JP2006188610A5 - - Google Patents
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- JP2006188610A5 JP2006188610A5 JP2005001776A JP2005001776A JP2006188610A5 JP 2006188610 A5 JP2006188610 A5 JP 2006188610A5 JP 2005001776 A JP2005001776 A JP 2005001776A JP 2005001776 A JP2005001776 A JP 2005001776A JP 2006188610 A5 JP2006188610 A5 JP 2006188610A5
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- integer
- osi
- carbon atoms
- integers
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Description
上記ｅは０以上の整数であるが、好ましくは０〜５００の整数であり、より好ましくは５〜１００の整数である。上記ｆは１以上の整数であるが、好ましくは１〜１００の整数であり、より好ましくは２〜５０の整数である。上記ｇは１以上の整数であるが、好ましくは１〜１００の整数であり、より好ましくは１〜５０の整数である。上記ｈは０以上の整数であるが、好ましくは０〜１００の整数であり、より好ましくは０〜５０の整数である。 The e is an integer of 0 or more, preferably an integer of 0 to 500, more preferably an integer of 5 to 100. Said f is an integer greater than or equal to 1, Preferably it is an integer of 1-100, More preferably, it is an integer of 2-50. The g but is an integer of 1 or more, preferably 1 to 100 integer, more preferably an integer of 1 to 50. Said h is an integer greater than or equal to 0, Preferably it is an integer of 0-100, More preferably, it is an integer of 0-50.
（ｅ）成分の具体例としては、下記一般式（７）〜（９）：
R3-Si(R3)2-[OSi(R3)2]i-[OSi(R3)(H)]j-OSi(R3)2-R3 （７）
R3-Si(R3)2-[OSi(R3)2]i-[OSi(R3)(H)]k-OSi(R3)2-H （８）
H-Si(R3)2-[OSi(R3)2]i-[OSi(R3)(H)]l-OSi(R3)2-H （９）
（式中、Ｒ３は独立に脂肪族不飽和結合を含有しない非置換または置換の、炭素原子数が好ましくは１〜１２、より好ましくは１〜１０、更により好ましくは１〜６の１価炭化水素基であり、ｉおよびlは０以上の整数であり、ｊおよびｋは１以上の整数である）で表されるオルガノハイドロジェンポリシロキサンが挙げられる。これらのオルガノハイドロジェンポリシロキサンは、１種単独で使用しても、２種以上を併用してもよい。
Specific examples of the component (e) include the following general formulas (7) to (9):
R 3 -Si (R 3 ) 2- [OSi (R 3 ) 2 ] i- [OSi (R 3 ) (H)] j -OSi (R 3 ) 2 -R 3 (7)
R 3 -Si (R 3 ) 2- [OSi (R 3 ) 2 ] i- [OSi (R 3 ) (H)] k -OSi (R 3 ) 2 -H (8)
H-Si (R 3 ) 2- [OSi (R 3 ) 2 ] i- [OSi (R 3 ) (H)] l -OSi (R 3 ) 2 -H (9)
(In the formula, R 3 independently represents an unsubstituted or substituted monovalent valence having 1 to 12 carbon atoms, more preferably 1 to 10 carbon atoms, and even more preferably 1 to 6 carbon atoms, which does not contain an aliphatic unsaturated bond. Hydrocarbon group, i and l are integers of 0 or more, and j and k are integers of 1 or more). These organohydrogenpolysiloxanes may be used alone or in combination of two or more.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005001776A JP4463117B2 (en) | 2005-01-06 | 2005-01-06 | Flame-retardant and heat-conductive silicone molded article and method for producing the same |
| TW095100465A TW200632043A (en) | 2005-01-06 | 2006-01-05 | The low flammability, heat-conductivity silicone plastic and the producing method |
| CN 200610051332 CN1803925A (en) | 2005-01-06 | 2006-01-05 | Flame-retardant heat-conductive silicone former and method of producing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005001776A JP4463117B2 (en) | 2005-01-06 | 2005-01-06 | Flame-retardant and heat-conductive silicone molded article and method for producing the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006188610A JP2006188610A (en) | 2006-07-20 |
| JP2006188610A5 true JP2006188610A5 (en) | 2008-01-24 |
| JP4463117B2 JP4463117B2 (en) | 2010-05-12 |
Family
ID=36796106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005001776A Expired - Fee Related JP4463117B2 (en) | 2005-01-06 | 2005-01-06 | Flame-retardant and heat-conductive silicone molded article and method for producing the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4463117B2 (en) |
| CN (1) | CN1803925A (en) |
| TW (1) | TW200632043A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5283346B2 (en) | 2007-04-10 | 2013-09-04 | 信越化学工業株式会社 | Thermally conductive cured product and method for producing the same |
| CN101168620B (en) * | 2007-09-04 | 2012-07-25 | 东莞兆舜有机硅新材料科技有限公司 | Heat-conducting anti-flaming liquid silicon rubber and preparation method thereof |
| JP5233325B2 (en) | 2008-02-29 | 2013-07-10 | 信越化学工業株式会社 | Thermally conductive cured product and method for producing the same |
| JP6061463B2 (en) * | 2011-08-08 | 2017-01-18 | 日東電工株式会社 | Adhesive tape or sheet |
| JP6674590B1 (en) * | 2018-05-08 | 2020-04-01 | 富士高分子工業株式会社 | Thermal conductive sheet, mounting method using the same, and bonding method using the same |
| CN109627473B (en) * | 2018-12-14 | 2020-07-31 | 东莞市佳迪新材料有限公司 | Preparation process of enhanced organic silicon composite sheet with surface tack removal function |
| CN109608886B (en) * | 2018-12-14 | 2021-02-05 | 东莞市佳迪新材料有限公司 | Enhanced organic silicon composite sheet with surface viscosity removal function |
| JP2021187877A (en) * | 2020-05-26 | 2021-12-13 | 信越化学工業株式会社 | Two-liquid addition curing type silicone rubber composition |
-
2005
- 2005-01-06 JP JP2005001776A patent/JP4463117B2/en not_active Expired - Fee Related
-
2006
- 2006-01-05 TW TW095100465A patent/TW200632043A/en not_active IP Right Cessation
- 2006-01-05 CN CN 200610051332 patent/CN1803925A/en active Pending
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