JP2000354950A5 - - Google Patents

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Publication number
JP2000354950A5
JP2000354950A5 JP1999167892A JP16789299A JP2000354950A5 JP 2000354950 A5 JP2000354950 A5 JP 2000354950A5 JP 1999167892 A JP1999167892 A JP 1999167892A JP 16789299 A JP16789299 A JP 16789299A JP 2000354950 A5 JP2000354950 A5 JP 2000354950A5
Authority
JP
Japan
Prior art keywords
polishing pad
polishing
polished
open cells
slurry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999167892A
Other languages
English (en)
Japanese (ja)
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JP2000354950A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP16789299A priority Critical patent/JP2000354950A/ja
Priority claimed from JP16789299A external-priority patent/JP2000354950A/ja
Publication of JP2000354950A publication Critical patent/JP2000354950A/ja
Publication of JP2000354950A5 publication Critical patent/JP2000354950A5/ja
Pending legal-status Critical Current

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JP16789299A 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法 Pending JP2000354950A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16789299A JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16789299A JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Publications (2)

Publication Number Publication Date
JP2000354950A JP2000354950A (ja) 2000-12-26
JP2000354950A5 true JP2000354950A5 (fr) 2006-02-23

Family

ID=15858010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16789299A Pending JP2000354950A (ja) 1999-06-15 1999-06-15 研磨パッド、研磨装置及び平坦な表面を有する被研磨体を製造する方法

Country Status (1)

Country Link
JP (1) JP2000354950A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7192340B2 (en) 2000-12-01 2007-03-20 Toyo Tire & Rubber Co., Ltd. Polishing pad, method of producing the same, and cushion layer for polishing pad
JP4566660B2 (ja) * 2004-08-30 2010-10-20 富士紡ホールディングス株式会社 仕上げ研磨用研磨布及び研磨布の製造方法
JP2007103485A (ja) * 2005-09-30 2007-04-19 Fujifilm Corp 研磨方法及びそれに用いる研磨液
JP4942170B2 (ja) * 2006-09-12 2012-05-30 東洋ゴム工業株式会社 研磨パッド
JP4737689B2 (ja) * 2007-02-15 2011-08-03 メゾテクダイヤ株式会社 表面研磨方法と表面研磨装置と表面研磨板
JP5172457B2 (ja) * 2008-05-08 2013-03-27 株式会社ディスコ 研削装置及び研削方法
JP5050064B2 (ja) * 2010-02-04 2012-10-17 メゾテクダイヤ株式会社 表面研磨方法と表面研磨装置と表面研磨板
JP5544213B2 (ja) * 2010-04-26 2014-07-09 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
JP5639854B2 (ja) * 2010-11-11 2014-12-10 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
JP6016301B2 (ja) 2013-02-13 2016-10-26 昭和電工株式会社 単結晶ＳｉＣ基板の表面加工方法、その製造方法及び単結晶ＳｉＣ基板の表面加工用研削プレート
CN109909868B (zh) * 2019-04-23 2023-11-21 蚌埠中光电科技有限公司 一种tft-lcd玻璃面研磨装置及方法

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