JP2000337823A - Surface inspection device and surface inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface inspection device and a surface inspection method significantly improving the measurement time by unifying two measurement systems to one system to execute two-dimensional and three-dimensional inspections at the same time. SOLUTION: The device comprises a first surface detecting process for two dimensionally detecting the surface of an object to be measured by continuously radiating a radiation beam from a first beam source 8, and a second surface detecting process for three dimensionally detecting the surface of the measured object by intermittently radiating a sheet-like radiation beam from second beam sources 1-5. As a result, the second surface detecting process is executed only during lighting on of the second beam sources 1 to 5, and then the first surface detecting process is executed only during lighting off of the second beam sources 1 to 5. Quality of the object to be measured is judged from detection results of the first and second surface detecting process to determine whether it is acceptable or rejected.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a surface inspection apparatus and a surface inspection method. For example, the present invention can be applied to a wafer bump inspection apparatus and an inspection method. More specifically, the present invention relates to a technique for inspecting the height, shape, dimensions, and the like of gold-plated bumps or solder bumps formed on a semiconductor wafer or a film substrate.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional two-dimensional inspection method for a wafer bump. As shown in FIG. 5, illumination light is supplied from a continuously lit white light source 8 via an optical fiber 9, and an epi-illumination 20 which is coaxial with the two-dimensional light receiving lens 7 is irradiated onto the wafer 17 via a mirror 28 and a half mirror 29. Then, after the two-dimensional image 18 obtained by the CCD camera 6 is image-processed by the image processing device 26 using the reflected light 21 from the surface of the wafer 17, it is judged by the pass / fail judgment device 27 whether it is a non-defective or defective product. By such a two-dimensional inspection, it is possible to determine the size, pitch, presence / absence of a chip, presence / absence of a protrusion defect, and the like.

[0003]

The present inventor has already proposed a three-dimensional inspection method for wafer bumps (Japanese Patent Application No. Hei.
-369520). FIG. 6 shows the three-dimensional inspection method. As shown in FIG. 6, the regular reflection laser light sources 3, 4, 5
From a regular reflection laser 14 to 16 in the form of a wafer
And the scattering laser light sources 1 and 2
Then, the scattering lasers 12 and 13 are irradiated onto the wafer 17 from directly above, and a three-dimensional inspection image 19 is obtained by the CCD camera 10. This three-dimensional inspection image 19 shows a cross section of the wafer bump 17.

The three-dimensional inspection image 19 can be image-processed by an image processing device 26, and the pass / fail judgment device 27 can inspect the height of the bumps. When the three-dimensional inspection proposed by the inventor and the two-dimensional inspection described in the above-described related art are separately performed, it takes time and effort to inspect one place twice.
It takes 20 to 60 minutes to inspect one 6-inch wafer. With such a measurement time, it is difficult to cope with the speed of the semiconductor wafer manufacturing line.

Therefore, it is conceivable to combine the two measurement systems into one. However, it is a problem how to avoid the adverse effects of the two light sources used for the bump height inspection and the two-dimensional inspection on each other's inspection cameras. Becomes The present invention solves the above-mentioned problems, and provides a surface inspection apparatus and a surface inspection method that combine these two measurement systems into one, perform two-dimensional inspection and three-dimensional inspection simultaneously, and significantly improve measurement time. The purpose is to do.

[0006]

According to a first aspect of the present invention, there is provided a surface inspection apparatus for detecting a surface of an object to be inspected two-dimensionally. Second surface detection means for three-dimensionally detecting the surface of the inspection object, a first light source for continuously irradiating the inspection object with irradiation light, and intermittent sheet-like irradiation light for the inspection object A second light source for irradiating the second light source, turning on and off the second light source, operating the second surface detection unit while the second light source is turned on, and the second light source A synchronizing signal generating means for generating a synchronizing signal for operating the first surface detecting means while the light is turned off, and a pass / fail judgment means for judging pass / fail of the object to be inspected from detection results of the first and second surface detecting means. And characterized in that:

According to a second aspect of the present invention, there is provided a surface inspection apparatus according to the first aspect, wherein the second surface detecting means attenuates light other than light emitted from the second light source. It is characterized in that a damping means is provided.

According to a third aspect of the present invention, there is provided a surface inspection apparatus comprising: first surface detection means for two-dimensionally detecting a surface of an object; and three-dimensionally detecting the surface of the object. Second surface detecting means for intermittently detecting irradiation light, a first light source for intermittently applying irradiation light to the inspection object, and a second light source for intermittently applying sheet-like irradiation light to the inspection object. The light source and the first and second light sources are instructed to be turned on and off so that the first and second light sources are not turned on at the same time, and the second surface detection unit is turned on while the second light source is turned on. A synchronizing signal generating means for generating a synchronizing signal for operating and operating the first surface detecting means while the first light source is turned on, and a detection signal from the first and second surface detecting means. A quality determination unit for determining the quality of the inspection object.

According to a fourth aspect of the present invention, there is provided a surface inspection apparatus according to the third aspect of the present invention, wherein one or both of the surface detecting means receives light other than illumination light from the light source for the means. It is characterized in that a damping means for damping is provided.

A surface inspection apparatus according to a fifth aspect of the present invention that achieves the above object, according to the first, second, third or fourth aspect,
A synchronization signal generating unit that has a position detection unit that detects a position of the inspection object, and that generates a synchronization signal in consideration of a position of the inspection object that is detected by the synchronization signal generation unit by the synchronization signal generation unit. It is characterized by having.

According to a sixth aspect of the present invention, there is provided a surface inspection apparatus according to the first aspect, wherein the sheet-like illumination light is a sheet-like laser light or a sheet-like slit. It is characterized by being light.

A surface inspection apparatus according to a seventh aspect of the present invention to achieve the above object is characterized in that, in the first aspect, the object to be inspected is a wafer on which bumps are formed.

According to a second aspect of the present invention, there is provided a surface inspection apparatus, wherein the object to be inspected is a wafer having bumps formed thereon.

According to a ninth aspect of the present invention, there is provided a surface inspection apparatus, wherein the object to be inspected is a wafer having bumps formed thereon.

According to a tenth aspect of the present invention, there is provided a surface inspection apparatus according to the fourth aspect, wherein the object to be inspected is a wafer on which bumps are formed.

According to a eleventh aspect of the present invention, there is provided a surface inspection apparatus according to the fifth aspect, wherein the object to be inspected is a wafer on which bumps are formed.

According to a twelfth aspect of the present invention, there is provided a surface inspection apparatus according to the sixth aspect, wherein the object to be inspected is a wafer having bumps formed thereon.

The surface inspection method according to a thirteenth aspect of the present invention, which achieves the above object, irradiates the inspection object with the irradiation light from the first light source continuously, thereby irradiating the surface of the inspection object with two light beams.
A first surface detection step of detecting three-dimensionally, and three-dimensionally detecting a surface of the inspection object by intermittently irradiating the inspection object with sheet-like irradiation light from a second light source. A second surface detection step, wherein the second surface detection step is executed only while the second light source is turned on, and the first surface detection step is performed while the second light source is turned off. Only is executed, and the quality of the inspection object is determined based on the detection results of the first and second surface detection steps.

According to a fourteenth aspect of the present invention, there is provided a surface inspection method for continuously irradiating an irradiation light from a first light source to the inspection object.
A first surface detection step of detecting three-dimensionally, and three-dimensionally detecting a surface of the inspection object by intermittently irradiating the inspection object with sheet-like irradiation light from a second light source. A second surface detection step, wherein the first and second light sources are not simultaneously turned on, the first surface detection step is performed only while the first light source is turned on, and The second surface detection step is performed only when the second light source is turned on, and further, the quality of the inspection object is determined based on the detection results of the first and second surface detection steps. .

A surface inspection method according to a fifteenth aspect of the present invention that achieves the above object is characterized in that, in the thirteenth aspect, the object to be inspected is a wafer on which bumps are formed.

A surface inspection method according to a sixteenth aspect of the present invention for achieving the above object is characterized in that, in the fourteenth aspect, the object to be inspected is a wafer on which bumps are formed.

[0022]

1 and 2 show a wafer bump inspection apparatus according to an embodiment of the present invention. FIG. 1 is an explanatory view of an optical head of the wafer bump inspection apparatus, and FIG. 2 is a schematic view of the wafer bump inspection apparatus. This wafer bump inspection device
As shown in FIG. 2, a rotary table 110 and an XY table 100 are provided.

The XY table 100 moves in a horizontal plane (X and Y directions) and can be positioned at an arbitrary position.
It is placed on the top and rotated in a horizontal plane (θ direction) to enable arbitrary positioning. This rotary table 110 and XY
The wafer on which bumps are formed is carried in and out of the table 100 by a robot omitted in the figure. The present inspection apparatus is applicable not only to a wafer but also to an inspection of a bump on a film substrate.

The optical head 200 is arranged above the rotary table 110 and the XY table 100 so as to be able to move up and down in the vertical direction (Z-axis direction). Optical head 2
Reference numeral 00, as shown in FIG. 1, comprises a plurality of laser light sources 1 to 5, CCD cameras 6, 10, and the like, and their functions are basically the same as those shown in FIGS.
That is, in this embodiment, the laser beam cutting method is used for measuring the bump height. As the laser light source, laser light sources for scattering 1,2 in a vertical plane and laser light sources 3,4,5 for regular reflection in an inclined plane are used. Sheet-like laser beams 12, 13, 14 to 16 emitted from laser light sources 1 to 5 are:
The wafer 17 on which the bumps are formed becomes specularly reflected light or scattered light, and is photographed by the height inspection CCD camera 10 as a shape line indicating the wafer height and the shape of the bump, and a bump height image 19 is obtained.

A two-dimensional inspection of bump size, pitch, chipping, protrusion defect, etc. is performed using the coaxial incident illumination light 20. The two-dimensional inspection lens 7 is arranged at the center of the scattering laser light sources 1 and 2 in the vertical plane. Illumination light was supplied from a white light source 8 via an optical fiber 9, and bumps were formed as illumination light in a downward direction parallel to the optical axis of the lens 7 via a mirror and a half mirror (not shown) (see FIG. 5). Irradiation is performed on the surface of the wafer 17. Coaxial epi-illumination light 2
0 is reflected from the surface of the wafer 17 on which the bumps are formed, and the reflected light 21 is transmitted through the lens 7 to the two-dimensional inspection C
The CD camera 6 captures a two-dimensional image 18 of the bumped wafer 17.

The images photographed by the CCD camera 10 for height inspection and the CCD camera 6 for two-dimensional inspection are subjected to image processing by an image processing device 26, respectively.
Pass / fail is determined. However, sheet-like laser beams 12, 13, 14 to 16 emitted from laser light sources 1 to 5
The specular reflected light and scattered light are the target height inspection CCD
In addition to the camera 10, the light may be received by the two-dimensional inspection CCD camera 6. Similarly, the coaxial incident illumination light 20 for two-dimensional inspection is reflected from the surface of the wafer 17 on which bumps are formed, and the reflected light 21 may be received by the height inspection CCD camera 10.

Therefore, in this embodiment, the laser light sources 1 to 5
In order to avoid the interference of the two types of light sources, namely, the white light source 8 and the white light source 8, and perform the bump height inspection and the two-dimensional inspection simultaneously in parallel, the laser light sources 1 to 5 for height measurement are strobed, While the strobe light is on, the shutter of the CCD camera 10 is released.
The shutter of the dimension inspection CCD camera 6 is released. Here, the white light source 8 is continuously turned on. Thus, the two-dimensional inspection of the same position as the height measurement is performed without the laser light entering the two-dimensional inspection CCD camera 6. The timing control of the laser light sources 1 to 5 and the CCD cameras 6 and 10 is performed by a trigger output unit 24 as described later.

Further, in order to prevent the reflected light from the wafer 17 from the white light source 8 from entering the CCD camera 10 for height inspection, the CCD camera 10 for height inspection is provided with a laser bandpass filter 11, Light other than the wavelengths of 12 to 16 is blocked. In order to simultaneously perform such two-dimensional inspection and three-dimensional inspection at the same inspection point, the wafer bump inspection apparatus according to the present embodiment includes a wafer position detector 22, a wafer positioning apparatus 23, a laser A trigger output unit 24 for adjusting the lighting of the light sources 1 to 5 and the timing of the shutters of the CCD cameras 6 and 10, and a band-pass filter for blocking the irradiation light from the white light source 8 by the bump height inspection CCD camera 10. 11 and the like.

The wafer positioning device 23 controls the XY table 100 and the rotary table 110 to arbitrarily position the wafer 17 on which bumps are formed, and the wafer position detector 22 detects the position of the wafer 17. The wafer position monitoring device 24 monitors the signal of the wafer position detector 22, and outputs a wafer arrival signal to the trigger output device 25 when the wafer 17 reaches a position to be imaged (inspection position). The trigger output unit 25 receives a wafer arrival signal from the wafer position monitoring device 24 and outputs a trigger signal to the laser light sources 1 to 5 and the CCD cameras 6 and 10 as shown in FIG.

The timing chart of the trigger output unit 25 is as shown in FIG. First, the wafer position monitoring device 24
The trigger output device 25 that has received the wafer arrival signal from the controller outputs a trigger signal for lighting the laser light sources 1 to 5. Next, while the laser light sources 1 to 5 are lit, the shutter trigger of the bump height inspection camera 10 is output. After the shutter trigger of the bump height inspection camera 10 is turned off and the laser light sources 1 to 5 are turned off, the shutter trigger of the two-dimensional camera 6 is finally turned on to take an image necessary for the two-dimensional inspection. The white light source 8 for two-dimensional inspection certification is continuously turned on.
Although omitted in the timing chart shown in FIG.
Strictly, the trigger signals to the cameras 6, 10 and the laser light sources 1 to 5 have a time difference.

In this embodiment, five laser light sources 1 to 5 are used for three-dimensional inspection, and the shutter of the bump height inspection CCD camera 10 is turned on while the laser light sources 1 to 5 are turned on by a trigger output. The shutter of the two-dimensional inspection CCD camera 6 is turned off while the laser light sources 1 to 5 are turned off, and a laser band pass filter is used as the white light source light-shielding filter 11 for the bump height inspection CCD camera 10, and illumination for the two-dimensional inspection is performed. Although the white light source 8 was used as the above, the present invention is not limited to this.

For example, instead of the white light source 8 as the illumination for the two-dimensional inspection, a light source that can be intermittently turned on may be used and lighted only when the shutter of the two-dimensional inspection CCD camera 6 is released. . In other words, as the light source used for the two types of inspection, a light source that is intermittently turned on is used,
The intermittent lighting sources are controlled not to be turned on at the same time, for example, by controlling the trigger output unit 14 so that the shutter of the two-dimensional inspection CCD camera is opened while one of the intermittent lighting sources is turned on, The shutter of the CCD camera for bump height inspection may be released while the lighting light source is on.

[0033]

As described above in detail, the surface inspection apparatus according to the first aspect of the present invention comprises a first surface detection means for two-dimensionally detecting the surface of an object to be inspected, Second surface detecting means for three-dimensionally detecting the surface of the object, a first light source for continuously irradiating the object with the irradiation light, and intermittently applying sheet-like irradiation light to the object to be inspected. To irradiate the second
And the second light source is instructed to be turned on and off, and the second surface detection means is operated while the second light source is turned on, and the second light source is turned off while the second light source is turned off. 1
A synchronous signal generating means for generating a synchronizing signal for operating the surface detecting means, and a pass / fail judgment means for judging pass / fail of the inspection object from the detection results of the first and second surface detecting means. Can simultaneously perform the two-dimensional inspection and the three-dimensional inspection without adversely affecting each other's surface inspection means, and can greatly reduce the measurement time.

According to a second aspect of the present invention, in the first aspect, the second surface detecting means includes:
Since the attenuating means for attenuating light other than the irradiation light from the second light source is provided, the same effect as the invention described in claim 1 can be obtained, and when the second light source is constantly lit. However, there is an effect that each light source does not adversely affect each other's surface inspection means.

According to a third aspect of the present invention, there is provided a surface inspection apparatus comprising: first surface detection means for two-dimensionally detecting the surface of an inspection object; and three-dimensionally detecting the surface of the inspection object. A second light source that intermittently irradiates the inspection object with irradiation light, a second light source that irradiates the inspection object with sheet-like irradiation light, Instructing the first and second light sources to be turned on and off so that the first and second light sources are not turned on simultaneously, and operating the second surface detection means while the second light source is turned on, A synchronization signal generating unit for generating a synchronization signal for operating the first surface detection unit while the first light source is turned on; and a detection result of the inspection object based on a detection result of the first and second surface detection units. Since each light source has a pass / fail determination means for performing pass / fail determination, Totally 2D inspection and 3D inspection without adversely affecting can be performed simultaneously on,
Measurement time can be greatly reduced.

According to a fourth aspect of the present invention, in the surface inspection apparatus according to the third aspect, one or both of the surface detection means attenuates light other than illumination light from the light source for the means. Since the means is provided, the same effect as the invention described in claim 3 can be obtained, and also, in an environment where other light sources are present, each surface inspection means is not affected at all.

According to a fifth aspect of the present invention, there is provided a surface inspection apparatus according to the first, second, third or fourth aspect, further comprising a position detecting means for detecting a position of the inspection object, wherein the synchronous signal generating means is provided. Has a synchronizing signal generating means for generating a synchronizing signal in consideration of the position of the inspection object detected by the position detecting means, so that the same effect as the invention described in claim 3 can be obtained. , The two-dimensional inspection and the three-dimensional inspection can be automatically performed simultaneously on the inspection object that has reached.

According to a sixth aspect of the present invention, in the surface inspection apparatus according to the first, second, third, fourth, or fifth aspect, a sheet-like laser light or a sheet-like slit light is used as the sheet-like illumination light. be able to.

In the surface inspection apparatus according to a seventh aspect of the present invention, since the object to be inspected in the first aspect is a wafer on which bumps are formed, the surface inspection apparatus is similar to the first aspect. In addition to the effects, it is possible to inspect the shape and dimensions.

In the surface inspection apparatus according to an eighth aspect of the present invention, since the object to be inspected in the second aspect is a wafer on which bumps are formed, the inspection is the same as that of the second aspect. In addition to the effect, it is possible to inspect the height, shape and size of the solder bump.

In the surface inspection apparatus according to the ninth aspect of the present invention, since the object to be inspected in the third aspect is a wafer on which bumps are formed, the surface inspection apparatus is similar to the third aspect of the present invention. In addition to the effect, it is possible to inspect the height, shape and size of the solder bump.

According to a tenth aspect of the present invention, in the fourth aspect, the object to be inspected is a wafer on which bumps are formed. In addition to the effect, it is possible to inspect the height, shape and size of the solder bump.

Also, in the surface inspection apparatus according to claim 11 of the present invention, since the object to be inspected is a wafer on which bumps are formed in claim 5, the same as the invention described in claim 5 is provided. In addition to the effect, it is possible to inspect the height, shape and size of the solder bump.

In the surface inspection apparatus according to a twelfth aspect of the present invention, since the object to be inspected in the sixth aspect is a wafer on which bumps are formed, it is the same as the invention described in the sixth aspect. In addition to the effect, it is possible to inspect the height, shape and size of the solder bump.

The surface inspection method according to a thirteenth aspect of the present invention is to detect the surface of the inspection object two-dimensionally by continuously irradiating the irradiation light from the first light source to the inspection object. A first surface detecting step to perform the first surface detecting step, and a second surface for three-dimensionally detecting the surface of the inspected object by intermittently irradiating the inspected object with sheet-shaped irradiation light from a second light source. A detecting step, wherein the second surface detecting step is performed only when the second light source is turned on, and the first surface detecting step is performed only when the second light source is turned off, Furthermore,
Since the quality of the object to be inspected is determined based on the detection results of the first and second surface detection steps, the two-dimensional inspection and the three-dimensional inspection are simultaneously performed without each light source adversely affecting each other's surface inspection means. Measurement time can be greatly reduced.

According to a fourteenth aspect of the present invention, the surface of the object is two-dimensionally detected by continuously irradiating the object with the light from the first light source. A first surface detecting step to perform the first surface detecting step, and a second surface for three-dimensionally detecting the surface of the inspected object by intermittently irradiating the inspected object with sheet-shaped irradiation light from a second light source. Detecting step, wherein the first and second light sources are not simultaneously turned on, the first surface detecting step is performed only while the first light source is turned on, and the second The surface detection step is performed only while the second light source is turned on, and further, the quality of the inspection object is determined based on the detection results of the first and second surface detection steps. Simultaneous two-dimensional inspection and three-dimensional inspection without any adverse effect on the means It can be done, it can greatly shorten the measurement time.

Further, in the surface inspection method according to claim 15 of the present invention, since the inspection object in claim 13 is a wafer on which bumps are formed, a method similar to the invention described in claim 13 is used. In addition to the effects, it is possible to inspect the shape and dimensions.

In the surface inspection method according to the sixteenth aspect of the present invention, since the object to be inspected in the fourteenth aspect is a wafer on which bumps are formed, a method similar to that of the fourteenth aspect is provided. In addition to the effects, it is possible to inspect the shape and dimensions.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing an optical head of a two-dimensional and three-dimensional simultaneous inspection apparatus according to one embodiment of the present invention.

FIG. 2 is an external view of a two-dimensional and three-dimensional simultaneous inspection apparatus according to one embodiment of the present invention.

FIG. 3 is a block diagram showing a system of a two-dimensional and three-dimensional simultaneous inspection apparatus according to one embodiment of the present invention.

FIG. 4 is a timing chart of a trigger output device.

FIG. 5 is an explanatory diagram showing an independent two-dimensional inspection system according to the related art.

FIG. 6 is an explanatory diagram showing an independent three-dimensional inspection system.

[Explanation of symbols]

 1,2,3,4,5 laser light source 6,10 CCD camera 7 lens 8 white light source 9 optical fiber 11 bandpass filter 12,13 scattering laser 14,15,16 regular reflection laser 17 wafer 18 two-dimensional inspection image Reference Signs List 19 3D inspection image 20 Coaxial epi-illumination 21 Coaxial epi-illumination reflected light 22 Wafer position detector 23 Wafer position monitoring device 24 Wafer positioning device 25 Trigger output device 26 Image processing device 27 Pass / fail judgment device

 ──────────────────────────────────────────────────続 き Continuing on the front page F term (reference) 2F065 AA00 AA21 AA24 AA49 AA52 AA53 BB07 CC17 CC26 FF01 FF02 FF09 FF42 FF67 GG04 GG08 GG13 GG24 HH05 HH12 HH13 HH14 HH16 HH17 JJ03 LL03 PP02 PP12 PP13 RR00 TT02 2G051 AA51 AA90 AB07 BA01 BA10 BB07 BB17 BC02 BC03 CA07 CB01 CD06 DA08

Claims (16)

[Claims] A first surface detecting means for two-dimensionally detecting a surface of the object to be inspected; a second surface detecting means for three-dimensionally detecting the surface of the object to be inspected; and the object to be inspected. A first light source that continuously irradiates the test object with light, a second light source that intermittently irradiates the inspection object with a sheet-like irradiation light, and instructs turning on and off of the second light source. Synchronization signal generation means for operating the second surface detection means while the second light source is turned on, and generating a synchronization signal for operating the first surface detection means when the second light source is turned off A surface inspection apparatus comprising: a quality determination unit configured to determine quality of the inspection object based on detection results of the first and second surface detection units. 2. The surface inspection apparatus according to claim 1, wherein the second surface detection unit includes an attenuation unit that attenuates light other than light emitted from the second light source. 3. A first surface detecting means for two-dimensionally detecting the surface of the object, a second surface detecting means for three-dimensionally detecting the surface of the object, and the object to be inspected. A first light source that intermittently irradiates the test object, a second light source that intermittently irradiates the inspection object with a sheet-like irradiation light, and the first and second light sources are not simultaneously turned on. To turn on and off the first and second light sources,
Operating the second surface detection means while the light source is turned on,
A synchronization signal generating unit for generating a synchronization signal for operating the first surface detection unit while the first light source is turned on; and a detection result of the inspection object based on a detection result of the first and second surface detection units. A surface inspection apparatus comprising: a quality determination unit configured to determine quality. 4. The surface inspection apparatus according to claim 3, wherein one or both of the surface detection units is provided with an attenuation unit that attenuates light other than illumination light from the light source for the unit. 5. A synchronization device comprising: position detection means for detecting a position of the inspection object, wherein the synchronization signal generation means generates a synchronization signal in consideration of the position of the inspection object detected by the position detection means. 5. The surface inspection apparatus according to claim 1, further comprising signal generation means. 6. The surface inspection apparatus according to claim 1, wherein the sheet-like illumination light is a sheet-like laser light or a sheet-like slit light. 7. The surface inspection apparatus according to claim 1, wherein the inspection object is a wafer on which bumps are formed. 8. The surface inspection apparatus according to claim 2, wherein the inspection object is a wafer on which bumps are formed. 9. The surface inspection apparatus according to claim 3, wherein the inspection object is a wafer on which bumps are formed. 10. The surface inspection apparatus according to claim 4, wherein the object to be inspected is a wafer on which bumps are formed. 11. The surface inspection apparatus according to claim 5, wherein the inspection object is a wafer on which bumps are formed. 12. The surface inspection apparatus according to claim 6, wherein the inspection object is a wafer on which bumps are formed. 13. A first surface detecting step of two-dimensionally detecting a surface of an inspection object by continuously irradiating irradiation light from a first light source to the inspection object, and a second light source. A second surface detection step of three-dimensionally detecting the surface of the inspection object by intermittently irradiating the inspection object with sheet-like irradiation light from Is executed only while the second light source is turned on, and the first surface detection step is executed only while the second light source is turned off. A surface inspection method characterized by determining the quality of an inspection object from a detection result. 14. A first surface detecting step of two-dimensionally detecting a surface of the inspection object by continuously irradiating the inspection object with irradiation light from a first light source, and a second light source. A second surface detection step of three-dimensionally detecting the surface of the inspection object by intermittently irradiating the inspection object with sheet-shaped irradiation light from the first and second inspection objects, The light sources are not turned on at the same time, the first surface detection step is performed only while the first light source is turned on, and
The surface detecting step is performed only when the second light source is turned on, and further, the quality of the inspection object is determined based on the detection results of the first and second surface detecting steps. . 15. The surface inspection method according to claim 13, wherein the inspection object is a wafer on which bumps are formed. 16. The surface inspection method according to claim 14, wherein the inspection object is a wafer on which bumps are formed.