JP2000345369A - Speaker diaphragm, and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flat, thin film type diaphragm for a speaker and its manufacture in which the thickness of a conductive thin film, its pattern and impedance, and the heat resistant capacity can be set to desired values in a flat diaphragm in which a patterned thin film-like coil is formed on an insulation thin film. SOLUTION: In a diaphragm for a speaker in which a film-like coil 2 of a specified pattern consisting of a conductive material is formed on a surface of an insulation thin film 1, a metal layer of laminated structure is obtained by coating a second metal film 22 by an electroplating method on the surface of a first metal film 21 on which the film-like coil 2 is formed by sputtering a conductive material, and the film-like coil 2 of a specified pattern is formed by etching. In addition, a coil 2 of a metal layer 2b is also present on which a corrosion preventive metal thin film 23 is formed by an electroless plating method on the second metal film 22. A manufacturing method includes a cleaning process, a sputtering process, an electroplating process, an etching process, and an electroless plating process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diaphragm for a speaker and a method of manufacturing the same, and more particularly to a diaphragm for a speaker which is formed of a thin-film coil patterned on an insulating thin film and is lightweight and suitable for driving the whole surface. The present invention relates to a plate and a manufacturing method.

[0002]

2. Description of the Related Art Conventionally, a speaker diaphragm in which a patterned thin film coil made of a conductive material is formed on an insulating thin film as described above has been light in weight and has a coil pattern formed on the entire surface of the diaphragm. Because it is suitable for full-surface driving by diffusing, significant splitting vibration is not likely to occur at its own frequency during operation, and it has characteristics that the frequency characteristics are flat and good and the transient characteristics are excellent, It is used for speakers that reproduce high frequency.
Such a diaphragm generally has a copper foil 2c having a predetermined thickness adhered to the surface of an insulating thin film 1 such as a synthetic resin sheet as shown in a cross section in FIG. 16, and the copper foil is etched by a technique such as etching. Dissolve unnecessary parts and remove coil 2 in desired pattern
Is obtained. Although the thin film coil is formed on only one surface of the insulating thin film, there is also a diaphragm formed on both front and back surfaces (not shown).

[0003]

The above-mentioned conventional diaphragm has a structure in which a copper foil having a certain thickness is adhered to a surface of a synthetic resin sheet or the like to form a pattern. Since it uses off-the-shelf copper foil, it cannot be used freely with any thickness, and it is designed to obtain a coil having a desired shape pattern and desired impedance and heat resistance capacity. There was a drawback that it was difficult. In addition, there is a problem to be solved that the adhesive used for attaching the copper foil affects the rigidity of the diaphragm and deteriorates the frequency characteristics.

In order to solve the problems of the prior art, the present invention relates to a planar diaphragm having a thin-film coil patterned on an insulating thin film. It is an object of the present invention to provide a thin-film planar speaker diaphragm and a method of manufacturing the same, which can set the pattern, impedance, and heat-resistant capacity together with the thickness of the conductive thin film in a desired shape by modifying the means. I do.

[0005]

According to the present invention, there is provided a speaker diaphragm and a method of manufacturing the same according to the present invention.
According to the respective drawings showing the respective embodiments, description will be made using the reference numerals used in the respective drawings. A diaphragm for a speaker according to the invention described in claim 1 is made of a conductive material on the surface of the insulating thin film 1. A speaker diaphragm on which a film-shaped coil 2 having a predetermined pattern is formed, wherein the film-shaped coil 2 is provided.
Consists of a metal layer 2a having a multilayer structure in which a conductive material is adhered to a surface of a first metal film 21 formed by sputtering a conductive material and a second metal film 22 is formed by electroplating.

A speaker diaphragm according to the second aspect of the present invention is a speaker diaphragm in which a film-shaped coil 2 having a predetermined pattern made of a conductive material is formed on the surface of an insulating thin film 1. A first metal film 21 in which the film coil 2 is formed by sputtering a conductive material.
Has a multilayer structure in which a conductive material is adhered to the surface of the second metal film 22 by electrolytic plating, and a metal thin film 23 for preventing corrosion is formed on the surface of the second metal film 22 by electroless plating. It consists of a metal layer 2b.

In a method of manufacturing a diaphragm for a loudspeaker according to claim 8, a step W of cleaning the surface of the insulating thin film 1 and the first metal film 21 are formed on the surface of the insulating thin film 1 by sputtering. Forming the first metal film 2
A second surface made of a conductive material by electrolytic plating on the surface of the first surface;
E of forming the metal layer 2a by attaching the metal film 22 of FIG.
P and a step E of etching the metal layer 2a to obtain a film-shaped coil 2 having a desired pattern.

According to a ninth aspect of the present invention, there is provided a method of manufacturing a diaphragm for a loudspeaker according to the present invention, wherein a step W of cleaning the surface of the insulating thin film 1 and the first metal is formed on the surface of the insulating thin film 1 by sputtering. Step S of forming the film 21 into a desired pattern, and attaching a second metal film 22 made of a conductive material to the surface of the first metal film 21 by electrolytic plating to form a desired pattern made of the metal layer 2a. And a step EP of obtaining the film-shaped coil 2 of the above.

According to a tenth aspect of the present invention, there is provided a method of manufacturing a diaphragm for a loudspeaker according to the present invention, wherein a step W of cleaning the surface of the insulating thin film 1 and the first metal is formed on the surface of the insulating thin film 1 by sputtering. A step S of forming the film 21, a step EP of attaching a second metal film 22 made of a conductive material to the surface of the first metal film 21 by an electrolytic plating method, and a surface EP of the second metal film 22. A step CP of forming a metal layer 2b having a multilayer structure by depositing a metal film 23 for preventing corrosion by an electroless plating method, and a step E of obtaining a film-shaped coil 2 having a desired pattern by etching the metal layer 2b. Consists of

In the method for manufacturing a diaphragm for a loudspeaker according to the present invention, a step W of cleaning the surface of the insulating thin film 1 and a step of forming a first metal on the surface of the insulating thin film 1 by sputtering. A step S of forming the film 21 into a desired pattern, a step EP of attaching a second metal film 22 made of a conductive material to the surface of the first metal film 21 by an electrolytic plating method, A step CP of obtaining a film-shaped coil 2 having a desired pattern comprising a metal layer 2b having a multilayer structure in which a metal film 23 for preventing corrosion is attached to the surface of the film 22 by an electroless plating method.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the diaphragm for a speaker according to the present invention will be described with reference to FIGS. 1 to 3 showing the structure of the diaphragm according to the first embodiment and FIGS. As shown in the perspective view of FIG. 1 and the front view of FIG. 2, the diaphragm according to claim 1 has a ribbon shape having a rectangular front shape, and is made of an insulating material made of polyimide (hereinafter abbreviated as PI). Bent portion 25 made of a conductive material on the surface of conductive thin film 1
The film-like coil 2 has a pattern in which the linear coil 26 and the linear portion 26 are alternately and continuously continued. This film-shaped coil 2
As shown in the perspective view of FIG. 1 and the cross-sectional view of FIG.
A second metal film 2 made of copper, aluminum, or the like is formed on the surface of a first metal film 21 formed by sputtering a conductive metal such as copper on the surface of an insulating thin film 1 made of
2 is formed into a desired pattern by etching the metal layer 2a having a multi-layer structure to which 2 is attached.

In the diaphragm according to the first embodiment, the thickness of the insulating thin film 1 is 25 microns, but this thickness is not limited to the above-mentioned value, and the required diaphragm vibration of the speaker is required. It should be determined based on performance such as frequency and conversion efficiency. In addition to PI, besides PI, polyparaphenylene terephthalamide (PPTA), or polyethylene naphthalate (PEN), or polyethylene terephthalate (PET), or polycarbonate (PC), or a synthetic resin sheet equivalent to these in terms of material You can choose from: The thickness of the first metal film 21 formed by sputtering is 1 Å to 100 Å.
Angstrom is appropriate. When the thickness is smaller than this value, the adhesion of the coil 2 is not sufficient. On the other hand, when the thickness is thicker, it takes time to form the first metal film and the manufacturing efficiency is reduced. If the materials are the same, there is no problem, but if the materials are different, the electrical performance of the speaker may be affected. As a material of the second metal film 22, a high conductivity material such as aluminum (Al) or copper (Cu) is suitable. Although the thickness of the metal layer 2a having the multilayer structure is 9 microns in this embodiment, it should be determined based on the basic performance of the speaker such as the above-described diaphragm resonance frequency, conversion efficiency, and allowable input.

In order to manufacture the diaphragm according to the first aspect, the surface of the insulating thin film 1 is first cleaned in step W according to the manufacturing method according to the eighth aspect of the present invention shown in FIG. In a step S, a conductive metal such as copper is sputtered on the surface of the insulating thin film 1 to form a first metal film 21. Then, in a step EP, the surface of the first metal film 21 is electroplated by an electroplating method. Made of a conductive material such as copper or aluminum
Is deposited to form a metal layer 2a having a multilayer structure composed of the first metal film 21 and the second metal film 22, and the metal layer 2a is etched in step E to form a film having a desired pattern. A coil 2 having the shape of a circle is obtained.

Alternatively, according to the manufacturing method of the ninth aspect of the present invention shown in FIG. 5, first, the surface of the insulating thin film 1 is cleaned in step W, and then the pattern mask S1 is formed on the surface of the insulating thin film 1 in step S. A conductive metal such as copper is sputtered through the first metal film 21 to form a first metal film 21 having a coil pattern shape, and then the surface of the first metal film 21 is formed by electrolytic plating on a surface of the first metal film 21 in a step EP. A second metal film 22 made of a conductive material is deposited to form a metal layer 2a having a multilayer structure.
Is obtained in a desired pattern.

FIG. 6 shows a diaphragm according to a second aspect of the present invention, which has the same front-surface coil pattern as that of the first embodiment. As shown in FIG. 7 and the cross-sectional view of FIG. 7, the surface of the first metal film 21 formed by sputtering a conductive metal such as copper or aluminum on the surface of the insulating thin film 1 made of PI is coated with copper, A second metal film 22 on which a conductive metal such as aluminum is deposited by an electrolytic plating method, and a metal thin film 23 for preventing corrosion such as a nickel thin film formed on the surface of the second metal film 22 by an electroless plating method. Metal layer 2 having a multilayer structure composed of three layers
b. In this diaphragm, the corrosion-preventing metal thin film 23 is made of nickel (Ni), but other metals such as tin (Sn) and gold (Au) can be used.

In the diaphragm according to the second aspect, FIG.
10. The manufacturing method according to the present invention shown in FIG.
The coil pattern is formed by forming the first metal film 21 in accordance with the method of manufacturing a diaphragm described in claim 8, and then forming the first metal film 21. 10. The method according to claim 9, wherein after forming the second metal film 22 on the surface of the metal film 21, the corrosion preventing metal thin film 23 is subsequently deposited in the step CP, and then the etching is performed in the etching step E, or as described in the above-mentioned claim 9. A first metal film 21 having a pattern shape using a mask S1 utilizing a method of manufacturing a diaphragm.
Is formed, and the second metal film 2 is formed on the surface of the first metal film 21.
Then, the metal film 23 for preventing corrosion may be deposited in the step CP. It should be noted that the above-described steps such as cleaning, sputtering, electrolytic plating, electroless plating, and etching shown in FIG. 4, FIG. 5, FIG. 8, and FIG. Can be.

FIGS. 10 and 11 show an enlarged sectional structure and an enlarged sectional structure of a diaphragm according to an applied example of the present invention. The structure of the diaphragm is the same as that of the diaphragm shown in FIG. 3. A film-like coil 2 having the same structure as that of the diaphragm according to claim 2 is formed on both surfaces of the insulating thin film 1, both of which increase the effective length of the coil in a magnetic field to increase the conversion efficiency of the speaker. This is a diaphragm which aims to increase the number. The base material of each member is the same as the material used in the diaphragm according to the first and second aspects.

The front shape shown in FIG. 12 is a spiral shape of the coil 2 pattern, and FIG. 13 shows a part of an enlarged sectional structure of the diaphragm formed on one side only with the coil 2 pattern being a spiral shape. It is an expanded sectional view in the radial direction, and shows an application example diaphragm having a circular outer shape. It is arranged and driven in a magnetic field spreading radially from one point. Coil 2
Has the same structure as the diaphragm according to the first aspect. The speaker using the diaphragm shown in FIGS. 12 and 13 emits a spherical wave, has directivity symmetrical in the vertical and horizontal directions, has good sound wave diffusion in a reproduced sound field, and has a broad frequency characteristic. Have. Although not shown, a spiral coil 2 may be formed on both sides of the insulating thin film 1, and the coil 2 may have a three-layer structure like the diaphragm according to the second aspect.

FIG. 14 shows the front shape of a diaphragm according to an application example of the present invention reduced to about 0.75 times. The coil 2 is formed by forming the conductor in the longitudinal direction along the longitudinal direction of the diaphragm, and uses a magnetic circuit having a different magnetic flux distribution from the other embodiments. The insulating thin film 1 uses a polyimide film having a thickness of 25 microns. The coil 2 is formed by sputtering copper thinly on a polyimide film and depositing copper on the polyimide film by electrolytic plating to a total thickness of 9 microns. It has adhered to. FIG. 15 shows a frequency characteristic of a speaker using a diaphragm of an application example of the diaphragm of the present invention. For comparison,
The pattern of the coil is the same as the pattern shown in FIG. 12, and FIG. 17 shows the frequency characteristics of the conventional diaphragm whose cross section is shown in FIG. As is clear from comparison of the two frequency characteristic diagrams, in the conventional example, remarkable unevenness is observed due to local resonance, whereas in the diaphragm of the application example of the present invention, it is flat. In addition, the average sound pressure is also high, and the excellent effects of the diaphragm of the application example of the present invention are clear.

The embodiments which are considered to be representative of the present invention have been described above. However, the present invention is not necessarily limited to the structures of the embodiments, but has the above-mentioned constitutional requirements according to the present invention, and The present invention achieves the object of the present invention and can be appropriately modified and implemented within the range having the following effects.

[0021]

The loudspeaker diaphragm according to the present invention is, as described above, a thin-film planar diaphragm for driving the entire surface, in which a film-like coil having a predetermined pattern is formed on the surface of an insulating thin film, The film-shaped coil is formed by a metal layer having a multilayer structure in which a conductive material is adhered to a surface of a first metal film formed by sputtering a conductive material and a second metal film is deposited by electrolytic plating. So the coil material,
By adjusting and controlling the working conditions of the sputtering process and the electrolytic plating process, the length, thickness,
Since the dimensions and shape such as the width can be freely set, a flat diaphragm having a pattern having basic specifications such as a desired impedance, heat resistance capacity, and weight can be easily obtained. And can be easily designed and manufactured.

In the past, since the copper foil of the coil was bonded with a heat-fusible adhesive to a thickness of 10 μm, the rigidity and mass distribution on the vibration plate became inevitably inevitable, and the adverse effect on the frequency characteristics was avoided. However, in the diaphragm of the present invention, since the conductor is directly attached to the insulating thin film, the adverse effect of the adhesive is eliminated, and the frequency characteristics and the transient characteristics are remarkably improved.

Further, a diaphragm having a structure in which a metal thin film for corrosion prevention is adhered to the surface of a coil by electroless plating has a significantly improved corrosion resistance, and is stable in terms of quality such as speaker performance and longer life. Is guaranteed. Also, the process of attaching the metal film for corrosion prevention for that purpose does not impede the degree of freedom in setting the above-mentioned basic specifications of the speaker, so that the loudspeaker can be easily designed and manufactured. .

In addition, for obtaining the above-described diaphragm, individual steps such as a sputtering step, an electrolytic plating step, and an electroless plating step included in the manufacturing method are as follows.
Since it is sufficient to apply a general method which is already used for production stably at present, no special equipment is required, an increase in production equipment can be prevented, and mass production can be performed stably. Therefore, in combination with the above-mentioned various effects, by using the diaphragm obtained by the manufacturing method of the present invention, it is possible to easily provide a speaker excellent in various characteristics such as frequency characteristics, transient characteristics, directional characteristics and the like, and quality. The effect was that they could do things.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a structure of a diaphragm according to an embodiment of the present invention.

FIG. 2 is a front view of the same.

FIG. 3 is a partially enlarged cross-sectional view of a side surface in the longitudinal direction according to the first embodiment;

FIG. 4 is an explanatory process diagram showing the configuration of the manufacturing method according to claim 8 by blocks.

FIG. 5 is an explanatory process diagram showing the configuration of the manufacturing method according to claim 9 by blocks.

FIG. 6 is a perspective view showing a structure of a diaphragm according to a second embodiment.

FIG. 7 is a partially enlarged side sectional view of the same in the longitudinal direction.

FIG. 8 is an explanatory process diagram showing the configuration of the manufacturing method according to claim 8 by blocks.

FIG. 9 is an explanatory process diagram showing the configuration of the manufacturing method shown in claim 9 by blocks.

FIG. 10 is a partially enlarged longitudinal side sectional view showing a structure of a diaphragm in which a metal layer 2a including a first metal film 21 and a second metal film 22 is formed on both surfaces of an insulating thin film.

FIG. 11 is a partially enlarged longitudinal side sectional view showing a structure of a diaphragm in which a metal layer 2a including a first metal film 21 and a second metal film 22 is formed on both surfaces of an insulating thin film.

FIG. 12 is a front view of a diaphragm in which the pattern of the coil 2 shown in FIGS. 10 and 11 is spiral.

FIG. 13 is an enlarged radial cross-sectional view showing a part of an enlarged cross-sectional structure of the diaphragm in which the pattern of the coil 2 is formed in a spiral shape on one side only.

FIG. 14 is a front view of a diaphragm according to an application example of the present invention.

FIG. 15 is a frequency characteristic diagram of a speaker using the diaphragm of the present invention.

FIG. 16 is an enlarged longitudinal sectional view showing a part of the structure of a conventional diaphragm.

FIG. 17 is a frequency characteristic diagram of a speaker using a conventional diaphragm.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Insulating thin film 2 Film-shaped coil 21 1st metal film 22 2nd metal film 23 Metal thin film for corrosion prevention 2a Metal layer consisting of 1st metal film 21 and 2nd metal film 22 2b 1st metal Metal layer 2c composed of film 21, second metal film 22, and metal thin film for corrosion prevention 2c Copper foil 25 Bent portion 26 Linear portion W Cleaning process S First metal film forming process by sputtering S1 Mask for sputtering process EP Electrolysis Second metal film forming step by plating E Pattern forming step by etching CP Corrosion preventing metal thin film forming step by electroless plating

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C23C 28/02 C23C 28/02 C25D 5/56 C25D 5/56 CB 7/00 7/00 G H04R 7 / 04 H04R 7/04 9/04 102 9/04 102 31/00 31/00 A (72) Inventor Nobuya Mizone 1006 Ojidoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Hitoshi Sato 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. (72) Inventor Takuji Miyamoto 1006 Kadoma Kadoma, Kadoma City, Osaka Pref. Matsushita Electric Industrial Co., Ltd. F term (reference) 4K022 AA15 AA19 AA20 AA32 AA41 AA44 BA03 BA14 BA21 BA35 DA01 4K024 AA01 AA09 AB08 AB15 AB17 BA12 BB18 BC01 BC02 DA10 DB10 FA01 GA01 4 K044 AA16 AB10 BA06 BA08 BA10 BB03 BB04 BB10 BC14 CA04 CA13 CA15 CA17 5D012 CA02 GA01 HA04 5D016 AA01 HA04 HA07 JA11 JA13 JA16

Claims (11)

[Claims] A loudspeaker diaphragm in which a film-shaped coil (2) having a predetermined pattern made of a conductive material is formed on a surface of an insulating thin film (1), wherein the film-shaped coil (2) is provided. But,
A metal layer (2a) having a multilayer structure in which a second metal film (22) made of a conductive material is adhered to the surface of a first metal film (21) formed by sputtering a conductive material by electrolytic plating. A diaphragm for a speaker, comprising: 2. A diaphragm for a loudspeaker, wherein a film-shaped coil (2) having a predetermined pattern made of a conductive material is formed on a surface of an insulating thin film (1), wherein the film-shaped coil (2) is provided. Metal film formed by sputtering a conductive material
A second metal film (22) is deposited with a conductive material on the surface of (21) by electroplating, and a metal thin film for corrosion prevention (electrolytic plating) is formed on the surface of the second metal film (22). 23. A speaker diaphragm comprising a metal layer (2b) having a multilayer structure with 23) formed thereon. 3. The material of said insulating thin film (1) is polyimide.
(PI) or polyparaphenylene terephthalamide (PPT
A), or polyethylene naphthalate (PEN), or polyethylene terephthalate (PET), or polycarbonate (P
The speaker diaphragm according to claim 1, wherein the diaphragm is a material selected from C). 4. The speaker diaphragm according to claim 1, wherein the second metal film is made of copper (Cu) or aluminum (Al). 5. The speaker diaphragm according to claim 1, wherein said first metal film has a thickness of 1 Å to 100 Å. 6. The speaker diaphragm according to claim 1, wherein the thickness of the second metal film is in a range of 1 μm to 30 μm. 7. The material of the metal film for preventing corrosion is tin.
The speaker diaphragm according to claim 2, wherein the diaphragm is made of a material selected from (Sn), nickel (Ni), and gold (Au). 8. A step (W) of cleaning the surface of the insulating thin film (1)
A step (S) of forming a first metal film (21) on the surface of the insulating thin film (1) by sputtering;
A step (EP) of forming a metal layer (2a) having a multilayer structure by depositing a second metal film (22) made of a conductive material on the surface of (21) by electrolytic plating, and (E) obtaining a film-shaped coil (2) having a desired pattern by etching the diaphragm. 9. A step (W) of cleaning the surface of the insulating thin film (1)
A step (S) of forming a first metal film (21) in a desired pattern on the surface of the insulating thin film (1) by sputtering with a mask; and electrolyzing the surface of the first metal film (21). A step (EP) of depositing a second metal film (22) made of a conductive material by a plating method to obtain a film-shaped coil (2) having a desired pattern made of a metal layer (2a) (EP). Plate manufacturing method. 10. A step of cleaning the surface of the insulating thin film (1)
(W), a step (S) of forming a first metal film (21) on the surface of the insulating thin film (1) by sputtering, and an electroplating method on the surface of the first metal film (21). A step (EP) of attaching a second metal film (22) made of a conductive material, and attaching a corrosion-preventing metal thin film (23) to the surface of the second metal film (22) by an electroless plating method. (CP) forming a metal layer (2b) having a multilayer structure, and a step (E) of etching the metal layer (2b) to obtain a film-shaped coil (2) having a desired pattern. Manufacturing method of diaphragm for use. 11. A step of cleaning the surface of the insulating thin film (1)
(W), a step (S) of forming a first metal film (21) in a desired pattern by sputtering with a mask on the surface of the insulating thin film (1), and a step (S) of forming the first metal film (21). A step (EP) of attaching a second metal film (22) made of a conductive material to the surface by electrolytic plating, and a metal thin film for preventing corrosion by electroless plating on the surface of the second metal film (22). (23) a step (CP) of obtaining a film-shaped coil (2) having a desired pattern comprising a metal layer (2b) having a multilayer structure to which the (23) is attached.