JP2000357848A - Wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board capable of accurate and easy alignment of through holes and wiring conductor and easy confirmation of position precision of the through holes and the wiring conductor by visual inspection. SOLUTION: This wiring board is provided with an insulating layer in which through holes 14 are formed, and wiring conductor 16 is stuck adjacently to the though holes 14 on the upper surface and/or the lower surface of the insulating layer. A plurality of position deviation detecting holes 5 bored at a fixed distance from the through holes 14, and a plurality of position deviation detecting patterns 6 which are stuck so as to surround the holes 5 at a fixed distance from the wiring conductor 16 are so formed on the insulating layer that the eccentric amount of the hole 5 corresponding to one out of the patterns 6 becomes zero, when the position deviation between the through holes 14 and the wiring conductor 16 becomes equal to a specified amount in a specified direction. By the surrounding condition of the patterns 6 to the holes 5, the direction and the amount of position deviation between the through holes 14 and the wiring conductor 16 can be detected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board used for a package for accommodating a semiconductor element for accommodating a semiconductor element.

[0002]

2. Description of the Related Art Conventionally, a package for housing a semiconductor element has been
For example, as shown in a sectional view in FIG. 6, a package body 11 for mounting a semiconductor element 21 and this package body 11
For hermetically sealing the semiconductor element 21 mounted on the device
It consists of 12 and.

The package body 11 is made of, for example, an electrically insulating material such as an aluminum oxide sintered body. The package body 11 has a mounting portion 13 for mounting the semiconductor element 21 at the center of the upper surface, and a plurality of through holes around the mounting portion 13. A substantially rectangular plate-shaped insulating base 15 having holes 14 and a refractory metal powder such as tungsten or molybdenum metallized from the mounting portion 13 on the upper surface of the insulating base 15 through the through holes 14 to the lower surface. And a plurality of wiring conductors 16.

After mounting the semiconductor element 21 on the mounting portion 13 of the package body 11 such that each electrode of the semiconductor element 21 is electrically connected to the corresponding wiring conductor 16 via the solder bump 22, , Lid 12 on top of package body 11
The semiconductor device 21 is completed by hermetically sealing the semiconductor element 21 inside a package including the package body 11 and the lid 12. The semiconductor device is mounted on the external electric circuit board by connecting a portion led out to the lower surface of the insulating base 15 with the wiring conductor 16 to a wiring conductor of an external electric circuit board (not shown) via the solder bump 23. At the same time, each electrode of the semiconductor element 21 is electrically connected to a predetermined external electric circuit via the wiring conductor 14.

Conventionally, the package body 11 as described above has
In general, they have been manufactured simultaneously and collectively using a multi-cavity wiring board as shown in a top view in FIG. 7 and a sectional view in FIG.

In this conventional multi-piece wiring board, for example, a plurality of package areas 42 each serving as the package body 11 shown in FIG. 6 are provided at the center of an insulating board 41 having a single insulating layer 41a. Are partitioned by virtual dividing lines 43 and are integrally arranged, and a frame-shaped throwaway area 44 is formed on the outer periphery so as to surround these arrayed package areas 42. Become. In each package area 42, a through hole 14 and a wiring conductor 16 corresponding to the package body 11 are formed.

Then, the insulating substrate 41 is cut along the dividing line 43 by using a diamond cutter or a laser cutter, or a dividing groove having a predetermined depth is formed in advance along the dividing line 43, and the dividing groove is used as a boundary. Fig. 6
A large number of package bodies 11 as shown in FIG.

In such a conventional wiring board, for example, the insulating layer 41a is made of a sintered body of aluminum oxide,
In the case where 16 is made of tungsten powder metallization, a ceramic slurry obtained by adding an appropriate organic binder and a solvent to raw material powders such as aluminum oxide, silicon oxide, calcium oxide and magnesium oxide is mixed with a conventionally known doctor blade method. A ceramic green sheet is obtained by adopting a sheet shape, and then a through hole to be a through hole 14 is formed in the ceramic green sheet, and the inside of the through hole 14 becomes a part of the wiring conductor 16. The metal paste is filled, and the metal paste to be the remaining part of the wiring conductor 16 is printed and applied to the upper and lower surfaces of the ceramic green sheet so as to cover the through holes 14 filled with the metal paste. Manufactured by firing green sheets at a temperature of about 1600 ° C in a reducing atmosphere You.

In the wiring board obtained in this manner, if the positional displacement between the through hole 14 formed in the insulating layer 41a and the wiring conductor 16 formed on the upper and lower surfaces of the insulating layer 41a is large, each package region 42 In this case, a disconnection, a short circuit, or the like may occur in the wiring conductor 16 at the time. Then, the wiring conductor 16
If there is a disconnection or short circuit in the package, when the semiconductor device having the semiconductor element 21 mounted on the obtained package body 11 is mounted on an external electric circuit board, each electrode of the semiconductor element 21 is connected to the predetermined through the wiring conductor 16. Cannot be normally connected to the external electric circuit.

Therefore, conventionally, when a through hole serving as a through hole 14 is formed in a ceramic green sheet serving as an insulating layer 41a, a reference hole 45 for positioning is formed in the outer peripheral portion of the ceramic green sheet at the same time. When printing and applying a metal paste to be the wiring conductor 16 on the upper and lower surfaces of the ceramic green sheet, the through hole 14 and the wiring conductor 16 are simultaneously formed of the same metal paste and surround the reference holes 45 at equal intervals. Print and apply a ring-shaped alignment pattern 46 arranged so that the position matches with the position, and print the metal paste while visually confirming that the alignment pattern 46 surrounds the reference holes 45 at equal intervals. By adjusting the position, the through hole 14 and the wiring conductor 16 are aligned.

[0011]

However, in this conventional wiring board, the positioning reference hole 45 provided in the ceramic green sheet is aligned with the positioning pattern.
Since the printing position of the metal paste is adjusted while visually confirming that 46 is surrounded at equal intervals, the accuracy of the alignment greatly depends on the operator's feeling, so the through hole 14 and the wiring conductor 16 However, there is a problem in that the accuracy of the alignment with the substrate has a large variation. Particularly, in recent years, in wiring boards in which the through-holes 14 and the wiring conductors 16 have become finer and denser, extremely high-precision alignment between the through-holes 14 and the wiring conductors 16 is required. There has been a problem in that it has become impossible to perform positioning with predetermined accuracy.

In addition, it is impossible to numerically grasp how much the through hole 14 and the wiring conductor 16 are displaced from each other. Therefore, it is necessary to adjust the printing position of the metal paste by trial and error by relying on intuition. In addition, there is a problem that the work of positioning is extremely complicated.

Further, it is not possible to visually check whether or not the wiring conductor 16 is printed with a predetermined positional accuracy on the through-hole 14 in the completed wiring board, so that the position between the through-hole 14 and the wiring conductor 16 cannot be confirmed. For example, it is necessary to measure the relationship using an optical dimension measuring device or the like, and there is a problem that this operation is extremely complicated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to accurately and easily align a through hole with a wiring conductor, and to further position the through hole with a wiring conductor. It is an object of the present invention to provide a wiring board capable of easily confirming the accuracy visually.

[0015]

A wiring board according to the present invention comprises at least one insulating layer. The insulating layer has a through-hole penetrating between upper and lower surfaces, and has at least one insulating layer. Or a wiring board in which a wiring conductor is attached to the lower surface in contact with or adjacent to the through hole, wherein a plurality of misalignments formed in the insulating layer in a fixed positional relationship with the through hole. The detection holes and the plurality of misregistration detection patterns attached so as to respectively surround the misalignment detection holes in a fixed positional relationship with the wiring conductor are determined by determining the misalignment between the through hole and the wiring conductor. Provided that the amount of eccentricity of the misregistration detection hole corresponding to one of the misregistration detection patterns when the predetermined amount in the direction becomes zero,
The direction and amount of displacement between the through-hole and the wiring conductor can be detected by the surroundings of the displacement detection pattern with respect to the displacement detection hole.

According to the wiring board of the present invention, a plurality of misregistration detection holes formed in the insulating layer in which the through-holes and the wiring conductors are formed in a fixed positional relationship with the through-holes, A plurality of misregistration detection patterns attached so as to surround the misregistration detection holes in a positional relationship, respectively, are used when the misalignment between the through hole and the wiring conductor is a predetermined amount in a predetermined direction. The eccentricity of one of the misregistration detection holes is provided to be zero, and the direction and the amount of misregistration between the through hole and the wiring conductor can be detected by the surroundings of the misregistration detection pattern with respect to the misalignment detection hole. By visually checking the surroundings of the misregistration detection pattern with respect to such misregistration detection holes, the amount of the through hole and the wiring conductor in which direction and how much Whether is shifted can be easily confirmed. And based on the result, it becomes the wiring board which can position a through-hole and a wiring conductor accurately and easily.

[0017]

Next, a wiring board according to the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a top view showing an example of an embodiment in which the wiring board of the present invention is applied to a package body of a package for housing semiconductor elements, and FIG. 2 is a sectional view of the wiring board shown in FIG. It is.

In this embodiment, a wiring board according to the present invention comprises a plurality of package regions 2 each serving as a package body 11 shown in FIG.
Are partitioned by a dividing line 3 which is a virtual line, are integrally arranged and formed, and a frame-shaped waste allowance area 4 is formed on the outer peripheral portion so as to surround these arranged package areas 2. Become.

Each of the package regions 2 has substantially the same configuration as the package body 11 shown in FIG. 6, and the same parts as those of the package body 11 shown in FIG. It is. Some of these will not be described in order to avoid unnecessary duplication.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a mullite sintered body, a silicon nitride sintered body, and a glass ceramic. Square-plate-shaped insulating layer 1 made of
a. In each package area 2, a plurality of through holes 14 and wiring conductors 16 corresponding to the package body 11 are provided.

If the insulating layer 1a is made of, for example, an aluminum oxide sintered body, a suitable organic binder or solvent is added to a raw material powder such as aluminum oxide, silicon oxide, magnesium oxide, or calcium oxide. In addition to forming a slurry, the ceramic green sheet is formed into a sheet-like ceramic green sheet by a sheet forming method such as a well-known doctor blade method. Thereafter, the ceramic green sheet is appropriately punched and fired at a high temperature. Produced by

Further, through holes 14 formed in insulating layer 1a are formed.
Is for providing a lead-out path for leading the wiring conductor 16 attached to each package region 2 from the upper surface to the lower surface of the insulating layer 1a. A part of the wiring conductor 16 that is led out to is filled.

These through holes 14 are punched in predetermined positions, shapes, and sizes in each package region 2 by, for example, punching a ceramic green sheet serving as an insulating layer 1a by a conventionally known die press. .

The wiring conductor 16 attached to each package region 2 is made of metallized metal powder made of a metal such as tungsten, molybdenum, copper, silver or the like, and penetrates from the upper surface of the insulating layer 1a in each package region 2. It is led to the lower surface through the inside of the hole 14.

If the wiring conductor layer 16 is made of, for example, metallized tungsten powder, a metal paste obtained by adding and mixing an appropriate organic binder and a solvent to the tungsten powder is perforated on a ceramic green sheet to be the insulating layer 1a. By filling in the through-holes, and applying a predetermined pattern by a conventionally known screen printing method on the upper and lower surfaces of the ceramic green sheet so as to cover the through-holes, and by firing this together with the ceramic green sheet, A predetermined pattern is formed on the upper and lower surfaces of the insulating layer 1a and in the through hole 14 in each package region 2.

On the other hand, the disposal margin area 4 provided on the insulating substrate 1 functions as a support for facilitating the handling of the wiring board when performing various processes on the wiring board.

Each side of the discard area 4 has a fixed positional relationship with the through-hole 14. For example, a displacement detection hole 5 drilled simultaneously with the through-hole 14 is provided on each side of the discard allowance area 4. A plurality of lines are provided at substantially equal intervals in an array such as a linear arrangement along the line.

The displacement detection hole 5 is formed by, for example, drilling simultaneously with the through hole 14 by the same method as forming the through hole 14. Therefore, the displacement detection hole 5 and the through-hole 14 are formed with an exactly fixed positional relationship.

In this example, the misregistration detecting hole 5 has a circular shape with an opening having a diameter D1, and has a predetermined pitch (meaning the distance between the centers of the adjacent misregistration detecting holes 5) P1. Plural pieces are formed at equal intervals along each side.

The position deviation detecting holes 5 have, for example, a diameter D1 of each position deviation detecting hole 5 of about 0.05 to 5 mm and a pitch P1 between adjacent position deviation detecting holes 5 of about 0.5 to 10 mm. However, there are 11 in this example.

Further, on each side of the discard allowance area 4, a misregistration detection pattern 6 surrounds the misalignment detection hole 5 in a one-to-one relationship with the misalignment detection hole 5 in a fixed positional relationship with the wiring conductor 16. So that it is adhered.

The misregistration detection pattern 6 is made of the same material as the wiring conductor 16, and is formed, for example, simultaneously with the wiring conductor 16 by the same method as that for forming the wiring conductor 16. Therefore, the positional deviation detection pattern 6 and the wiring conductor 16 are formed with an exactly fixed positional relationship.

In this example, the displacement detection pattern 6 is a circular ring-shaped pattern having an inner diameter D2 and an outer diameter D3, and is discarded at a predetermined pitch (meaning the distance between centers of adjacent patterns 6) P2. A plurality of them are attached at equal intervals along each side of the region 4.

The displacement detection pattern 6 has, for example, an inner diameter D2 that is 0.02 times smaller than the diameter D1 of the displacement detection hole 5.
About 0.2 mm, and the outer diameter D3 is further 0.2 to 1 mm.
mm larger. The pitch P2 is smaller than the pitch P1 of the displacement detection holes by about 0.01 to 0.05 mm, and the number in each row is
Is the same as the number of.

The misregistration detection holes 5 and the misregistration detection patterns 6 are arranged so as to correspond to each other on a one-to-one basis. A position shift detecting section 7 is formed.

Each of the position shift detecting sections 7 includes a through hole 14 and a wiring conductor 16 in the direction along the position of the position shift detecting section 7.
The positional deviation detection hole 5 is surrounded by the positional deviation detection pattern 6 with a uniform width in the direction in which the positional deviation detection units 7 are arranged, and is positioned at the center of each line. In the displacement detection unit 7, the displacement detection hole 6 is surrounded by the displacement detection pattern 6 with a uniform width in the direction in which the displacement detection unit 7 is arranged.
When the amount of eccentricity of the misalignment detection hole 5 corresponding to “0” becomes zero, the through hole 14 and the wiring conductor
They are arranged so that the displacement from 16 is zero.

The position shift detection hole 5 and the position shift detection pattern 6 are defined by the pitch P2 of the position shift detection pattern 6.
Is smaller than the pitch P1 of the displacement detection holes 5,
For example, the wiring conductor 16 is displaced from the through hole 14
When the position is shifted by n × (P1−P2) in the direction of the alignment, the position error detection pattern 6 is shifted from the position error detection hole 5 in the nth position error detection unit 7 to the position error detection unit 7 at the center of the alignment. It is surrounded by a uniform width in the direction in which the detection units 7 are arranged (where n is an integer).

That is, as shown in the top view of the main part in FIG. 3, for example, the pitch P1 of the displacement detection holes 5 in each row is 50
0 μm and the pitch P of the displacement detection pattern 6
2 is 490 μm, and the wiring conductor 16 is a through hole.
When the position is shifted by 20 μm to the left in the figure with respect to 14, the position shift detection hole 5 is detected by the position shift detection pattern 6 in the position shift detection hole 7 in the second position shift detection unit 7 from the center. It is surrounded by a uniform width in the direction in which the portions 7 are arranged, and the eccentricity of the displacement detection hole 5 corresponding to the displacement detection pattern 6 becomes zero. As a result, the wiring conductor 16 moves to the left in the drawing with respect to the through hole 14.
It is easy to numerically recognize that the displacement is 20 μm.

As described above, according to the wiring board of the present invention,
By visually checking the surroundings of the position shift detection pattern 6 with respect to the position shift detection hole 5 in each position shift detection unit 7, the direction of the position shift of the wiring conductor 16 with respect to the through hole 14 can be easily checked. The amount of displacement can be easily confirmed numerically.

Therefore, when the through hole 14 and the wiring conductor 16 are aligned, the surroundings of the position shift detection pattern 6 with respect to the position shift detection hole 5 in each position shift detection section 7 are visually checked, and the positions are obtained. The through hole 14 and the wiring conductor 16 can be easily and accurately aligned with each other based on the direction of the position shift and the amount of the position shift.

Also, in the completed wiring board, the position of the through hole 14 and the wiring conductor 16 can be determined by visually checking the surroundings of the position detection pattern 6 with respect to the position detection hole 5 in each position detection unit 7. Of the product can be confirmed, and the finished product can be known very easily without using an optical dimension measuring device or the like.

Further, for example, the respective through-holes 14 and the wiring conductor when the amount of eccentricity becomes 0 by the respective positional deviation detecting patterns 6 surrounding the positional deviation detecting holes 5 in the vicinity of the respective positional deviation detecting portions 7 with an equal width. If a numerical pattern F indicating the amount of deviation from 16 is applied, it is very easy to numerically confirm the amount of positional deviation between the through-hole 14 and the wiring conductor 16. Therefore, in the vicinity of each of the positional deviation detecting sections 7, the respective positional deviation detecting patterns 6 surround the positional deviation detecting holes 5 with an equal width and the through hole 14 and the wiring conductor 16 when the amount of eccentricity becomes zero. It is preferable that a numerical pattern F indicating the amount of positional deviation is applied.

Such a pattern F may be formed, for example, by simultaneously applying the same material as the position shift detection pattern 6 when forming the position shift detection pattern 6.

The electronic component mounting board of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. For example, in the example of the above-described embodiment, the displacement detection hole 5 is circular, and the displacement detection pattern 6 corresponding to the hole is a circular ring. The displacement detection pattern 6 may have a square shape or another shape.

Further, in the above-described embodiment, the position shift detection holes 5 and the position shift detection patterns 6 are arranged 11 each in each line. What is necessary is just to select suitably according to precision etc.

Further, in the above-described embodiment, the insulating substrate 1 is formed of one insulating layer 1a.
The insulating substrate 1 may be formed of two or more insulating layers including a single insulating layer on which a position shift detecting unit is formed.

Further, in the example of the above-described embodiment, the present invention is applied to a wiring board in which the wiring conductor 16 covers the through hole 14, that is, is disposed in contact with the through hole 14. As shown in a top view in FIG. 4 and a sectional view in FIG. 5, the insulating layers 31a and 31b are laminated and the insulating layers 31a and 31b are stacked.
The present invention can also be applied to a wiring board in which a through hole 32 is provided in a for accommodating a semiconductor element or the like, and a wiring conductor 33 is provided adjacent to the through hole 32. In this case, a misregistration detection hole having a fixed positional relationship with the through hole 32 is provided.
34, a displacement detection unit 36 including a displacement detection pattern 35 having a fixed relationship with the wiring conductor 33 may be formed on the insulating layer 31a in the same manner as in the example of the above-described embodiment. Through hole 32 for accommodating semiconductor elements and the like
And the wiring conductor 33 can be accurately and easily aligned.

[0049]

According to the wiring board of the present invention, a plurality of misregistration detecting holes formed in the insulating layer in which the through holes and the wiring conductors are formed in a fixed positional relationship with the through holes, A plurality of misregistration detection patterns attached so as to surround the misregistration detection holes in a fixed positional relationship,
When the positional deviation between the through hole and the wiring conductor is a predetermined amount in a predetermined direction, the eccentricity of the positional deviation detecting hole corresponding to one of the positional deviation detecting patterns is provided to be 0, and the position with respect to the positional deviation detecting hole is provided. Since the direction and amount of displacement between the through hole and the wiring conductor can be detected based on the surroundings of the misalignment detection pattern, it is necessary to visually check the surroundings of the misalignment detection pattern for such misalignment detecting holes. Thus, the positional accuracy between the through hole and the wiring conductor can be easily confirmed visually, and a wiring board capable of accurately and easily positioning the through hole and the wiring conductor can be provided.

[Brief description of the drawings]

FIG. 1 is a top view illustrating an example of an embodiment of a wiring board of the present invention.

FIG. 2 is a sectional view of the wiring board shown in FIG.

FIG. 3 is a top view of a main part of the wiring board shown in FIG. 1;

FIG. 4 is a top view showing another example of the embodiment of the wiring board of the present invention.

5 is a cross-sectional view of the wiring board shown in FIG.

FIG. 6 is a cross-sectional view showing a package for housing a semiconductor element.

FIG. 7 is a top view of a conventional wiring board.

8 is a cross-sectional view of the wiring board shown in FIG.

[Explanation of symbols]

 1a, 31a ... insulating layer 5, 34 ... misregistration detection holes 6, 35 ... misregistration detection patterns 14, 32 ... through holes 16, 33 ..... Wiring conductors

Claims (1)

[Claims] 1. An insulating layer comprising at least one insulating layer, wherein the insulating layer has a through hole penetrating between upper and lower surfaces, and an upper surface and / or a lower surface thereof is in contact with the through hole, or A wiring board having a wiring conductor attached adjacent thereto, wherein the insulating layer has a plurality of misregistration detection holes formed in a fixed positional relationship with the through hole, and a fixed position with the wiring conductor. A plurality of misregistration detection patterns attached so as to surround the misalignment detection holes in a relationship, the misalignment is determined when the misalignment between the through hole and the wiring conductor is a predetermined amount in a predetermined direction. The eccentricity of the displacement detection hole corresponding to one of the detection patterns is provided so as to be 0, and the position of the through hole and the wiring conductor is determined depending on the surroundings of the displacement detection pattern with respect to the displacement detection hole. A wiring board characterized in that the direction and amount of displacement can be detected.