JP2000331902A - Exposure device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the load on file management, to prevent the deterioration of performance due to file increase, and to efficiently use a storage device. SOLUTION: An exposure device decides which of parameter files to be used for exposing processing should be deleted based on the final use time of each parameter file and the number of times of access to each parameter file (S10). At that time, when the parameter file having the same name exists in the other device on a connected network, whether or not each parameter file should be deleted is judged under the consideration of the final use time or the number of times of access of the parameter (S8, S9).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for manufacturing devices such as semiconductor elements and liquid crystal elements, and more particularly, to an improved exposure apparatus for managing various parameter files required for exposure processing. INDUSTRIAL APPLICABILITY The present invention is suitably applied to a semiconductor manufacturing apparatus, particularly a semiconductor exposure apparatus for printing a circuit pattern on a wafer.

[0002]

2. Description of the Related Art Conventionally, in a reduction projection type exposure apparatus used in a semiconductor manufacturing (exposure) process, with the diversification of products to be exposed, an extremely large number of jobs and parameter files called reticle files required for exposure processing are created. Is done. However, when creating a file, it is necessary to always be aware of the capacity of a storage device such as a hard disk mounted on the device. In addition, there is a concern that the performance of the device may be degraded due to the increase in these files. Therefore, when the capacity of the storage device approaches the limit, unnecessary files are manually deleted. When erasing a file, a distinction is made between a file that is no longer needed due to the end of production and a file that is needed for the current production, depending on the file name or the date and time of the file. .

[0003]

However, since the date and time when the file was created is held as the date and time of the file, it is not possible to discriminate a necessary file from an unnecessary file based on this and delete the file. Have difficulty. In addition, when the operator performs an operation of selecting and deleting unnecessary files from thousands of files, mistakes are likely to occur. Therefore, file management is a heavy load.

Further, for users who use the semiconductor exposure apparatus, the number of products and the like for specific applications is increasing, and the number of jobs and reticle files is increasing.
In recent years, the miniaturization of semiconductor elements has advanced, and the amount of information per file has also increased. Therefore, the performance of the device may be reduced due to the increase in the number of files. In addition, when creating a file, the load on file management, such as deleting unnecessary files, is always conscious of the capacity of the storage device.

An object of the present invention is to reduce the load of file management in an exposure apparatus in the light of the above-mentioned problems of the prior art. Second, performance degradation due to an increase in files is prevented. Third
Another object is to efficiently use a storage device.

[0006]

In order to achieve the above object, an exposure apparatus according to the present invention uses a parameter file used for an exposure process to be erased by deleting the last use time of each parameter file or the number of accesses to each parameter file. And a file erasing means for performing a process to determine based on the file, thereby reducing the load of file management. Further, the device manufacturing method of the present invention, a step of determining the parameter file used for the exposure process to be erased based on the last use time of each parameter file or the number of accesses to each parameter file, according to this determination, A step of erasing a parameter file to be erased; and a step of performing an exposure process using a necessary one of the parameter files. By performing these steps with an exposure apparatus, a load on file management can be reduced. The goal is to prevent performance degradation due to an increase in the number of files and to use storage devices efficiently.

[0007]

In a preferred embodiment of the exposure apparatus according to the present invention, attribute information recording means for recording and updating the last use time or the number of accesses as attribute information when each parameter file is used. Having.
The apparatus further includes a reference value setting unit that sets a reference value serving as a criterion for determining whether to delete the parameter file. The file erasing unit is configured to delete the parameter file when the number of parameter files exceeds the reference value. A parameter file to be determined is determined. Further, the file erasing means determines whether or not each parameter file is to be erased, if a parameter file of the same name exists in another device on the connected network, and also determines the last use time or the number of accesses for the parameter file. The determination process is performed in consideration of the parameter file to be deleted. Then, the file erasing means erases the parameter file based on the result of determining the parameter file to be erased.

[0008] The apparatus further comprises means for setting whether or not to back up the parameter file to be erased. The file erasing means creates a backup file of the parameter file to be erased in accordance with the setting when the parameter file is erased. I do. Further, there are provided condition setting means for setting conditions for performing processing by the file erasing means, and control means for controlling processing by the file erasing means in accordance with the set conditions. The conditions for performing the processing by the file erasing means include, for example, the timing of performing the processing and the condition of performing the processing based on the last use time or the number of accesses.

In this configuration, every time a parameter file typified by a job and a reticle file is used, the attribute information of the last use time and the number of accesses is updated and held. When the processing by the file erasing means is started by the control means, the file erasing means, when the number of parameter files exceeds the reference value set by the user, attribute information of each parameter file in a single device, Alternatively, a file to be deleted is determined by giving weight to the attribute information in consideration of attribute information of a file having the same name in another device on the network. Then, the number of files in the device is managed by deleting the files according to the result. As a result, the user's file management load is reduced, performance is prevented from deteriorating due to an increase in the number of files, and efficient utilization is performed without being conscious of the capacity of the storage device.

[0010]

Hereinafter, embodiments of the present invention will be described more specifically with reference to examples. [First Embodiment] FIG. 1 is a perspective view showing the appearance of a semiconductor exposure apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the semiconductor exposure apparatus includes a temperature control chamber 101 for controlling an environmental temperature of the apparatus main body, an EWS main body 106 disposed therein and having a CPU for controlling the apparatus main body,
An EWS display device 102 for displaying predetermined information in the device; a monitor TV 105 for displaying image information obtained via imaging means in the device body;
Operation panel 10 for making a predetermined input to the device
3. It has a console unit including an EWS keyboard 104 and the like. In the figure, 107 is an ON-OFF switch, 1
08 is an emergency stop switch, 109 is various switches, a mouse, etc., 110 is a LAN communication cable, 111 is an exhaust duct for generating heat from the console function, and 112 is an exhaust device for the chamber. The semiconductor exposure apparatus main body is chamber 1
01.

The EWS display 102 is of a thin flat type such as EL, plasma, liquid crystal, etc., is housed in the front of the chamber 101, and is connected to the EWS main body 106 by a LAN cable 110. Operation panel 10
3. A keyboard 104, a monitor TV 105, and the like are also installed on the front surface of the chamber 101 so that a console operation similar to the conventional console operation can be performed from the front surface of the chamber 101.

FIG. 2 is a diagram showing the internal structure of the apparatus shown in FIG. FIG. 1 shows a stepper as a semiconductor exposure apparatus. In the drawing, reference numeral 202 denotes a reticle, and 203, a wafer. When a light beam emitted from the light source device 204 illuminates the reticle 202 through the illumination optical system 205, the pattern on the reticle 202 is exposed by the Can be transferred to a layer. The reticle 202 is supported by a reticle stage 207 for holding and moving the reticle 202. Wafer 20
3 is exposed in a state where it is vacuum-sucked by the wafer chuck 291. The wafer chuck 291 is the wafer stage 2
09 allows movement in each axis direction. Reticle 202
A reticle optical system 281 for detecting the amount of displacement of the reticle is disposed above the reticle. Wafer stage 209
An off-axis microscope 282 is arranged adjacent to and above the projection lens 206. Off-axis microscope 28
Reference numeral 2 has a main function of detecting a relative position between an internal reference mark and an alignment mark on the wafer 203. Further, a reticle library 220 and a wafer carrier elevator 230, which are peripheral devices, are arranged adjacent to the stepper body, and necessary reticles and wafers are transferred to the stepper body by the reticle transfer device 221 and the wafer transfer device 231.

The chamber 101 is mainly composed of an air conditioner room 210 for adjusting the temperature of air, a filter box 213 for filtering out minute foreign matters and forming a uniform flow of clean air, and a booth 214 for shutting off the environment of the apparatus from the outside. It is configured. In the chamber 101, air whose temperature has been adjusted by the cooler 215 and the reheat heater 216 in the air conditioner room 210 is supplied into the booth 214 via the air filter g by the blower 217. This booth 214
Is supplied to the air conditioner room 2 again from the return port ra.
10 and circulates in the chamber 101. Normally, the chamber 101 is not strictly a complete circulation system. To maintain the inside of the booth 214 at a positive pressure at all times, about 10% of the circulating air amount outside the booth 214 is supplied to the air conditioning room 210.
Is introduced through a blower from an outside air inlet oa provided in the air conditioner. In this way, the chamber 101 can keep the environment temperature where the apparatus is placed at a constant level and keep the air clean. The light source device 204 is provided with an intake port sa and an exhaust port ea in preparation for cooling of the ultra-high pressure mercury lamp and generation of toxic gas at the time of laser abnormality, and a part of the air in the booth 214 passes through the light source device 204 to be air-conditioned. The air is forcibly exhausted to factory equipment via a dedicated exhaust fan provided in the machine room 210. Further, a chemical adsorption filter cf for removing a chemical substance in the air is connected to the outside air inlet o of the air conditioner room 210.
a and the return port ra.

FIG. 3 is a block diagram showing an electric circuit configuration of the apparatus shown in FIG. In the figure, reference numeral 321 denotes a main unit C built in the EWS main unit 106, which controls the entire apparatus.
It is a PU and comprises a central processing unit such as a microcomputer or a minicomputer. 322 is a wafer stage driving device, 323 is an alignment detection system such as the off-axis microscope 282 or the like, 324 is a reticle stage driving device, 325 is an illumination system such as the light source device 204 or the like, 326
Is a shutter driving device, 327 is a focus detection system, 32
Reference numeral 8 denotes a Z drive device, which is controlled by the main body CPU 321. 329 is the reticle transport device 2
21, a transfer system such as a wafer transfer device 231. 330
Is a console unit having the display 102, the keyboard 104, etc., for giving various commands and parameters relating to the operation of the apparatus to the main body CPU 321. That is, it is for exchanging information with the operator. Reference numeral 332 denotes a hard disk, for example, in which a database is constructed, in which various parameters and their management data, operator groups, and the like are recorded.

FIG. 4 is a diagram showing a user setup editor displayed on the display screen of the display 102 in FIG. 1 for the user to determine various settings. The figure shows how to set a "reference file number", which is a reference value parameter for automatically deleting a file when the number of files exceeds the limit.
The “reference file number” has an input range of, for example, 0 to 3000. The input set value is used as a reference when performing automatic file deletion, and is saved by a Save button 41.

FIG. 5 is a flowchart showing an example of a control procedure in the console CPU 331 in the console unit 330 of FIG. 3 for executing the above-mentioned automatic file erasing process by monitoring the number of files. As shown in the figure,
When this process is started, the console CPU 331 first acquires the value of the reference value parameter (the number of reference files) for automatic file deletion from the parameters set by the user setup editor in step S1.
In step S2, the current number of files is obtained.
Then, in step S3, the reference value obtained in step S1 is compared with the number of files obtained in step S2. As a result, if the reference value is larger than the number of files, the automatic file erasing process by monitoring the number of files is terminated, and if the number of files is larger than the reference value, the process proceeds to step S.
Proceed to 4. In step S4, it is determined whether the device is stand-alone or connected to a network.
In the case of the stand-alone, the process directly proceeds to step S6, and in the case of the network connection, the process proceeds to step S6.
After setting the network flag to ON at 5, the process proceeds to step S6.

Step S6 is the start of a loop, and all files are to be investigated. Therefore, while a file is found, the following steps S7 to S10 are repeated, and the investigation of all files is completed. In this case, the process proceeds to step S11, which is the end of the loop. In step S7 in the loop, the file name is specified and the attribute information of the file in the apparatus, that is, the last use time and the number of accesses are obtained. In step S8, it is determined whether the device is stand-alone or connected to a network based on the network flag set in step S5.
Proceed to. If connected to the network, in step S9, the attribute information (last use time and number of accesses) of the file of the same name in another device on the same network is queried, and after acquiring this, the process proceeds to step S10. However, if there is no file with the same name in another device, the attribute information of the file in the device acquired in step S7 is adopted. In step S10, weighting is performed based on the attribute information of the file acquired from the device or from another device on the same network, and the result is stored in a memory.

When the last use time is used as a method for determining file erasure, whether the last use time is within the last one month, one to three months ago, or three months or more is weighted. It is performed in three steps as described above. This weighting can be arbitrarily set by a configuration file. In the same stage, it is determined that the older the last use time of the file is, the less the file can be deleted. When acquiring attribute information from another device on the same network, the latest last use time is adopted from several devices, and weighting is performed based on this. Specifically, the current date is "98/12
/ 15 ", and assuming that the automatic file erasure process by the file monitoring is being performed in the device A, as shown in FIG. j
The last use time of “ob” is “98/05/01”,
Although it was more than six months ago, the last use time of “A. job” of the device B is “98/12/10”, and since it has been used until recently, “A. job” may be used in the future, so it is deleted. Judge that you cannot do it. Then, "A.
Regarding “job”, the last use time of the device B having the latest last use time among the devices other than the device A is “98/1”.
2/10 "is adopted, and it is determined that it is within one month.

Although the method of weighting based on the last use time has been described here, weighting can be similarly performed based on the number of accesses. Further, the case where the device B is referred to as another device on the same network has been described. However, as long as the device is on the same network, the number of referred devices is not limited.

When the process proceeds to step S11, which is the end of the loop started in step S6, next, in step S12, an erased file list in which files to be erased are listed based on the result of the weighting in step S10 is created. Next, in step S13,
According to the erased file list created in step S10,
Files are deleted until the number becomes equal to or less than the set “reference number of files”.

It is to be noted that the user can set in advance whether or not to back up the file to be deleted in step 13, and if the backup is set, the file is deleted in step S13. Alternatively, a backup file of the file to be deleted may be created. Also, here, an example has been described in which the automatic file erasure process based on file monitoring is independently activated, but this activation may be performed at a fixed (fixed) interval by the device maker. Further, as in the following second embodiment, a user can set a monitoring condition and start the system arbitrarily.

[Embodiment 2] FIG. 7 shows a monitoring condition editor in an exposure apparatus according to a second embodiment of the present invention. This editor is displayed as a window in the apparatus of FIG. 1 in which the user can arbitrarily set the monitoring condition of the number of files, whereby the user can arbitrarily set the monitoring condition,
Start automatic file deletion by file monitoring.
This window is displayed as a pop-up when setting conditions for monitoring files on the device. As shown in FIG. 7, this window has a window title area 1
0, a monitoring condition setting region 20, a guide region 30 indicating an input range of monitoring condition parameters, and a button region 40 in which operation buttons are arranged. In the figure, 2
1 is a parameter name display section, 22 is a monitoring condition parameter input section, 41 is a Save button for saving monitoring conditions, and 42 is a Quit button for terminating the monitoring condition editor.

Next, the operation when the user sets the monitoring condition parameter for the number of files will be described using this window. First, input means of the console unit 330 (touch panel 103, keyboard 104, mouse, etc.)
Displays the user setup editor (FIG. 4) on the screen. Next, a value serving as a reference for automatic file deletion is set for a parameter "reference number of files" in the user setup editor. After setting the “reference file number”, the monitoring condition editor of FIG. 7 is displayed. On this window, the user makes arbitrary settings for the parameters "automatic file deletion function", "monitoring time interval" and "file deletion judgment method".

The "automatic file erasure function" is a parameter for setting a mode of automatic file erasure by monitoring the number of files, and includes "Volume" (capacity) and "File".
There are three options, “Count” (the number of files) and “Off” (off). When “Volume” is selected, automatic file erasing is performed based on the used capacity of the hard disk.
When "" is selected, automatic file deletion is performed based on the number of files. When "Off" is selected, automatic deletion by monitoring the number of files is not performed.

The "monitoring time interval" is a parameter for setting an interval for monitoring the number of files, and "Every Mon"
th (every month), "Every Week" (every week), and "Every Day" (every day). If "EveryMonth" is set, "day" and "time" are further set. "Ever
If “Y Week” is selected, “Day of the week” and “Time” are further set as shown in FIG.
When "y" is selected, the time is set.

The "file deletion judging method" is a parameter for setting a judging method at the time of automatically deleting a file, and includes "Use Time" (last use time) or "F".
ile Access ”(the number of file accesses).

After setting all the monitoring condition parameters described above, when the Save button 41 is pressed, the setting becomes valid, and the automatic file erasing process by monitoring the number of files is started according to the monitoring condition arbitrarily set by the user. . The automatic file erasing process is performed in the same manner as in the first embodiment. In order to allow the user to set in advance whether or not to back up the file to be deleted in step 13 of FIG.
1 and an item may be added to the monitoring condition parameter input unit 22 so that it is possible to select whether or not to back up the file to be deleted.

<Embodiment of Device Manufacturing Method> Next, an embodiment of a device manufacturing method using the above-described exposure apparatus will be described. FIG. 8 shows a flow of manufacturing micro devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin film magnetic heads, micro machines, etc.). In step 1 (circuit design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon or glass.
Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes an assembly process (dicing, bonding),
It includes steps such as a packaging step (chip encapsulation). In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).

FIG. 9 shows the wafer process (step 4).
The detailed flow of is shown. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a resist is applied to the wafer. Step 16 (exposure) uses the above-described exposure apparatus or exposure method to align and print the circuit pattern of the mask on a plurality of shot areas of the wafer.
Step 17 (development) develops the exposed wafer.
In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps,
Multiple circuit patterns are formed on the wafer.

By using the production method of this embodiment, it is possible to produce a large-sized device, which was conventionally difficult to produce, at low cost.

[0031]

As described above, according to the present invention, the parameter file to be erased among the parameter files used for the exposure processing is determined based on the last use time or the number of accesses, so that the number of files can be easily reduced. By managing the storage device, it is possible to prevent a decrease in performance due to an increase in data, and to efficiently use the storage device without being conscious of the capacity of the storage device.

In addition, since the parameter file to be deleted is determined in consideration of the attribute information of the parameter file having the same name in another device on the network, the parameter file to be deleted is determined with higher reliability. It can be done with gender.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an overview of a semiconductor exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing the internal structure of the device of FIG.

FIG. 3 is a block diagram showing an electric circuit configuration of the device shown in FIG.

FIG. 4 is a diagram showing a display example of a user setup editor for performing various settings including reference parameters for automatic file deletion in the apparatus of FIG. 1;

FIG. 5 shows a console C in the console unit of FIG.
It is a flowchart which shows the procedure of the control operation | movement regarding the automatic file deletion processing by the monitoring of the number of files which PU performs according to this invention.

6 is a diagram showing attribute information of a file in another device on the same network referred to in the procedure of FIG.

FIG. 7 is a plan view showing a display example of a monitoring condition editor for setting a file monitoring condition in the apparatus of FIG. 1;

FIG. 8 is a flowchart illustrating a device manufacturing method that can use the exposure apparatus of the present invention.

FIG. 9 is a detailed flowchart of a wafer process in FIG. 8;

[Description of Signs] 10: window title area, 20: monitoring condition setting area, 21: parameter name display section, 22: monitoring condition parameter input section, 30: guide area, 40: button area,
41: Save button, 42: Quit button, 106: EWS main body, 102: EWS
Display devices 102 and 103: operation panel, 10
4: keyboard for EWS, 202: reticle, 203:
Wafer, 204: light source device, 205: illumination optical system, 20
6: projection lens, 221: reticle transport device, 231:
Wafer transfer device 321, main body CPU, 322: wafer stage drive device, 324: reticle stage drive device, 325: illumination system, 329: transfer system, 330: console unit, 332: hard disk.

Claims (10)

[Claims] 1. A file erasing means for performing a process of determining a parameter file to be erased among exposure files based on the last use time of each parameter file or the number of accesses to each parameter file. Exposure apparatus. 2. An exposure apparatus according to claim 1, further comprising attribute information recording means for recording and updating the last use time or the number of accesses as attribute information when each parameter file is used. apparatus. 3. The apparatus according to claim 1, further comprising: a reference value setting unit configured to set a reference value serving as a criterion for determining whether or not to delete the parameter file. 3. The exposure apparatus according to claim 1, wherein, when the operation is performed, a process of determining the parameter file to be erased is performed. 4. 4. The file erasing means determines whether or not each parameter file is to be erased, when a parameter file of the same name exists in another device on the connected network, and the last use time for the parameter file. 4. A process for determining a parameter file to be deleted by making a determination in consideration of the number of accesses.
The exposure apparatus according to any one of the above items. 5. The apparatus according to claim 1, wherein said file erasing means performs processing for erasing a parameter file based on a result of determining the parameter file to be erased. Exposure apparatus according to the above. 6. A method for setting whether or not to back up the parameter file to be erased, wherein the file erasing means performs a backup of the parameter file to be erased in accordance with the setting when the parameter file is erased. 6. The exposure apparatus according to claim 5, wherein the exposure apparatus creates a file. 7. A system comprising: condition setting means for setting conditions for performing processing by the file erasing means; and control means for controlling processing by the file erasing means in accordance with the set conditions. Claim 1
7. The exposure apparatus according to claim 6. 8. The condition for performing the processing by the file erasing means includes a timing of performing the processing, and whether to perform the processing of determining the parameter file to be deleted based on the last use time or the number of accesses. The condition of 1 to 7 is included.
The exposure apparatus according to any one of the above items. 9. A step of deciding which of the parameter files to be used for the exposure processing to be erased based on the last use time of each parameter file or the number of times of access to each parameter file, A device manufacturing method, comprising: a step of performing erasing; and a step of performing an exposure process using a necessary one of the parameter files, and performing these steps by an exposure apparatus. 10. Determine whether each parameter file is to be deleted or not, when a parameter file of the same name exists in another exposure apparatus on the network to which the exposure apparatus is connected, the last use time or access time of the parameter file. 10. The device manufacturing method according to claim 9, wherein the parameter file to be erased is determined by making a determination in consideration of the number of times.