WO2013024543A1 - Diaphragm and flat speaker - Google Patents

Diaphragm and flat speaker Download PDF

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Publication number
WO2013024543A1
WO2013024543A1 PCT/JP2011/068692 JP2011068692W WO2013024543A1 WO 2013024543 A1 WO2013024543 A1 WO 2013024543A1 JP 2011068692 W JP2011068692 W JP 2011068692W WO 2013024543 A1 WO2013024543 A1 WO 2013024543A1
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WO
WIPO (PCT)
Prior art keywords
pattern
diaphragm
wiring
base material
wiring pattern
Prior art date
Application number
PCT/JP2011/068692
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French (fr)
Japanese (ja)
Inventor
久保田　裕司
孝弥 松元
Original Assignee
Toa 株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toa 株式会社 filed Critical Toa 株式会社
Priority to PCT/JP2011/068692 priority Critical patent/WO2013024543A1/en
Publication of WO2013024543A1 publication Critical patent/WO2013024543A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H04R7/06—Plane diaphragms comprising a plurality of sections or layers

Definitions

  • the present invention relates to a diaphragm having a wiring pattern formed on at least one surface and a flat speaker.
  • the flat speaker includes two magnet plates and a diaphragm.
  • a wiring pattern is formed on one or both surfaces of the diaphragm.
  • the weight reduction of the diaphragm is demanded from the demand for the improvement of the efficiency of the flat speaker.
  • the base material thickness is too thin, the rigidity of the base material becomes small and the sound quality deteriorates.
  • the present invention has been made in view of such circumstances, and an object of the present invention is to provide a diaphragm that is lighter than conventional ones and a flat speaker including the diaphragm.
  • a wiring protection pattern that covers the wiring pattern is formed along the wiring pattern, and the wiring pattern is formed.
  • the gist of the present invention is that at least a part of the surface where the wiring pattern is not formed is not covered with the wiring protection pattern.
  • the diaphragm is lighter than a diaphragm that is entirely covered with a protective layer.
  • the area of the portion covered with the wiring protection pattern is preferably smaller than the area of the portion not covered with the wiring protection pattern.
  • a reinforcing pattern for reinforcing the diaphragm is formed in a portion where the wiring pattern is not formed.
  • the wiring protection pattern is preferably formed by a coverlay or covercoat treatment.
  • Another aspect of the present invention provides a flat speaker having a diaphragm on one side.
  • the flat speaker according to the present invention is lighter in vibration than a conventional flat speaker having a diaphragm having a protective layer formed on the entire surface of the diaphragm, and thus can be more efficient than a conventional flat speaker. .
  • the present invention it is possible to provide a diaphragm that is lighter than the conventional one and a flat speaker including the diaphragm.
  • the exploded view of the plane speaker concerning one embodiment of the present invention.
  • the top view of the magnet plate of the flat speaker of FIG. Sectional drawing of the diaphragm of the planar speaker of FIG. Sectional drawing of the planar speaker of FIG.
  • the top view of the diaphragm of the flat speaker of FIG. The graph which shows the efficiency characteristic of a diaphragm.
  • the flat speaker 1 includes a housing case 10, a magnet plate 20, a vibration plate 40, a shock absorber 30 disposed between the magnet plate 20 and the vibration plate 40, and a magnet plate 20.
  • a spacer 50 is provided for securing a distance from the diaphragm 40.
  • the housing case 10 includes a first case 11 and a second case 12.
  • first case 11 and the second case 12 When the first case 11 and the second case 12 are combined, an accommodation space is formed therein.
  • the first case 11 is formed with a plurality of radiation holes 13 for emitting sound waves to the outside.
  • through holes 14 through which bolts 60 as fastening members are inserted are formed at the four corners of the first case 11 and the four corners of the second case 12.
  • the buffer material 30 alleviates the collision between the vibrating diaphragm 40 and the magnet plate 20.
  • a material that has flexibility and air permeability and that does not damage these plates when contacting the magnet plate 20 and the vibration plate 40 is employed.
  • a nonwoven fabric is used as the buffer material 30.
  • the spacer 50 is interposed between the diaphragm 40 and the magnet plate 20 and keeps the distance between them constant.
  • the spacer 50 is configured as a substantially rectangular frame.
  • the cushioning material 30 is accommodated in the space inside the spacer 50 (inside the frame). That is, the buffer material 30 is accommodated in a space surrounded by the diaphragm 40, the spacer 50, and the magnet plate 20.
  • Through holes 51 through which the bolts 60 are inserted are formed at the four corners of the spacer 50.
  • the magnet plate 20 will be described with reference to FIG.
  • the magnet plate 20 is a planar sheet that can be magnetized, and is multipolarized. On the flat sheet, S poles 22 and N poles 21 are alternately formed in parallel to each other. The distance between the S pole 22 and the N pole 21 is a fixed distance. In the illustrated example, the magnet plate 20 is formed with a plurality of sound holes 23 for passing sound waves on the boundary between the S pole 22 and the N pole 21. Further, through holes 24 through which the bolts 60 are inserted are formed at the four corners of the magnet plate 20.
  • the diaphragm 40 will be described with reference to FIG. FIG. 3 shows the wiring pattern 43 with emphasis.
  • the diaphragm 40 includes a base material 41, a wiring pattern 43 provided on both surfaces of the base material 41, and a protective layer 46 that covers the wiring pattern 43.
  • the wiring pattern 43 is formed on both surfaces of the base material 41.
  • the wiring pattern 43 formed on one surface of the base material 41 and the wiring pattern 43 formed on the other surface are formed in the same place with the base material 41 interposed therebetween.
  • the base material 41 a flexible substrate, for example, a polyimide resin sheet is used.
  • the wiring pattern 43 is formed of a conductive member.
  • the wiring pattern 43 is formed of copper or aluminum.
  • Through holes 42 through which the bolts 60 are inserted are formed at the four corners of the base material 41.
  • the wiring pattern 43 includes a linear wiring 43 a that linearly extends in the longitudinal direction of the base material 41, a connection wiring 43 b that connects the linear wiring 43 a to each other, and two electrodes 44 for energization. , 45.
  • the straight wiring 43 a is formed in parallel to the extending direction of the S pole 22 and the N pole 21.
  • the above-described members that is, the housing case 10, the magnet plate 20, the diaphragm 40, and the spacer 50 are fixed to each other at four corners by bolts 60.
  • the through hole 14 of the housing case 10 the through hole 24 of the magnet plate 20, the through hole 51 of the spacer 50, and the through hole 42 of the diaphragm 40 coincide.
  • a communication hole is formed.
  • the bolt 60 is inserted into the communication hole, and the members are fixed to each other by the coupling of the bolt 60 and the nut 61.
  • the four corners of the diaphragm 40 are fixed in a state where the abdomen can swing.
  • the assembly of the flat speaker 1 is performed as follows.
  • the first case 11, the magnet plate 20, the spacer 50, the buffer material 30, and the diaphragm 40 are overlapped in order. And each member is positioned so that the axis
  • the second case 12, the magnet plate 20, the spacer 50, and the buffer material 30 are overlapped in order, and these parts are integrated by a bolt 60 to form a second assembly. Then, the first assembly and the second assembly are overlapped, and these parts are fastened by the bolt 60 and the nut 61.
  • neutral zone 25 a boundary portion between the N pole 21 and the S pole 22 is formed.
  • Conductive wires (straight lines 43 a) of the wiring pattern 43 are arranged in the base material 41 so as to face the neutral zone 25 and along the neutral zone 25.
  • the magnetic field lines of the magnet plate 20 exit from the N pole 21 and go to the S pole 22.
  • the direction of the magnetic lines formed is a direction (lateral direction) perpendicular to the longitudinal direction (vertical direction) of the neutral zone 25 (see the arrow in FIG. 4). Since the wiring pattern 43 is formed along the neutral zone 25, the magnetic field lines are orthogonal to the longitudinal direction (vertical direction) of the straight wiring 43a. For this reason, when a current flows through the wiring pattern 43, a force in the vertical direction (up and down direction) acts on the surface of the diaphragm 40 according to Fleming's law.
  • the straight wirings 43a are formed in parallel to each other.
  • the adjacent linear wirings 43a have opposite directions of current flow. Further, the magnetic lines of force corresponding to the adjacent straight wirings 43a are in opposite directions. For this reason, when a current flows through the wiring pattern 43, a force is applied to all the straight wirings 43 a constituting the wiring pattern 43 in the same direction.
  • the straight wiring 43a and the connection wiring 43b are connected in series to form a single conducting wire.
  • a first electrode 44 and a second electrode 45 for energization are provided.
  • the protective layer 46 includes a wiring protective pattern 46a and a reinforcing pattern 46b (see FIG. 3).
  • the wiring protection pattern 46 a is formed along the wiring pattern 43.
  • the width of the wiring protection pattern 46 a is slightly larger than the width of the wiring pattern 43. That is, the wiring pattern 43 is covered with the wiring protection pattern 46a.
  • the area of the portion covered with the wiring protection pattern 46a is smaller than the area of the portion not covered with the wiring protection pattern 46a (hereinafter referred to as “substrate exposed portion”).
  • substrate exposed portion the area of the portion not covered with the wiring protection pattern 46a
  • a wiring protection pattern 46a is formed. That is, on the one surface of the diaphragm 40, the area of the base material exposed portion is made larger than the area of the portion covered with the wiring protection pattern 46a, thereby increasing the reduction amount of the wiring protection pattern 46a.
  • a part of the first electrode 44 and the second electrode 45 functions as a conductor pad. For this reason, the periphery of the part is covered with the wiring protection pattern 46a, and the part is exposed as a conductor pad.
  • the reinforcing pattern 46b is formed in a portion where the wiring pattern 43 is not formed. Specifically, the reinforcing pattern 46b extends at a set angle with respect to the straight portion of the wiring protection pattern 46a. For example, the setting angle is set to 90 degrees as shown in FIG. The set angle is appropriately set according to the use or size or mass of the diaphragm 40.
  • the reinforcing pattern 46b formed between the wiring protection patterns 46a connects adjacent wiring protection patterns 46a.
  • the reinforcing patterns 46b are arranged substantially evenly on the entire base material 41 in order to increase the rigidity of the entire diaphragm 40.
  • a mesh pattern is formed by the wiring protection pattern 46a and the reinforcing pattern 46b.
  • the wiring protection pattern 46 a is formed corresponding to the shape of the wiring pattern 43. That is, the wiring protection pattern 46a is not formed in many portions where the wiring pattern 43 is not formed. For this reason, the diaphragm 40 according to the embodiment is lighter than the diaphragm provided with the protective layer 46 so as to cover the entire surface of the base material 41.
  • the reinforcing pattern 46b is formed so as to extend at a set angle with respect to the wiring protection pattern 46a, it is possible to suppress the vibration plate 40 from being easily bent only in one direction like a column surface. That is, when the straight wirings 43a of the wiring pattern 43 are parallel to each other, it is easy to bend in a direction perpendicular to the parallel direction, but the reinforcing pattern 46b is provided in a direction crossing the straight wirings 43a. Thus, it is difficult to bend in a direction perpendicular to the longitudinal direction of the wiring protection pattern 46a.
  • FIG. 6 shows the efficiency characteristic (broken line) of the comparative diaphragm (hereinafter referred to as “comparative product”) and the efficiency characteristic (solid line) of the diaphragm 40 (hereinafter referred to as “implemented product”) according to the present embodiment. Yes.
  • the structure of the flat speaker 1 used for the evaluation of characteristics is as follows.
  • the distance between the diaphragm 40 and the magnet plate 20 is 0.5 mm.
  • a non-woven fabric having a thickness of 0.4 mm is used as the buffer material 30.
  • the magnet plate 20 a neodymium magnet plate having a surface magnetic flux density of 180 (mT) by multipolar magnetization is used. The sound pressure was measured at a distance of 2 m from the flat speaker 1, and this value was converted to 1 m to calculate the output sound pressure level.
  • the structure of the diaphragm is as follows.
  • the comparative diaphragm has the following configuration.
  • the size of the diaphragm 40 is approximately the size obtained by dividing the A5 size in half in the vertical direction (63 mm ⁇ 210 mm).
  • -The structure of the diaphragm 40 is a two-layer substrate.
  • the material of the base material 41 is a polyimide resin.
  • the thickness of the base material 41 is 25 ⁇ m.
  • -The mass of the base material 41 is 0.4 g.
  • the wiring pattern 43 was formed on both surfaces of the base material 41.
  • -The material of the wiring pattern 43 is copper.
  • the horizontal width of the wiring pattern 43 is 0.5 mm.
  • -The interval of the linear wiring 43a of the wiring pattern 43 is 3 mm.
  • the longitudinal direction of the straight wiring 43 a of the wiring pattern 43 is substantially the same as the longitudinal direction of the diaphragm 40.
  • the thickness of the wiring pattern 43 is 18 ⁇ m.
  • the weight of the wiring pattern 43 is 0.7 g.
  • the material of the protective layer 46 is an epoxy resin.
  • the protection area of the protective layer 46 is the both surfaces of the base material 41, and each surface is the whole surface.
  • the mass of the protective layer 46 is 0.8g.
  • -The mass of the diaphragm 40 is 1.9 g.
  • the mass ratio of the protective layer 46 to the diaphragm 40 is 42%.
  • the diaphragm 40 according to the embodiment has the following configuration.
  • the basic structure is the same as the comparative product. It differs from the comparison product in the following points.
  • the protective region of the protective layer 46 was formed on both surfaces of the base material 41 and each surface was formed on a portion corresponding to the wiring pattern 43.
  • -The mass of the protective layer 46 is 0.3 g.
  • -The mass of the diaphragm 40 is 1.4 g.
  • the mass ratio of the protective layer 46 to the diaphragm 40 is 21%.
  • the implementation product when comparing the comparison product with the implementation product, the implementation product has an output sound pressure level of 1 to 4 dB higher than the comparison product in the frequency range of 300 Hz to 10 kHz. Such an improvement in efficiency is due to the weight reduction of the diaphragm 40.
  • the wiring pattern 43 is formed by etching the double-sided copper-clad laminate.
  • the protective layer 46 is formed by a cover coat method (cover coat treatment). Specifically, a photosensitive resin is applied to the entire surface of the base material 41 by screen printing or the like and dried. Next, a predetermined pattern including the wiring protection pattern 46a and the reinforcing pattern 46b is selectively exposed. Then, the uncured portion is removed with a developer. Then, the photosensitive resin is cured by heating the photosensitive resin at a predetermined temperature. Thus, the protective layer 46 is formed.
  • cover coat treatment cover coat treatment
  • the photosensitive resin a resin having excellent environmental resistance is used.
  • a photosensitive resin such as an epoxy / acrylic resin is preferably used.
  • the photosensitive resin used as a soldering resist can also be used.
  • the method for forming the protective layer 46 is not limited to the above method. Hereinafter, other examples of the method for forming the protective layer 46 will be described.
  • the protective layer 46 can be formed by screen printing which is a kind of cover coat method. In this method, a liquid polyimide resin is applied to a predetermined portion of the base material 41 on which the wiring pattern 43 is formed using screen printing. Next, this is heated to cure the liquid polyimide resin. Thereby, the protective layer 46 is formed.
  • the protective layer 46 can also be formed by a coverlay method. For example, a resin film having an uncured adhesive applied on one side is cut into a predetermined shape and placed on the base material 41 on which the wiring pattern 43 is formed. And the resin film is affixed on the base material 41 by heating and pressurizing the base material 41 and the resin film through the cushion material.
  • This method has lower dimensional accuracy than other methods. For this reason, it is preferable to apply this method to the formation of the protective layer 46 that does not require dimensional accuracy, such as when forming the protective layer 46 that collectively covers a large number of wiring patterns 43.
  • the coverlay method there is a method using a photosensitive dry film.
  • a photosensitive dry film is laminated on the base material 41 on which the wiring pattern 43 is formed, and exposure and development are performed to form a predetermined pattern.
  • the protective layer 46 is formed by heat-curing this.
  • FIG. 7 is a view in which the magnet plate 20 and the diaphragm 40 are overlapped and seen through.
  • the N pole 21 and the S pole 22 are formed in a quadrangular shape and are alternately arranged in the vertical direction and the horizontal direction.
  • the wiring pattern 43 is wired so as to sew the N pole 21 and the S pole 22. That is, the linear portion of the wiring pattern 43 is formed in the base material 41 at a position facing the neutral zone 25 between the S pole 22 and the N pole 21.
  • the straight portions of the wiring patterns 43 are connected in series.
  • the wiring protection pattern 46 a is formed along the wiring pattern 43.
  • the reinforcing pattern 46b is formed so as to connect the diagonal positions of the wiring protection pattern 46a. Thereby, the diaphragm 40 becomes difficult to bend.
  • the wiring protection pattern 46 a is formed along the wiring pattern 43. At least a part of the base material portion on which the wiring pattern 43 is not formed on the surface on which the wiring pattern 43 is formed is not covered with the wiring protection pattern 46a. That is, a portion of the base material portion that does not need to be protected from moisture or the like is not provided with the wiring protection pattern 46a, and the base material 41 is exposed. For this reason, the diaphragm 40 can be made lighter than the diaphragm in which the entire surface of the base material 41 is covered with the protective layer.
  • the area of the part covered with the wiring protection pattern 46a on the one surface of the diaphragm 40 is smaller than the area of the part not covered with the wiring protection pattern 46a.
  • the wiring protection pattern 46a is densely arranged and the area of the portion covered with the wiring protection pattern 46a is made larger than the area of the portion not covered with the wiring protection pattern 46a.
  • the diaphragm 40 can be reduced in weight.
  • a reinforcing pattern 46 b that reinforces the base material 41 is formed on the base material 41 where the wiring pattern 43 is not formed.
  • the wiring protection pattern 46a is formed only in the portion corresponding to the wiring pattern 43, the entire diaphragm 40 is easily bent. Then, when the vibration plate 40 vibrates, the vibration plate 40 may be undulated, which may reduce the sound quality. Therefore, the reinforcing pattern 46b is formed to suppress the bending of the diaphragm 40. Thereby, the bending of the diaphragm 40 can be made small. Thereby, weight reduction of the diaphragm 40 and suppression of the deterioration of the sound quality resulting from the bending of the diaphragm 40 can be made compatible.
  • the wiring protection pattern 46a and the reinforcing pattern 46b are integrally formed of the same material. “Integrally” is intended to mean a structure formed in the same process and having no discontinuous boundaries. If the wiring protection pattern 46a and the reinforcing pattern 46b are not integrally formed, sound quality may be deteriorated because discontinuous portions are formed on the physical structure in the base material 41.
  • the wiring protection pattern 46a and the reinforcing pattern 46b are integrally formed of the same material. For this reason, there is no boundary as described above. Therefore, the diaphragm 40 of the embodiment can improve the sound quality as compared with the diaphragm in which the wiring protection pattern 46a and the reinforcing pattern 46b are formed of different materials.
  • plating is conceivable, but it is difficult to apply plating to a predetermined area at a portion other than metal.
  • the wiring protection pattern 46a and the reinforcing pattern 46b are formed of a photosensitive resin. Forming the wiring protection pattern 46a and the reinforcing pattern 46b by development is relatively simple. Therefore, the diaphragm 40 of the embodiment can be easily manufactured as compared with the diaphragm in which the wiring protection pattern 46a and the reinforcing pattern 46b are formed by a plating method.
  • the reinforcing pattern 46b is formed to extend at a set angle with respect to the wiring protection pattern 46a.
  • the reinforcing pattern 46 b intersects the wiring pattern 43 at a set angle.
  • the vibration plate 40 is reinforced along the wiring pattern 43 by the wiring protection pattern 46a, so that the vibration plate 40 is easily bent in a certain direction.
  • the base material 41 is reinforced by the reinforcing pattern 46b extending at a set angle with respect to the direction of the wiring pattern 43, the diaphragm 40 is prevented from being easily bent only in a certain direction.
  • the wiring protection pattern 46 a has a shape corresponding to the shape of the wiring pattern 43. In this case, the mass of the wiring protection pattern 46a can be further reduced, and the lighter diaphragm 40 can be obtained.
  • the flat speaker 1 of the present embodiment includes the diaphragm 40 having the above-described configuration. Since the diaphragm 40 is lightweight, the efficiency can be increased as compared with the conventional flat speaker 1 including the diaphragm 40 in which the protective layer 46 is formed on the entire surface of the base material 41.
  • the embodiment of the present invention is not limited to the embodiment exemplified in the above-described embodiment, and can be implemented by changing it as shown below, for example.
  • the following modifications are not applied only to the above-described embodiment, and different modifications can be combined with each other.
  • a breathable waterproof sheet may be disposed between the housing case 10 and the magnet plate 20. With this configuration, moisture can be prevented from entering through the radiation holes 13 of the housing case 10.
  • the diaphragm 40 is arranged between the two magnet plates 20, but the number of the magnet plates 20 may be one.
  • the buffer material 30 is disposed on one surface of the magnet plate 20, and the diaphragm 40 is disposed on the buffer material 30.
  • the magnet plate 20 is formed of a flat sheet that can be magnetized. And the N pole 21 and the S pole 22 are formed by multipolarizing a plane sheet. On the other hand, the magnet plate 20 can also be formed by arranging a plurality of permanent magnets on the substrate.
  • the wiring pattern 43 is formed on both surfaces of the base material 41, but the wiring pattern 43 may be formed only on one surface of the base material 41.
  • the wiring protection pattern 46a is formed along the line connecting all the straight wirings 43a and the connection wirings 43b of the wiring pattern 43.
  • the plurality of wiring patterns 43 may be collectively covered with the wiring protection pattern 46a. Even in this case, as compared with the diaphragm in which the wiring protection pattern 46a is formed on the entire surface of the base material 41, the diaphragm is lighter by the amount that the wiring protection pattern 46a is not formed in the base material portion on which the wiring patterns 43 are not formed. 40 can be obtained.
  • the wiring protection pattern 46a and the reinforcing pattern 46b are formed together by development, but can be formed in separate steps. Further, the wiring protection pattern 46a and the reinforcing pattern 46b can be formed of different materials.
  • the reinforcing pattern 46b is formed at a set angle with respect to the wiring protection pattern 46a.
  • the setting angle of the reinforcing pattern 46b is set to two or more types, and in different directions with respect to the linear portion of the wiring protection pattern 46a. Two or more types of reinforcing patterns 46b that extend may be provided.
  • a two-layer substrate is used as the diaphragm 40, but a substrate having an adhesive layer between the wiring pattern 43 and the base material 41 (three-layer substrate) can also be used. Even in this case, by forming the wiring protection pattern 46 a along the wiring pattern 43, the same effect as the above (1) can be obtained.
  • the diaphragm 40 is not provided with a through hole other than the through hole 42 through which the bolt 60 is inserted, but the diaphragm 40 has a through hole or a hole for the purpose of weight reduction.
  • a cut or the like may be formed.
  • Such a through-hole is formed in a portion other than the wiring pattern 43, the wiring protection pattern 46a, and the reinforcing pattern 46b, which does not affect the sound quality, for example, the outer peripheral portion of the substrate 41.
  • the cut is formed at the edge of the base material 41.
  • the diaphragm 40 is used for the flat speaker 1, but the diaphragm 40 can also be used as a vibration component of the silencer. That is, the diaphragm 40 can be used as a vibration component of an electric device that converts a current signal into vibration. Moreover, since the diaphragm 40 generates an induced voltage by vibration, it can also be used as a vibration part of a microphone.

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  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

A diaphragm (40) capable of being used in a flat speaker (1) is provided with a wiring pattern (43) formed on at least one surface of a substrate (41) and a wiring protection pattern (46a) covering the wiring pattern (43). On the at least one surface of the substrate (41), at least part of the portion of the substrate where the wiring pattern (43) is not formed is not covered by the wiring protection pattern (46a).

Description

振動板および平面スピーカDiaphragm and flat speaker
　本発明は、少なくとも一方の面に配線パターンが形成された振動板および平面スピーカに関する。 The present invention relates to a diaphragm having a wiring pattern formed on at least one surface and a flat speaker.
　平面スピーカ用の振動板としては、例えば特許文献１に記載されるものが知られている。平面スピーカは、２枚の磁石板と、振動板とを備えている。この振動板の一面または両面に配線パターンが形成されている。 As a diaphragm for a flat speaker, for example, the one described in Patent Document 1 is known. The flat speaker includes two magnet plates and a diaphragm. A wiring pattern is formed on one or both surfaces of the diaphragm.
特開平０９－３３１５９６号公報JP 09-331596 A
　ところで、平面スピーカの能率の向上の要求から、振動板の軽量化が要求されている。しかし、基材厚を薄くし過ぎると、基材の剛性が小さくなるため音質が低下する。また、配線パターンの導電線厚を薄くすることにも限界がある。このように、振動板の軽量化が困難となっている。 By the way, the weight reduction of the diaphragm is demanded from the demand for the improvement of the efficiency of the flat speaker. However, if the base material thickness is too thin, the rigidity of the base material becomes small and the sound quality deteriorates. There is also a limit to reducing the conductive line thickness of the wiring pattern. Thus, it is difficult to reduce the weight of the diaphragm.
　本発明はこのような実情に鑑みてなされたものであり、その目的は、従来よりも軽量の振動板およびこの振動板を備えた平面スピーカを提供することにある。 The present invention has been made in view of such circumstances, and an object of the present invention is to provide a diaphragm that is lighter than conventional ones and a flat speaker including the diaphragm.
　（１）本発明の一側面は、少なくとも一方の面に配線パターンが形成された振動板において、前記配線パターンを覆う配線保護パターンが当該配線パターンに沿って形成され、前記配線パターンが形成されている面において前記配線パターンが形成されていない少なくとも一部は配線保護パターンにより覆われていないことを要旨とする。 (1) According to one aspect of the present invention, in a diaphragm having a wiring pattern formed on at least one surface, a wiring protection pattern that covers the wiring pattern is formed along the wiring pattern, and the wiring pattern is formed. The gist of the present invention is that at least a part of the surface where the wiring pattern is not formed is not covered with the wiring protection pattern.
　この振動板によれば、配線パターンが形成されていない部分の少なくとも一部分は、配線保護パターンが覆われていない。すなわち、全面が保護層により覆われている振動板に比べて、振動板は軽量になる。 According to this diaphragm, at least a part of the portion where the wiring pattern is not formed is not covered with the wiring protection pattern. That is, the diaphragm is lighter than a diaphragm that is entirely covered with a protective layer.
　（２）振動板において、前記配線保護パターンにより覆われている部分の面積は、前記配線保護パターンにより覆われていない部分の面積よりも小さいことが好ましい。 (2) In the diaphragm, the area of the portion covered with the wiring protection pattern is preferably smaller than the area of the portion not covered with the wiring protection pattern.
　（３）前記配線パターンが形成されていない部分に、当該振動板を補強する補強パターンが形成されていることが好ましい。 (3) It is preferable that a reinforcing pattern for reinforcing the diaphragm is formed in a portion where the wiring pattern is not formed.
　（４）前記配線保護パターンは、カバーレイまたはカバーコート処理により形成されることが好ましい。 (4) The wiring protection pattern is preferably formed by a coverlay or covercoat treatment.
　（５）本発明の他の側面は、一側面の振動板を備えた平面スピーカを提供する。 (5) Another aspect of the present invention provides a flat speaker having a diaphragm on one side.
　本発明の平面スピーカは、振動板全面に保護層を形成した振動板を備えた従来平面スピーカに比べて、振動板が軽量であるため、従来平面スピーカに比べて、能率を高くすることができる。 The flat speaker according to the present invention is lighter in vibration than a conventional flat speaker having a diaphragm having a protective layer formed on the entire surface of the diaphragm, and thus can be more efficient than a conventional flat speaker. .
　本発明によれば、従来よりも軽量の振動板およびこの振動板を備えた平面スピーカを提供するができる。 According to the present invention, it is possible to provide a diaphragm that is lighter than the conventional one and a flat speaker including the diaphragm.
本発明の一実施形態に係る平面スピーカの分解図。The exploded view of the plane speaker concerning one embodiment of the present invention. 図１の平面スピーカの磁石板の平面図。The top view of the magnet plate of the flat speaker of FIG. 図１の平面スピーカの振動板の断面図。Sectional drawing of the diaphragm of the planar speaker of FIG. 図１の平面スピーカの断面図。Sectional drawing of the planar speaker of FIG. 図１の平面スピーカの振動板の平面図。The top view of the diaphragm of the flat speaker of FIG. 振動板の能率特性を示すグラフ。The graph which shows the efficiency characteristic of a diaphragm. 変形例の平面スピーカの平面図。The top view of the flat speaker of a modification.
　図１～図７を参照して、本発明の実施形態の平面スピーカについて説明する。 A planar speaker according to an embodiment of the present invention will be described with reference to FIGS.
　図１に示すように、平面スピーカ１は、収容ケース１０と、磁石板２０と、振動板４０と、磁石板２０と振動板４０との間に配置される緩衝材３０と、磁石板２０と振動板４０との間の距離を確保するためのスペーサ５０とを備えている。 As shown in FIG. 1, the flat speaker 1 includes a housing case 10, a magnet plate 20, a vibration plate 40, a shock absorber 30 disposed between the magnet plate 20 and the vibration plate 40, and a magnet plate 20. A spacer 50 is provided for securing a distance from the diaphragm 40.
　収容ケース１０は、第１ケース１１と第２ケース１２とを備えている。第１ケース１１と第２ケース１２とが合わさることにより、その内部に収容空間が形成される。収容空間に、２枚の磁石板２０、２枚の緩衝材３０、２枚のスペーサ５０、および振動板４０が収容される。第１ケース１１には音波を外部に出すための複数の放射孔１３が形成されている。また、第１ケース１１の四隅および第２ケース１２の四隅には、締結部材としてのボルト６０が挿通する貫通孔１４が形成されている。 The housing case 10 includes a first case 11 and a second case 12. When the first case 11 and the second case 12 are combined, an accommodation space is formed therein. In the accommodation space, the two magnet plates 20, the two cushioning materials 30, the two spacers 50, and the diaphragm 40 are accommodated. The first case 11 is formed with a plurality of radiation holes 13 for emitting sound waves to the outside. Further, through holes 14 through which bolts 60 as fastening members are inserted are formed at the four corners of the first case 11 and the four corners of the second case 12.
　緩衝材３０は、振動する振動板４０と磁石板２０との衝突を緩和する。緩衝材３０としては、柔軟性および通気性があり、かつ磁石板２０および振動板４０に接触したときこれらの板に傷を付けないものが採用される。例えば不織布が緩衝材３０として用いられる。 The buffer material 30 alleviates the collision between the vibrating diaphragm 40 and the magnet plate 20. As the buffer material 30, a material that has flexibility and air permeability and that does not damage these plates when contacting the magnet plate 20 and the vibration plate 40 is employed. For example, a nonwoven fabric is used as the buffer material 30.
　スペーサ５０は、振動板４０と磁石板２０との間に介在し、両者の距離を一定に保持する。スペーサ５０は略四角形の枠体として構成されている。スペーサ５０の内側の空間（枠体の内側）に、緩衝材３０が収容される。すなわち、振動板４０とスペーサ５０と磁石板２０とにより囲まれる空間に緩衝材３０が収容される。スペーサ５０の四隅には、ボルト６０が挿通する貫通孔５１が形成されている。 The spacer 50 is interposed between the diaphragm 40 and the magnet plate 20 and keeps the distance between them constant. The spacer 50 is configured as a substantially rectangular frame. The cushioning material 30 is accommodated in the space inside the spacer 50 (inside the frame). That is, the buffer material 30 is accommodated in a space surrounded by the diaphragm 40, the spacer 50, and the magnet plate 20. Through holes 51 through which the bolts 60 are inserted are formed at the four corners of the spacer 50.
　図２を参照して、磁石板２０について説明する。 The magnet plate 20 will be described with reference to FIG.
　磁石板２０は、着磁可能な平面シートであり、多極着磁されている。平面シートには、互いに平行にＳ極２２とＮ極２１とが交互に形成されている。Ｓ極２２とＮ極２１との間隔は一定距離とされている。図示した例では、磁石板２０には、Ｓ極２２とＮ極２１との境界上に、音波を通過させるための複数の音孔２３が形成されている。また、磁石板２０の四隅にはボルト６０が挿通する貫通孔２４が形成されている。 The magnet plate 20 is a planar sheet that can be magnetized, and is multipolarized. On the flat sheet, S poles 22 and N poles 21 are alternately formed in parallel to each other. The distance between the S pole 22 and the N pole 21 is a fixed distance. In the illustrated example, the magnet plate 20 is formed with a plurality of sound holes 23 for passing sound waves on the boundary between the S pole 22 and the N pole 21. Further, through holes 24 through which the bolts 60 are inserted are formed at the four corners of the magnet plate 20.
　図３を参照して、振動板４０について説明する。図３は配線パターン４３を強調して示す。 The diaphragm 40 will be described with reference to FIG. FIG. 3 shows the wiring pattern 43 with emphasis.
　振動板４０は、基材４１と、基材４１の両面に設けられた配線パターン４３と、配線パターン４３を覆う保護層４６とを備えている。図示した例では、配線パターン４３は、基材４１の両面に形成されている。基材４１の一方の面に形成されている配線パターン４３と、他方の面に形成されている配線パターン４３とは、当該基材４１を間に挟んで同じところに形成されている。 The diaphragm 40 includes a base material 41, a wiring pattern 43 provided on both surfaces of the base material 41, and a protective layer 46 that covers the wiring pattern 43. In the illustrated example, the wiring pattern 43 is formed on both surfaces of the base material 41. The wiring pattern 43 formed on one surface of the base material 41 and the wiring pattern 43 formed on the other surface are formed in the same place with the base material 41 interposed therebetween.
　基材４１としては、フレキシブル基板、例えばポリイミド樹脂シートが用いられる。配線パターン４３は、導電性部材により形成されている。例えば、銅またはアルミニウムにより配線パターン４３が形成されている。基材４１の四隅には、ボルト６０が挿通する貫通孔４２が形成されている。 As the base material 41, a flexible substrate, for example, a polyimide resin sheet is used. The wiring pattern 43 is formed of a conductive member. For example, the wiring pattern 43 is formed of copper or aluminum. Through holes 42 through which the bolts 60 are inserted are formed at the four corners of the base material 41.
　配線パターン４３は、図１および図５に示すように、基材４１の長手方向に直線的に延びる直線配線４３ａと、直線配線４３ａを互いに接続する接続配線４３ｂと、２つの通電用の電極４４、４５とにより構成されている。直線配線４３ａは、Ｓ極２２およびＮ極２１の延長方向に対して平行に形成されている。 As shown in FIGS. 1 and 5, the wiring pattern 43 includes a linear wiring 43 a that linearly extends in the longitudinal direction of the base material 41, a connection wiring 43 b that connects the linear wiring 43 a to each other, and two electrodes 44 for energization. , 45. The straight wiring 43 a is formed in parallel to the extending direction of the S pole 22 and the N pole 21.
　上記各部材、すなわち収容ケース１０、磁石板２０、振動板４０、およびスペーサ５０は、ボルト６０により四隅で互いに固定されている。具体的には、各部材を重ね合わせたとき、収容ケース１０の貫通孔１４と、磁石板２０の貫通孔２４と、スペーサ５０の貫通孔５１と、振動板４０の貫通孔４２とが一致し、連通孔が形成される。そして、この連通孔にボルト６０が挿通され、ボルト６０とナット６１との結合により、各部材が互いに固定される。なお、振動板４０は、腹部が振幅可能な状態で四隅が固定される。 The above-described members, that is, the housing case 10, the magnet plate 20, the diaphragm 40, and the spacer 50 are fixed to each other at four corners by bolts 60. Specifically, when the respective members are overlapped, the through hole 14 of the housing case 10, the through hole 24 of the magnet plate 20, the through hole 51 of the spacer 50, and the through hole 42 of the diaphragm 40 coincide. A communication hole is formed. Then, the bolt 60 is inserted into the communication hole, and the members are fixed to each other by the coupling of the bolt 60 and the nut 61. The four corners of the diaphragm 40 are fixed in a state where the abdomen can swing.
　平面スピーカ１の組み立ては次のようにして行われる。 The assembly of the flat speaker 1 is performed as follows.
　第１ケース１１と、磁石板２０と、スペーサ５０と、緩衝材３０と、振動板４０とを順に重ね合わせる。そして、第１ケース１１、磁石板２０、スペーサ５０および振動板４０の各貫通孔の軸が一致するように各部材を位置決めして、これら貫通孔を連通させる。これにより、各部品を積層した積層体の四隅には、４つの連通孔が形成される。そして、対角線上の２つの連通孔にそれぞれボルト６０を挿通し、各部品を一体にして、第１のアッセンブリを形成する。 The first case 11, the magnet plate 20, the spacer 50, the buffer material 30, and the diaphragm 40 are overlapped in order. And each member is positioned so that the axis | shaft of each through-hole of the 1st case 11, the magnet plate 20, the spacer 50, and the diaphragm 40 may correspond, and these through-holes are connected. As a result, four communication holes are formed at the four corners of the laminate in which the components are laminated. Then, the bolts 60 are respectively inserted into the two communication holes on the diagonal line, and the parts are integrated to form the first assembly.
　また、同様に、第２ケース１２と、磁石板２０と、スペーサ５０と、緩衝材３０とを順に重ね合わせて、これら部品をボルト６０により一体にし、第２のアッセンブリを形成する。そして、第１のアッセンブリと第２のアッセンブリとを重ねて、ボルト６０とナット６１により、これら部品を締結する。 Similarly, the second case 12, the magnet plate 20, the spacer 50, and the buffer material 30 are overlapped in order, and these parts are integrated by a bolt 60 to form a second assembly. Then, the first assembly and the second assembly are overlapped, and these parts are fastened by the bolt 60 and the nut 61.
　図４を参照して、磁石板２０の各磁極と振動板４０の配線パターン４３との位置関係について説明する。 With reference to FIG. 4, the positional relationship between each magnetic pole of the magnet plate 20 and the wiring pattern 43 of the diaphragm 40 will be described.
　便宜上、以降の説明では、図４の紙面に対して垂直方向を「縦方向」とする。振動板４０に対して垂直な方向を「上下方向」とする。「縦方向」および「上下方向」に垂直な方向を「横方向」とする。 For convenience, in the following description, the vertical direction with respect to the paper surface of FIG. A direction perpendicular to the vibration plate 40 is referred to as “vertical direction”. A direction perpendicular to “vertical direction” and “vertical direction” is defined as “lateral direction”.
　磁石板２０のＮ極２１とＳ極２２とは互いに交互に形成されているため、Ｎ極２１とＳ極２２との境界部（以下、「ニュートラルゾーン２５」）が形成される。基材４１においてこのニュートラルゾーン２５に対向するところに、かつニュートラルゾーン２５に沿うように、配線パターン４３の導線（直線配線４３ａ）が配置されている。 Since the N pole 21 and the S pole 22 of the magnet plate 20 are alternately formed, a boundary portion (hereinafter, “neutral zone 25”) between the N pole 21 and the S pole 22 is formed. Conductive wires (straight lines 43 a) of the wiring pattern 43 are arranged in the base material 41 so as to face the neutral zone 25 and along the neutral zone 25.
　磁石板２０の磁力線はＮ極２１から出てＳ極２２に向う。図２に示すように、Ｎ極２１とＳ極２２とが互いに平行に配列されている場合、基材４１においてＮ極２１とＳ極２２との境界部（ニュートラルゾーン２５）に対向する部分に形成される磁力線の向きは、当該ニュートラルゾーン２５の長手方向（縦方向）に対して垂直な方向（横方向）である（図４の矢印参照）。配線パターン４３はニュートラルゾーン２５に沿って形成されているため、上記磁力線は、直線配線４３ａの長手方向（縦方向）と直交する。このため、配線パターン４３に電流が流れるとき、フレミングの法則により、振動板４０の面に対して垂直方向（上下方向）の力が作用する。 The magnetic field lines of the magnet plate 20 exit from the N pole 21 and go to the S pole 22. As shown in FIG. 2, when the N pole 21 and the S pole 22 are arranged in parallel to each other, a portion of the base material 41 that faces the boundary portion (neutral zone 25) between the N pole 21 and the S pole 22. The direction of the magnetic lines formed is a direction (lateral direction) perpendicular to the longitudinal direction (vertical direction) of the neutral zone 25 (see the arrow in FIG. 4). Since the wiring pattern 43 is formed along the neutral zone 25, the magnetic field lines are orthogonal to the longitudinal direction (vertical direction) of the straight wiring 43a. For this reason, when a current flows through the wiring pattern 43, a force in the vertical direction (up and down direction) acts on the surface of the diaphragm 40 according to Fleming's law.
　直線配線４３ａは互いに平行に形成されている。そして、隣接する直線配線４３ａ同士は、電流の流れる方向が逆向きとなっている。また、隣接する直線配線４３ａに対応する磁力線は互いに反対方向になっている。このため、配線パターン４３に電流が流れたとき、配線パターン４３を構成する全ての直線配線４３ａには同じ方向に力が加わる。 The straight wirings 43a are formed in parallel to each other. The adjacent linear wirings 43a have opposite directions of current flow. Further, the magnetic lines of force corresponding to the adjacent straight wirings 43a are in opposite directions. For this reason, when a current flows through the wiring pattern 43, a force is applied to all the straight wirings 43 a constituting the wiring pattern 43 in the same direction.
　振動板４０の動作について説明する。 The operation of the diaphragm 40 will be described.
　配線パターン４３に電流が流れるとき、振動板４０に上方向の力または下方向の力が加わる。このため、振動板４０が上下方向に振動する。すなわち、配線パターン４３に流れる電流信号が振動板４０の振動に変換され、これにより、音波が形成される。 When an electric current flows through the wiring pattern 43, an upward force or a downward force is applied to the diaphragm 40. For this reason, the diaphragm 40 vibrates in the vertical direction. That is, a current signal flowing through the wiring pattern 43 is converted into vibration of the diaphragm 40, thereby forming a sound wave.
　図５を参照して、配線パターン４３と保護層４６との関係について説明する。 The relationship between the wiring pattern 43 and the protective layer 46 will be described with reference to FIG.
　直線配線４３ａと接続配線４３ｂとは直列に接続され、一本の導線を形成している。配線パターン４３の両端には、通電用の第１電極４４および第２電極４５がそれぞれ設けられている。 The straight wiring 43a and the connection wiring 43b are connected in series to form a single conducting wire. At both ends of the wiring pattern 43, a first electrode 44 and a second electrode 45 for energization are provided.
　保護層４６は、配線保護パターン４６ａと、補強パターン４６ｂとにより構成されている（図３参照）。配線保護パターン４６ａは配線パターン４３に沿って形成されている。配線保護パターン４６ａの幅は、配線パターン４３の幅よりも僅かに大きい。すなわち、配線パターン４３は、配線保護パターン４６ａにより覆われている。 The protective layer 46 includes a wiring protective pattern 46a and a reinforcing pattern 46b (see FIG. 3). The wiring protection pattern 46 a is formed along the wiring pattern 43. The width of the wiring protection pattern 46 a is slightly larger than the width of the wiring pattern 43. That is, the wiring pattern 43 is covered with the wiring protection pattern 46a.
　そして、振動板４０の一面において、配線保護パターン４６ａにより覆われている部分の面積が、配線保護パターン４６ａにより覆われていない部分（以下、「基材露出部」）の面積よりも小さくなるように、配線保護パターン４６ａが形成されている。すなわち、振動板４０の一面において、基材露出部の面積を配線保護パターン４６ａにより覆われている部分の面積よりも大きくすることにより、配線保護パターン４６ａの減量分を大きくする。 Then, on one surface of the diaphragm 40, the area of the portion covered with the wiring protection pattern 46a is smaller than the area of the portion not covered with the wiring protection pattern 46a (hereinafter referred to as “substrate exposed portion”). In addition, a wiring protection pattern 46a is formed. That is, on the one surface of the diaphragm 40, the area of the base material exposed portion is made larger than the area of the portion covered with the wiring protection pattern 46a, thereby increasing the reduction amount of the wiring protection pattern 46a.
　なお、第１電極４４および第２電極４５の一部分は、導電体パッドとして機能する。このため、当該一部分の周囲を配線保護パターン４６ａで覆い、当該一部分を導電体パッドとして露出させている。 A part of the first electrode 44 and the second electrode 45 functions as a conductor pad. For this reason, the periphery of the part is covered with the wiring protection pattern 46a, and the part is exposed as a conductor pad.
　補強パターン４６ｂは配線パターン４３が形成されていない部分に形成されている。具体的には、補強パターン４６ｂは配線保護パターン４６ａの直線部分に対し設定角度で延びる。設定角度は、例えば、図５に示すように９０度に設定される。設定角度は、振動板４０の用途または寸法また質量等に応じて適宜設定される。配線保護パターン４６ａ間に形成された補強パターン４６ｂは、隣り合う配線保護パターン４６ａ同士を接続する。 The reinforcing pattern 46b is formed in a portion where the wiring pattern 43 is not formed. Specifically, the reinforcing pattern 46b extends at a set angle with respect to the straight portion of the wiring protection pattern 46a. For example, the setting angle is set to 90 degrees as shown in FIG. The set angle is appropriately set according to the use or size or mass of the diaphragm 40. The reinforcing pattern 46b formed between the wiring protection patterns 46a connects adjacent wiring protection patterns 46a.
　補強パターン４６ｂは、振動板４０全体の剛性を高くするために、基材４１全体に略均等に配置されることが好ましい。例えば、本実施形態では、配線保護パターン４６ａと補強パターン４６ｂとにより網目模様が形成されている。 It is preferable that the reinforcing patterns 46b are arranged substantially evenly on the entire base material 41 in order to increase the rigidity of the entire diaphragm 40. For example, in the present embodiment, a mesh pattern is formed by the wiring protection pattern 46a and the reinforcing pattern 46b.
　以上のように、配線保護パターン４６ａは配線パターン４３の形状に対応して形成されている。すなわち、配線パターン４３が形成されていない部分の多くが配線保護パターン４６ａが形成されていない。このため、基材４１全面を被覆するように保護層４６が設けられた振動板と比較して、実施形態の振動板４０は軽量である。 As described above, the wiring protection pattern 46 a is formed corresponding to the shape of the wiring pattern 43. That is, the wiring protection pattern 46a is not formed in many portions where the wiring pattern 43 is not formed. For this reason, the diaphragm 40 according to the embodiment is lighter than the diaphragm provided with the protective layer 46 so as to cover the entire surface of the base material 41.
　さらに、補強パターン４６ｂを配線保護パターン４６ａに対して設定角度で延びるように形成しているため、振動板４０が柱面のように一方向にのみ湾曲しやすくなることが抑制される。すなわち、配線パターン４３の直線配線４３ａが互いに平行となっている場合は、平行方向に対して垂直な方向に湾曲しやすくなるが、直線配線４３ａに対して交叉する方向に補強パターン４６ｂが設けられることにより、配線保護パターン４６ａの長手方向に対して垂直な方向へも湾曲しにくい。 Furthermore, since the reinforcing pattern 46b is formed so as to extend at a set angle with respect to the wiring protection pattern 46a, it is possible to suppress the vibration plate 40 from being easily bent only in one direction like a column surface. That is, when the straight wirings 43a of the wiring pattern 43 are parallel to each other, it is easy to bend in a direction perpendicular to the parallel direction, but the reinforcing pattern 46b is provided in a direction crossing the straight wirings 43a. Thus, it is difficult to bend in a direction perpendicular to the longitudinal direction of the wiring protection pattern 46a.
　図６を参照して、平面スピーカ１の特性について説明する。 The characteristics of the flat speaker 1 will be described with reference to FIG.
　図６は、比較の振動板（以下、「比較品」）の能率特性（破線）と、本実施形態に係る振動板４０（以下、「実施品」）の能率特性（実線）とを示している。 FIG. 6 shows the efficiency characteristic (broken line) of the comparative diaphragm (hereinafter referred to as “comparative product”) and the efficiency characteristic (solid line) of the diaphragm 40 (hereinafter referred to as “implemented product”) according to the present embodiment. Yes.
　特性の評価に使用した平面スピーカ１の構造は次の通り。 The structure of the flat speaker 1 used for the evaluation of characteristics is as follows.
　振動板４０と磁石板２０との間隔は０．５ｍｍ。緩衝材３０として、厚さ０．４ｍｍの不織布を使用。磁石板２０として、多極着磁して表面磁束密度１８０（ｍＴ）としたネオジム磁石板を使用。平面スピーカ１から２ｍ離れた距離で音圧を測定し、この値を１ｍ換算して出力音圧レベルを算出した。 The distance between the diaphragm 40 and the magnet plate 20 is 0.5 mm. A non-woven fabric having a thickness of 0.4 mm is used as the buffer material 30. As the magnet plate 20, a neodymium magnet plate having a surface magnetic flux density of 180 (mT) by multipolar magnetization is used. The sound pressure was measured at a distance of 2 m from the flat speaker 1, and this value was converted to 1 m to calculate the output sound pressure level.
　振動板の構造は以下の通り。 The structure of the diaphragm is as follows.
　比較品の振動板は次のような構成を有する。
・振動板４０の大きさは、ほぼＡ５サイズを縦方向に半分に割った大きさ（６３ｍｍ×２１０ｍｍ）。
・振動板４０の構造は、２層基板。
・基材４１の材料は、ポリイミド樹脂。
・基材４１の厚さは、２５μｍ。
・基材４１の質量は、０．４ｇ。
・配線パターン４３は、基材４１の両面に形成した。
・配線パターン４３の材料は、銅。
・配線パターン４３の横幅は、０．５ｍｍ。
・配線パターン４３の直線配線４３ａの間隔は、３ｍｍ。
・配線パターン４３の直線配線４３ａの長手方向は、振動板４０の長手方向とほぼ一致。
・配線パターン４３の厚さは、１８μｍ。
・配線パターン４３の質量は、０．７ｇ。
・保護層４６の材料は、エポキシ樹脂。
・保護層４６の保護領域は、基材４１の両面、かつ各面ともに全面。
・保護層４６の質量は、０．８ｇ。
・振動板４０の質量は、１．９ｇ。
・振動板４０に対する保護層４６の質量比は、４２％。 The comparative diaphragm has the following configuration.
The size of the diaphragm 40 is approximately the size obtained by dividing the A5 size in half in the vertical direction (63 mm × 210 mm).
-The structure of the diaphragm 40 is a two-layer substrate.
-The material of the base material 41 is a polyimide resin.
-The thickness of the base material 41 is 25 μm.
-The mass of the base material 41 is 0.4 g.
The wiring pattern 43 was formed on both surfaces of the base material 41.
-The material of the wiring pattern 43 is copper.
-The horizontal width of the wiring pattern 43 is 0.5 mm.
-The interval of the linear wiring 43a of the wiring pattern 43 is 3 mm.
The longitudinal direction of the straight wiring 43 a of the wiring pattern 43 is substantially the same as the longitudinal direction of the diaphragm 40.
-The thickness of the wiring pattern 43 is 18 μm.
-The weight of the wiring pattern 43 is 0.7 g.
-The material of the protective layer 46 is an epoxy resin.
-The protection area of the protective layer 46 is the both surfaces of the base material 41, and each surface is the whole surface.
-The mass of the protective layer 46 is 0.8g.
-The mass of the diaphragm 40 is 1.9 g.
The mass ratio of the protective layer 46 to the diaphragm 40 is 42%.
　実施品の振動板４０は次のような構成を有する。
・基本構造は比較品と同じである。次の点で比較品と異なる。
・保護層４６の保護領域は、基材４１の両面に形成、かつ各面ともに配線パターン４３に対応する部分に形成した。
・保護層４６の質量は、０．３ｇ。
・振動板４０の質量は、１．４ｇ。
・振動板４０に対する保護層４６の質量比は、２１％。 The diaphragm 40 according to the embodiment has the following configuration.
・ The basic structure is the same as the comparative product. It differs from the comparison product in the following points.
The protective region of the protective layer 46 was formed on both surfaces of the base material 41 and each surface was formed on a portion corresponding to the wiring pattern 43.
-The mass of the protective layer 46 is 0.3 g.
-The mass of the diaphragm 40 is 1.4 g.
The mass ratio of the protective layer 46 to the diaphragm 40 is 21%.
　図６に示すように、比較品と実施品とを比較すると、実施品は、周波数３００Ｈｚ～１０ｋＨｚの範囲において比較品よりも出力音圧レベルが１～４ｄＢ高い。このような能率の向上は、振動板４０の軽量化による。 As shown in FIG. 6, when comparing the comparison product with the implementation product, the implementation product has an output sound pressure level of 1 to 4 dB higher than the comparison product in the frequency range of 300 Hz to 10 kHz. Such an improvement in efficiency is due to the weight reduction of the diaphragm 40.
　このような傾向は、基材４１の材料、基材４１の寸法、配線パターン４３の材料、配線パターン４３の寸法等に関係なく成立する。すなわち、基材全面に保護層４６を形成した振動板を備える平面スピーカの能率よりも、部分的に保護層４６を形成した振動板４０を有する平面スピーカ１の能率が高い。 Such a tendency is established regardless of the material of the base material 41, the dimensions of the base material 41, the material of the wiring pattern 43, the dimensions of the wiring pattern 43, and the like. That is, the efficiency of the flat speaker 1 having the diaphragm 40 partially formed with the protective layer 46 is higher than the efficiency of the flat speaker including the diaphragm having the protective layer 46 formed on the entire surface of the substrate.
　［振動板４０の製造方法］
　振動板４０の製造方法について説明する。 [Method for Manufacturing Diaphragm 40]
A method for manufacturing the diaphragm 40 will be described.
　まず、両面銅張積層板をエッチングすることにより、配線パターン４３を形成する。 First, the wiring pattern 43 is formed by etching the double-sided copper-clad laminate.
　次に、保護層４６をカバーコート法（カバーコート処理）により形成する。具体的には、感光性樹脂をスクリーン印刷等で基材４１全面に塗布し、これを乾燥する。次に、配線保護パターン４６ａおよび補強パターン４６ｂを含む所定パターンに対して選択的に露光する。そして、現像液により、未硬化部分を除去する。この後、所定温度で感光性樹脂を加熱することにより、感光性樹脂を硬化させる。以上により、保護層４６が形成される。 Next, the protective layer 46 is formed by a cover coat method (cover coat treatment). Specifically, a photosensitive resin is applied to the entire surface of the base material 41 by screen printing or the like and dried. Next, a predetermined pattern including the wiring protection pattern 46a and the reinforcing pattern 46b is selectively exposed. Then, the uncured portion is removed with a developer. Then, the photosensitive resin is cured by heating the photosensitive resin at a predetermined temperature. Thus, the protective layer 46 is formed.
　感光性樹脂としては、耐環境性に優れたものが採用される。例えば、エポキシ・アクリル樹脂等の感光性樹脂を用いることが好ましい。なお、ソルダーレジストとして用いられる感光性樹脂を用いることもできる。 As the photosensitive resin, a resin having excellent environmental resistance is used. For example, a photosensitive resin such as an epoxy / acrylic resin is preferably used. In addition, the photosensitive resin used as a soldering resist can also be used.
　保護層４６の形成方法は上記方法に限定されない。以下、保護層４６の形成方法の他の例を挙げる。 The method for forming the protective layer 46 is not limited to the above method. Hereinafter, other examples of the method for forming the protective layer 46 will be described.
　カバーコート法の一種であるスクリーン印刷により保護層４６を形成することができる。この方法では、配線パターン４３が形成された基材４１の所定部分に、スクリーン印刷を用いて、液状ポリイミド樹脂を塗布する。次に、これを加熱し、液状ポリイミド樹脂を硬化させる。これにより、保護層４６が形成される。 The protective layer 46 can be formed by screen printing which is a kind of cover coat method. In this method, a liquid polyimide resin is applied to a predetermined portion of the base material 41 on which the wiring pattern 43 is formed using screen printing. Next, this is heated to cure the liquid polyimide resin. Thereby, the protective layer 46 is formed.
　カバーレイ法により保護層４６を形成することもできる。例えば、一方面に未硬化状態の接着材が塗布された樹脂フィルムを所定形状に切断加工し、これを配線パターン４３が形成された基材４１に配置する。そして、クッション材を介して基材４１と樹脂フィルムとを加熱および加圧することにより樹脂フィルムを基材４１に貼り付ける。この方法は、他の方法と比較すると寸法精度が低い。このため、多数の配線パターン４３を一括して覆う保護層４６を形成する場合等、寸法精度の必要としない保護層４６の形成に対し、この方法を適用することが好ましい。 The protective layer 46 can also be formed by a coverlay method. For example, a resin film having an uncured adhesive applied on one side is cut into a predetermined shape and placed on the base material 41 on which the wiring pattern 43 is formed. And the resin film is affixed on the base material 41 by heating and pressurizing the base material 41 and the resin film through the cushion material. This method has lower dimensional accuracy than other methods. For this reason, it is preferable to apply this method to the formation of the protective layer 46 that does not require dimensional accuracy, such as when forming the protective layer 46 that collectively covers a large number of wiring patterns 43.
　カバーレイ法の他の方法として、感光性ドライフィルムを用いる方法もある。この方法では、配線パターン４３が形成された基材４１に感光性ドライフィルムをラミネートし、露光および現像して所定パターンを形成する。そして、これを加熱硬化することにより、保護層４６を形成する。 As another method of the coverlay method, there is a method using a photosensitive dry film. In this method, a photosensitive dry film is laminated on the base material 41 on which the wiring pattern 43 is formed, and exposure and development are performed to form a predetermined pattern. And the protective layer 46 is formed by heat-curing this.
　［振動板４０の変形例］
　図７を参照して、振動板４０の変形例について説明する。図７は、磁石板２０と振動板４０とを重ね合わせて、透視した図である。 [Modification of diaphragm 40]
A modification of the diaphragm 40 will be described with reference to FIG. FIG. 7 is a view in which the magnet plate 20 and the diaphragm 40 are overlapped and seen through.
　変形例では、Ｎ極２１とＳ極２２とが四角形に形成され、縦方向および横方向に互いに交互に配列されている。配線パターン４３は、これらＮ極２１とＳ極２２を縫うように配線されている。すなわち、基材４１において、Ｓ極２２とＮ極２１との間のニュートラルゾーン２５に対向する位置に配線パターン４３の直線部が形成されている。各配線パターン４３の直線部は直列に接続されている。 In the modification, the N pole 21 and the S pole 22 are formed in a quadrangular shape and are alternately arranged in the vertical direction and the horizontal direction. The wiring pattern 43 is wired so as to sew the N pole 21 and the S pole 22. That is, the linear portion of the wiring pattern 43 is formed in the base material 41 at a position facing the neutral zone 25 between the S pole 22 and the N pole 21. The straight portions of the wiring patterns 43 are connected in series.
　配線保護パターン４６ａは、配線パターン４３に沿って形成されている。補強パターン４６ｂは、配線保護パターン４６ａの対角位置同士を接続するように形成されている。これにより、振動板４０が湾曲しにくくなる。 The wiring protection pattern 46 a is formed along the wiring pattern 43. The reinforcing pattern 46b is formed so as to connect the diagonal positions of the wiring protection pattern 46a. Thereby, the diaphragm 40 becomes difficult to bend.
　本実施形態によれば以下の効果が得られる。 According to this embodiment, the following effects can be obtained.
　（１）本実施形態では、配線パターン４３に沿って配線保護パターン４６ａが形成されている。配線パターン４３が形成されている面において配線パターン４３が形成されていない基材部分の少なくとも一部分は、配線保護パターン４６ａにより覆われていない状態にある。すなわち、湿気等から保護する必要のない基材部分のうちの一部分は、配線保護パターン４６ａが設けられず、基材４１が露出している。このため、基材４１の全面が保護層により覆われている振動板に比べて、振動板４０を軽量にすることができる。 (1) In the present embodiment, the wiring protection pattern 46 a is formed along the wiring pattern 43. At least a part of the base material portion on which the wiring pattern 43 is not formed on the surface on which the wiring pattern 43 is formed is not covered with the wiring protection pattern 46a. That is, a portion of the base material portion that does not need to be protected from moisture or the like is not provided with the wiring protection pattern 46a, and the base material 41 is exposed. For this reason, the diaphragm 40 can be made lighter than the diaphragm in which the entire surface of the base material 41 is covered with the protective layer.
　（２）本実施形態では、振動板４０の一面において、配線保護パターン４６ａにより覆われている部分の面積は、配線保護パターン４６ａにより覆われていない部分の面積よりも小さい。この構成によれば、配線保護パターン４６ａを密に配置して配線保護パターン４６ａで覆われている部分の面積を、配線保護パターン４６ａにより覆われていない部分の面積よりも大きくする場合に比べ、振動板４０を軽量にすることができる。 (2) In the present embodiment, the area of the part covered with the wiring protection pattern 46a on the one surface of the diaphragm 40 is smaller than the area of the part not covered with the wiring protection pattern 46a. According to this configuration, the wiring protection pattern 46a is densely arranged and the area of the portion covered with the wiring protection pattern 46a is made larger than the area of the portion not covered with the wiring protection pattern 46a. The diaphragm 40 can be reduced in weight.
　（３）本実施形態では、基材４１上で、配線パターン４３が形成されていない基材部分に、基材４１を補強する補強パターン４６ｂが形成されている。 (3) In the present embodiment, a reinforcing pattern 46 b that reinforces the base material 41 is formed on the base material 41 where the wiring pattern 43 is not formed.
　配線パターン４３に対応する部分にだけ配線保護パターン４６ａを形成すると、振動板４０全体として撓みやすくなる。すると、振動板４０が振動するとき、振動板４０が波打つおそれがあり、これにより音質が低下する場合がある。そこで、振動板４０の撓みを抑制するために補強パターン４６ｂを形成する。これにより、振動板４０の撓みを小さくすることができる。これにより、振動板４０の軽量化と、振動板４０の撓みに起因する音質の低下の抑制とを両立することができる。 If the wiring protection pattern 46a is formed only in the portion corresponding to the wiring pattern 43, the entire diaphragm 40 is easily bent. Then, when the vibration plate 40 vibrates, the vibration plate 40 may be undulated, which may reduce the sound quality. Therefore, the reinforcing pattern 46b is formed to suppress the bending of the diaphragm 40. Thereby, the bending of the diaphragm 40 can be made small. Thereby, weight reduction of the diaphragm 40 and suppression of the deterioration of the sound quality resulting from the bending of the diaphragm 40 can be made compatible.
　（４）本実施形態では、配線保護パターン４６ａおよび補強パターン４６ｂが同一材料により一体的に形成されている。「一体的に」とは同一工程で形成された、不連続境界を持たない構造を意図している。仮に、配線保護パターン４６ａと補強パターン４６ｂとを一体的に形成されたものでない場合、基材４１において物理構造上で不連続部が形成されるため音質が低下することがある。 (4) In this embodiment, the wiring protection pattern 46a and the reinforcing pattern 46b are integrally formed of the same material. “Integrally” is intended to mean a structure formed in the same process and having no discontinuous boundaries. If the wiring protection pattern 46a and the reinforcing pattern 46b are not integrally formed, sound quality may be deteriorated because discontinuous portions are formed on the physical structure in the base material 41.
　この点、本実施形態では、配線保護パターン４６ａおよび補強パターン４６ｂが同一材料により一体的に形成している。このため、上記のような境目が存在しない。従って実施形態の振動板４０は、配線保護パターン４６ａと補強パターン４６ｂとが別材料で形成された振動板よりも、音質を良くすることができる。 In this respect, in this embodiment, the wiring protection pattern 46a and the reinforcing pattern 46b are integrally formed of the same material. For this reason, there is no boundary as described above. Therefore, the diaphragm 40 of the embodiment can improve the sound quality as compared with the diaphragm in which the wiring protection pattern 46a and the reinforcing pattern 46b are formed of different materials.
　（５）配線パターン４３を保護する方法として例えばメッキ等も考えられるが、金属以外の部分で所定領域にメッキを施すことは難しい。 (5) As a method for protecting the wiring pattern 43, for example, plating is conceivable, but it is difficult to apply plating to a predetermined area at a portion other than metal.
　この点、本実施形態では、配線保護パターン４６ａおよび補強パターン４６ｂが感光性樹脂により形成されている。現像により、配線保護パターン４６ａおよび補強パターン４６ｂを形成することは比較的簡単である。従って、実施形態の振動板４０は、メッキ法で配線保護パターン４６ａおよび補強パターン４６ｂが形成される振動板に比べて、容易に製造可能である。 In this respect, in this embodiment, the wiring protection pattern 46a and the reinforcing pattern 46b are formed of a photosensitive resin. Forming the wiring protection pattern 46a and the reinforcing pattern 46b by development is relatively simple. Therefore, the diaphragm 40 of the embodiment can be easily manufactured as compared with the diaphragm in which the wiring protection pattern 46a and the reinforcing pattern 46b are formed by a plating method.
　（６）本実施形態では、補強パターン４６ｂが配線保護パターン４６ａに対して設定角度で延びるように形成されている。 (6) In the present embodiment, the reinforcing pattern 46b is formed to extend at a set angle with respect to the wiring protection pattern 46a.
　補強パターン４６ｂは配線パターン４３に対して設定角度で交わる。配線パターン４３に対応する部分にだけ配線保護パターン４６ａを形成した場合、配線保護パターン４６ａにより配線パターン４３に沿うように振動板４０が補強されるため、振動板４０が一定方向に湾曲しやすくなることがある。この点、上記構成によれば、配線パターン４３の方向に対して設定角度で延びる補強パターン４６ｂにより基材４１が補強されるため、振動板４０が一定方向にだけ湾曲しやすくなることが抑制される。 The reinforcing pattern 46 b intersects the wiring pattern 43 at a set angle. When the wiring protection pattern 46a is formed only in the portion corresponding to the wiring pattern 43, the vibration plate 40 is reinforced along the wiring pattern 43 by the wiring protection pattern 46a, so that the vibration plate 40 is easily bent in a certain direction. Sometimes. In this regard, according to the above configuration, since the base material 41 is reinforced by the reinforcing pattern 46b extending at a set angle with respect to the direction of the wiring pattern 43, the diaphragm 40 is prevented from being easily bent only in a certain direction. The
　（７）配線保護パターン４６ａは配線パターン４３の形状に対応した形状を有する。この場合、配線保護パターン４６ａの質量をより小さくすることができ、いっそう軽量な振動板４０が得られる。 (7) The wiring protection pattern 46 a has a shape corresponding to the shape of the wiring pattern 43. In this case, the mass of the wiring protection pattern 46a can be further reduced, and the lighter diaphragm 40 can be obtained.
　（８）本実施形態の平面スピーカ１は、上記構成の振動板４０を備えている。振動板４０は軽量であるため、基材４１全面に保護層４６を形成した振動板４０を備えた従来平面スピーカ１に比べて、能率を高くすることができる。 (8) The flat speaker 1 of the present embodiment includes the diaphragm 40 having the above-described configuration. Since the diaphragm 40 is lightweight, the efficiency can be increased as compared with the conventional flat speaker 1 including the diaphragm 40 in which the protective layer 46 is formed on the entire surface of the base material 41.
　（その他の実施形態）
　なお、本発明の実施態様は上記実施形態にて例示した態様に限られるものではなく、これを例えば以下に示すように変更して実施することもできる。また以下の各変形例は、上記実施形態についてのみ適用されるものではなく、異なる変形例同士を互いに組み合わせて実施することもできる。 (Other embodiments)
In addition, the embodiment of the present invention is not limited to the embodiment exemplified in the above-described embodiment, and can be implemented by changing it as shown below, for example. The following modifications are not applied only to the above-described embodiment, and different modifications can be combined with each other.
　・上記実施形態では、収容ケース１０と磁石板２０との間に通気性のある防水シートを配置してもよい。この構成により、収容ケース１０の放射孔１３を通じて水分が浸入することを抑制することができる。 In the above embodiment, a breathable waterproof sheet may be disposed between the housing case 10 and the magnet plate 20. With this configuration, moisture can be prevented from entering through the radiation holes 13 of the housing case 10.
　・上記実施形態では、２枚の磁石板２０の間に振動板４０を配置する構成としているが、磁石板２０は１枚でもよい。例えば、磁石板２０の一方の面に緩衝材３０が配置され、緩衝材３０の上に振動板４０が配置される。 In the above embodiment, the diaphragm 40 is arranged between the two magnet plates 20, but the number of the magnet plates 20 may be one. For example, the buffer material 30 is disposed on one surface of the magnet plate 20, and the diaphragm 40 is disposed on the buffer material 30.
　・上記実施形態では、磁石板２０を着磁可能な平面シートにより形成している。そして、平面シートを多極着磁することによりＮ極２１とＳ極２２を形成している。これに対し、複数の永久磁石を基板に配列することにより、磁石板２０を形成することもできる。 In the above embodiment, the magnet plate 20 is formed of a flat sheet that can be magnetized. And the N pole 21 and the S pole 22 are formed by multipolarizing a plane sheet. On the other hand, the magnet plate 20 can also be formed by arranging a plurality of permanent magnets on the substrate.
　・上記実施形態では、基材４１の両面に配線パターン４３を形成しているが、基材４１の一方の面にのみ配線パターン４３を形成してもよい。 In the above embodiment, the wiring pattern 43 is formed on both surfaces of the base material 41, but the wiring pattern 43 may be formed only on one surface of the base material 41.
　・上記実施形態では、配線パターン４３の全ての直線配線４３ａおよび接続配線４３ｂを結ぶ線に沿うように配線保護パターン４６ａを形成している。一方、複数の配線パターン４３が互いに近接する場合には、複数の配線パターン４３を配線保護パターン４６ａで一括して覆ってもよい。この場合でも、基材４１全面に配線保護パターン４６ａを形成した振動板に比べて、当該複数の配線パターン４３の形成されていない基材部分に配線保護パターン４６ａを形成しない分だけ軽量な振動板４０を得ることができる。 In the above embodiment, the wiring protection pattern 46a is formed along the line connecting all the straight wirings 43a and the connection wirings 43b of the wiring pattern 43. On the other hand, when the plurality of wiring patterns 43 are close to each other, the plurality of wiring patterns 43 may be collectively covered with the wiring protection pattern 46a. Even in this case, as compared with the diaphragm in which the wiring protection pattern 46a is formed on the entire surface of the base material 41, the diaphragm is lighter by the amount that the wiring protection pattern 46a is not formed in the base material portion on which the wiring patterns 43 are not formed. 40 can be obtained.
　・上記実施形態では、配線保護パターン４６ａと補強パターン４６ｂとを現像により一括して形成しているが、別工程で形成することもできる。また、配線保護パターン４６ａと補強パターン４６ｂとを別材料により形成することも可能である。 In the above embodiment, the wiring protection pattern 46a and the reinforcing pattern 46b are formed together by development, but can be formed in separate steps. Further, the wiring protection pattern 46a and the reinforcing pattern 46b can be formed of different materials.
　・上記実施形態では、配線保護パターン４６ａに対して設定角度で補強パターン４６ｂを形成しているが、補強パターン４６ｂの設定角度を２種類以上とし、配線保護パターン４６ａの直線部分に対し異なる方向に延びる２種類以上の補強パターン４６ｂを設けることもできる。 In the above embodiment, the reinforcing pattern 46b is formed at a set angle with respect to the wiring protection pattern 46a. However, the setting angle of the reinforcing pattern 46b is set to two or more types, and in different directions with respect to the linear portion of the wiring protection pattern 46a. Two or more types of reinforcing patterns 46b that extend may be provided.
　・上記実施形態では、振動板４０として２層基板を用いているが、配線パターン４３と基材４１との間に接着層のある基板（３層基板）を用いることもできる。この場合においても、配線パターン４３に沿って配線保護パターン４６ａを形成することにより、上記（１）と同様の効果が得られる。 In the above embodiment, a two-layer substrate is used as the diaphragm 40, but a substrate having an adhesive layer between the wiring pattern 43 and the base material 41 (three-layer substrate) can also be used. Even in this case, by forming the wiring protection pattern 46 a along the wiring pattern 43, the same effect as the above (1) can be obtained.
　・上記実施形態では、振動板４０にはボルト６０が挿通するための貫通孔４２以外の貫通孔は設けられていないが、振動板４０に軽量化の目的で、当該振動板４０に貫通孔もしくは切り込み等を形成してもよい。このような貫通孔は、配線パターン４３および配線保護パターン４６ａおよび補強パターン４６ｂ以外のところであって音質等に影響のない部分、例えば基材４１の外周部分に形成される。切り込みは、基材４１の端縁に形成される。この構成により、振動板４０をさらに軽量にすることができる。 In the above embodiment, the diaphragm 40 is not provided with a through hole other than the through hole 42 through which the bolt 60 is inserted, but the diaphragm 40 has a through hole or a hole for the purpose of weight reduction. A cut or the like may be formed. Such a through-hole is formed in a portion other than the wiring pattern 43, the wiring protection pattern 46a, and the reinforcing pattern 46b, which does not affect the sound quality, for example, the outer peripheral portion of the substrate 41. The cut is formed at the edge of the base material 41. With this configuration, the diaphragm 40 can be further reduced in weight.
　・上記実施形態では、振動板４０を平面スピーカ１に用いているが、振動板４０を消音装置の振動部品として用いることもできる。すなわち、電流信号を振動に変換する電気機器の振動部品として、振動板４０を用いることができる。また、振動板４０は、振動により誘起電圧を発生させるため、マイクの振動部品として用いることもできる。 In the above embodiment, the diaphragm 40 is used for the flat speaker 1, but the diaphragm 40 can also be used as a vibration component of the silencer. That is, the diaphragm 40 can be used as a vibration component of an electric device that converts a current signal into vibration. Moreover, since the diaphragm 40 generates an induced voltage by vibration, it can also be used as a vibration part of a microphone.
　１…平面スピーカ、１０…収容ケース、１１…第１ケース、１２…第２ケース、１３…放射孔、１４…貫通孔、２０…磁石板、２１…Ｎ極、２２…Ｓ極、２３…音孔、２４…貫通孔、２５…ニュートラルゾーン、３０…緩衝材、４０…振動板、４１…基材、４２…貫通孔、４３…配線パターン、４３ａ…直線配線、４３ｂ…接続配線、４４…第１電極、４５…第２電極、４６…保護層、４６ａ…配線保護パターン、４６ｂ…補強パターン、５０…スペーサ、５１…貫通孔、６０…ボルト、６１…ナット。 DESCRIPTION OF SYMBOLS 1 ... Flat speaker, 10 ... Housing case, 11 ... 1st case, 12 ... 2nd case, 13 ... Radiation hole, 14 ... Through-hole, 20 ... Magnet plate, 21 ... N pole, 22 ... S pole, 23 ... Sound Holes 24 ... through holes 25 ... neutral zone 30 ... buffer material 40 ... vibrating plate 41 ... base material 42 ... through hole 43 ... wiring pattern 43a ... straight wiring 43b ... connection wiring 44th 1 electrode 45 ... second electrode 46 ... protective layer 46a ... wiring protection pattern 46b ... reinforcing pattern 50 ... spacer 51 ... through hole 60 ... bolt 61 ... nut

Claims (5)

  1. 　少なくとも一方の面に配線パターンが形成された振動板において、
    　前記配線パターンを覆う配線保護パターンが当該配線パターンに沿って形成され、
    　前記配線パターンが形成されている面において前記配線パターンが形成されていない少なくとも一部は配線保護パターンにより覆われていない
    　ことを特徴とする振動板。     In a diaphragm having a wiring pattern formed on at least one surface,
    A wiring protection pattern covering the wiring pattern is formed along the wiring pattern,
    At least a part of the surface on which the wiring pattern is not formed is not covered with a wiring protection pattern.
  2. 　請求項１に記載の振動板において、
    　前記配線保護パターンにより覆われている部分の面積は、前記配線保護パターンにより覆われていない部分の面積よりも小さい
    　ことを特徴とする振動板。     The diaphragm according to claim 1,
    The area of the portion covered with the wiring protection pattern is smaller than the area of the portion not covered with the wiring protection pattern.
  3. 　請求項１または２に記載の振動板において、
    　前記配線パターンが形成されていない部分に、当該振動板を補強する補強パターンが形成されている
    　ことを特徴とする振動板。     The diaphragm according to claim 1 or 2,
    A vibration pattern that reinforces the vibration plate is formed at a portion where the wiring pattern is not formed.
  4. 　請求項１～３のいずれか一項に記載の振動板において、
    　前記配線保護パターンは、カバーレイまたはカバーコート処理により形成される
    　ことを特徴とする振動板。     The diaphragm according to any one of claims 1 to 3,
    The wiring protection pattern is formed by a cover lay or cover coat process.
  5. 　請求項１～４のいずれか一項に記載の振動板を備えた平面スピーカ。 A flat speaker comprising the diaphragm according to any one of claims 1 to 4.
PCT/JP2011/068692 2011-08-18 2011-08-18 Diaphragm and flat speaker WO2013024543A1 (en)

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Application Number Priority Date Filing Date Title
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63151296A (en) * 1986-12-16 1988-06-23 Foster Denki Kk Diaphragm for overall driving type speaker and its manufacture
JP2000345369A (en) * 1999-06-01 2000-12-12 Sakai Electronic Industry Co Ltd Speaker diaphragm, and its manufacture
JP2008113368A (en) * 2006-10-31 2008-05-15 Fps:Kk Planar acoustic transducer and method of manufacturing same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63151296A (en) * 1986-12-16 1988-06-23 Foster Denki Kk Diaphragm for overall driving type speaker and its manufacture
JP2000345369A (en) * 1999-06-01 2000-12-12 Sakai Electronic Industry Co Ltd Speaker diaphragm, and its manufacture
JP2008113368A (en) * 2006-10-31 2008-05-15 Fps:Kk Planar acoustic transducer and method of manufacturing same

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