JP2000505601A - クロストーク減少のための非抵抗エネルギ結合 - Google Patents
クロストーク減少のための非抵抗エネルギ結合Info
- Publication number
- JP2000505601A JP2000505601A JP9531017A JP53101797A JP2000505601A JP 2000505601 A JP2000505601 A JP 2000505601A JP 9531017 A JP9531017 A JP 9531017A JP 53101797 A JP53101797 A JP 53101797A JP 2000505601 A JP2000505601 A JP 2000505601A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- traces
- terminals
- trace
- crosstalk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6473—Impedance matching
- H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
- H01R13/6461—Means for preventing cross-talk
- H01R13/6464—Means for preventing cross-talk by adding capacitive elements
- H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.第1電気コネクタ(12)を第2電気コネクタ(14)に相互接続する回路 基板(10)であって、前記第1電気コネクタが、1セットの狭い間隔の端子を 有し、該端子の各々は、前記端子の各他の1つと関連して信号対を形成し、該信 号対の各々は、前記コネクタを経て各電気回路と関連し、このため、前記異なる 信号対における隣接する前記端子は、電気クロストークを受けやすくなっており 、前記回路基板は、表面に回路トレースを有する誘電基板を具備し、前記回路ト レースは、前記第1セットの端子を前記第2電気コネクタにおける対応するセッ トの端子に電気的に相互接続するために配列されている回路基板において、 前記回路基板上の少なくとも1つの他のトレース(41)は、いすれの前記 回路トレースにも非抵抗接続され、この非抵抗接続されたトレース(41)は、 複数の対のうちの異なる対における2つの前記回路トレース間のエネルギを結合 するために配列され、このため、2つの前記回路トレース間のクロストークは減 少されるようになっていることを特徴とする回路基板。 2.前記非抵抗接続されたトレース(41)は、前記基板上に配置されると共に 、前記回路トレースの各々の各長さの少なくとも1部分だけ前記2つの回路トレ ースの各々と密接して延びていることを特徴とする請求の範囲第1項記載の回路 基板。 3.前記誘電基板は対向する主表面を有すると共に、前記非抵抗接続されたトレ ースは前記主表面のうちの一方上にもっぱら配置されていることを特徴とする請 求の範囲第2項記載の回路基板。 4.前記誘電基板は対向する主表面を有し、前記回路トレースのうちの少なくと もいくつかは前記主表面間の各ビアを貫通して延び、前記非抵抗接続されたトレ ースは前記ビアのうちの1つを少なくとも部分的に取り囲むことを特徴とする請 求の範囲第2項記載の回路基板。 5.前記誘電基板は対向する主表面を有し、前記回路トレースのうちの少なくと もいくつかは前記主表面の双方上に配置された部分を有し、前記非抵抗接続され たトレースは、ビアを貫通して延びると共に、前記主表面の双方上の 前記部分のいくつかと密接していることを特徴とする請求の範囲第2項記載の回 路基板。 6.複数の前記非抵抗接続されたトレースが、前記回路トレースの異なる対に密 接して前記基板上に配置されていることを特徴とする請求の範囲第1項記載の回 路基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60873696A | 1996-02-29 | 1996-02-29 | |
US08/608,736 | 1996-02-29 | ||
PCT/US1997/002730 WO1997032456A1 (en) | 1996-02-29 | 1997-02-26 | Non-ohmic energy coupling for cross talk reduction |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000505601A true JP2000505601A (ja) | 2000-05-09 |
JP3802070B2 JP3802070B2 (ja) | 2006-07-26 |
Family
ID=24437766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53101797A Expired - Lifetime JP3802070B2 (ja) | 1996-02-29 | 1997-02-26 | クロストーク減少のための非抵抗エネルギ結合 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6096980A (ja) |
EP (1) | EP0883977B1 (ja) |
JP (1) | JP3802070B2 (ja) |
DE (1) | DE69703482T2 (ja) |
WO (1) | WO1997032456A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016531407A (ja) * | 2013-08-23 | 2016-10-06 | アップル インコーポレイテッド | プリント回路基板を使用して形成されたコネクタインサート及びレセプタクル舌部 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6264689B1 (en) | 1998-03-31 | 2001-07-24 | Scimed Life Systems, Incorporated | Low profile medical stent |
US6249047B1 (en) * | 1999-09-02 | 2001-06-19 | Micron Technology, Inc. | Ball array layout |
US6548757B1 (en) | 2000-08-28 | 2003-04-15 | Micron Technology, Inc. | Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies |
US6710255B2 (en) * | 2001-03-30 | 2004-03-23 | Intel Corporation | Printed circuit board having buried intersignal capacitance and method of making |
MXPA05005341A (es) * | 2002-11-20 | 2005-08-16 | Siemon Co | Aparato para compensacion de interferencia en un conector de telecomunicacion. |
US7153168B2 (en) * | 2004-04-06 | 2006-12-26 | Panduit Corp. | Electrical connector with improved crosstalk compensation |
US7414322B2 (en) * | 2005-07-29 | 2008-08-19 | Lsi Corporation | High speed interface design |
US8011972B2 (en) * | 2006-02-13 | 2011-09-06 | Panduit Corp. | Connector with crosstalk compensation |
US7488206B2 (en) * | 2006-02-14 | 2009-02-10 | Panduit Corp. | Method and apparatus for patch panel patch cord documentation and revision |
US7874878B2 (en) | 2007-03-20 | 2011-01-25 | Panduit Corp. | Plug/jack system having PCB with lattice network |
TWI377745B (en) * | 2007-04-27 | 2012-11-21 | Delta Electronics Thailand Public Co Ltd | Electronic apparatus with power connection interface |
US7658651B2 (en) * | 2008-04-25 | 2010-02-09 | Tyco Electronics Corporation | Electrical connectors and circuit boards having non-ohmic plates |
US7914345B2 (en) * | 2008-08-13 | 2011-03-29 | Tyco Electronics Corporation | Electrical connector with improved compensation |
US9768556B2 (en) | 2013-03-15 | 2017-09-19 | Commscope Technologies Llc | Connector with capacitive crosstalk compensation to reduce alien crosstalk |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2060266B (en) * | 1979-10-05 | 1984-05-31 | Borrill P L | Multilayer printed circuit board |
JPS63131416A (ja) * | 1986-11-20 | 1988-06-03 | ブラザー工業株式会社 | 印刷回路基板 |
US4798918A (en) * | 1987-09-21 | 1989-01-17 | Intel Corporation | High density flexible circuit |
US5278727A (en) * | 1990-05-29 | 1994-01-11 | Digital Equipment Corporation | High density electrical interconnection device and method therefor |
JP2988075B2 (ja) * | 1991-10-19 | 1999-12-06 | 日本電気株式会社 | 半導体装置 |
US5288949A (en) * | 1992-02-03 | 1994-02-22 | Ncr Corporation | Connection system for integrated circuits which reduces cross-talk |
US5299956B1 (en) * | 1992-03-23 | 1995-10-24 | Superior Modular Prod Inc | Low cross talk electrical connector system |
JPH0770837B2 (ja) * | 1992-05-20 | 1995-07-31 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 多層配線を有する電子パッケージ基板及び方法 |
CA2072380C (en) * | 1992-06-25 | 2000-08-01 | Michel Bohbot | Circuit assemblies of printed circuit boards and telecommunications connectors |
US5341419A (en) * | 1992-08-21 | 1994-08-23 | The Whitaker Corporation | Capacitive unbalancing for reduction of differential mode cross-talk |
EP0603565B1 (en) * | 1992-11-24 | 1999-05-12 | TDK Corporation | Chip varistor and its production method |
US5295869A (en) * | 1992-12-18 | 1994-03-22 | The Siemon Company | Electrically balanced connector assembly |
US5269708A (en) * | 1993-03-03 | 1993-12-14 | Adc Telecommunications, Inc. | Patch panel for high speed twisted pair |
DE4400160A1 (de) * | 1994-01-05 | 1995-07-06 | Wuerth Elektronik Gmbh & Co Kg | Bus-Leiterplatte |
US5399106A (en) * | 1994-01-21 | 1995-03-21 | The Whitaker Corporation | High performance electrical connector |
US5431584A (en) * | 1994-01-21 | 1995-07-11 | The Whitaker Corporation | Electrical connector with reduced crosstalk |
US5975960A (en) * | 1998-10-06 | 1999-11-02 | The Whitaker Corporation | Modular connector with capacitive plates |
-
1997
- 1997-02-26 WO PCT/US1997/002730 patent/WO1997032456A1/en active IP Right Grant
- 1997-02-26 EP EP97906720A patent/EP0883977B1/en not_active Expired - Lifetime
- 1997-02-26 DE DE69703482T patent/DE69703482T2/de not_active Expired - Lifetime
- 1997-02-26 JP JP53101797A patent/JP3802070B2/ja not_active Expired - Lifetime
-
1998
- 1998-05-14 US US09/078,365 patent/US6096980A/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016531407A (ja) * | 2013-08-23 | 2016-10-06 | アップル インコーポレイテッド | プリント回路基板を使用して形成されたコネクタインサート及びレセプタクル舌部 |
US9992863B2 (en) | 2013-08-23 | 2018-06-05 | Apple Inc. | Connector inserts and receptacle tongues formed using printed circuit boards |
Also Published As
Publication number | Publication date |
---|---|
EP0883977A1 (en) | 1998-12-16 |
JP3802070B2 (ja) | 2006-07-26 |
WO1997032456A1 (en) | 1997-09-04 |
DE69703482D1 (de) | 2000-12-14 |
US6096980A (en) | 2000-08-01 |
EP0883977B1 (en) | 2000-11-08 |
DE69703482T2 (de) | 2001-05-03 |
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