incident on the optical sensor 32 disposed on the inner surface of the box member 11. The optical sensor 32 is connected to the detection unit 34, and the detection unit 34 detects that light has entered the optical sensor 32. That is, the optical sensor 32 and the detection unit 34 serve as detection means for detecting light emitted from the line light emitting unit 26 and penetrating the through hole 10c.
[0030]
A determination unit 35 is connected to the detection unit 34, and the determination unit 35 determines the arrangement state of the conductive balls 4 based on the detection result signal of the detection unit 34. That is, if light incident on the optical sensor 32 is detected, it is determined that an arrangement error in which the conductive balls 4 are not accommodated in any of the recesses 10a of the arrangement member 10 is determined. Therefore, the determination unit 35 is an alignment error determination unit that determines an alignment error based on a signal from the detection unit.
[0031]
By driving the motor 62 to move the box member 11, the line light emitting unit 26 moves relative to the array member 10. That is, the above-mentioned moving means for moving the box member 11 is also a moving means for moving the line light emitting unit 26 as a light emitting means relative to the array member 10 integrally with the container 54. In this movement, when there is a concave portion 10a in which the conductive ball 4 is not accommodated as shown in FIG. 7, the light emitted from the line light emitting portion 26 passes through the through hole 10c in the concave portion 10a and is boxed. The light beam L entering the dark room inside the member 11 and reflected by the reflecting plate 31 enters the optical sensor 32. The incident light to the optical sensor 32 is detected by the detection unit 34. When an input is detected, the determination unit 35 determines that there is a ball arrangement error.
[0032]
Next, the ball supply operation to the transfer head 7 by the ball supply unit 9 will be described with reference to FIG. 3, FIG. 6, FIG. 7, FIG. First, in the state shown in FIG. 3, the conductive ball 4 is supplied into the container 54 by the ball supply unit 56. After the replenishment of the balls, the box member 11 is moved by driving the motor 62 with the lower surface of the opening 55a of the guide member 55 covered with the upper surfaces of the array member 10 and the overhanging portion 11a (see arrow c in FIG. 6). In this operation, when the opening 55a passes above the recess 10a, the conductive balls 4 in the container 54 are accommodated in the recess 10a of the array member 10 through the opening 55a.
[0033]
FIG. 11A shows the conductive ball in the opening 55a when the arraying member 10 is moved in the arrow f direction with respect to the container 54 in a state where the conductive ball 4 is supplied in the container 54. 4 movements are shown. When the conductive balls 4 are placed on the bottom surface 55, the conductive balls 4 are initially present in the openings 55a in a random state. However, when the arraying member 10 moves in the direction of the arrow f, FIG. As shown, the conductive balls 4 present in the openings 55a move in the direction of the arrow f together with the array members 10 and come into contact with the tapered surface 55b.
[0034]
At this time, a force F directed in the moving direction of the conductive ball 4 acts on the tapered surface 55b. However, since the opening 55a is inclined with respect to the moving direction, the conductive ball 4 is opened to the opening. A component force F1 is generated that pushes in the longitudinal direction in 55a. Thereby, during the relative movement of the array member 10, a force that always moves the conductive balls 4 inside the openings 55a in the longitudinal direction acts. Therefore, even if it is a random state with a gap at the start of movement, the conductive ball 4 is continuously present inside the opening 55a after the movement starts.
[0035]
Therefore, by moving the container 54 relative to the array member 10 in this state, the conductive ball 4 in the opening 55a surely enters the recess 10a at the position where the opening 55a and the recess 10a coincide. To do. The gap generated by the separation of the conductive ball 4 from the opening 55a is promptly changed because the force for moving the conductive ball 4 in the longitudinal direction always acts in the opening 55a as described above. It is occupied by the conductive ball 4 and disappears. Thereby, the situation that the conductive ball 4 does not exist in the opening 55a located on the empty concave portion 10a does not occur, and the conductive ball 4 is reliably fed into all the concave portions 10a.
[0036]
The conductive ball 4 accommodated in the recess 10a by the feeding operation is vacuum-sucked by the through-hole 10c by being vacuumed from the tube 53 and is held in the recess 10a. Next, the container 54 is retracted from above the array member 10 by moving the box member 11 in the direction indicated by the arrow d in FIG. Also in this retreating operation, since the opening 11a passes again above the recess 10a, the conductive ball can be fed into the recess 10 where the conductive ball 4 could not be accommodated.
[0037]
Further, in this retracting operation, a lamp in the light source device 28 (see FIG. 2) is turned on to emit light toward the array member 10 below the line light emitting unit 26. Thereby, the light irradiates the array member 10, and when there is a concave portion 10 a that does not hold the conductive ball 4 as shown in FIG. 7, the light emitted from the line light emitting portion 26 penetrates the concave portion 10 a. The light passes through the hole 10 c and enters the dark room inside the box member 11, is reflected by the reflecting plate 31, and enters the optical sensor 32. Then, the detection unit 34 detects the incidence of light, and the determination unit 35 determines the presence or absence of misalignment of the conductive balls 4 based on the detection result.
[0038]
In the present embodiment, since the light emitting means (line light emitting unit 26) is integrally attached to the container 54, it is possible to detect misalignment while the container 54 is retracted from the upper surface of the array member 10. As a result, the time for detecting the misalignment is overlapped with the evacuation operation to be substantially zero, thereby improving the work efficiency.
[0039]
Thereafter, as shown in FIG. 8, the box member 11 further advances in the direction of arrow e, and the container 54 moves onto the overhanging portion 11a. As a result, when the concave portions 10a of the array member 10 are completely exposed and the array member 10 is in a free state, the transfer head 7 is moved onto the array member 10. Then, the suction hole 8a of the suction tool 8 is aligned with the recess 10a, and the transfer head 7 is lowered. When the suction tool 8 performs vacuum suction, the conductive ball 4 held in the recess 10 a is vacuum-sucked in the suction hole 8 a of the suction tool 8.
[0040]
At this time, the switching valve 37 may be switched to supply slightly positive air into the box member 11. Thereby, the separation of the conductive ball 4 from the recess 10a is facilitated, and the adsorption of the conductive ball 4 to the suction hole 8 is promoted. Thereafter, as shown in FIG. 9, the transfer head 7 is raised, and the transfer head 7 picking up the conductive ball 4 by each suction hole 8 a of the suction tool 8 puts the conductive ball 4 at a predetermined position on the substrate 3. Transfer.
[0041]
As a result, the conductive balls 4 are not present in the recesses 10a of the array member 10. However, for some reason, a suction error to the suction holes 8a occurs, and even after the pickup operation, the state shown in FIG. As shown, the conductive ball 4 may remain in the recess 10a. Therefore, a ball detection operation for detecting such a remaining ball is performed. That is, by driving the motor 62 to move the box member 11, the optical axis a from the light emitting portion 29A to the light receiving portion 29B is moved relative to the array member 10, and the optical axis a is increased to the height of the groove 10b. Scan at the position.
[0042]
At this time, when the conductive ball 4 does not remain in the recesses 10a intersecting with the grooves 10b, the light from the light emitting part 29A is received by the light receiving part 29B. A graph of the waveform indicating the mountain and valley is obtained (see FIGS. 10B and 10A). On the other hand, when the conductive ball 4 remains in any one of the recesses 10a, the light from the light emitting portion 29A is blocked by the conductive ball 4 and does not reach the light receiving portion 29B. Therefore, in such a case, a graph is obtained in which a peak waveform (broken line portion indicated by an arrow in the figure) that should originally appear at the position corresponding to the recess row to which the recess 10a belongs (FIG. 10B (b)). )reference).
[0043]
The residual ball detection based on the graph waveform is performed by receiving a signal from the light receiving unit 29B by the detection unit 70, and based on the residual ball detection result of the detection unit 70, the determination unit 71 detects a pickup mistake by the transfer head 7. Presence / absence is determined. In the present embodiment, since the light emitting unit 29A and the light receiving unit 29B are moved integrally with the container 54, the conductive ball 4 is accommodated in the empty recess 10a simultaneously with the operation of detecting the remaining ball. Thus, the cycle time of supplying the conductive balls by the ball supply unit 9 is shortened, and the productivity of the conductive ball transfer device is increased.
[0044]
As described above, in the present embodiment, the shape of the opening 55a through which the conductive ball 4 is fed from the container 54 to the array member 10 is a slit as described above. Thereby, even when the arrangement of the conductive balls is different, the conductive balls can be arranged on the arrangement member 10 by sharing the same container. In addition, since the shape of the opening is simple, processing is easy and low cost, and it is possible to achieve low cost of the arrangement mechanism in combination with the above-described container sharing.
[0045]
This arrangement of the conductive balls is performed by moving the container relative to the arrangement member, and the supply of the conductive balls to the transfer head 7 only needs to adsorb the arranged conductive balls. Compared with the method of lowering the conventional suction tool directly to the ball tank and sucking the conductive ball, the conductive ball can be supplied to the transfer head in a very short time.
[0046]
【The invention's effect】
According to the present invention, the conductive ball is accommodated in the concave portion of the array member by moving the container containing the plurality of conductive balls on the lower surface, having a slit-like opening through which the conductive ball can pass. As a result, the conductive balls can be supplied promptly and accurately.
[Brief description of the drawings]
FIG. 1 is a perspective view of a conductive ball transfer device according to an embodiment of the present invention. FIG. 2 is a perspective view of a ball supply unit of the conductive ball transfer device according to an embodiment of the present invention. 3 is a cross-sectional view of a ball supply unit of a conductive ball transfer device according to an embodiment of the present invention. FIG. 4 (a) a ball supply unit of a conductive ball transfer device according to an embodiment of the present invention. (B) Sectional view of the opening of the ball supply portion of the conductive ball transfer device of one embodiment of the present invention FIG. 5 (a) (a) The ball supply portion of one embodiment of the present invention FIG. 6B is a sectional view of the array member of the ball supply unit of the embodiment of the present invention. FIG. 6 is a ball supply operation of the conductive ball transfer device of the embodiment of the present invention. FIG. 7 is an explanatory view of the ball supply operation of the conductive ball transfer device according to the embodiment of the present invention. FIG. 9 is an explanatory view of the ball supply operation of the conductive ball transfer device according to the embodiment. FIG. 9 is an explanatory view of the ball supply operation of the conductive ball transfer device according to the embodiment of the invention. FIG. 11 is a diagram illustrating how a remaining ball is detected by a remaining ball detection unit according to an embodiment of the invention. FIG. 11 is a diagram illustrating a ball supply operation according to an embodiment of the invention.
3 Substrate 4 Conductive ball 7 Transfer head 8 Suction tool 9 Ball supply unit 10 Array member 10a Recess 10b Groove 10c Through hole 11 Box member 26 Line light emitting unit 28 Light source device 29A Light emitting unit 29B Light receiving unit 32 Optical sensor 34 Detection unit 35 Determination unit 54 container 55a opening

Claims (3)

A conductive ball supply device for supplying conductive balls in an array state, wherein an array member having a plurality of recesses in a predetermined arrangement on the upper surface capable of accommodating one conductive ball, and a conductive ball on a lower surface A container having a slit-like opening that can pass therethrough and housing a plurality of conductive balls, and a movement that relatively moves the container along the upper surface of the array member while the opening is closed by the array member. and means, the orientation of the slit-shaped openings, the supply device of the conductive ball characterized in that it is inclined with respect to the sequence of vertical and horizontal recess of the array member. A conductive ball supply device for supplying conductive balls in an array state, wherein an array member having a plurality of recesses in a predetermined arrangement on the upper surface capable of accommodating one conductive ball, and a conductive ball on a lower surface A container having a slit-like opening that can pass therethrough and housing a plurality of conductive balls, and a movement that relatively moves the container along the upper surface of the array member while the opening is closed by the array member. and means, the orientation of the slit-shaped openings, the supply device of the conductive ball shall be the being inclined with respect to the direction of relative movement sequences member of the container. The upper surface has an array member having a plurality of recesses that can accommodate one conductive ball in a predetermined arrangement, and the lower surface has a slit-like opening through which the conductive ball can pass, and stores the plurality of conductive balls. And a conductive ball supplying method in which the conductive balls accommodated in the container are accommodated in the recesses and supplied in an arrayed state, wherein the openings are closed by the upper surface of the arraying member. The container and the array member are slid relative to each other to pass the opening over the recess, and the container and the array member are relatively slid to move the container from above the recess. and a step of retracting, the orientation of the slit-shaped opening is inclined with respect to the direction of relative movement sequences member of the container, longitudinal opening conductive balls in the opening by the relative movement The method of supplying the conductive ball characterized by causing moved.

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