JP2000500794A - 複合材及び接着剤用途の熱硬化性重合体 - Google Patents
複合材及び接着剤用途の熱硬化性重合体Info
- Publication number
- JP2000500794A JP2000500794A JP9518887A JP51888797A JP2000500794A JP 2000500794 A JP2000500794 A JP 2000500794A JP 9518887 A JP9518887 A JP 9518887A JP 51888797 A JP51888797 A JP 51888797A JP 2000500794 A JP2000500794 A JP 2000500794A
- Authority
- JP
- Japan
- Prior art keywords
- bismaleimide
- resin
- weight
- bis
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/123—Unsaturated polyimide precursors the unsaturated precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/124—Unsaturated polyimide precursors the unsaturated precursors containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. スラリー混合によって製造される熱硬化性の樹脂組成物であって、 A.メチレンジアニリンビスマレイミド、ビス(アミノフェノキシフェニ ル)プロパンビスマレイミド、オキシジアニリンビスマレイミド、ビス(アミノ フェノキシ)ベンゼンビスマレイミド、ジアミノジフェニルスルホンビスマレイ ミド、ジアミノジフェニルイソプロピリデンビスマレイミド、ジアミノジフェニ ルケトンビスマレイミド、ジアミノジフェニルスルフィドビスマレイミド、ジア ミノジフェニルヘキサフルオルイソプロピリデンビスマレイミド及びビス(ジア ミノジフェニルイソプロピリデン)ベンゼンビスマレイミドから成る群から選ば れる固体のアルキレンジアニリンビスマレイミド樹脂、並びに B.液状のプロペニルベンゾフェノン共反応物 を含んで成り、反応物と共反応物が実質的に約1:1の重量比で存在し、硬化後 の組成物が熱老化において減少した重量損失を示すことを特徴とする組成物。 2. ベンゾフェノン共反応物が4,4’−ビス[O−(1−プロペニル)−フ ェノキシ]ベンゾフェノンである請求項1に記載の組成物。 3. 反応物と共反応物が、硬化時の該組成物中の反応性成分全重量の約70% を超える請求項1に記載の組成物。 4. A.粉末状のメチレンジアニリンビスマレイミド樹脂反応物を硬化剤中へ スラリー混合すること、及び B.反応物−硬化剤混合物を、50℃と150℃の間に加熱され ている液状の均質なベンゾフェノン共反応物へ組み合わせること を含んで成る熱硬化性の樹脂組成物の製造方法。 5. A.メチレンジアニリンビスマレイミド、ビス(アミノフェノキシフェニ ル)プロパンビスマレイミド、オキシジアニリンビスマレイミド、ビス(アミノ フェノキシ)ベンゼンビスマレイミド、ジアミノジフェニルスルホンビスマレイ ミド、ジアミノジフェニルイソプロピリデンビスマレイミド、ジアミノジフェニ ルケトンビスマレイミド、ジアミノジフェニルスルフィドビスマレイミド、ジア ミノジフェニルヘキサフルオルイソプロピリデンビスマレイミド及びビス(ジア ミノジフェニルイソプロピリデン)ベンゼンビスマレイミドから成る群から選ば れる固体のアルキレンジアニリンビスマレイミド樹脂、並びに B.液状のベンゾフェノン共反応物 を含んで成り、反応物と共反応物が実質的に約1:1の重量比で存在し、硬化後 の組成物が熱老化において減少した重量損失を示すことを特徴とする複合材又は 接着剤用途の熱硬化性の樹脂組成物。 6. ベンゾフェノン共反応物が4,4’−ビス[O−(1−プロペニル)−フ ェノキシ]ベンゾフェノンである請求項5に記載の組成物。 7. 反応物と共反応物が、硬化時の該組成物中の反応性成分全重量の約70% を超える請求項1に記載の組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US645295P | 1995-11-13 | 1995-11-13 | |
US60/006,452 | 1995-11-13 | ||
PCT/US1996/017499 WO1997018254A1 (en) | 1995-11-13 | 1996-10-30 | Thermosetting polymers for composite and adhesive applications |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000500794A true JP2000500794A (ja) | 2000-01-25 |
JP4054062B2 JP4054062B2 (ja) | 2008-02-27 |
Family
ID=21720963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51888797A Expired - Lifetime JP4054062B2 (ja) | 1995-11-13 | 1996-10-30 | 複合材及び接着剤用途の熱硬化性重合体 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6313248B1 (ja) |
EP (1) | EP0861281B1 (ja) |
JP (1) | JP4054062B2 (ja) |
AT (1) | ATE218593T1 (ja) |
CA (1) | CA2237359A1 (ja) |
DE (1) | DE69621635T2 (ja) |
DK (1) | DK0861281T3 (ja) |
ES (1) | ES2175145T3 (ja) |
WO (1) | WO1997018254A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008120484A1 (ja) * | 2007-03-29 | 2008-10-09 | Toho Tenax Co., Ltd. | 繊維強化プリプレグ及びそれから得られる複合材料 |
WO2019198607A1 (ja) * | 2018-04-09 | 2019-10-17 | 日本化薬株式会社 | アルケニル基含有化合物、硬化性樹脂組成物及びその硬化物 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6281314B1 (en) | 1998-07-02 | 2001-08-28 | National Starch And Chemical Investment Holding Corporation | Compositions for use in the fabrication of circuit components and printed wire boards |
US6350840B1 (en) | 1998-07-02 | 2002-02-26 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulants prepared from allylated amide compounds |
US6063828A (en) * | 1998-07-02 | 2000-05-16 | National Starch And Chemical Investment Holding Corporation | Underfill encapsulant compositions for use in electronic devices |
US6057381A (en) | 1998-07-02 | 2000-05-02 | National Starch And Chemical Investment Holding Corporation | Method of making an electronic component using reworkable underfill encapsulants |
US6316566B1 (en) | 1998-07-02 | 2001-11-13 | National Starch And Chemical Investment Holding Corporation | Package encapsulant compositions for use in electronic devices |
SG105450A1 (en) | 1998-07-02 | 2004-08-27 | Nat Starch Chem Invest | Allylated amide compounds and die attach adhesives prepared therefrom |
FR2849046A1 (fr) * | 2002-12-24 | 2004-06-25 | Atofina | Composition a base de pvdf heterogene et de bisimide aromatique reticulable par des radiations ionisantes |
US20050042961A1 (en) * | 2003-08-18 | 2005-02-24 | Henkel Loctite Corporation | Curable compositions for advanced processes, and products made therefrom |
US7160946B2 (en) * | 2004-04-01 | 2007-01-09 | National Starch And Chemical Investment Holding Corporation | Method to improve high temperature cohesive strength with adhesive having multi-phase system |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
AU2006214709B2 (en) * | 2005-02-16 | 2012-08-02 | Cytec Technology Corp. | Bismaleimire resin with high temperature thermal stability |
EP1874867B1 (en) * | 2005-04-28 | 2012-06-20 | Cytec Technology Corp. | Bismaleimide resin system with improved manufacturing properties |
CN101589127B (zh) * | 2006-11-21 | 2012-10-10 | 汉高公司 | 用于预先加工的增韧粘合剂组合物 |
US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
US7422707B2 (en) * | 2007-01-10 | 2008-09-09 | National Starch And Chemical Investment Holding Corporation | Highly conductive composition for wafer coating |
US11286346B2 (en) * | 2015-01-13 | 2022-03-29 | Showa Denko Materials Co., Ltd. | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar |
US11059324B2 (en) * | 2015-09-18 | 2021-07-13 | Paul Rivera | Electrically actuated apparatus and method for tire replacement |
WO2017108946A1 (en) * | 2015-12-21 | 2017-06-29 | Hexcel Composites Limited | Thermosetting resin compositions |
CN108219134B (zh) * | 2018-01-10 | 2020-07-17 | 苏州生益科技有限公司 | 一种改性复合双马来酰亚胺树脂的预聚物、树脂组合物及使用其制作的半固化片及层压板 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4175175A (en) | 1963-07-16 | 1979-11-20 | Union Carbide Corporation | Polyarylene polyethers |
NL6609886A (ja) | 1966-07-14 | 1968-01-15 | ||
FR2094607A5 (ja) | 1970-06-26 | 1972-02-04 | Rhone Poulenc Sa | |
CH615935A5 (ja) | 1975-06-19 | 1980-02-29 | Ciba Geigy Ag | |
US4546131A (en) | 1985-01-15 | 1985-10-08 | The Dow Chemical Company | Polymer modified cyanate mixture and epoxy resins thereof |
US4654407A (en) | 1985-08-02 | 1987-03-31 | Amoco Corporation | Aromatic bismaleimide and prepreg resin therefrom |
US4689378A (en) | 1985-12-16 | 1987-08-25 | Ciba-Geigy Corporation | Stable imide-containing composition from diamino phenyl indane-bis-maleimide and alkenyl phenol |
EP0230741B1 (en) | 1986-01-18 | 1993-08-11 | Technochemie GmbH - Verfahrenstechnik | Curable resins |
US5003018A (en) | 1988-04-29 | 1991-03-26 | Basf Aktiengesellschaft | Slurry mixing of bismaleimide resins |
DE3827120A1 (de) * | 1988-08-10 | 1990-02-15 | Basf Ag | Hitzehaertbare bismaleinimid-copolymere sowie 2,6-disubstituierte pyridin-verbindungen als comonomere |
DE3843641A1 (de) | 1988-12-23 | 1990-07-05 | Technochemie Gmbh | Mit neuen alkenylphenoxyimiden modifizierte polyimide, deren verwendung sowie die neuen alkenylphenoxyimide |
US5013804A (en) | 1989-04-14 | 1991-05-07 | Ciba-Geigy Corporation | Curable mixtures containing a bismaleimide and a propenyl compound |
US5143969A (en) * | 1991-06-24 | 1992-09-01 | Basf Aktiengesellschaft | Heat-curable bismaleimide molding compositions |
-
1996
- 1996-10-30 WO PCT/US1996/017499 patent/WO1997018254A1/en active IP Right Grant
- 1996-10-30 DK DK96938713T patent/DK0861281T3/da active
- 1996-10-30 EP EP96938713A patent/EP0861281B1/en not_active Expired - Lifetime
- 1996-10-30 ES ES96938713T patent/ES2175145T3/es not_active Expired - Lifetime
- 1996-10-30 DE DE69621635T patent/DE69621635T2/de not_active Expired - Lifetime
- 1996-10-30 AT AT96938713T patent/ATE218593T1/de active
- 1996-10-30 CA CA002237359A patent/CA2237359A1/en not_active Abandoned
- 1996-10-30 JP JP51888797A patent/JP4054062B2/ja not_active Expired - Lifetime
- 1996-11-13 US US08/748,438 patent/US6313248B1/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008120484A1 (ja) * | 2007-03-29 | 2008-10-09 | Toho Tenax Co., Ltd. | 繊維強化プリプレグ及びそれから得られる複合材料 |
US8034442B2 (en) | 2007-03-29 | 2011-10-11 | Toho Tenax Co., Ltd. | Fiber-reinforced prepreg and composite material obtained from the same |
JP5451379B2 (ja) * | 2007-03-29 | 2014-03-26 | 東邦テナックス株式会社 | 繊維強化プリプレグ及びそれから得られる複合材料 |
WO2019198607A1 (ja) * | 2018-04-09 | 2019-10-17 | 日本化薬株式会社 | アルケニル基含有化合物、硬化性樹脂組成物及びその硬化物 |
JPWO2019198607A1 (ja) * | 2018-04-09 | 2021-04-15 | 日本化薬株式会社 | アルケニル基含有化合物、硬化性樹脂組成物及びその硬化物 |
Also Published As
Publication number | Publication date |
---|---|
JP4054062B2 (ja) | 2008-02-27 |
DK0861281T3 (da) | 2002-09-16 |
EP0861281A1 (en) | 1998-09-02 |
DE69621635T2 (de) | 2003-01-02 |
CA2237359A1 (en) | 1997-05-22 |
ATE218593T1 (de) | 2002-06-15 |
EP0861281B1 (en) | 2002-06-05 |
WO1997018254A1 (en) | 1997-05-22 |
US6313248B1 (en) | 2001-11-06 |
ES2175145T3 (es) | 2002-11-16 |
DE69621635D1 (de) | 2002-07-11 |
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