JP2000355788A - Nickel laminated body and its production - Google Patents
Nickel laminated body and its productionInfo
- Publication number
- JP2000355788A JP2000355788A JP2000161038A JP2000161038A JP2000355788A JP 2000355788 A JP2000355788 A JP 2000355788A JP 2000161038 A JP2000161038 A JP 2000161038A JP 2000161038 A JP2000161038 A JP 2000161038A JP 2000355788 A JP2000355788 A JP 2000355788A
- Authority
- JP
- Japan
- Prior art keywords
- nickel layer
- nickel
- electroforming
- laminate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばインクジェット
用ノズル振動板のように耐振動性が要求される部品や、
電子部品用チップ挿入用治具などに用いて好適なニッケ
ル積層体並びにその製造方法に関する。The present invention relates to a component requiring vibration resistance, such as an ink jet nozzle diaphragm,
The present invention relates to a nickel laminate suitable for use as a jig for inserting a chip for an electronic component and a method for producing the same.
【０００２】[0002]
【従来の技術】従来、例えばインクジェット用ノズル振
動板は、エッチングで作られるのが一般的である。その
エッチングに際しては、図４の（Ａ）に示すようにＳＵ
Ｓ材１０（１５〜２０μ厚）の裏面側にポリイミド１１
をコートし、ついで図４の（Ｂ）に示すようにＳＵＳ材
１０の表面にレジスト膜１２をパターンニング形成し、
ついで図４の（Ｃ）に示すようにエッチング処理する。
最後に、図４の（Ｄ）に示すようにレジスト膜１２を除
去してインクジェット用ノズル振動板１３を得ていた
（文献不詳）。2. Description of the Related Art Conventionally, for example, an ink jet nozzle diaphragm is generally manufactured by etching. At the time of the etching, as shown in FIG.
Polyimide 11 on the back side of S material 10 (15-20μ thick)
Then, as shown in FIG. 4B, a resist film 12 is formed on the surface of the SUS material 10 by patterning,
Next, an etching process is performed as shown in FIG.
Finally, as shown in FIG. 4D, the resist film 12 was removed to obtain an ink jet nozzle diaphragm 13 (literature unknown).
【０００３】[0003]
【発明が解決しようとする課題】このように、ベース材
上に所定パターンの溝を有する薄肉の金属製品は、多用
途に供され、そこでの溝は耐振動性や強度調整などの機
能を発揮させるものとなる。しかるに、先の従来例のよ
うにポリイミド１１をベース材として使用すると、用途
によっては全体が金属製のものに比べて耐久性に劣る点
が問題になったり、とくにポリイミド１１とＳＵＳ材１
０との密着もあまり良くない。また、エッチング時にダ
レが発生し易く、高精度な形状のものが得難い。As described above, a thin metal product having grooves in a predetermined pattern on a base material is used for various purposes, and the grooves there exhibit functions such as vibration resistance and strength adjustment. It will be. However, when the polyimide 11 is used as a base material as in the above-mentioned conventional example, there is a problem in that the durability is inferior to that of a metal as a whole depending on the application.
The adhesion with 0 is not very good. In addition, sagging easily occurs during etching, and it is difficult to obtain a highly accurate shape.
【０００４】そこで、本発明者達は、外表面に多数の溝
を有する薄肉金属板をニッケル電鋳で作ることを試み、
本発明を完成するに至ったものである。すなわち、本発
明の目的は、１次電鋳ついで２次電鋳を行ってニッケル
層を二層構造にし、その際に外表面に所定パターンの溝
をつくるようにしたニッケル積層体並びにその製造方法
を提供するにある。Accordingly, the present inventors have attempted to make a thin metal plate having a large number of grooves on the outer surface by nickel electroforming.
The present invention has been completed. That is, an object of the present invention is to provide a nickel laminate in which a nickel layer is formed into a two-layer structure by performing primary electroforming and then secondary electroforming, in which a groove having a predetermined pattern is formed on the outer surface, and a method of manufacturing the same. To provide.
【０００５】[0005]
【課題を解決するための手段】本発明のニッケル積層体
は、図１に示すごとく１次電鋳された第１ニッケル層１
の表面に、所定パターンの溝２ａを持つ第２ニッケル層
２が２次電鋳されて一体に積層されていることを特徴と
する。According to the present invention, there is provided a nickel laminate comprising a first electroformed nickel layer 1 as shown in FIG.
A second nickel layer 2 having a predetermined pattern of grooves 2a is secondarily electroformed and integrally laminated on the surface thereof.
【０００６】更に具体的に説明すると、本発明のニッケ
ル積層体は、１次電鋳された第１ニッケル層１の表面
に、環状の溝２ａと、該溝２ａで囲まれた突起２ｂとを
備えた第２ニッケル層２が２次電鋳されて一体に積層さ
れたものである。その第２ニッケル層２には、多数の環
状の溝２ａと、外周が各溝２ａで囲まれた多数の突起２
ｂとが、それぞれ平面的な拡がりをもって連続状に形成
されている。More specifically, the nickel laminate of the present invention has an annular groove 2a and a projection 2b surrounded by the groove 2a on the surface of the first electroformed first nickel layer 1. The provided second nickel layer 2 is formed by secondary electroforming and integrally laminated. The second nickel layer 2 has a large number of annular grooves 2a and a large number of protrusions 2 whose outer periphery is surrounded by the grooves 2a.
b are formed continuously with a planar spread.
【０００７】本発明のニッケル積層体の製造に際して
は、図２に示すごとく電鋳母型３の表面に、第１ニッケ
ル層１を１次電鋳する工程と、第１ニッケル層１の表面
に、溝のパターンを持つフォトレジスト膜６を形成する
工程と、第１ニッケル層１のフォトレジスト膜６で覆わ
れていない表面に、第２ニッケル層２を２次電鋳する工
程と、電鋳母型３から第１ニッケル層１を第２ニッケル
層２ごと剥離する工程とからなる。かくして得たニッケ
ル積層体の第２ニッケル層２には、フォトレジスト膜６
が除去されたところに第１ニッケル層１の表面に達する
溝２ａを有するものとなる。その際、１次電鋳した第１
ニッケル層１の表面にフォトレジスト４を形成したの
ち、このフォトレジスト４の上に焼き付けついで現像の
各処理を行って溝のパターンを持つフォトレジスト膜６
を形成することができる。このフォトレジスト膜６は、
２次電鋳工程後に除去したのち、次の前記剥離工程に入
ることができる。In manufacturing the nickel laminate of the present invention, as shown in FIG. 2, a step of primary electroforming the first nickel layer 1 on the surface of the electroformed Forming a photoresist film 6 having a groove pattern, performing a second electroforming of the second nickel layer 2 on the surface of the first nickel layer 1 not covered by the photoresist film 6, Peeling the first nickel layer 1 together with the second nickel layer 2 from the matrix 3. A photoresist film 6 is formed on the second nickel layer 2 of the nickel laminate thus obtained.
Has a groove 2a reaching the surface of the first nickel layer 1 where the metal has been removed. At that time, the first electroformed first
After a photoresist 4 is formed on the surface of the nickel layer 1, the photoresist 4 is baked on the photoresist 4 and subjected to various development processes to form a photoresist film 6 having a groove pattern.
Can be formed. This photoresist film 6
After the removal after the secondary electroforming step, the next stripping step can be started.
【０００８】[0008]
【発明の作用効果】本発明に係るニッケル積層体によれ
ば、第１ニッケル層１と第２ニッケル層２とは、それぞ
れ電鋳によって一体に積層形成され、第１ニッケル層１
と、第２ニッケル層２とがそれぞれμｍオーダーの均一
な薄肉に成形できる。そのうえで、第２ニッケル層２に
形成される溝２ａも高精度に仕上がる。本発明方法によ
れば、２次電鋳時にフォトレジスト膜６で覆われていた
部分が該膜６の除去で溝２ａとなり、フォトレジスト膜
６で覆われていない部分が突起２ｂとなる。そこでの溝
２ａは、これの底面が第１ニッケル層１の外表面となっ
ていて上面が開口している。従って、製品・ニッケル積
層体は、溝２ａの存在部分が第１ニッケル層１のみから
なる薄肉化部分となり、溝２ａの存在しない部分、つま
り突起２ｂの存在部分が第１ニッケル層１と第２ニッケ
ル層２とからなる厚肉部分となる。その結果、本発明に
係るニッケル積層体は、溝２ａ付きの薄肉化部分と厚肉
部分とを有するμｍオーダーの金属極薄板を必要とする
多方面の用途に供することができる。その際に、溝２ａ
に対応する薄肉化部分は、溝幅の大小や第１ニッケル層
１の板厚の大小などで強度調整や耐振動性の調整などの
機能を果たすことになる。According to the nickel laminate according to the present invention, the first nickel layer 1 and the second nickel layer 2 are integrally formed by electroforming, respectively.
And the second nickel layer 2 can be formed into a uniform and thin wall of the order of μm. Then, the groove 2a formed in the second nickel layer 2 is also finished with high precision. According to the method of the present invention, the portion covered by the photoresist film 6 at the time of the secondary electroforming becomes the groove 2a by removing the film 6, and the portion not covered by the photoresist film 6 becomes the projection 2b. The groove 2 a has a bottom surface serving as an outer surface of the first nickel layer 1 and an upper surface opening. Therefore, in the product / nickel laminated body, the portion where the groove 2a exists is a thinned portion composed of only the first nickel layer 1, and the portion where the groove 2a does not exist, that is, the portion where the protrusion 2b exists is the first nickel layer 1 and the second nickel layer. It becomes a thick portion composed of the nickel layer 2. As a result, the nickel laminate according to the present invention can be used in various applications that require an ultrathin metal plate on the order of μm having a thinned portion with a groove 2a and a thickened portion. At that time, the groove 2a
The thickness-reduced portion corresponding to the above function fulfills functions such as strength adjustment and vibration resistance adjustment depending on the size of the groove width and the thickness of the first nickel layer 1.
【０００９】本発明方法によれば、第１ニッケル層１上
にフォトレジスト４を形成し、この上に溝のパターンを
持つフォトレジスト膜６を形成したのち、２次電鋳する
ので、フォトレジスト膜６の溝パターンに応じて製品に
は平面的に多数の溝２ａが所定のパターンで平面的な拡
がりをもって形成されることになる。かかる製品・ニッ
ケル積層体は、用途に応じて所定の大きさにいくつかに
切断して用いることができるし、環状の溝２ａで一つの
突起２ｂが囲まれた細小単位でも当然に用いることがで
きる。従って、例えば、耐振動性の要求されるインクジ
ェット用ノズル振動板などの部品に好適に使用すること
ができる。According to the method of the present invention, a photoresist 4 is formed on the first nickel layer 1, a photoresist film 6 having a groove pattern is formed thereon, and then a secondary electroforming is performed. In accordance with the groove pattern of the film 6, a large number of grooves 2a are formed in the product in a planar manner with a predetermined pattern. Such a product / nickel laminate can be cut into several pieces of a predetermined size according to the application, and it can be naturally used in a small unit in which one protrusion 2b is surrounded by an annular groove 2a. it can. Therefore, for example, it can be suitably used for components such as an inkjet nozzle diaphragm that requires vibration resistance.
【００１０】[0010]
【実施例】図１は本発明が対象とするニッケル積層体を
示しており、ベース材となる第１ニッケル層１の表面
に、所定の溝パターンを持つ第２ニッケル層２を一体に
積層形成してなる。すなわち、第２ニッケル層２には、
多数の環状の溝２ａが形成され、外周が各溝２ａで囲ま
れた突起２ｂが多数形成され、これら溝２ａと突起２ｂ
とが平面的な拡がりをもって連続状に所定のパターンで
形成されたものとなっている。FIG. 1 shows a nickel laminate to which the present invention is applied. A second nickel layer 2 having a predetermined groove pattern is integrally laminated on the surface of a first nickel layer 1 serving as a base material. Do it. That is, the second nickel layer 2 includes
A large number of annular grooves 2a are formed, and a large number of protrusions 2b whose outer periphery is surrounded by the grooves 2a are formed.
Are continuously formed in a predetermined pattern with a planar spread.
【００１１】このようなニッケル積層体の電鋳法の一例
を図２の（Ａ）ないし（Ｇ）に基づき説明する。まず、
電鋳母型３を無光沢ニッケル浴の電解液に浸漬して該母
型３の表面に１次電鋳を行う。この無光沢ニッケル浴の
組成とメッキ条件は次に示すとおりである。 スルファミン酸ニッケル ４５０ｇ／ｌ ホウ酸 ３０ｇ／ｌ ｐＨ ４〜4.５ 浴温 ５０℃ 電流密度 ２Ａ／ｄｍ2 〜７Ａ／ｄｍ2 上記の無光沢ニッケル浴にて電鋳を行うことにより、図
２の（Ａ）に示すように、電鋳母型３の表面に第１ニッ
ケル層１を形成する。この第１ニッケル層１の厚みは、
例えば１５μｍ程度にする。An example of the electroforming method of such a nickel laminate will be described with reference to FIGS. First,
The electroforming mold 3 is immersed in an electrolytic solution of a matte nickel bath to perform primary electroforming on the surface of the matrix 3. The composition and plating conditions of this matte nickel bath are as follows. Nickel sulfamate 450 g / l Boric acid 30 g / l pH 4-4.5 Bath temperature 50 ° C. Current density 2 A / dm 2 -7 A / dm 2 By performing electroforming in the above-mentioned matte nickel bath, As shown in FIG. 1A, a first nickel layer 1 is formed on the surface of an electroformed mold 3. The thickness of the first nickel layer 1 is
For example, it is set to about 15 μm.
【００１２】ついで、この第１ニッケル層１を付けた電
鋳母型３を上記の無光沢ニッケル浴より引き上げ、図２
の（Ｂ）に示すごとく第１ニッケル層１の表面に、ネガ
タイプのフォトレジスト４を均一に塗布して乾燥させる
か、またはラミネートする。ついで、そのレジスト４の
上に図２の（Ｃ）に示すごとく前記溝２ａのパターンに
対応するネガタイプフイルム５を密着させ、焼き付け、
現像の各処理を行って、図２の（Ｄ）に示すごとく溝パ
ターンのフォトレジスト膜６を形成する。勿論、上記フ
ォトレジスト４としては、ネガタイプのものに代えて、
ポジタイプのものであってもよい。Next, the electroformed mold 3 provided with the first nickel layer 1 is pulled up from the above-mentioned matte nickel bath, and FIG.
As shown in (B), a negative type photoresist 4 is uniformly applied to the surface of the first nickel layer 1 and dried or laminated. Then, a negative type film 5 corresponding to the pattern of the groove 2a is brought into close contact with the resist 4 as shown in FIG.
Each process of development is performed to form a photoresist film 6 having a groove pattern as shown in FIG. Of course, as the photoresist 4, instead of the negative type,
It may be of a positive type.
【００１３】ついで、このフォトレジスト膜６が形成さ
れた電鋳母型３を、光沢ニッケル浴に移して２次電鋳を
行う。この光沢ニッケル浴の組成とメッキ条件は次に示
すとおりである。 スルファミン酸ニッケル ４５０ｇ／ｌ ブチンジオール 0.００５〜0.０１ｇ／ｌ ＮＴＳ 0.０１〜0.０５ｇ／ｌ ホウ酸 ３０ｇ／ｌ ｐＨ ４〜4.５ 浴温 ５０℃ 上記の光沢ニッケル浴にて電流密度２Ａ／ｄｍ2 〜７Ａ
／ｄｍ2 で電鋳を行うことにより、図２の（Ｅ）に示す
ごとく第１ニッケル層１のフォトレジスト膜６で覆われ
ていない表面に、第２ニッケル層２を形成する。この第
２ニッケル層２の厚みは３０μｍ程度とする。Next, the electroformed mold 3 on which the photoresist film 6 is formed is transferred to a bright nickel bath and subjected to secondary electroforming. The composition and plating conditions of this bright nickel bath are as follows. Nickel sulfamate 450 g / l Butynediol 0.005 to 0.01 g / l NTS 0.01 to 0.05 g / l Boric acid 30 g / l pH 4 to 4.5 Bath temperature 50 ° C Current in the above bright nickel bath Density 2A / dm 2 -7A
By performing electroforming at / dm 2 , the second nickel layer 2 is formed on the surface of the first nickel layer 1 which is not covered with the photoresist film 6 as shown in FIG. The thickness of the second nickel layer 2 is about 30 μm.
【００１４】この第２ニッケル層２の電鋳後、フォトレ
ジスト膜６を除去し、図２の（Ｆ）に示すごとく電鋳母
型３から第１ニッケル層１を第２ニッケル層２ごと剥離
する。かくして、図２の（Ｇ）および図１に示すごとき
ニッケル積層体の電鋳製品が得られる。After the electroforming of the second nickel layer 2, the photoresist film 6 is removed, and the first nickel layer 1 and the second nickel layer 2 are removed from the electroforming mold 3 as shown in FIG. I do. Thus, an electroformed product of a nickel laminate as shown in FIG. 2 (G) and FIG. 1 is obtained.
【００１５】よって得られた製品・ニッケル積層体は、
先の図１および図２（Ｇ）に示すとおりであり、各溝２
ａは溝底が第１ニッケル層１の外表面であって上面が開
口しており、各溝２ａで囲まれた各突起２ｂが第２ニッ
ケル層２を構成している。従って、ニッケル積層体の厚
みは、各溝２ａの存在部分が第１ニッケル層１の厚みに
相当する１５μｍ程度、突起２ｂの存在部分が第１ニッ
ケル層１と第２ニッケル層２との厚みの合計に相当する
４５μｍ程度になっている。The product / nickel laminate thus obtained is:
As shown in FIG. 1 and FIG.
In a, the bottom of the groove is the outer surface of the first nickel layer 1 and the top surface is open, and each projection 2b surrounded by each groove 2a constitutes the second nickel layer 2. Therefore, the thickness of the nickel laminated body is such that the portion where each groove 2a exists is about 15 μm corresponding to the thickness of the first nickel layer 1 and the portion where the protrusion 2b exists is the thickness of the first nickel layer 1 and the second nickel layer 2. It is about 45 μm corresponding to the total.
【００１６】このようにして得られたニッケル積層体の
第１・第２ニッケル層１・２どうしの密着強さをテスト
してみた。その際に、それぞれを光沢ニッケルで形成し
た第１ニッケル層と第２ニッケル層とからなるニッケル
積層体を比較例として挙げた。そして、これらのニッケ
ル積層体に振動を加えてみたところ、本発明実施例では
比較例と異なり第２ニッケル層２が第１ニッケル層１か
ら剥がれるようなことがなく、完全に密着していた。The adhesion strength between the first and second nickel layers 1 and 2 of the nickel laminate thus obtained was tested. At that time, a nickel laminate including a first nickel layer and a second nickel layer, each formed of bright nickel, was given as a comparative example. Then, when vibrations were applied to these nickel laminates, unlike the comparative example, the second nickel layer 2 did not peel off from the first nickel layer 1 and was completely adhered in the example of the present invention.
【００１７】また、本発明実施例のニッケル積層体を第
１ニッケル層１側に折り曲げて第１・第２ニッケル層１
・２相互間の一端に剥離応力を加えてみたが、電子顕微
鏡で拡大して見た図３に示すようにその接合部に剥がれ
が無く、むしろ第１ニッケル層１における第２ニッケル
層２との接合部Ｃとは異なり、その近傍の第１ニッケル
層１における第２ニッケル層２で覆われていない露出表
面部の箇所Ｄが引きちぎれる様な破壊状態が認められ、
このことからもニッケル層１・２相互間がいかに強く密
着しているかがよく判った。Further, the nickel laminate of the embodiment of the present invention is bent toward the first nickel layer 1 to form the first and second nickel layers 1.
Although a peeling stress was applied to one end between the two, there was no peeling at the joint as shown in FIG. Unlike the joint portion C, a broken state in which the portion D of the exposed surface portion of the first nickel layer 1 which is not covered with the second nickel layer 2 in the vicinity thereof is torn off is recognized,
From this, it was clearly understood how strongly the nickel layers 1 and 2 were closely adhered to each other.
【００１８】すなわち、第１ニッケル層と第２ニッケル
層とが共に光沢ニッケル浴で電鋳されている場合、両者
の密着性に難が出る。その理由は定かでないが、ブチン
ジオール、あるいはサッカリンやＮＴＳなどの光沢剤を
添加したスルファミン酸ニッケル浴でベース材の第１ニ
ッケル層を１次電鋳した場合は、その第１ニッケル層に
イオウやカーボンの含有量が多くなるため、１次電鋳後
において２次電鋳するまでの間に、その表面に酸化皮膜
ができたり、アルカリ現像液などの薬品付着などで第１
ニッケル層の表面状態が変化する。そのため、その第１
ニッケル層の表面に対し第２ニッケル層が組成的に密着
しにくくなるものと考えられる。そのほかに、第１ニッ
ケル層の光沢表面の結晶がち密になるため、第２ニッケ
ル層が物理的にも密着しにくいかと考えられる。That is, when both the first nickel layer and the second nickel layer are electroformed in a bright nickel bath, the adhesion between them becomes difficult. Although the reason is not clear, when the first nickel layer of the base material is primarily electroformed in a nickel sulfamate bath to which a brightener such as butynediol or saccharin or NTS is added, the first nickel layer has sulfur or Since the carbon content is increased, an oxide film is formed on the surface after the primary electroforming and before the secondary electroforming, or the first electroforming occurs due to the adhesion of a chemical such as an alkali developing solution.
The surface state of the nickel layer changes. Therefore, the first
It is considered that the second nickel layer hardly adheres compositionally to the surface of the nickel layer. In addition, it is conceivable that the crystal on the glossy surface of the first nickel layer becomes dense, so that the second nickel layer is hardly physically adhered.
【００１９】第２ニッケル層２は光沢ニッケルあるいは
無光沢ニッケルのいずれの電鋳で形成しても、第１ニッ
ケル層１との密着性に優れるが、上記実施例のように第
２ニッケル層２をブチンジオールを添加する光沢ニッケ
ル浴で電鋳した場合は、腐食環境においてイオウを含む
第２ニッケル層２がイオウを含まない第１ニッケル層１
に対してアノードとして作用し、腐食は第２ニッケル層
２で止まるため耐蝕性を向上させることができる。The second nickel layer 2 is excellent in adhesion to the first nickel layer 1 when formed by electroforming either bright nickel or dull nickel. Is electroformed in a bright nickel bath to which butyne diol is added, the second nickel layer 2 containing sulfur becomes the first nickel layer 1 containing no sulfur in a corrosive environment.
Acts as an anode, and the corrosion stops at the second nickel layer 2, so that the corrosion resistance can be improved.
【００２０】なお、第２ニッケル層２は通常、上記のご
とく２〜７Ａ／ｄｍ2 程度の電流密度で形成することが
多いが、好ましくは0.５〜１Ａ／ｄｍ2 の低電流密度で
第２ニッケル層２を形成すれば、電着時間は長くかかる
が、第１ニッケル層１との親和力が向上し、より一層良
好な密着性が得られる。The second nickel layer 2 is usually formed at a current density of about 2 to 7 A / dm 2 as described above, but is preferably formed at a low current density of 0.5 to 1 A / dm 2 . If the two nickel layers 2 are formed, the electrodeposition time is long, but the affinity with the first nickel layer 1 is improved, and better adhesion is obtained.
【図１】ニッケル積層体の一部を示す斜視図である。FIG. 1 is a perspective view showing a part of a nickel laminate.
【図２】ニッケル積層体の電鋳工程図である。FIG. 2 is an electroforming process chart of a nickel laminate.
【図３】ニッケル積層体の密着強さをテストしたときの
要部の一部斜視図である。FIG. 3 is a partial perspective view of a main part when the adhesion strength of the nickel laminate is tested.
【図４】従来のエッチング法によるインクジェット用ノ
ズル振動板のエッチング工程図である。FIG. 4 is an etching process diagram of an inkjet nozzle diaphragm by a conventional etching method.
１ 第１ニッケル層 ２ａ 溝 ２ｂ 突起 ２ 第２ニッケル層 ３ 電鋳母型 ４ フォトレジスト ６ フォトレジスト膜 DESCRIPTION OF SYMBOLS 1 1st nickel layer 2a groove | channel 2b protrusion 2 2nd nickel layer 3 Electroforming mold 4 Photoresist 6 Photoresist film
Claims (5)
に、第１ニッケル層１の表面を露出させる所定パターン
の溝２ａを持つ第２ニッケル層２が２次電鋳されて一体
に積層されていることを特徴とするニッケル積層体。1. A second nickel layer 2 having a predetermined pattern of grooves 2a for exposing the surface of the first nickel layer 1 is formed on the surface of the first electroformed first nickel layer 1 by second electroforming. A nickel laminate, wherein the nickel laminate is laminated.
に、環状の溝２ａと、該溝２ａで囲まれた突起２ｂとを
備えた第２ニッケル層２が２次電鋳されて一体に積層さ
れていることを特徴とするニッケル積層体。2. A second nickel layer 2 having an annular groove 2a and a projection 2b surrounded by the groove 2a is secondarily electroformed on the surface of the first electroformed first nickel layer 1. A nickel laminate, wherein the nickel laminate is integrally laminated.
２ａと、外周が各溝２ａで囲まれた多数の突起２ｂと
が、それぞれ平面的な拡がりをもって連続状に形成され
ている請求項１又は２記載のニッケル積層体。3. In the second nickel layer 2, a large number of annular grooves 2a and a large number of projections 2b whose outer periphery is surrounded by the respective grooves 2a are formed continuously in a planar manner. The nickel laminate according to claim 1.
を１次電鋳する工程と 、 第１ニッケル層１の表面に、溝のパターンを持つフォト
レジスト膜６を形成する工程と、 第１ニッケル層１のフォトレジスト膜６で覆われていな
い表面に、第２ニッケル層２を２次電鋳する工程と、 電鋳母型３から第１ニッケル層１を第２ニッケル層２ご
と剥離する工程とを経て、 第２ニッケル層２に、フォトレジスト膜６が除去された
ところに第１ニッケル層１の表面に達する溝２ａを有す
るニッケル積層体の製造方法。4. A first nickel layer 1 is formed on the surface of the electroformed mold 3.
A first electroforming step, a step of forming a photoresist film 6 having a groove pattern on the surface of the first nickel layer 1, and a step of forming a photoresist film 6 having a groove pattern on the surface of the first nickel layer 1 which is not covered with the photoresist film 6. A second nickel layer 2 and a second nickel layer 2, and a step of peeling the first nickel layer 1 together with the second nickel layer 2 from the electroforming matrix 3. 6. A method of manufacturing a nickel laminate having a groove 2a reaching the surface of the first nickel layer 1 where 6 has been removed.
を１次電鋳する工程と、 第１ニッケル層１の表面にフォトレジスト４を形成する
工程と、 フォトレジスト４の上に、焼き付けついで現像の各処理
を行って、溝のパターンを持つフォトレジスト膜６を形
成する工程と、 第１ニッケル層１のフォトレジスト膜６で覆われていな
い表面に、第２ニッケル層２を２次電鋳する工程と、 フォトレジスト膜６を除去したのち、電鋳母型３から第
１ニッケル層１を第２ニッケル層２ごと剥離する工程と
を経て、 第２ニッケル層２に、第１ニッケル層１の表面に達する
溝２ａを有するニッケル積層体の製造方法。5. A first nickel layer 1 on the surface of an electroformed mold 3.
A first electroforming step; a step of forming a photoresist 4 on the surface of the first nickel layer 1; and a step of baking and developing each of the photoresist 4 to form a photoresist having a groove pattern. A step of forming a film 6; a step of second electroforming the second nickel layer 2 on the surface of the first nickel layer 1 which is not covered with the photoresist film 6; a step of removing the photoresist film 6; Removing the first nickel layer 1 together with the second nickel layer 2 from the casting mold 3, and manufacturing the nickel laminate having the groove 2 a reaching the surface of the first nickel layer 1 in the second nickel layer 2. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000161038A JP3295810B2 (en) | 1993-06-03 | 2000-05-30 | Nickel laminate and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000161038A JP3295810B2 (en) | 1993-06-03 | 2000-05-30 | Nickel laminate and method for producing the same |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16007993A Division JP3270948B2 (en) | 1993-06-03 | 1993-06-03 | Nickel laminate and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000355788A true JP2000355788A (en) | 2000-12-26 |
| JP3295810B2 JP3295810B2 (en) | 2002-06-24 |
Family
ID=18665140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000161038A Expired - Fee Related JP3295810B2 (en) | 1993-06-03 | 2000-05-30 | Nickel laminate and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3295810B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045657A (en) * | 2001-05-24 | 2003-02-14 | Kyushu Hitachi Maxell Ltd | Deposition mask for organic el element and its manufacturing method |
| JP2003323980A (en) * | 2002-04-26 | 2003-11-14 | Kyushu Hitachi Maxell Ltd | Vapor deposition mask for organic el element and its manufacturing method |
| JP2017036471A (en) * | 2015-08-07 | 2017-02-16 | 大日本印刷株式会社 | Vapor deposition mask manufacturing method |
-
2000
- 2000-05-30 JP JP2000161038A patent/JP3295810B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003045657A (en) * | 2001-05-24 | 2003-02-14 | Kyushu Hitachi Maxell Ltd | Deposition mask for organic el element and its manufacturing method |
| JP2003323980A (en) * | 2002-04-26 | 2003-11-14 | Kyushu Hitachi Maxell Ltd | Vapor deposition mask for organic el element and its manufacturing method |
| JP2017036471A (en) * | 2015-08-07 | 2017-02-16 | 大日本印刷株式会社 | Vapor deposition mask manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3295810B2 (en) | 2002-06-24 |
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