JPH04348050A - Material surface inspection apparatus - Google Patents

Material surface inspection apparatus

Info

Publication number
JPH04348050A
JPH04348050A JP33013990A JP33013990A JPH04348050A JP H04348050 A JPH04348050 A JP H04348050A JP 33013990 A JP33013990 A JP 33013990A JP 33013990 A JP33013990 A JP 33013990A JP H04348050 A JPH04348050 A JP H04348050A
Authority
JP
Japan
Prior art keywords
image data
image
stage
processing apparatus
image processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33013990A
Other languages
Japanese (ja)
Other versions
JP2782473B2 (en
Inventor
Kazuo Moriya
Takayuki Tsuzura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Priority to JP2330139A priority Critical patent/JP2782473B2/en
Publication of JPH04348050A publication Critical patent/JPH04348050A/en
Application granted granted Critical
Publication of JP2782473B2 publication Critical patent/JP2782473B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To increase a moving speed of a stage and very easily and appropriately input an image data without stopping the stage for this purpose by synchronously irradiating a light beam and fetches an image data when a test specimen placed on the stage reaches the predetermined position.
CONSTITUTION: In order to fetch image data by an image processing apparatus 7, an image of specimen 1 enlarged by a microscope 4 is obtained under irradiation of light from a strobe 11. This enlarged image is input to an image processing apparatus 7 as image data via a TV camera 6. Next, the image data is processed by the image processing apparatus 7 and a computer 8 to measure (calculate) distribution, number, shape and density of crystal defects. In this case, the stage 2 is moving continuously. Therefore, defects of test specimen can be measured and evaluated at a high speed and thereby the processing capability of apparatus can be increased.
COPYRIGHT: (C)1992,JPO&Japio
JP2330139A 1990-11-30 1990-11-30 Material surface inspection equipment Expired - Fee Related JP2782473B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2330139A JP2782473B2 (en) 1990-11-30 1990-11-30 Material surface inspection equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2330139A JP2782473B2 (en) 1990-11-30 1990-11-30 Material surface inspection equipment

Publications (2)

Publication Number Publication Date
JPH04348050A true JPH04348050A (en) 1992-12-03
JP2782473B2 JP2782473B2 (en) 1998-07-30

Family

ID=18229250

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2330139A Expired - Fee Related JP2782473B2 (en) 1990-11-30 1990-11-30 Material surface inspection equipment

Country Status (1)

Country Link
JP (1) JP2782473B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007212230A (en) * 2006-02-08 2007-08-23 Tokyo Electron Ltd Defect inspecting method, defect inspection system and computer program
JP2008082926A (en) * 2006-09-28 2008-04-10 Sumitomo Metal Mining Co Ltd Device for observing light scattering
JP2008224303A (en) * 2007-03-09 2008-09-25 Toray Eng Co Ltd Automatic visual examination device
JP2010175563A (en) * 1998-07-15 2010-08-12 August Technology Corp Automated wafer defect inspection system and process of performing such inspection
CN103428426A (en) * 2012-05-22 2013-12-04 康耐视公司 Machine vision systems and methods with predictive motion control
WO2015114779A1 (en) * 2014-01-30 2015-08-06 ヤマハ発動機株式会社 Mounted component inspection device
US10083496B2 (en) 2012-05-22 2018-09-25 Cognex Corporation Machine vision systems and methods with predictive motion control

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5704520B2 (en) * 2013-10-17 2015-04-22 セイコーエプソン株式会社 Etching defect inspection method and inspection system for piezoelectric vibrating piece wafer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101942A (en) * 1983-11-07 1985-06-06 Mitsubishi Chem Ind Ltd Method of measuring etching pit on surface of single crystal and apparatus therefor
JPS61251705A (en) * 1985-04-30 1986-11-08 Sumitomo Metal Ind Ltd Method and apparatus for inspecting pattern
JPS62223651A (en) * 1986-03-26 1987-10-01 Hitachi Ltd Method and device for inspection
JPS63128730U (en) * 1987-02-16 1988-08-23

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60101942A (en) * 1983-11-07 1985-06-06 Mitsubishi Chem Ind Ltd Method of measuring etching pit on surface of single crystal and apparatus therefor
JPS61251705A (en) * 1985-04-30 1986-11-08 Sumitomo Metal Ind Ltd Method and apparatus for inspecting pattern
JPS62223651A (en) * 1986-03-26 1987-10-01 Hitachi Ltd Method and device for inspection
JPS63128730U (en) * 1987-02-16 1988-08-23

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010175563A (en) * 1998-07-15 2010-08-12 August Technology Corp Automated wafer defect inspection system and process of performing such inspection
JP2011107159A (en) * 1998-07-15 2011-06-02 August Technology Corp Automated wafer defect inspection system, and method of performing such inspection
JP2007212230A (en) * 2006-02-08 2007-08-23 Tokyo Electron Ltd Defect inspecting method, defect inspection system and computer program
JP2008082926A (en) * 2006-09-28 2008-04-10 Sumitomo Metal Mining Co Ltd Device for observing light scattering
JP2008224303A (en) * 2007-03-09 2008-09-25 Toray Eng Co Ltd Automatic visual examination device
CN103428426A (en) * 2012-05-22 2013-12-04 康耐视公司 Machine vision systems and methods with predictive motion control
JP2014013231A (en) * 2012-05-22 2014-01-23 Cognex Corp Machine visual device with motion prediction control, and method
US9200890B2 (en) 2012-05-22 2015-12-01 Cognex Corporation Machine vision systems and methods with predictive motion control
US10083496B2 (en) 2012-05-22 2018-09-25 Cognex Corporation Machine vision systems and methods with predictive motion control
WO2015114779A1 (en) * 2014-01-30 2015-08-06 ヤマハ発動機株式会社 Mounted component inspection device
JP6095805B2 (en) * 2014-01-30 2017-03-15 ヤマハ発動機株式会社 Mounting component inspection equipment

Also Published As

Publication number Publication date
JP2782473B2 (en) 1998-07-30

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