JP2000348998A - Film-sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To add a function of pressing on an integrated film to a cutter and to provide a film sticking method by which the abrasion of a cutter blade and the deterioration of the cutter blade reception face of a cutter stand owing to the cutter blade are difficult to occur. SOLUTION: In a mechanism for giving a perforation or cutting processing for exposing a resist film 5, only in a part where plural substrates transferred on a transfer path by leaving intervals are to be stuck with respect to an integrated film, which is fed out of a film roll, cost for the mechanism in adding a function for pressing the integrated film to a cutter 9, is reduced by reducing the number of parts, a groove is added so that a cutter blade does not directly abut on a cutter stand 8 or cutter blade receiving face material is set as a soft material, in which scars of the cutter blade tend not to occur and which is easily restored, even if scars are given, and abrasion of the cutter blade can be prevented or the deterioration of the cutter blade reception face of the cutter stand can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for attaching a film, and more particularly to a method for attaching a film such as a resist film to a surface of a substrate such as a semiconductor substrate or a printed wiring board.

[0002]

2. Description of the Related Art As a conventional method of this type, a film having a three-layer structure (hereinafter, referred to as a resist film) such as a base film and a resist film as a film, and a cover film (hereinafter, integrally formed) is used. The film is wound so that the base film is on the outer periphery and the cover film is on the inner periphery. The cover film is peeled off from the integrated film that is unwound from the film roll, and the film is transported at regular intervals on the transport path. The two-layered resist film and the base film are cut in the width direction according to the dimensions of each substrate conveyed so that the resist film is on the substrate surface side.
There is a single-wafer method in which a pair of pressure bonding rolls is applied to each substrate.

In the single-wafer method, it is difficult to position the leading end of the film in the substrate transport direction at the leading end of the substrate, and it is easy to form bubbles at the time of alignment. In addition, the trailing end of the film becomes a free end and bubbles are taken in. Therefore, there is a problem that the device configuration of the edge processing is complicated.

Therefore, a continuous method has been proposed to simplify the device configuration.

[0005] In this method, a film roll is used in the same manner as in the single-wafer method, and only a portion where a plurality of substrates conveyed on a conveyance path at a fixed interval is to be adhered to an integrated film fed from the film roll is used. A continuous method in which a resist film is placed on a substrate surface side without cutting the base film after a substrate-to-substrate treatment for peeling the film and pasting to each substrate through a pair of pressure-bonding rolls (JP-A-8-26557) See).

In either case, at least when the cover film and the resist film are cut, a clamper or a guide roll or the like for holding the film is required on the cutter side with the film interposed therebetween.

In addition, a plate-shaped cutter holder is required on the opposite side of the cutter with an integrated film therebetween,
The receiving surface of the cutter holder is damaged by the cutter blade.

Incidentally, the inter-substrate processing in these film bonding methods is for preventing the pressure roll from being stained with the resist film when the resist film is bonded to one side of the substrate.

[0009]

In the above method, the integral film is interposed, and the cutter side requires a clamper or a guide roll for holding the film in addition to the cutter. Therefore, the mechanism becomes complicated, and the number of parts is reduced. Production costs increase. In addition, the cutter blade receiving surface on the integrated film side of the cutter holder directly contacts the cutter holder via the integrated film, and the cutter blade may be worn or the cutter blade receiving surface of the cutter holder may be damaged. There is.

Further, if the cutter blade receiving surface of the force irrigation cradle is damaged, the cutter blade receiving surface may be embossed, and a solidified film may be pressed against this surface, or a solidified film may be formed on this surface. Rubbing while passing-scratches the body film.
This scratch becomes indistinguishable from the exposure pattern on the resist film, and causes a reduction in the exposure yield.

Therefore, an object of the present invention is to add a function of holding an integrated film to a cutter, and to prevent the wear of the cutter blade or the deterioration of the cutter blade receiving surface of the cutter receiving stand due to the cutter blade, that is, sticking. It is an object of the present invention to provide a film sticking method that reduces the running cost and maintenance cost required for the film.

Another object of the present invention is to provide a method for attaching a film, which can perform inter-substrate processing without damaging the force ivy blade receiving surface of the force ivy receiving table.

[0013]

The feature of the present invention resides in that a resist film is formed only at a position where a plurality of substrates conveyed on a conveyance path at intervals are to be bonded to an integrated film fed from a film roll. In the mechanism that provides a perforation or cutting process for exposing the cutter, simplification of the mechanism by adding the function of holding the integrated film to the cutter, reduction of the manufacturing cost by reducing the number of parts, and the cutter blade directly By adding grooves so that they do not hit, or by making the cutter blade receiving surface material a soft material that does not easily cause damage to the cutter blade and easily recovers even if it is damaged, wear of the cutter blade or It is an object of the present invention to provide a film sticking method capable of preventing the cutter blade receiving surface from deteriorating.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The method of the present invention will be described below with reference to the embodiment shown in the drawings.

FIG. 1 is a schematic view of a film sticking apparatus embodying an embodiment of the method of the present invention.

In FIG. 1, each substrate 1 is transported on a transport roll 2 forming a transport path at an interval L1. still,
For those on the upper side of the transport roll 2, the suffix a is added to the reference numerals, and for the lower one, the suffix b is added.

Reference numeral 3 denotes a roll of a film F having a three-layer structure of a base film 4, a resist film (film main body) 5, and a cover film 6. Reference numeral 7 denotes a perforation forming unit having a groove 8B on a cutter blade receiving surface 8A. It is composed of a pair of cutter blade receivers 8 having a plate shape or a roll shape and a pair of perforated cutters 9. The perforated cutter 9 is made of a material such as steel or diamond cutter, and the interval L2 between the perforated cutters 9 is The distance is set wider than the distance L1 between the substrates 1 and includes portions where the resist film 5 is not required to be adhered onto the substrates.

A method of providing perforations is as follows. First, the perforation forming unit 7 is moved in the same direction as the direction of feeding the film F at the same speed while the pair of cutter blade receivers 8 are being moved.
After a pair of perforated cutters 9 are moved in the direction of the film F in contact with or in a gap smaller than the thickness of the film F, the receiving surface 8A of the cutter blade receiver 8 and the perforated cutter 9 are moved in the width direction of the film F. Film F at the boss portion 9A of 9
The film F is provided with perforations while sandwiching. At this time, the cutter blade 9B of the perforation cutter 9 is
Since it is located at the portion B, the cutting edge is not worn by the cutter blade receiver 8. Further, since the cutter blade receiver 8 does not hit the cutting edge of the perforated cutter 9, the surface in contact with the film F is not deteriorated by the perforated cutter 9.

(Note that the blade 9B of the force ivy is actually
Although the length protruding from A is small, the length that the cutter blade 9B protrudes from the boss portion is exaggerated for the sake of clarity. When a perforation is provided, depending on the nature of the film, the film may escape into the groove 8B of the cutter blade receiver 8 due to the pressing force of the cutting edge when the perforation is cut, and it may be difficult to obtain a desired perforation shape. is there. In this case, perforations can be reliably formed by providing the cutter blade receiver 8 with a function of vacuum-sucking the film.

After the perforation is provided, the pair of cutter blade receivers 8 and the pair of perforation cutters 9 move in a direction away from the film F, and the perforation forming unit 7 moves in the same direction as the feeding direction of the film F. The parallel movement is started in the direction opposite to the feeding direction of the film F to the point where the parallel movement is started at the same speed, and the processing for providing the next perforation is performed.

Reference numeral 10 denotes a cover film partial peeling mechanism, a pair of film clampers 11, a pair of adhesive tapes 13, a roll 12 for attaching the pair of adhesive tapes 13 to the cover film 6, and a length to be attached on a substrate. Take-up roll 14 for taking up the cover film 6 having a thickness of L3
It consists of.

The method of peeling the cover film 6 is as follows. First, the film F is pressed by a pair of film clampers 11 while the cover film partial peeling mechanism 10 is translated at the same speed in the same direction as the feed direction of the film F, The adhesive tape 13 is applied to the portion of the film F where the cover film 6 is peeled off in the width direction of the film by the roll 12,
The cover film 6 is peeled from the film F in the width direction of the film using the adhesive tape 13, and the peeled cover film 6 is collected by the take-up roll 14.

After the cover film 6 has been peeled off, the pair of film clampers 11 move in the direction away from the film F, and the cover film partial peeling mechanism 10 starts parallel movement at the same speed in the same direction as the feeding direction of the film F. Is moved in a direction opposite to the direction in which the film F is fed, and a process of peeling the next cover film 6 is performed.

The film F is placed so that the resist film 5 of the film F is located on the substrate 1 side at the pressure roll 15.
The transfer speed of the substrate 1 is adjusted to the moving speed of the film F, and the pressing roll 15 is moved in the direction of the substrate 1 at the start end face of the portion to be attached to the substrate 1, and the base film 4 is pressed on the upper surface of the substrate 1. The resist film 5 is stuck through.
The end end surface of the portion of the substrate 1 to be attached is a pressure roll 15
Is reached, the pressure roll 15 is moved in a direction away from the substrate, and the attachment to one substrate 1 is completed.

When the next substrate 1 is conveyed, the pressure roll 15 is moved again to the substrate 1 side, and the next resist film 5 is attached.

In this embodiment, only the resist film 5 between the perforations L3 can be attached to the substrate.

When the perforations between L3 are provided on the film F, the cover film 6 side is pressed by the cutter blade receiver 8, and the base film 4 side is pressed by the perforation cutter 9. The resist film 5 is not damaged by pressing the unnecessary portion of the cover film 6 with the film clamper 11.

Next, another embodiment of the method of the present invention will be described with reference to FIG.

FIG. 2 is a view in which only the cutter blade receiver 8 of FIG. 1 is changed in shape. The cutter blade receiving surface 8A is not formed with a groove, and the material of the cutter blade receiving surface 8A is hardly worn by the cutter blade 9B. In addition, even if the cutter blade receiving surface is damaged by the cutter, the soft material is easily restored.

As a result, even if the film F comes into contact with the receiving surface 8A of the cutter blade receiver 8, the film surface will not be damaged, the life of the cutter blade 9B will be extended, and the running cost and maintenance cost can be reduced. .

Note that the embodiment shown in FIG. 1 may be inverted. Further, a perforation may be formed or a cutting process may be provided from the cover film 6 side.

[0032]

As described above, according to the method of the present invention, a separate film clamping mechanism other than the cutter is not required on the cutter side with the integrated film therebetween, and the integrated film is disposed on the opposite side of the cutter. The blade receiver can prevent wear of the cutter blade or deterioration of the cutter blade receiving surface due to the cutter blade.

[Brief description of the drawings]

FIG. 1 is a schematic view of a film sticking apparatus embodying an embodiment of the film sticking method of the present invention.

FIG. 2 is a schematic view of a film sticking apparatus embodying another embodiment of the film sticking method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Transport roll 3 Roll 4 Base film 5 Resist film (film main body) 6 Cover film 7 Perforation forming unit 8 Cutter blade receiver 9 Perforation cutter 10 Cover film partial peeling mechanism 11 Film clamper 12 Roll 13 Adhesive tape 14 Winding Roll 15 Crimping roll

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Fumaki Numajiri F-term (reference) 2H025 AB15 AB16 EA08 5F046 JA27 5-2-2 Koyodai, Ryugasaki-shi, Ibaraki Pref.

Claims (3)

[Claims] 1. A plurality of substrates are conveyed on a conveyance path at intervals, and a base film and a cover film are provided on each side of a film body to be attached to each substrate to form a three-layer structure. Provide the processing in the width direction of the film with the length to be pasted on the substrate, peel off the cover film, and pass the film body on the substrate surface with a pair of pressure rolls together with the base film so that the film body is on the substrate side A film sticking method, wherein a boss for pressing a film is provided on a cutter provided in a width direction of the film with a length to be stuck on a substrate at a perforation or a cutting process. 2. A cutter holder according to claim 1, wherein the cutter blade provided in the width direction of the film at a length desired to be perforated or cut on the substrate is directly contacted by the cutter blade. A film sticking method characterized by a shape subjected to a groove processing so as not to be formed. 3. A cutter base provided in the width direction of the film at a length desired to be perforated or cut on a substrate according to claim 1, wherein the cutter blade receiving surface material is a cutter blade. A film sticking method characterized by using a soft material which is hard to cause scratches and is easily restored even when scratched.