DE69703482D1 - Nicht-ohmische energiekupplung zur reduzierung des übersprechens - Google Patents

Nicht-ohmische energiekupplung zur reduzierung des übersprechens

Info

Publication number
DE69703482D1
DE69703482D1 DE69703482T DE69703482T DE69703482D1 DE 69703482 D1 DE69703482 D1 DE 69703482D1 DE 69703482 T DE69703482 T DE 69703482T DE 69703482 T DE69703482 T DE 69703482T DE 69703482 D1 DE69703482 D1 DE 69703482D1
Authority
DE
Germany
Prior art keywords
crossing
energy coupling
reduce cross
ohmic energy
ohmic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69703482T
Other languages
English (en)
Other versions
DE69703482T2 (de
Inventor
Jay Ferry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of DE69703482D1 publication Critical patent/DE69703482D1/de
Application granted granted Critical
Publication of DE69703482T2 publication Critical patent/DE69703482T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6474—Impedance matching by variation of conductive properties, e.g. by dimension variations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6464—Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466—Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
DE69703482T 1996-02-29 1997-02-26 Nicht-ohmische energiekupplung zur reduzierung des übersprechens Expired - Lifetime DE69703482T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60873696A 1996-02-29 1996-02-29
PCT/US1997/002730 WO1997032456A1 (en) 1996-02-29 1997-02-26 Non-ohmic energy coupling for cross talk reduction

Publications (2)

Publication Number Publication Date
DE69703482D1 true DE69703482D1 (de) 2000-12-14
DE69703482T2 DE69703482T2 (de) 2001-05-03

Family

ID=24437766

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69703482T Expired - Lifetime DE69703482T2 (de) 1996-02-29 1997-02-26 Nicht-ohmische energiekupplung zur reduzierung des übersprechens

Country Status (5)

Country Link
US (1) US6096980A (de)
EP (1) EP0883977B1 (de)
JP (1) JP3802070B2 (de)
DE (1) DE69703482T2 (de)
WO (1) WO1997032456A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6264689B1 (en) 1998-03-31 2001-07-24 Scimed Life Systems, Incorporated Low profile medical stent
US6249047B1 (en) 1999-09-02 2001-06-19 Micron Technology, Inc. Ball array layout
US6548757B1 (en) 2000-08-28 2003-04-15 Micron Technology, Inc. Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies
US6710255B2 (en) * 2001-03-30 2004-03-23 Intel Corporation Printed circuit board having buried intersignal capacitance and method of making
EP1563573A4 (de) * 2002-11-20 2009-07-15 Siemon Co Vorrichtung zur bersprechkompensation in einem telekommunnikationsverbinder
US7153168B2 (en) * 2004-04-06 2006-12-26 Panduit Corp. Electrical connector with improved crosstalk compensation
US7414322B2 (en) * 2005-07-29 2008-08-19 Lsi Corporation High speed interface design
US8011972B2 (en) * 2006-02-13 2011-09-06 Panduit Corp. Connector with crosstalk compensation
US7488206B2 (en) * 2006-02-14 2009-02-10 Panduit Corp. Method and apparatus for patch panel patch cord documentation and revision
US7874878B2 (en) 2007-03-20 2011-01-25 Panduit Corp. Plug/jack system having PCB with lattice network
TWI377745B (en) * 2007-04-27 2012-11-21 Delta Electronics Thailand Public Co Ltd Electronic apparatus with power connection interface
US7658651B2 (en) * 2008-04-25 2010-02-09 Tyco Electronics Corporation Electrical connectors and circuit boards having non-ohmic plates
US7914345B2 (en) * 2008-08-13 2011-03-29 Tyco Electronics Corporation Electrical connector with improved compensation
US9768556B2 (en) 2013-03-15 2017-09-19 Commscope Technologies Llc Connector with capacitive crosstalk compensation to reduce alien crosstalk
US9992863B2 (en) * 2013-08-23 2018-06-05 Apple Inc. Connector inserts and receptacle tongues formed using printed circuit boards

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2060266B (en) * 1979-10-05 1984-05-31 Borrill P L Multilayer printed circuit board
JPS63131416A (ja) * 1986-11-20 1988-06-03 ブラザー工業株式会社 印刷回路基板
US4798918A (en) * 1987-09-21 1989-01-17 Intel Corporation High density flexible circuit
US5278727A (en) * 1990-05-29 1994-01-11 Digital Equipment Corporation High density electrical interconnection device and method therefor
JP2988075B2 (ja) * 1991-10-19 1999-12-06 日本電気株式会社 半導体装置
US5288949A (en) * 1992-02-03 1994-02-22 Ncr Corporation Connection system for integrated circuits which reduces cross-talk
US5299956B1 (en) * 1992-03-23 1995-10-24 Superior Modular Prod Inc Low cross talk electrical connector system
JPH0770837B2 (ja) * 1992-05-20 1995-07-31 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層配線を有する電子パッケージ基板及び方法
CA2072380C (en) * 1992-06-25 2000-08-01 Michel Bohbot Circuit assemblies of printed circuit boards and telecommunications connectors
US5341419A (en) * 1992-08-21 1994-08-23 The Whitaker Corporation Capacitive unbalancing for reduction of differential mode cross-talk
DE69324896T2 (de) * 1992-11-24 1999-12-02 Tdk Corp Chip-Varistor und Verfahren zu seiner Herstellung
US5295869A (en) * 1992-12-18 1994-03-22 The Siemon Company Electrically balanced connector assembly
US5269708A (en) * 1993-03-03 1993-12-14 Adc Telecommunications, Inc. Patch panel for high speed twisted pair
DE4400160A1 (de) * 1994-01-05 1995-07-06 Wuerth Elektronik Gmbh & Co Kg Bus-Leiterplatte
US5431584A (en) * 1994-01-21 1995-07-11 The Whitaker Corporation Electrical connector with reduced crosstalk
US5399106A (en) * 1994-01-21 1995-03-21 The Whitaker Corporation High performance electrical connector
US5975960A (en) * 1998-10-06 1999-11-02 The Whitaker Corporation Modular connector with capacitive plates

Also Published As

Publication number Publication date
US6096980A (en) 2000-08-01
EP0883977B1 (de) 2000-11-08
JP3802070B2 (ja) 2006-07-26
EP0883977A1 (de) 1998-12-16
DE69703482T2 (de) 2001-05-03
WO1997032456A1 (en) 1997-09-04
JP2000505601A (ja) 2000-05-09

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