JP2001007591A - Electronic component mounting apparatus and method of feeding electronic component used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow component sets to be replaced more safely and easily by a worker for making each component set capable of being slidably mounted and removed and improving the feed efficiency of electronic components. SOLUTION: In a feeding method, an operation controller requests data concerning feed positions of a component feeder which houses electronic components memorized in a data memory (step S31), the data memory transmits data about the feed positions to the operation controller (S32), the controller sends signals to component cassette designated terminals, corresponding to component cassettes attached to the component feeder and designates component cassettes which house electronic components to be mounted (S33). It further sends signals to feed operation terminals, corresponding to the component cassettes to feed required components for the component cassettes. This step is repeated so as to successively feed the electronic components to be mounted (S34).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electronic component mounting apparatus for mounting electronic components on a circuit board, and an electronic component supply method used therefor.

[0002]

2. Description of the Related Art An example of a conventionally known electronic component mounting apparatus and a method of supplying an electronic component used therein will be described with reference to FIGS. FIG. 6 is an overall perspective view showing a conventional electronic component mounting apparatus. The electronic component mounting apparatus 50 is configured to sequentially move and mount electronic components on a circuit board held at a predetermined position, and basically, with respect to a circuit board 51 carried in by a circuit board transport unit 57. Then, by a mounting head 52 capable of sucking and holding an electronic component by a nozzle 53 provided on the tip side thereof, the electronic component is sequentially moved to a predetermined position on the circuit board 51 and then subjected to a bonding operation such as thermal bonding. Perform the implementation.

In the electronic component mounting apparatus 50, a component supply unit 54 is provided as a means for supplying the electronic components to the mounting head 52, by sequentially sending and supplying the electronic components to a position where the mounting head 52 sucks the electronic components. I have. A plurality of component cassettes 55 such as taping cassettes or sticks each having a plurality of electronic components are attached to the component supply unit 54, and a predetermined feed mechanism 56 is designated when sending out the electronic components. The electronic component is moved to a position that can correspond to the component cassette 55 and the component cassette 55 performs a feeding operation, so that one electronic component is sent out. That is, the conventional electronic component mounting apparatus 5
At 0, the integrated feed mechanism 56 moves between a plurality of component cassettes 55, and one electronic component is supplied for each operation. In addition, the plurality of component cassettes 55 attached to the electronic component supply unit 54 are replaced, for example, when components run out.

FIG. 7 is an explanatory diagram showing an operation flow of each component in the conventional electronic component mounting apparatus 50. First, in step 60 (hereinafter, step is referred to as S), the circuit board is transported onto a mounting stage. Next, in S70, supply and mounting of electronic components are performed. In this supply / mounting operation, first, the feed mechanism 56 is moved with respect to a predetermined component cassette in the electronic component supply unit 54 (S71), and the component cassette 55 performs a feed operation to remove one electronic component. It is sent out (S72). Then, the mounting head 52 is moved so that the nozzle 53 provided on the distal end side sucks the electronic component (S73), and the electronic component is sucked and held (S74) and moved to a predetermined position on the circuit board (S75). ) (S76). Such a supply / mounting operation is repeated until there are no more electronic components stored in the electronic component supply unit 54. Finally, in step S80, the circuit board is carried out of the mounting stage 51. Subsequently, when supplying and mounting electronic components, the component cassette 55 in the electronic component supply unit 54 is replaced with a new one.

[0005]

However, with the recent technological progress, in performing surface mounting using the electronic component mounting apparatus 50, improvement in productivity and reliability in terms of safety are more emphasized. It has become. However, in the above-described conventional electronic component mounting apparatus 50, for example, the feed mechanism 56 that sends out the electronic component in each component supply unit 54.
Accordingly, the electronic components can be supplied only one by one from the component supply unit 54, and the component cassettes 55 attached to the component supply unit 54 while the electronic components are sequentially mounted on the circuit board.
In any one of the above, when an electronic component runs out of components, there is a factor that hinders improvement in productivity, such as inability to individually replace the electronic component. Furthermore, in the above-described conventional electronic component mounting apparatus 50, when a component cassette 55 that stores a plurality of electronic components is attached to the component supply unit 54, the component cassette 55 itself may interfere with the feed mechanism unit 56, If such interference occurs due to a mounting error or the like, there is a possibility that the feed mechanism 56 may be damaged or a worker near the apparatus may be harmed, and there is a problem regarding reliability in terms of safety. are doing.

SUMMARY OF THE INVENTION The present invention has been made in view of the above technical problems, and improves the supply efficiency of electronic components.
It is an object of the present invention to provide an electronic component mounting apparatus in which an operator of the apparatus can exchange a component cassette more safely and easily, and a method of supplying electronic components used therein.

[0007]

An invention according to claim 1 of the present application (hereinafter referred to as a first invention) supplies an electronic component in an electronic component mounting apparatus for mounting an electronic component at a predetermined position on a circuit board. A component supply unit to which a plurality of component cassettes capable of feeding operation are attached has a predetermined slide mechanism corresponding to the component cassette, and that each component cassette can be slidably attached and detached. It is a characteristic.

The invention according to claim 2 of the present application (hereinafter referred to as “the invention”)
According to a second aspect of the present invention, a component cassette designation terminal to which a signal for designating a component cassette is sent when supplying electronic components, and a designated component cassette corresponding to each component cassette attached to the component supply unit. And a feed operation terminal to which a signal for performing a feed operation is sent.

Further, the invention according to claim 3 of the present application (hereinafter referred to as “the invention”)
The third invention is used in an electronic component mounting apparatus that mounts electronic components supplied from a component supply unit to which a plurality of component cassettes that can perform a feed operation to supply electronic components are mounted at predetermined positions on a circuit board. In the electronic component supply method, at least one of the component cassettes in the component supply unit is designated by sending a signal to a component cassette designation terminal provided corresponding to the component cassette, and the designated component cassette is designated. The method is characterized in that it has a step of feeding electronic components by feeding a component cassette by sending a signal to a feed operation terminal provided corresponding to the component cassette.

Further, the invention according to claim 4 of the present application (hereinafter, referred to as a fourth invention) is characterized in that two or more component cassettes in the component supply section are provided corresponding to the component cassettes. By specifying a signal by sending a signal to one or more component cassette designating terminals, for each of the designated two or more component cassettes, a signal is sent to a feed operation terminal provided corresponding to each component cassette, whereby each component is designated. It is characterized in that it has a step of feeding electronic components simultaneously by feeding the cassette.

Further, the invention according to claim 5 of the present application (hereinafter, referred to as a fifth invention) is characterized in that, when one of the component cassettes in the component supply section runs out of components,
A signal is sent to a component cassette designation terminal provided corresponding to the component cassette, and a component cassette that has run out of components is automatically slid by a predetermined slide mechanism, thereby notifying the component cassette that the component has run out, and the component is notified. A step of replacing the cassette with a new component cassette.

[0012]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. 1 and 2 are an overall perspective view schematically showing an electronic component mounting apparatus according to an embodiment of the present invention, and a block diagram of a main configuration included in the apparatus. This electronic component mounting apparatus 10
As a basic configuration, a substrate transport unit 2 for loading / unloading a circuit board 1 and a nozzle for sucking and holding an electronic component are provided at the distal end thereof, and the electronic component is moved to be mounted on the circuit board 1. A head 3, a head driving unit 8 for moving the mounting head 3 in a horizontal direction and a vertical direction, and an electronic component supply unit 4 for sequentially sending and supplying the electronic components to a position where the mounting head 3 sucks the electronic components. Have. Also,
The electronic component mounting apparatus 10 includes an operation control unit 11 that controls the operation of each of the operation units, and data that is used as a reference when the operation control unit 11 controls the operation (for example, when the electronic component is mounted on the circuit board 1). And a data storage unit 12 for storing the position and angle of the electronic component and the supply position of the electronic component in the electronic component supply unit 4. Further, as can be clearly understood from FIG. 1, when the electronic component stored in the electronic component supply unit 4 is exhausted, the electronic component mounting apparatus 10 replaces the exhausted electronic component and then completes the replacement. To notify the operation control unit 11 of the change. In this embodiment, a mounting head that suctions and holds an electronic component by a nozzle is employed. However, the present invention is not limited to this, and a mounting head that holds an electronic component by a mechanical chuck may be used.

An electronic component mounting apparatus 10 having such a configuration
Then, as shown in FIG. 2, the operation control unit 11 requests the data stored in the data storage unit 12 and sends an operation command to each operation unit based on the obtained data. Is moved from the electronic component supply unit 4 to a predetermined position on the circuit board 1 loaded by the board transfer unit 2 while holding the electronic component supplied by the electronic component supply unit 4 by suction. The electronic components are mounted on the circuit board 1 by performing a joining operation such as joining.

FIG. 3 is a perspective view of the electronic component supply unit 4. The electronic component supply section 4 sequentially sends out and supplies the electronic components to a position where the mounting head 3 sucks the electronic components when mounting the electronic components. In this embodiment, a plurality of component cassette grooves 4a are provided. When mounting electronic components, a component cassette 18 such as a taping cassette or a stick is attached to each of these component cassette grooves 4a. Also, corresponding to each of these parts cassette groove 4a and parts cassette 18,
A component cassette designation terminal 15 (a terminal on the upper side in the figure) to which a signal for designating a component cassette is sent when supplying electronic components, and a feed operation terminal 16 (a figure in the figure) to which a signal for feeding the designated component cassette is sent. (A terminal on the lower side).

Next, in order to clarify the operation of the electronic component supply unit 4 having the component cassette designation terminal 15 and the feed operation terminal 16, the supply and mounting operation of the electronic component mounting apparatus will be described with reference to the flowchart of FIG. I will explain while. In the electronic component mounting apparatus 10, first, the circuit board 1 is transported by the board transport unit 2 (S10), and subsequently, the electronic components are mounted on the transported circuit board 1 by the mounting head (S20). At the same time, the electronic component supply unit 4 supplies the next electronic component to be mounted (S30). In the supply step, the operation control unit 11 requests data relating to the supply position of the component supply unit 4 in which the electronic components stored in the data storage unit 12 are stored (that is, the component cassette attached to the component supply unit 4). (S31), the data storage unit 1
2 transmits data on the supply position to the operation control unit 11 (S32). The operation control unit 11 performs a component cassette designation terminal corresponding to the component cassette 18 in order to perform a feed operation in one of the component cassettes 18 attached to the electronic component supply unit 4 based on the content of the data. A signal is sent to the component 15 to designate the component cassette 18 in which the electronic component to be mounted is stored (S33).
Further, in order to send out electronic components from the designated component cassette 18, a signal is sent to the feed operation terminal 16 corresponding to the component cassette 18, and the component cassette 1
8 is made to perform a feed operation only for a necessary amount. By repeating the above steps, electronic components to be mounted are sequentially supplied (S34).

On the other hand, in the mounting step, first, in order to suck and hold the electronic component supplied in the above-described supplying step, the mounting head 3 is operated by the electronic component in response to the signal transmitted from the operation control unit 11. The electronic component is moved to the position where the electronic component is supplied by the supply unit 4 (S21), and the electronic component is sucked (S22). The mounting head 3 moves to a predetermined position above the circuit board 1 while sucking and holding the electronic component (S23). Then, the electronic component is mounted at a predetermined position on the circuit board 1 (S24). Such supply and mounting steps are:
Based on the data stored in the data storage unit 12 in advance, the process is repeated until the mounting of all the electronic components on one circuit board 1 is completed. Thereafter, the circuit board 1 on which all the electronic components are mounted is carried out by the board transport unit 2 (S40).

As described above, in this embodiment, since the component cassette designation terminals 15 are individually provided corresponding to the component cassettes 18 attached to the electronic component supply section 4, a plurality of component cassettes are provided. By sending a signal to the designated terminal 15, a plurality of component cassettes in the component supply unit 4 are designated at the same time, and further, by sending a signal to each feed operation terminal 16 corresponding to the designated component cassette 18, the electronic In the component supply unit 4, a plurality of electronic components can be supplied at the same time. The difference from the conventional electronic component mounting apparatus is that the operation for supplying the electronic components is performed by the operation control unit controlling the component cassette designation terminal 15, the feed operation terminal 16, and the exchange completion switch 9. It is.

In the above-described embodiment, the mounting head 3 is provided with only one nozzle for sucking and holding an electronic component. However, the present invention is not limited to this, and a plurality of nozzles may be provided. . In this case, for example, the component cassette designation terminal 15 provided in the electronic component supply unit 4
, A plurality of electronic components are supplied at the same time by sending a signal to the feed operation terminal 16 corresponding to each terminal, and the nozzles suck and hold the plurality of supplied electronic components. It is possible to take out. When a signal is sent to a plurality of component cassette designation terminals 15, the number is determined, for example, by storing the data as a default value in the data storage unit 12 or by data such as a mounting position on the circuit board 1. This is performed by giving the information of the number together.

Further, in the case where the electronic component mounting apparatus 10 is equipped with a camera for receiving the electronic component or the circuit board 1, the electronic component is recognized by the camera to determine the quality of the electronic component. Even if a process of correcting the mounting position or the angle is corrected based on the state of being sucked by the suction nozzle, or by recognizing the circuit board 1 with a camera, the circuit board 1 is mounted on the electronic component mounting apparatus 10. A step of correcting the displacement may be performed.

Subsequently, a component cassette 18 such as a taping cassette or a stick installed in the component supply section 4 is provided.
A method of replacing the component cassette when the electronic component in item (1) runs out during the production of the circuit board 1 will be described with reference to the flowchart of the component replacement operation in FIG. During the production of the circuit board 1 by the electronic component mounting apparatus 10, if any of the plurality of component cassettes 18 installed in the component supply unit 4 has run out of electronic components, first, the operation control unit 11 is the component supply unit 4
A signal is sent to the component cassette designating terminal 15 of the component cassette 1, and the component
8 is designated (S51). After the designation, in order to replace the component cassette 18 with a new one, the slide mechanism is operated to move a predetermined component cassette 18 to a safe position in front of the electronic component mounting apparatus 10 (S52). This allows
The operator of the electronic component mounting apparatus 10 can be warned that the component has run out.

Next, the component cassette 18 of the component supply unit 4 that has run out of components is replaced (S53), and electronic components are supplied from the component cassette 18 newly added in the component supply unit 4 to perform production. Then, the exchange completion switch 9 is depressed to notify the operation controller 11 of the completion of the exchange of the component cassette 18 (S54). Then, upon receiving the notification of the completion of the replacement, the component cassette 18 is moved to the rear of the electronic component mounting apparatus 10 by the slide mechanism so that the suction holding / mounting head can take out the electronic component from the component cassette supplying the electronic component ( S55). By the above operation, the component supply unit 4
The electronic component can be replenished by replacing the component cassette which has run out of components.

In this embodiment, the component supply unit 4
Although no specific mechanism / structure is described for the slide mechanism, any suitable mechanism / structure may be used. For example, a cylinder using air and a signal terminal for operating the cylinder are provided.
By sending a signal to the signal terminal from, the sliding operation of the component cassette in the component supply unit 4 may be controlled. Also, by the operation of the slide mechanism, whether the component cassette 18 in the component supply unit 4 has come out of the front of the electronic component mounting apparatus 10 as a result of step 32, or returns to the rear of the electronic component mounting apparatus 10 as a result of step 35. In order to determine whether or not the component cassette 18 is in the component cassette groove 4a of the component supply unit 4 (see FIG. 3).
A sensor may be provided that responds when is at a predetermined position. By providing such a sensor, the safety of the operation of the slide mechanism can be enhanced. Further, in this case, since the operation control unit 11 determines the response of the sensor, it is possible to confirm that the component cassette 18 exists at a position where the suction nozzle can suck the electronic component. Thus, the reliability of the replacement operation can be improved.

The present invention is not limited to the illustrated embodiment, and it goes without saying that various improvements and design changes can be made without departing from the spirit of the present invention.

[0024]

As is clear from the above description, according to the first aspect of the present invention, when taking out an electronic component from the component supply unit, the electronic component can be supplied by a plurality of component cassettes. It is not necessary to move the feed mechanism in the component supply unit as in the related art, and
Since a plurality of electronic components can be supplied at the same time, the supply efficiency of the electronic components can be improved. Furthermore,
By providing the slide mechanism for each part to which the component cassette is attached, it is possible to easily and safely replace the component cassette of the component supply unit when the component runs out during the production of the circuit board. Accordingly, it is possible to improve the productivity of the circuit board after the electronic components are mounted by the device, and also to improve the safety and easiness of the operation of replacing the component cassette performed by the operator of the device.

According to the second aspect of the present invention, a component cassette designation terminal to which a signal for designating a component cassette when supplying an electronic component is sent, corresponding to each component cassette attached to the component supply unit, A feed operation terminal to which a signal for performing a feed operation of the designated component cassette is provided, and when each terminal receives a signal, electronic components can be arbitrarily supplied from the component cassette.

Further, according to the third aspect of the present invention, there is no need to move the feed mechanism in the component supply unit as in the prior art, the electronic components are efficiently supplied, and the electronic components with high circuit board productivity are obtained. Parts can be mounted.

Further, according to the fourth invention of the present application,
The two or more component cassettes in the component supply unit are designated by sending signals to two or more component cassette designation terminals provided corresponding to the component cassettes, and the designated two or more component cassettes are designated. By sending a signal to a feed operation terminal provided corresponding to each component cassette, each component cassette is fed and electronic components are supplied at the same time. Electronic components with high productivity can be mounted.

Further, according to the fifth invention of the present application,
When any one of the component cassettes in the component supply unit has run out of components, the component cassette of the electronic component that has run out of components is notified, and the component cassette can be replaced.

[Brief description of the drawings]

FIG. 1 is an overall perspective view schematically showing an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram illustrating a configuration of the electronic component mounting apparatus.

FIG. 3 is a perspective view of a component supply unit incorporated in the electronic component mounting apparatus.

FIG. 4 is an operation flowchart conceptually showing an electronic component supply step and a mounting step in the electronic component mounting apparatus.

FIG. 5 is a flowchart illustrating a method of replacing an electronic component when the electronic component runs out in the electronic component mounting apparatus of the present invention.

FIG. 6 is an overall perspective view of a conventional electronic component mounting apparatus.

FIG. 7 is an operation flowchart conceptually showing an electronic component supply step and a mounting step in the electronic component mounting apparatus.

[Description of Signs] 1 ... Circuit board 2 ... Substrate transport section 3 ... Mounting head 4 ... Component supply section 8 ... Head drive section 10 ... Electronic component 11 ... Operation control section 12 ... Data storage section 15 ... Component cassette designation terminal 16 ... Feed operation terminal 18: Parts cassette

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroshi Uchiyama 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. Terms (reference) 5E313 AA01 AA11 AA22 CC04 DD31 DD49 EE03 EE24 EE37

Claims (5)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component at a predetermined position on a circuit board, wherein a component supply unit to which a plurality of component cassettes that can be fed so as to supply the electronic component is mounted corresponds to the component cassette. An electronic component mounting apparatus having a predetermined slide mechanism, and wherein each component cassette can be slidably attached and detached. 2. A component cassette designation terminal to which a signal for designating a component cassette is supplied when supplying an electronic component, corresponding to each component cassette attached to the component supply unit.
2. The electronic component mounting apparatus according to claim 1, further comprising a feed operation terminal to which a signal for feeding the designated component cassette is sent. 3. An electronic component used in an electronic component mounting apparatus for mounting an electronic component supplied from a component supply unit to which a plurality of component cassettes capable of performing a feed operation so as to supply electronic components is mounted at a predetermined position on a circuit board. In the supply method, at least one of the component cassettes in the component supply unit is designated by sending a signal to a component cassette designation terminal provided corresponding to the component cassette, and a component is designated for the designated component cassette. An electronic component supply method, comprising a step of feeding an electronic component by feeding a component cassette by sending a signal to a feed operation terminal provided corresponding to the cassette. 4. Designating two or more component cassettes in the component supply unit by sending signals to two or more component cassette designation terminals provided corresponding to the component cassettes, and For the above component cassettes, a signal is supplied to a feed operation terminal provided corresponding to each component cassette, so that each component cassette is fed and electronic components are simultaneously supplied. The electronic component supply method according to claim 3, wherein: 5. When one of the component cassettes in the component supply unit runs out of components, a signal is sent to a component cassette designation terminal provided corresponding to the component cassette, and the signal is automatically transmitted by a predetermined slide mechanism. 4. The electronic component according to claim 3, further comprising a step of notifying the component cassette that has run out of components by sliding the component cassette that has run out of components, and replacing the component cassette with a new component cassette. Supply method.