JP2011089939A - Appearance inspection apparatus and printed solder inspection apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an appearance inspection apparatus and a printed solder inspection apparatus for simultaneously capturing a three-dimensional inspection image and a two-dimensional inspection image by imaging and scanning an inspecting object once. <P>SOLUTION: The printed solder inspection apparatus 1 illuminates a substrate 100, picks up its images, and inspects a solder printed on the substrate. A plurality of imaging areas are provided on an imaging element 51. An illumination range for one imaging area and an illumination range for the other imaging area are configured so as not to be interfered with each other. Since a plurality types of the two-dimensional images and the three-dimensional images are collected, two operations conventionally required for a three-dimensional inspection and a two-dimensional inspection is achieved by one operation. An inspection time is drastically reduced. Since two optical systems required for the three-dimensional inspection and the two-dimensional inspection are replaced with one optical system, a cost of the inspection apparatus is reduced. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an appearance inspection apparatus that illuminates and images an inspection object and inspects the appearance of the inspection object, and a printed solder inspection apparatus that illuminates and images a substrate and inspects solder printed on the substrate. .

  For example, Patent Document 1 discloses that a two-dimensional inspection of solder printed on a substrate is possible by an inspection device having an area camera, ring-shaped multistage illumination, and an image processing device. However, solder printing refers to a process of transferring paste-like solder (cream solder) onto a substrate pad through an opening provided in a thin metal plate called a metal mask. Therefore, the cream solder printed on the substrate usually has a thickness of about 100 μm to 150 μm. Of course, a three-dimensional measurement technique is necessary to grasp the transfer situation in the thickness direction.

  However, the three-dimensional measurement is a technique for measuring the height of the measurement object, and does not identify the difference in the material constituting the height. Therefore, it is called “smudge” in which cream solder spreads thinly on the pad. There is a limit that it is difficult to detect printing defects. On the other hand, two-dimensional measurement is a method of identifying cream solder and pad or substrate surface by brightness difference, color difference, surface condition difference by optimizing the illumination color and illumination direction. It has the complement to 3D measurement that can extract cream solder spread thinly.

  Patent Document 2 discloses that two-dimensional or three-dimensional inspection of solder printed on a substrate is possible by an inspection device having an area camera, ring-shaped multistage illumination, slit light illumination, and an image processing device. Has been. Further, in Patent Document 3, the slit light is irradiated obliquely, and the unevenness information of the slit light trace generated by the unevenness of the substrate is imaged by an imaging device installed directly above, whereby the solder printed on the substrate is detected. It is disclosed that a three-dimensional inspection is possible. Patent Document 4 discloses a method for realizing a printed solder state inspection in which both a two-dimensional inspection and a three-dimensional inspection are performed on solder printed on the same substrate, and its usefulness.

JP 2003-224353 A JP 2004-317176 A Japanese Patent Laid-Open No. 2005-207918 Japanese Patent Application No. 2007-203707

  In the printed solder inspection apparatus described in Patent Documents 2 to 4 described above, two-dimensional inspection and three-dimensional inspection are performed by mounting a multi-stage ring illumination for two-dimensional inspection and a slit illumination for three-dimensional inspection on one optical system. Both can be implemented. However, while 3D inspection is a method of imaging by continuously scanning the inspection object while irradiating slit light, 2D inspection is a method of irradiating multi-stage ring illumination and imaging the inspection object in a stationary state Since the operations are different, simultaneous execution is difficult. Therefore, even if a shared optical system configuration is adopted, the 3D inspection and the 2D inspection must be performed separately. When performing both the 2D inspection and the 3D inspection, the substrate to be inspected is performed twice. There was a problem in terms of inspection time that had to be inspected.

  That is, in the three-dimensional inspection, imaging is performed while the inspection target is continuously moved relative to the optical system while the slit light illumination is turned on. The continuous operation is premised on constant speed movement below a certain constant speed from the imaging conditions, although a certain range of speed change is recognized. Since it is moving, it is difficult to perform a two-dimensional inspection in which an imaging condition is that the inspection target is stationary. It may be possible to collect a two-dimensional image of a moving inspection object using strobe lighting, but surface illumination with illuminance comparable to slit light illumination for three-dimensional inspection is required, and one shot However, there is a problem that the processing time does not match in the two-dimensional inspection in which the entire surface of the image sensor is picked up with respect to the three-dimensional inspection in which several tens of lines are picked up, and it is difficult to realize with one optical system.

  Therefore, in order to execute the two-dimensional inspection, it is necessary to make the inspection object stationary. After moving at a constant speed for the above three-dimensional inspection, when the position for execution of the two-dimensional inspection is reached, the constant speed movement is terminated, the inspection object is stopped, and the slit light illumination for the three-dimensional inspection is turned off, instead. If the ring illumination is turned on, it is possible to perform three-dimensional inspection and two-dimensional inspection with a single optical system. However, according to the above operation, the three-dimensional inspection interrupts the continuous imaging which can be originally performed for the two-dimensional inspection, and the performance is significantly lowered. From the viewpoint of the two-dimensional inspection, since the moving speed between the visual fields is limited to a speed equal to or less than a certain speed due to the imaging condition of the three-dimensional inspection, this also significantly reduces the performance.

  The present invention has been made in view of the above-described problems, and its purpose is an appearance inspection capable of simultaneously capturing an image for a three-dimensional inspection and an image for a two-dimensional inspection by a single imaging scan on the inspection object. An apparatus and a printed solder inspection apparatus are provided.

  To achieve the above object, the appearance inspection apparatus according to the present invention is an appearance inspection apparatus that inspects the appearance of the inspection object by illuminating and imaging the inspection object, and provides a plurality of imaging regions on the image sensor. At the same time, it is characterized in that a plurality of types of images can be acquired by configuring so that the illumination ranges for the respective imaging areas do not interfere with the illumination ranges for the other imaging areas.

  To achieve the above object, the printed solder inspection apparatus according to the present invention is a printed solder inspection apparatus that inspects the solder printed on the substrate by illuminating and imaging the substrate, and includes a plurality of imaging regions on the image sensor. In addition, it is characterized in that a plurality of types of images can be acquired by configuring so that the illumination range for each imaging region and the illumination range for other imaging regions do not interfere with each other. The plurality of types of images are a plurality of types of two-dimensional images and three-dimensional images.

  In order to achieve the above object, another appearance inspection apparatus of the present invention is an appearance inspection apparatus that illuminates and images an inspection object to inspect the appearance of the inspection object. By providing an imaging region, the illumination range for each imaging region is configured not to interfere with the illumination range for other imaging regions, and the mounted illumination includes at least one red, blue, and green It is characterized in that a plurality of types of image collection and color display are made possible.

  In order to achieve the above object, in still another appearance inspection apparatus according to the present invention, an appearance inspection apparatus that inspects the appearance of the inspection object by illuminating and imaging the inspection object, a plurality of inspection apparatuses on the image sensor. Are equipped with a red filter, one with a blue filter, and another with a green filter, and an illumination area for each imaging area and other imaging areas. The present invention is characterized in that a plurality of types of image acquisition and color display are made possible by configuring so as not to interfere with the illumination range.

  In order to achieve the above object, another printed solder inspection apparatus of the present invention is a printed solder inspection apparatus that performs three-dimensional measurement by irradiating a substrate with slit light or spot light of high-speed scanning. A feature is that a plurality of three-dimensional measurement illumination light sources corresponding to the substrate colors are mounted. Further, a white light source is mounted as the illumination light source.

  Similar to the 3D inspection method, if the continuous scan method while irradiating slit light can be adopted as the 2D inspection method, the same processing is performed for image acquisition for 3D inspection and image acquisition for 2D inspection. Can be realized. In general, there are two types of imaging of an inspection object: a system that performs imaging while using an area camera while the inspection object is stationary, and a system that performs imaging while relatively moving the inspection object using a line sensor camera. . Which method is adopted is generally selected depending on how the inspection object is handled in the production process.

  If there is a state in which the inspection object is stationary during the production process, it is natural to adopt imaging using an area camera at that point. When the inspection target is always in a continuously moving state and there is no scene where the inspection object is stationary, a system is used in which imaging is performed in a continuously moving state using a line sensor camera. In general, ring-type illumination is used because it is necessary to illuminate the area camera and to uniformly illuminate the imaging range surface. On the other hand, in the case of a line camera, since the instantaneous imaging range is only one line, it is common to use line type (slit type) illumination. In any case, either imaging method can be adopted as necessary, and in the two-dimensional inspection method of the printed solder inspection apparatus, it is possible in principle to switch from the current area camera method to the line sensor method. .

  The camera used for the three-dimensional inspection is, for example, a CMOS. This camera can capture images limited to an arbitrary part of the image sensor. By limiting the imaging range of the CMOS camera, a large number of slit illuminations can be obtained. The irradiation image can be captured at high speed. If the limit of the imaging range is squeezed to the limit, it becomes a line of one pixel and is equivalent to a line sensor camera. Therefore, if a CMOS imaging camera for three-dimensional inspection is provided with a line imaging region for two-dimensional inspection while leaving the imaging region for three-dimensional inspection as it is, three-dimensional inspection is performed with one imaging scan for the inspection object. Thus, the image for the two-dimensional inspection and the image for the two-dimensional inspection can be taken simultaneously. Until now, the two operations of the three-dimensional inspection and the two-dimensional inspection which have been performed on one substrate are performed once, and the time required for the inspection is remarkably shortened. In addition, since only one optical system is required for two-dimensional inspection and two-dimensional inspection, it greatly contributes to cost reduction.

1 is a perspective view showing an overall configuration of a printed solder inspection apparatus according to an embodiment of the present invention. It is a figure which shows the imaging area of the image pick-up element of FIG. It is a figure which shows the measurement result of the printed solder by the printed solder test | inspection apparatus of FIG. It is a figure which shows the three-dimensional line illumination light trace in the board | substrate to be test | inspected by the printed solder test | inspection apparatus of FIG.

  Embodiments of the present invention will be described with reference to the drawings. The embodiments described below do not limit the invention according to the claims, and all the combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. Absent.

  FIG. 1 is a perspective view showing the overall configuration of a printed solder inspection apparatus according to an embodiment of the present invention. The printed solder inspection apparatus 1 has a function of performing two-dimensional measurement and three-dimensional measurement of cream solder (hereinafter referred to as “printed solder”) printed on the inspection target substrate 100 to inspect the printed solder. The printed solder inspection apparatus 1 includes an illumination device 2, an imaging device 3, a control device 4, a table 5, and the like.

  The illumination device 2 includes two three-dimensional line illumination projectors 10a and 10b and six two-dimensional line illumination projectors 20a, 20b, 30a, 30b, 40a, and 40b. The imaging device 3 includes a camera 50 and a lens 60 that capture black and white images. The camera 50 includes an image sensor 51 of a CMOS sensor. The control device 4 includes an image processing control unit 70. The image processing control unit 70 includes a three-dimensional imaging area image memory 71a for the three-dimensional line illumination projector 10a, a three-dimensional imaging area image memory 71b for the three-dimensional line illumination projector 10b, and a two-dimensional line illumination projector 20a. , 20b two-dimensional imaging region image memory 72, two-dimensional line illumination projectors 30a, 30b two-dimensional imaging region image memory 73, two-dimensional line illumination projectors 40a, 40b two-dimensional imaging region images. A memory 74 is provided. The table 5 includes an X-axis table 80, an X-axis motor 81, a Y-axis table 82, and a Y-axis motor 83.

  The two-dimensional line illumination projectors 20a and 20b are arranged so as to sandwich an optical system constituted by the camera 50 and the lens 60, and the two-dimensional line illumination light projector 21a and the two-dimensional line illumination light 21a of the two-dimensional line illumination projector 20a. The two-dimensional line illumination light 21b of the line illumination projector 20b is projected obliquely downward from the upper direction, whereby the two-dimensional line illumination light trace 21 is generated on the substrate 100. The two-dimensional line illumination light projectors 30 a and 30 b and the two-dimensional line illumination light projectors 40 a and 40 b are arranged and projected in the same manner, so that the two-dimensional line illumination light traces 31 and 41 are generated on the substrate 100.

  The line widths (line widths) of the above-described two-dimensional line illumination light traces 21, 31, 41 are relatively large so that the line to be imaged can be continuously illuminated even if the inspection target substrate 100 is slightly moved up and down. It is necessary to have. Although it depends on the allowable vertical width of the inspection target substrate 100, specifically, the line width is set to about 1 to 2 mm. Also, a red light source is used for the two-dimensional line illumination projectors 20a and 20b, a green light source is used for the two-dimensional line illumination projectors 30a and 30b, and the two-dimensional line illumination projectors 40a and 40b are used. Adopts blue light source.

  The three-dimensional line illumination projectors 10a and 10b are arranged in such a manner as to sandwich an optical system composed of the camera 50 and the lens 60, and each project light from an upper direction to a diagonally downward direction, thereby causing a three-dimensional line. Illumination lights 11 a and 11 b are generated, and three-dimensional line illumination light traces 12 a and 12 b are generated on the inspection target substrate 100.

  The line widths (line widths) of the above three-dimensional line illumination light traces 12a and 12b are measured by measuring a printed solder (not shown) having a height of about 100 μm formed on the surface of the inspection target substrate 100 on the order of μm. Accordingly, the straight line deformation degree of the three-dimensional line illumination light traces 12a and 12b generated by the unevenness of the substrate surface is set to a relatively thin line width of about 0.1 mm so that it can be easily measured. The three-dimensional line illumination projectors 10a and 10b employ a red light source or a blue / green light source according to the hue of the inspection target substrate 100.

  The two-dimensional line illumination light traces 21, 31, 41 and the three-dimensional line illumination light traces 12 a, 12 b generated on the inspection target substrate 100 are projected onto the image sensor 51 of the camera 50 through the lens 60. As shown in FIG. 2, the imaging element 51 can arbitrarily set the imaging area, and the two-dimensional imaging areas 53, 54, 55 for imaging the two-dimensional line illumination light traces 21, 31, 41. In addition, five areas of three-dimensional imaging areas 52a and 52b for imaging the three-dimensional line illumination light traces 12a and 12b are set. The two-dimensional imaging areas 53, 54, and 55 have an imaging width of one pixel and can be regarded as equivalent to a line sensor camera. The three-dimensional imaging regions 52a and 52b have a relatively large value because the imaging width defines the maximum measurement height, and are usually about 40 to 50 pixels.

  With the above-described optical system / illumination system configuration, the X axis motor 80 is moved at a constant pitch to capture an image with the camera 50, and the X axis motor 80 is moved at a constant pitch to capture an image with the camera 50. Here, for the fixed pitch, the same numerical value as that projected onto one pixel of the image sensor 51 is generally adopted. During the above operation, a plane image can be obtained by accumulating the line unit output from the two-dimensional imaging region 53 in the two-dimensional imaging region image memory 72. Similarly, the plane image of the two-dimensional imaging area image memory 73 is obtained from the line unit output of the two-dimensional imaging area 54, and the plane image of the two-dimensional imaging area image memory 74 is obtained from the line unit output of the two-dimensional imaging area 55. Generated. In addition, the strip-shaped surface image output from the three-dimensional imaging region 52a is output to the three-dimensional imaging region image memory 71a, and the strip-shaped surface image output from the three-dimensional imaging region 52b is input to the three-dimensional imaging region image memory. It accumulates in 71b.

  The surface image of the image memory 72 for the two-dimensional imaging region is an image captured with a red illumination from a relatively high position, and the surface image of the image memory 73 for the two-dimensional imaging region 73 is a green image from a relatively high position. The image is captured with illumination, and the plane image of the image memory 74 for the two-dimensional imaging region is an image captured with blue illumination from a relatively low position. The surface image of the image memory 72 for the two-dimensional imaging region is an image suitable for extracting a gold or copper pad from the marginal color system substrate, and the surface image of the image memory 73 for the two-dimensional imaging region is a red to amber system substrate. The surface image of the two-dimensional imaging region image memory 74 is an image suitable for extracting the printed solder printed on the gold or copper pad. A two-dimensional printed solder inspection can be performed from these three surface images.

  That is, as described in Japanese Patent Application Laid-Open No. 2003-224353, when green light is irradiated onto a substrate whose surface color is reddish brown, the green light becomes a complementary color and the green light is irregularly reflected by the printed solder particles, The amount of reflected light other than is very small. Therefore, the portion having high brightness when green light is lit becomes the pad, and the portion having low brightness becomes the substrate surface other than the pad, so that the pad can be recognized. On the other hand, when the printed solder is irradiated with blue light from a low position, it is irregularly reflected by the particles of the printed solder and a part of the irradiated light is incident on the camera, whereas the parts other than the printed solder are relatively mirror surfaces. Most of the irradiated light is reflected in the direction opposite to the incident direction and does not enter the camera. Accordingly, the printed solder has a relatively high brightness, and the printed solder can be recognized.

  Further, the uneven state of the measurement target surface can be reproduced from the image memories 71a and 71b for the three-dimensional imaging region in which a large number of strip-shaped surface images are accumulated, so that a three-dimensional printed solder inspection can be performed.

  That is, as described in Japanese Patent Laid-Open No. 2005-207918, the three-dimensional line illumination light traces 12a and 12b on the printed solder and the three-dimensional line illumination light traces 12a and 12b on the inspection target substrate 100 are printed solder. The image is taken as if the position is shifted by the height of. When the attachment angle of the three-dimensional line illumination lights 11a and 11b from the upper surface of the inspection target substrate 100 is θ, the height of the printed solder can be measured by multiplying the amount of deviation of the printed solder by tan θ. Further, the volume of the printed solder can be measured by similarly obtaining the direction orthogonal to the length direction of the three-dimensional line illumination light traces 12a and 12b.

  As described above, there is no distinction between the two-dimensional inspection and the three-dimensional inspection in the optical system of the camera 50 and the lens 60, and the imaging scanning that repeats the operation of moving the X-axis motor 80 by a constant pitch and capturing an image with the camera 50. It is possible to collect 2D images and 3D images, and to perform 2D inspections and 3D inspections by performing only once, and to perform 2D inspections and 3D inspections on the structure and operation surfaces of the printed solder inspection apparatus 1. Is completely fused.

  There is no need to individually display the two-dimensional image and the three-dimensional image collected in this manner in accordance with conventional practice. Rather, in measuring the shape of the printed solder 110 shown in FIG. 3, the bottom area 111 can be measured by a technique called two-dimensional inspection, and the cross-sectional area 112, the protrusion area 113, the average height 114, It should be considered that other items such as peak height 115 and volume 116 can be measured. Therefore, in the display of the inspection result, as shown in FIG. 3, it should be illustrated in a form including all the measurement results. As a result, the two-dimensional inspection and the three-dimensional inspection are completely fused and more accurate on the inspection result display surface. Thus, the printed solder inspection apparatus 1 can transmit the measurement result of the printed solder 110.

  Although not shown, the image processing control unit 70 is provided with a display device for displaying various information related to the operation of the printed solder inspection apparatus 1 and inspection results, and the shape of the printed solder 110 is displayed on the display apparatus. The inspection result including the display is displayed. The shape of the printed solder 110 is displayed as a three-dimensional image observed from a certain viewpoint as shown in FIG. 3, and this viewpoint can be set at an arbitrary position. If this viewpoint is set right above the printed solder 110, a display equivalent to a two-dimensional image can be obtained. In this way, by integrally displaying the items that can be measured in two dimensions and the items that can be measured in three dimensions, the shape of the printed solder 110 can be expressed more accurately, and further, the measurement can be performed by changing the display viewpoint. It is also possible to observe the result of each item. Therefore, the inspection of the printed solder 110 that performs both the two-dimensional inspection and the three-dimensional inspection on the same inspection target substrate 100 can be performed at low cost and efficiently.

  Here, the three-dimensional line illumination projector 10a and the three-dimensional line illumination projector 10b are arranged so as to sandwich the optical system composed of the camera 50 and the lens 60, and each project from the upper side obliquely downward. The three-dimensional line illumination light 11 a and the three-dimensional line illumination light 11 b are generated by the light, and the three-dimensional line illumination light trace 12 a and the three-dimensional line illumination light trace 12 b are generated on the inspection target substrate 100. The reason why the two three-dimensional line projectors 10a and 10b are prepared in this manner is that a measurement blind spot is generated only by one line projector, and if the measurement blind spot is not a problem, only one line projector can be used. Three-dimensional measurement can be performed. Therefore, a method for three-dimensional measurement using the three-dimensional line illumination light trace 12a will be described below.

  The three-dimensional line illumination light trace 12a is a complete straight line if the inspection target substrate 100 is a complete plane. However, since there are many printed solders 110 on the inspection target substrate 100, the three-dimensional line illumination light traces 12a2 when the three-dimensional line illumination light traces 12a are generated on the printed solder 110 as shown in FIG. The generation position is different from that of the three-dimensional line illumination light trace 12a1 generated on the surface of the inspection target substrate 100, and the three-dimensional line illumination light trace 12a is not a straight line but an uneven state. The difference h between the generation positions of the three-dimensional line illumination light trace 12a2 and the three-dimensional line illumination light trace 12a1 in FIG. 4 corresponds to the height of the printed solder 110, and the difference h is measured to obtain an appropriate geometric calculation. The height of the printed solder 110 in the line illumination light trace can be measured.

  As described above, not only the three-dimensional line illumination light trace 12a2 generated on the print solder 110 but also the three-dimensional line illumination light trace 12a1 generated on the surface of the inspection target substrate 100 are used for measuring the height of the printed solder 110. Must be detected. The three-dimensional line illumination light trace 12 a 2 is generated on the printed solder 110. Since the printed solder 110 has a relatively high reflectance and is a gray material, the three-dimensional line illumination light trace 12a2 is clearly generated without being greatly affected by the light source color of the three-dimensional line illumination light 11a. On the other hand, the three-dimensional line illumination light trace 12a1 is generated on the surface of the inspection target substrate 100. The surface of the substrate to be inspected 100 can be roughly divided into a gold / copper pad and a substrate resist. Since the gold / copper pad is covered with the printed solder 110, the surface of the substrate to be inspected 100 is effectively the upper surface of the resist. In most cases, the substrate resist is green, but in a flexible substrate or the like, it may be orange.

  Therefore, a green light source is adopted for the three-dimensional line illumination projector 10a, and a red light source is adopted for the three-dimensional line illumination projector 11b. By using a light source having the same color as the measurement target, the measurement target can be imaged brighter. Therefore, in the case of the green inspection target substrate 100, the surface of the inspection target substrate 100 is covered by the three-dimensional line illumination projector 10a of the green light source. In the case of an orange-based inspection target substrate 100, processing is performed so that the surface of the inspection target substrate 100 is detected by the three-dimensional line illumination projector llb of a red light source. As a result, the surface of the inspection target substrate 100 can be detected with certainty, and the inspection time can be shortened and the inspection accuracy can be improved. Further, since the printed solder 110 is neutral in terms of gray and hue, there is no problem in detection using either light source.

  In the case of a three-dimensional printed solder inspection apparatus that irradiates slit light, it is common to use a red light source in terms of cost. When detecting the substrate surface of a green substrate that is a complementary color, the exposure time is increased. However, this embodiment can be solved by mounting a green light source.

  A red light source is used for the two-dimensional line illumination lights 21a and 21b, a green light source is used for the two-dimensional line illumination lights 31a and 31b, and the two-dimensional line illumination lights 41a and 41b are used. When a blue light source is used, although the illumination angle is different, it is equivalent to collecting images with RGB elements for the same object. Therefore, it is possible to obtain a color image by calibrating the intensity between RGB in advance using a pure white measurement object and adding these three images. Although there are many color display devices in the two-dimensional inspection apparatus, only a few three-dimensional inspection apparatuses have a color display function because of the measurement principle. If the present two-dimensional and three-dimensional simultaneous imaging technology and the color display technology by RBG synthesis are used in combination, color display is possible even though the inspection apparatus has a three-dimensional measurement function, and the convenience for the user is greatly improved.

  Further, by installing a red filter in the two-dimensional imaging region 53, a green filter in the two-dimensional imaging region 54, and a blue filter in the two-dimensional imaging region 55, the two-dimensional line illumination lights 21a, 21b, 31a, 31b, 41a, You may employ | adopt a white light source for all the illumination light sources of 41b. This is equivalent to taking an image with each element of RGB for the same object, although the illumination angle of illumination is different, and therefore using a pure white measurement object, the intensity between RGB is preliminarily determined. It is possible to obtain a color image by performing calibration and adding these three images.

  In the printed solder inspection apparatus 1 of the present embodiment, all line illumination light is illustrated as an image of a point light source. However, whether the light source is a point light source or a line light source has no influence on the essence of the light emitting surface. Further, the two-dimensional line illumination light traces 21, 31, 41, and the three-dimensional line illumination light traces 12a and 12b are shown in the arrangement as shown in FIG. 1, but the arrangement is not limited to this arrangement, and any arrangement is possible. Is possible. Further, although there are five line illumination light traces, if there is one two-dimensional line illumination light trace and one three-dimensional line illumination light trace, the two-dimensional imaging and the three-dimensional imaging, which are the essence of the present invention. Can be realized by performing one operation, so that the number of them is arbitrary as long as each of them is one or more. Similarly to the above, the number of imaging areas set in the imaging element 51 is not limited to five. Further, the width of the two-dimensional imaging region is set to one pixel, but this is related to how to set the movement pitch between imagings, and is not limited to one pixel, but two pixels or more. But you can.

  DESCRIPTION OF SYMBOLS 1 Print solder inspection apparatus, 2 illumination apparatus, 3 imaging apparatus, 4 control apparatus, 5 table, 10a, 10b 3D line illumination projector, 20a, 20b, 30a, 30b, 40a, 40b 2D line illumination projector, 21a 21b, 31a, 31b, 41a, 41b Two-dimensional line illumination light, 21, 31, 41 Two-dimensional line illumination light trace, 11a, 11b Three-dimensional line illumination light, 12a, 12b Three-dimensional line illumination light trace , 50 cameras, 60 lenses, 70 image processing control units, 71a, 71b three-dimensional imaging area image memory, 72, 73, 74 two-dimensional imaging area image memory, 80 X-axis table, 81 X-axis motor, 82 Y Axis table, 83 Y-axis motor, 100 PCB to be inspected, 110 Print solder

Claims (7)

An appearance inspection apparatus that inspects the appearance of the inspection object by illuminating and imaging the inspection object,
Multiple imaging areas are provided on the imaging device, and multiple types of images can be acquired by configuring each imaging area so that the illumination range for each imaging area does not interfere with the illumination range for other imaging areas. An appearance inspection apparatus characterized by A printed solder inspection apparatus that illuminates and images a substrate and inspects the solder printed on the substrate,
Multiple imaging areas are provided on the image sensor, and multiple types of images can be acquired by configuring each imaging area so that the illumination range for each imaging area does not interfere with the other imaging areas. Printed solder inspection device characterized by An appearance inspection apparatus that inspects the appearance of the inspection object by illuminating and imaging the inspection object,
A plurality of imaging areas are provided on the imaging device, and the illumination ranges for the respective imaging areas are configured not to interfere with the illumination ranges for the other imaging areas. An appearance inspection apparatus characterized in that a plurality of types of image collection and color display are made possible by including one by one. An appearance inspection apparatus that inspects the appearance of the inspection object by illuminating and imaging the inspection object,
A plurality of imaging areas are provided on the imaging device, one of which is equipped with a red filter, the other is equipped with a blue filter, and the other is equipped with a green filter. And an illumination range for other imaging areas are configured so as not to interfere with each other, whereby a plurality of types of image collection and color display can be performed.   The printed solder inspection apparatus according to claim 2, wherein the plurality of types of images are a plurality of types of two-dimensional images and three-dimensional images. A printed solder inspection apparatus that performs three-dimensional measurement by irradiating a substrate with slit light or spot light of high-speed scanning,
A printed solder inspection apparatus comprising a plurality of three-dimensional measurement illumination light sources corresponding to the substrate colors of the substrate.   The printed solder inspection apparatus according to claim 6, wherein a white light source is mounted as the illumination light source.

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