JP2000351067A - Soldering iron - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering iron which can heat solder to its melting point in the minimum range of an object to be heated. SOLUTION: At the iron tip 10 of a soldering iron, a pin shape prow 12 is provided, which is used for conducting directly heat to a portion where the iron tip of the conventional soldering iron can not reach, and the iron tip which is a heat source can be approached as much as possible to an object to be heated. Consequently, in the minimum range of the object to be heated, solder can be heated to its melting point, and a heat stress given to the peripheral part of a portion to be heated, can be reduced. The change of a material by heat does not occur, and by melting the unnecessary solder staying behind in a hole, solder removing can be efficiently performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron, and more particularly, to a soldering iron capable of efficiently performing a soldering or solder removing operation.

[0002]

2. Description of the Related Art Conventionally, in an operation using a soldering iron as a manufacturing tool, how to raise a solder to be worked to a melting point temperature is one of the important factors.

FIG. 5 is a perspective view showing an example of a conventional soldering iron. As shown in FIG. 5, a conventional soldering iron tip 1 is formed in a rod shape or a plate shape, and gradually becomes thin with an intersection 2 where a straight line intersects as a tip.

For example, when heating the inside of a hole formed in a metal part using such a conventional tip 1, if the tip 1 cannot be inserted into the hole, the bottom of the hole is heated. Therefore, most of the heat generated from the tip 1 is absorbed by the surrounding metal parts. Therefore, the solder at the bottom of the hole to be heated cannot be raised to the melting point temperature, and the solder cannot be sufficiently removed from the hole.

[0005] Therefore, usually, when performing a solder removal operation on a part or the like where the soldering iron tip 1 cannot reach (particularly, a bottom part in a thin tube where solder remains), a high heat generation amount is required. By using a soldering iron or continuing to heat for a long time, the temperature of the entire target portion is raised.

In other words, since the portion to be heated cannot be directly heated, the temperature of the entire portion to be heated including the peripheral portion is raised to indirectly raise the temperature of the portion to be heated to the melting point of the solder.

[0007]

However, when raising the temperature of the entire portion to be heated including the peripheral portion, if a material having a high heat diffusion coefficient is used around the portion to be heated, the solder at the portion to be heated is not soldered. Is difficult to raise to the melting point temperature, and a great deal of thermal stress is applied to a wide range of surrounding materials.

Further, when the metal tip 1 is pressed against the metal portion or the peripheral portion for a long time, scratches, breaks, deterioration of the material, and the like are apt to occur, and the metal portion is peeled off due to the deterioration.

An object of the present invention is to provide a soldering iron capable of heating a solder to a melting point within a minimum heating range.

[0010]

In order to achieve the above object, a soldering iron according to the present invention is characterized in that a pin-like projection is protruded from the tip of the tip.

[0011] With the above configuration, a pin-like projection is provided at the tip of the tip. Thereby, the solder can be heated to the melting point within the minimum heating range.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory diagram of a soldering iron according to an embodiment of the present invention. As shown in FIG. 1, a pin (Pin) -shaped projection 12 protrudes from a tip 11 of the soldering iron tip 10 along an extension of a central longitudinal axis of the soldering iron 10.

FIG. 2 is an explanatory diagram showing the relationship between the pin-shaped projections and the heating site in FIG. As shown in FIG.
The pin-shaped protrusion 12 provided at the tip 11 of the hole is formed of a material having good thermal conductivity, and the hole 13 serving as a concave heating portion is formed.
And has a length equal to or longer than the depth h of the hole 13 (in FIG. 2, the thickness of the substrate 14 in which the hole 13 is formed) h.

The hole 13 is formed by a metal portion 15 provided in a state buried in a substrate 14, and the inside is filled with solder 16 to be heated (see FIG. 3). In this embodiment, the inner diameter r of the target hole 13 is about 0.5.
5 mm, and the depth h of the hole 13 is about 1.5 mm.
Therefore, the pin-shaped projection 12 has, for example, a total length of about 1.5 to
It is 2 mm and has an outer diameter of about 0.3 mm.

Heat is directly supplied from a heater (not shown) provided inside the soldering iron to the entire tip 10 on which the pin-shaped projections 12 are protruded.
The light is transmitted to the object to be heated via a pin-shaped projection 12 provided at the tip 11 of the zero. The state of diffusion of the transferred heat depends on the thermal resistance and distance of the substance receiving the heat and the heat capacity of the surrounding components.

FIG. 3 is a cross-sectional view of a heating portion for explaining a state in which heat of the pin-shaped projection is transmitted. As shown in FIG. 3, the solder 16
Is transmitted to the metal part 15 adjacent to the outside of the solder 16.

At this time, the thermal resistance of the metal part 15 is
And the heat capacity of the metal part 15 is smaller than that of the solder 16.
Is larger than the heat capacity of the metal part 1, the heat transmitted from the pin-shaped protrusion 12 located above the solder 16 (hole 13)
5, the solder 16 at the bottom of the hole 13 cannot be sublimated to the melting point temperature in some cases. The distance b between the tip and the solder 16 at the bottom of the hole 13 of the pin-shaped protrusion 12 located above the solder 16 (hole 13) is larger than the distance a between the metal part 15.

Even in such a case, the temperature of the solder 16 at the bottom of the hole 13 can be sublimated to the melting point by inserting the pin-shaped protrusion 12 deep into the solder 16 (in the hole 13). By pulling up the soldering iron in a state where the solder 16 is melted, the solder 16 inside the hole 13 can be removed.

FIG. 4 shows a soldering iron tip according to another embodiment of the present invention. FIG.
(B) is an explanatory diagram of a use situation (No. 2),
(C) is a perspective view of the modification.

As shown in FIG. 4A, a linear groove 17 may be provided on the peripheral surface of a pin-shaped projection 12 protruding from the tip 11 of the tip 10 along the longitudinal axis thereof. With the linear grooves 17, the molten solder 16 can be efficiently sucked out of the holes 13 using the solder adsorbent 18 inserted between the substrate 14 and the substrate 14.

The pin-shaped protrusion 12 is inserted into the hole 13 for removing the solder 16 by aligning the linear groove 17 with the solder adsorbent 18 or penetrating through the solder adsorbent 18. The solder 16 melted by the heat of the solder 12 is applied to a solder adsorbent 18 where a suction force acts on the solder 16, and the linear groove 1 is formed.
It is sucked up via 7.

As shown in FIG. 4B, if the solder 16 is previously stored in the linear groove 17 of the pin-shaped projection 12, the solder 16 is located on the side of the tip 10 inserted into the hole 13. Hole 1
The solder in the linear groove 17 can be soldered to the side wall portion 3.

Further, as shown in FIG. 4C, the spiral groove 1 along the peripheral surface of the pin-shaped projection 12 is used instead of the linear groove 17.
9 may be provided. By the spiral groove 19, unnecessary solder 16 remaining in the hole 13 or the thin tube, which cannot be removed conventionally, can be removed by utilizing the capillary phenomenon.

As described above, according to the present invention, the soldering iron tip 10 is provided with the pin-shaped protrusions 12 for directly transmitting heat to a portion where the conventional soldering iron tip cannot reach. The tip 10, which is a heat source, can be brought as close as possible to the object to be heated.

Thus, the solder 1 can be heated in the minimum heating range.
6 can be heated to the melting point, reducing the thermal stress applied to the peripheral portion of the heated portion and melting the unnecessary solder remaining in the hole 13 without causing a change in the material due to heat. Thus, the removal operation can be performed efficiently.

[0027]

As described above, according to the present invention, since the pin-shaped projection is provided at the tip of the tip,
The solder can be heated to its melting point within the minimum heating range, reducing the thermal stress that has been applied to the surrounding area of the heated area and eliminating the unnecessary unnecessary solder that does not change the material due to heat. The removal operation can be performed efficiently by melting.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a soldering iron tip according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a relationship between a pin-shaped protrusion and a heated portion in FIG.

FIG. 3 is a cross-sectional view of a heating portion for explaining a state where heat of a pin-shaped protrusion is transmitted.

4A and 4B show a soldering iron tip according to another embodiment of the present invention, in which FIG.
(B) is an explanatory view of a use situation (No. 2), and (c) is a perspective view of a modified example thereof.

FIG. 5 is a perspective view showing an example of a conventional soldering iron tip.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Tip 11 Tip 12 Pin-shaped projection 13 Hole 14 Board 15 Metal part 16 Solder 17 Linear groove 18 Solder adsorbent 19 Spiral groove a, b Distance r Inner diameter h Depth

Claims (6)

[Claims] 1. A soldering iron characterized in that a pin-like projection is provided at the tip of the iron tip. 2. The soldering iron according to claim 1, wherein the pin-shaped protrusion is along an extension of a central longitudinal axis of the tip. 3. The pin-shaped projection according to claim 1, wherein the pin-shaped projection is formed of a material having good thermal conductivity, and has a length smaller than the inner diameter of the concave heating portion and greater than the depth. Soldering iron. 4. A soldering iron according to claim 1, wherein a linear groove is provided on a peripheral surface of said pin-shaped projection so as to extend along a longitudinal axis of said pin-shaped projection. hand. 5. The soldering iron according to claim 4, wherein a spiral groove is provided along the peripheral surface of the pin-shaped projection instead of the linear groove. 6. The soldering iron according to claim 4, wherein the groove efficiently sucks out the molten solder using the solder adsorbent.