JP2001019765A5 - - Google Patents

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JP2001019765A5
JP2001019765A5 JP1999191404A JP19140499A JP2001019765A5 JP 2001019765 A5 JP2001019765 A5 JP 2001019765A5 JP 1999191404 A JP1999191404 A JP 1999191404A JP 19140499 A JP19140499 A JP 19140499A JP 2001019765 A5 JP2001019765 A5 JP 2001019765A5
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Japan
Prior art keywords
dielectric constant
polymer composition
low dielectric
constant polymer
general formula
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JP1999191404A
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Japanese (ja)
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JP2001019765A (en
JP4423705B2 (en
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Priority to JP19140499A priority Critical patent/JP4423705B2/en
Priority claimed from JP19140499A external-priority patent/JP4423705B2/en
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Publication of JP2001019765A5 publication Critical patent/JP2001019765A5/ja
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Description

【特許請求の範囲】
【請求項１】一般式（１）で表されるフッ素含有アミン化合物で分子末端を封止することを特徴とした低誘電率重合体組成物であり、該低誘電率重合体組成物がポリアミド酸、またはポリイミドである低誘電率重合体組成物。
【化１】

Figure 2001019765
（一般式（１）において、ＲはＦ、Ｒｆ、ＯＲｆから選ばれる少なくとも１つを示し、Ｒｆはフルオロ基を有する炭素数１〜２０までの一価の有機基を示す。ｎは１〜５の整数を示す。ｎが２以上の場合、Ｒは１種または２種以上を混在させてもよい。）
【請求項２】請求項１記載の低誘電率重合体組成物が分岐状ポリアミド酸、または分岐状ポリイミドであることを特徴とする低誘電率重合体組成物。
【請求項３】請求項２記載の低誘電率重合体組成物の比誘電率が２．８未満であることを特徴とする低誘電率重合体組成物。 [Claims]
1. A low dielectric constant polymer composition characterized in that the terminal of the molecule is blocked with a fluorine-containing amine compound represented by the general formula (1), wherein the low dielectric constant polymer composition is a polyamide. A low dielectric constant polymer composition which is an acid or a polyimide .
Embedded image
Figure 2001019765
(In the general formula (1), R represents at least one selected from F, Rf, and ORf, and Rf represents a monovalent organic group having a fluoro group and having 1 to 20 carbon atoms. N represents 1 to 5) In the case where n is 2 or more, R may be one kind or a mixture of two or more kinds.)
2. The low dielectric constant polymer composition according to claim 1, wherein the low dielectric constant polymer composition is a branched polyamic acid or a branched polyimide.
3. The low dielectric constant polymer composition according to claim 2 , wherein the relative dielectric constant of the low dielectric constant polymer composition is less than 2.8.

【０００５】
【課題を解決するための手段】
本発明は、一般式（１）で表されるフッ素含有アミン化合物で分子末端を封止することを特徴とした低誘電率重合体組成物であり、該低誘電率重合体組成物がポリアミド酸、またはポリイミドである低誘電率重合体組成物である。
[0005]
[Means for Solving the Problems]
The present invention is a low dielectric constant polymer composition characterized in that a molecular end is blocked with a fluorine-containing amine compound represented by the general formula (1), and the low dielectric constant polymer composition is a polyamic acid. Or a low dielectric constant polymer composition which is a polyimide.

JP19140499A 1999-07-06 1999-07-06 Low dielectric constant polymer Expired - Fee Related JP4423705B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19140499A JP4423705B2 (en) 1999-07-06 1999-07-06 Low dielectric constant polymer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19140499A JP4423705B2 (en) 1999-07-06 1999-07-06 Low dielectric constant polymer

Publications (3)

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JP2001019765A JP2001019765A (en) 2001-01-23
JP2001019765A5 true JP2001019765A5 (en) 2006-08-17
JP4423705B2 JP4423705B2 (en) 2010-03-03

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JP19140499A Expired - Fee Related JP4423705B2 (en) 1999-07-06 1999-07-06 Low dielectric constant polymer

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5600911B2 (en) * 2009-09-18 2014-10-08 富士ゼロックス株式会社 Fluorinated polyimide endless belt for fixing, belt unit and image forming apparatus
RU2645922C2 (en) * 2016-06-29 2018-03-01 Федеральное государственное бюджетное образовательное учреждение высшего образования "Ярославский государственный университет им. П.Г. Демидова" Method for production of n1-[2-amino-4-(trifluoromethyl) phenyl]-n1-phenyl-4-(trifluoromethyl)-benzene-1,2-diamine and its derivatives
CN113501983B (en) * 2021-04-15 2024-05-31 中山新高电子材料股份有限公司 Polyimide film with low dielectric and low water absorption rate and preparation method thereof
CN115044203A (en) * 2022-05-23 2022-09-13 中电科芜湖钻石飞机制造有限公司 Low-dielectric high-temperature-resistant resin-based composite material and preparation method thereof
CN115612098B (en) * 2022-07-28 2023-10-03 江西有泽新材料科技有限公司 Intrinsic low-dielectric low-water-absorption polymer and preparation method and application thereof

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