JP2001019765A5 - - Google Patents
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- Publication number
- JP2001019765A5 JP2001019765A5 JP1999191404A JP19140499A JP2001019765A5 JP 2001019765 A5 JP2001019765 A5 JP 2001019765A5 JP 1999191404 A JP1999191404 A JP 1999191404A JP 19140499 A JP19140499 A JP 19140499A JP 2001019765 A5 JP2001019765 A5 JP 2001019765A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric constant
- polymer composition
- low dielectric
- constant polymer
- general formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 10
- 239000004642 Polyimide Substances 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- -1 amine compound Chemical class 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19140499A JP4423705B2 (ja) | 1999-07-06 | 1999-07-06 | 低誘電率重合体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19140499A JP4423705B2 (ja) | 1999-07-06 | 1999-07-06 | 低誘電率重合体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001019765A JP2001019765A (ja) | 2001-01-23 |
| JP2001019765A5 true JP2001019765A5 (enExample) | 2006-08-17 |
| JP4423705B2 JP4423705B2 (ja) | 2010-03-03 |
Family
ID=16274052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19140499A Expired - Fee Related JP4423705B2 (ja) | 1999-07-06 | 1999-07-06 | 低誘電率重合体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4423705B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5600911B2 (ja) * | 2009-09-18 | 2014-10-08 | 富士ゼロックス株式会社 | 定着用フッ素化ポリイミド無端ベルト、ベルトユニットおよび画像形成装置 |
| RU2645922C2 (ru) * | 2016-06-29 | 2018-03-01 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Ярославский государственный университет им. П.Г. Демидова" | Способ получения N1-[2-амино-4-(трифторметил)фенил]-N1-фенил-4-(трифторметил)бензол-1,2-диамина и его производных |
| KR102733576B1 (ko) * | 2018-12-28 | 2024-11-21 | 주식회사 두산 | 폴리아믹산 조성물, 및 이를 이용한 투명 폴리이미드 필름 |
| CN113501983B (zh) * | 2021-04-15 | 2024-05-31 | 中山新高电子材料股份有限公司 | 一种具有低介电和低吸水率的聚酰亚胺薄膜及其制备方法 |
| CN115044203A (zh) * | 2022-05-23 | 2022-09-13 | 中电科芜湖钻石飞机制造有限公司 | 低介电耐高温树脂基复合材料及其制备方法 |
| CN115612098B (zh) * | 2022-07-28 | 2023-10-03 | 江西有泽新材料科技有限公司 | 一种本征型低介电低吸水的聚合物及其制备方法和应用 |
| CN118290733B (zh) * | 2024-06-05 | 2024-08-30 | 大连理工大学 | 高氟含量聚酰亚胺、气体分离膜及其制备方法与应用 |
-
1999
- 1999-07-06 JP JP19140499A patent/JP4423705B2/ja not_active Expired - Fee Related
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