JP2000317788A - Polishing method for outer circumference of work and polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently polish the outer circumference of a disc shaped work with high accuracy. SOLUTION: A polishing tool 12 having a recessed shape polishing surface 13 the outer circumference of which is polished such as a semi-conductor wafer, etc., is held by a work holding fixture 15 so as to be pressed onto the polishing surface 13. The polishing surface 13 corresponds to the polished surface at the outer circumference of the work W, so that the polishing surface 13 is mutually brought into contact with the whole surface of the polished surface of the work W. When the rotor 11 is drivingly rotated, the polished surface at the outer circumference of the work can be polished without rotating the work W.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for polishing the outer periphery of a disk-shaped work such as a silicon wafer.

[0002]

2. Description of the Related Art A semiconductor integrated circuit is formed on a semiconductor wafer made of silicon or a compound semiconductor wafer such as gallium arsenide through a series of manufacturing processes, and a chip is cut out from the semiconductor wafer to form a semiconductor integrated circuit device, that is, a semiconductor device. Are manufactured.

In manufacturing a semiconductor integrated circuit device, a disk-shaped wafer is frequently transferred or aligned during a series of manufacturing processes, and the outer periphery of the wafer comes into contact with a transfer device used for transfer. Become. The outer periphery of the wafer is chamfered by grinding to form a chamfer surface and the outer peripheral surface is ground, but since the ground surface is rough, the stress applied to the outer periphery at the time of contact causes the unevenness of the ground surface , And cracks may be generated starting from the uneven portions. The cracks cause cracking or chipping during the transfer of the wafer, and lower the yield of the wafer. Also, if there is an uneven portion on the outer periphery of the wafer, particles or fine particles may adhere to that portion,
The outer periphery of the wafer is polished.

Polishing is also called lapping or polishing. For example, as disclosed in Japanese Patent Application Laid-Open No. Hei 5-23959 or Japanese Patent Application Laid-Open No. 10-296641, a drum having a polishing cloth on the inner peripheral surface or an outer peripheral surface is disclosed. Using a drum provided with a polishing pad, the polishing process is performed by rotating not only the drum but also the wafer while bringing the inner or outer surface of these drums into contact with the drum so that the outer periphery of the wafer is partially cut into the drum. To do.

[0005]

As described above, the wafer is tilted with respect to the rotation center axis of the drum by using a polishing tool such as a polishing cloth or a polishing pad provided on the inner peripheral surface or the outer peripheral surface of the drum. In the polishing method in which the wafer is rotated while the wafer is in contact with the polishing tool obliquely so that the wafer is in contact with the outer circumference, only a part of the outer circumference of the wafer contacts the polishing tool, and the entire outer circumference is polished. It is necessary to rotate the wafer, and the processing efficiency cannot be improved.
There is a problem that processing takes time.

Further, since the outer periphery of the wafer is buried in the polishing tool for polishing, the shape of the edge formed by the chamfer surface and the outer peripheral surface of the outer periphery of the ground wafer may be broken. In addition to the above, there is a problem that the radially inner portion of the chamfer surface has insufficient contact compared with the outer portion, so that a sufficient polished surface cannot be obtained on the inner portion.

An object of the present invention is to enable the outer periphery of a disk-shaped work such as a semiconductor wafer to be efficiently polished with high precision.

[0008]

According to the present invention, there is provided a method for polishing an outer periphery of a work, which is a method for polishing an outer peripheral surface of a disk-shaped work. Pressing the outer periphery of the work against the polishing surface of the polishing tool provided on the rotating body and rotating the polishing tool, thereby polishing the polished surface without rotating the work. It is characterized in that it is obtained.

The polishing method according to the present invention is a polishing method for polishing a peripheral surface of a disk-shaped work, the polishing method comprising: a polishing surface having a polishing surface in contact with the entire surface to be polished; By pressing the outer periphery of the work against the polishing surface of the provided polishing tool and rotating the polishing tool, the surface to be polished can be polished without rotating the work. And

[0010] The method for polishing the outer periphery of a work according to the present invention is a method for polishing the outer periphery of a work to be polished on the outer peripheral surface of a disk-shaped work. Pressing a chamfer surface on one side of the work against the polishing surface while polishing the rotating body having a polishing surface to be polished, and polishing the chamfer surface on one side while rotating the rotating body. Pressing the chamfer surface on the other surface side against the polishing surface to polish the chamfer surface on the other side, and a plurality of polishing tools having a concave polishing surface corresponding to the outer peripheral surface of the work. Polishing the outer peripheral surface by rotating a rotating body provided with a polishing arm and pressing the polishing tool against the outer peripheral surface of the work, the chamfer surface and the outer peripheral surface Characterized by being adapted to be polished without rotating the workpiece.

The polishing apparatus for polishing the outer periphery of a work according to the present invention is a polishing apparatus for polishing an outer peripheral surface of a disk-shaped work, the polishing apparatus having a concave polishing surface having a spherical shape. A rotating body, a driving unit for rotating and driving the rotating body, and a work holder for holding a work and pressing a chamfer surface on an outer periphery of the work against the polishing surface. It is characterized in that polishing is performed by pressing against the polishing surface.

An apparatus for polishing an outer periphery of a work according to the present invention is a polishing apparatus for polishing an outer peripheral surface of a disk-shaped work, the chamfer having an inclination angle corresponding to a chamfer surface on the outer periphery of the work. A rotating body provided with a polishing tool having a polishing surface, a driving unit for rotationally driving the rotary body, and a work holding tool for holding a work and pressing the chamfer surface against the chamfer polishing surface, It is characterized in that the entire chamfer surface is pressed against the chamfer polishing surface for polishing.

The polishing apparatus for polishing the outer periphery of a work according to the present invention is a polishing apparatus for polishing the outer peripheral surface of a disk-shaped work, the polishing apparatus having a polishing tool having a concave polishing surface. A rotating body that rotatably supports the polishing arm about a support pin, a driving unit that rotationally drives the rotating body, and a work holding that holds the work in a polishing drum formed by the plurality of polishing arms. Tool, a spring member for urging a spring force in a direction to separate the polishing tool from the outer periphery of the work, and a weight for bringing the polishing tool closer to the outer periphery of the work by centrifugal force when the rotating body is rotationally driven. Wherein the arc-shaped outer peripheral surface of the work is simultaneously polished by the plurality of polishing arms.

[0014]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1A is a plan view showing a semiconductor wafer made of silicon, which is an example of a disk-shaped work W. The outer periphery of the work W has an arcuate portion R, and the crystal orientation and alignment are easy. And a flat orientation flat or flat portion F. This work W is formed by grinding a flat portion F on a disk-shaped wafer formed by cutting a silicon ingot to a predetermined thickness and grinding the outer periphery, and the arc-shaped portion R is formed as shown in FIG. )
As shown in FIG. 1, the outer peripheral surface Ra and the chamfer surfaces Rc1 and Rc2 on both the front and back sides are provided, and the flat portion F is likewise shown in FIG.
As shown in the figure, the outer peripheral surface Fa and the chamfer surfaces F
c1 and Fc2.

FIG. 2 is a process chart showing a procedure for polishing a work according to the present invention, and has six polishing steps 1 to 6. First, in step 1, one chamfer surface Rc1 of the arc-shaped portion R of the workpiece W is polished, and in step 2, the flat portion Fc is polished.
Is polished, the outer peripheral surface Fa of the flat portion F is polished in step 3, and the flat portion F
The other chamfer surface Fc2 is polished. Step 5
Then, the other chamfer surface Rc2 of the arc-shaped portion R is polished, and in step 6, the outer peripheral surface Ra of the arc-shaped portion R is polished.

FIG. 3 is a perspective view showing a polishing apparatus 10 for polishing the chamfer surfaces Rc1, Rc2 of the arc-shaped portion R of the work W, and FIG. 4 is a sectional view of FIG.

The polishing apparatus 10 has a rotating body 11 that rotates about a rotation center axis P. A spherical concave surface is formed on the surface of the rotating body 11, and a polishing tool 12 is provided on the concave surface. ing. The polishing surface 13 on the surface of the polishing tool 12 is a concave surface corresponding to the surface of the rotating body 11, and the concave surface has a spherical shape having a radius of curvature centered on the center point O. A drive shaft 14 is attached to the rotating body 11, and the rotating body 11 is driven to rotate by a motor (not shown) connected to the drive shaft.

The work W is held by a work holder 15 such as a vacuum chuck and pressed against the polishing surface 13. In order to prevent the work W from continuing to contact a part of the polishing surface 13, the work W is maintained at a right angle to a radius line passing through the center point O as shown by a two-dot chain line in FIG. The work holding tool 15 is configured so that its holding center axis Q can be inclined. When the rotating body 11 is rotated in the inclined state, the holding center axis Q of the work holder 15 is eccentric with respect to the rotation center axis P. Therefore, an alignment mechanism (not shown) for preventing eccentricity is provided. I have.

As described above, when the workpiece W is pressed against the concave polishing surface 13 of the polishing tool 12 and polished, the inclination angle of the polishing surface 13 becomes equal to the chamfer surfaces Rc1 and Rc2 of the arc-shaped portion R.
, The chamfer surface Rc1 of the arc-shaped portion R of the work W is the surface to be polished, and the polishing surface 13 contacts the entire surface of the chamfer surface Rc1 without rotating the work W.
The entire surface of the chamfer surface Rc1 can be simultaneously polished. As described above, since the polishing surface 13 is in contact with the entire chamfer surface, the polishing process can be performed quickly in a short time, and the processing efficiency can be improved. In addition, the work W is fixed by the work holder 15 and only the rotating body 11 is rotated, whereby the work deviation due to the rotational runout of the work W is prevented, and the processing accuracy can be improved. Furthermore, since the chamfer surface is pressed by the polishing tool with the same bite amount as a whole,
Polishing is performed with the same polishing amount as a whole.

At the time of this polishing, a polishing liquid such as a lapping liquid or a polishing liquid is applied to the polishing surface 13, and excess polishing liquid is discharged to the outside through a discharge hole 16 provided at the bottom of the rotating body 11. Will be discharged.

FIG. 5 shows another type of polishing apparatus 1 for polishing the chamfer surfaces Rc1, Rc2 of the arc-shaped portion R of the work W.
6 is a cross-sectional view of FIG.

In this polishing apparatus 10, a rotating body 11 has a cylindrical shape, that is, a drum shape. A polishing tool 12 is provided on an inner peripheral surface of the rotating body 11, and an inner peripheral surface of the polishing tool 12 is a polishing surface 13 It has become. The rotating body 11 is rotationally driven by a drive shaft 14 connected to a motor (not shown). The polishing surface 13 has a small-diameter inner peripheral surface 13a and a larger-diameter inner peripheral surface 13b having a larger diameter, and an inclined chamfer polishing surface 13c is formed between them. A chamfered surface R which is a surface to be polished of the work W over the entire circumference along the inner peripheral surface of the polishing tool 12.
The inclination angle corresponds to the inclination angle θ of c1 and Rc2.

In this case, when the work W is pressed or pressed against the chamfered polished surface 13c of the polished surface 13 formed on the polishing tool 12, the work W is polished, so that the entire chamfered surface Rc1 of the arc-shaped portion R of the work W The polishing surface 13 contacts,
The entire surface of the chamfer surface Rc1 can be simultaneously polished without rotating the work W. As described above, since the polishing surface 13 is in contact with the entire surface of the chamfer surface, the polishing process can be performed quickly in a short time. Further, the work accuracy can be improved by fixing the work W by the work holder 15 and rotating only the rotating body 11, so that the chamfer surface is pressed by the polishing tool with the same bite amount as a whole. Therefore, the polishing is performed with the same polishing amount as a whole.

At the time of this polishing, the applied polishing liquid is discharged to the outside through a discharge hole 16 at the bottom of the rotating body 11 after the processing.

After one of the chamfer surfaces Rc1 and Rc2 formed on the front and back surfaces of the arc-shaped portion R of the work W is polished by the polishing device 10 in the step 1, the other chamfer surface is processed in the step 5. Rc2 is polished.

FIG. 7 is a perspective view showing a polishing apparatus 20 for polishing the flat portion F shown in steps 2 to 4 in FIG. 2, and FIG. 8 is a sectional view of FIG.

The polishing apparatus 20 has a cylindrical or drum-shaped rotating body 21. A polishing tool 22 is provided on the outer peripheral surface of the rotating body 21. The polishing surface 23 of the polishing tool 22 has a polishing surface 23. It has a columnar shape. A drive shaft 24 is attached to the rotating body 21, and the rotating body 21 is driven to rotate by a motor (not shown) connected thereto.

The work W is held by a work holder 25 such as a vacuum chuck, and the flat portion F is pressed against the polishing surface 23.

In order to polish one chamfer surface Fc1 of the flat portion F by the polishing apparatus 20 as shown in step 2 in FIG.
As shown by a, the chamfer surface Fc1 is brought into contact with a position where the flat portion F is substantially parallel to the rotation center axis P of the rotating body 21 and the angle of the tangent to the polishing surface 23 is the inclination angle θ of the chamfer surface Fc1. . In that case, work holder 2
5, the workpiece Wa is moved rightward in the drawing as shown by the arrow in FIG. 8, and then pressed downward in the drawing as shown by the arrow. Polishing is performed by rotating the rotating body 21 in this state.

After the one chamfer surface Fc1 is polished in this manner, the workpiece Wa is separated from the polished surface 23, and as shown in step 3, the outer peripheral surface Fa of the flat portion F
Is polished. The polishing of the outer peripheral surface Fa is performed by a flat portion Fb as shown by a reference symbol Wb in FIGS.
Is made substantially parallel to the rotation center axis P of the rotating body 21 and the outer peripheral surface Fa is brought into contact with the polishing surface 23 such that the work W substantially coincides with the radial line r of the rotating body 21. At this time, the work Wb is pressed against the polishing surface 23 as indicated by an arrow in a state where the work Wb is positioned on the extension of the radial line r by the work holder 25.

With respect to the other chamfer surface Fc2 of the flat portion F, the surface of the work W on the chamfer surface Fc1 side which has been processed is held by the work holder 25 and polished by the same procedure as the work Wa shown in FIG. Do. As described above, in the case shown in the drawing, the chamfer surface and the outer peripheral surface of one of the two works Wa and Wb can be simultaneously polished.

FIG. 9A is a view showing a state in which four workpieces Wa to Wd are being simultaneously polished by the polishing apparatus 20 shown in FIGS.
a and Wc are states in which one chamfer surface of the flat portion F is polished, and the other two workpieces W
b and Wd are states in which the respective outer peripheral surfaces Fa are polished. As shown by the two-dot chain line, the workpiece Wc is brought into contact with the polishing surface 23 at a diagonal position with respect to the workpiece Wa, thereby causing relative slip between the chamfer surface and the polishing surface 23 for both chamfer surfaces. The direction of movement can be set to the same direction.

FIG. 9B is a view showing a state where three workpieces Wa to Wc are being simultaneously polished by the above-described polishing apparatus 20, and one of the chamfer surfaces of the workpiece Wa is polished. In this state, the work Wb is in a state where the outer peripheral surface is polished, and the work Wc is in a state where the other chamfer surface is polished. As described above, by performing the polishing, step 2 in FIG.
Steps 4 to 4 can be performed simultaneously for different works, and for one work W, a predetermined part can be sequentially polished by moving the work W by the work holder 25. In the case shown in FIG. 9B, six workpieces can be polished at the same time by pressing three workpieces on the right side in the figure. Also in this case, the work Wc may be brought into contact with the polishing surface 23 at a position diagonal to the work Wa, as shown by the two-dot chain line.

FIG. 10 is a perspective view showing a main part of a polishing apparatus 30 for polishing the outer peripheral surface Ra of the arcuate portion R in FIG. 2, FIG. 11 is a sectional view of the polishing apparatus 30, and FIG. FIG. 12 is a cross-sectional view in a direction along arrow 12 in FIG.

The polishing apparatus 30 has a disk-shaped rotating body 31, and a supporting ring 33 is fixed to the rotating body 31 by a plurality of connecting rods 32. By rotating the drive shaft 34 attached to the rotating body 31 about the rotation center axis P, the rotating body 31
3 and is driven to rotate.

Each of the four support pins 35 is provided on the rotating body 31 at the same distance from the rotating center axis P of the rotating body 31 and at the same distance from the rotating center axis P. 31 are displaced by the same distance in the circumferential direction. Each support pin 35 has a support pin 35
A polishing arm 36 is attached so as to be swingable about the center of the circle, and the four polishing arms 36 form a generally cylindrical polishing drum. A polishing tool 37 is provided on an arc-shaped concave surface of each polishing arm 36, and the polishing tool 37 has a concave polishing surface 38 having a curvature corresponding to the curvature of the arc-shaped portion R of the work W. .

Each polishing arm 36 has a polishing tool 37
A bracket 41 provided at the base end of each polishing arm 36 and a spring stopper 42 fixed to the rotating body 31 to apply a spring force in a direction in which the rotating body 31 moves radially outward. Between them, a tension coil spring 43 is mounted. Therefore, when the rotating body 31 is stationary, the respective polishing arms 36 are moved by the spring force as shown in FIG.
As shown by the two-dot chain line in FIG. 5, the polishing tools 37 provided on the tip side of the support pins 35 of the respective polishing arms 36 are displaced radially outward.

At the base end of each polishing arm 36, a balance weight or weight 44 is attached.
When the rotating body 31 is rotated, the polishing arm 36 rotates about the support pin 35 so that the polishing tool 37 is displaced radially inward against the spring force by the centrifugal force applied to each weight 44. . Thereby, as shown by the solid line in FIG. 12, the polishing tools 37 of the respective polishing arms 36 come into contact with the outer peripheral surface Ra of the arc-shaped portion R of the work W.

The work W is held by a work holder 45 formed of a vacuum chuck or the like and held in a polishing drum formed by a plurality of polishing arms 36 in the same manner as described above. In order to prevent the outer peripheral surface Ra of the work W from continuing to contact a part of the polishing tool 37 of each polishing arm 36, the work W is movable in the direction along the rotation center axis P by the work holding tool 45. ing.

Using such a polishing apparatus 30, the work W
In order to polish the workpiece, the workpiece W is positioned by the workpiece holder 45 inside the polishing drum formed by the plurality of polishing arms 36 while the rotating body 31 is stationary. At this time, since the respective polishing arms 36 are opened by the tension coil springs 43, the positioning operation can be easily performed while preventing interference between the polishing arms 36 and the work W. The spring member for opening the polishing arm 36 in a state where the rotation of the rotating body 31 is stopped is not limited to the tension coil spring 43, and a spring force is applied in a direction in which the polishing tool 37 opens. Any other spring member can be used. For example,
A compression coil spring may be mounted on the tip side of the polishing arm 36.

With the workpiece W positioned,
When the rotating body 31 is rotated, the polishing tool 37 comes into contact with the outer peripheral surface Ra of the work W due to the centrifugal force of the weight 44, and a predetermined pressing force is applied, whereby the surface to be polished is polished. This pressing force can be set by adjusting the rotation speed of the rotating body 31 and the load of the weight 44. Instead of attaching the weight 44 to the polishing arm 36, the weight 44 may be attached to the rotating body 31 and the movement of the weight 44 may be transmitted to the polishing arm 36 via a link.

In the polishing apparatus 30 of this type, the polishing tools 37 of the plurality of polishing arms 36 are connected to the outer circumferential surface R of the workpiece W.
Since the contact is made simultaneously over a wide range of about 2/3 or more of a, the processing can be performed quickly, and the polishing processing efficiency can be improved. In order to enhance the polishing efficiency, it is preferable that the workpiece W is simultaneously brought into contact with the outer peripheral surface in a range of about ２ or more.

The polishing arm 36 in the polishing apparatus 30
Is four in the illustrated case, but may be two, three, or five or more according to the outer diameter of the work W or the like. Further, when the polishing arm 36 is provided with a chamfer polishing surface as shown in FIG.
a and the chamfer surfaces Rc1 and Rc2 can be simultaneously polished.

The present invention is not limited to the above embodiment, and it goes without saying that various modifications can be made without departing from the spirit of the present invention.

For example, in the illustrated embodiment, the semiconductor wafer is a disc-shaped work. However, the present invention is not limited to the semiconductor wafer, and a flat work may be used for a disc-shaped work for polishing an outer peripheral surface or a chamfer surface. Polishing can also be performed on a glass plate or a metal plate having no. When a member having an arc-shaped portion and a flat portion is used as a workpiece like a semiconductor wafer, the processing procedure of the outer peripheral surface and the chamfer surface is not limited to the order shown in FIG. can do.

[0047]

According to the present invention, the outer periphery of the work is polished by rotating a polishing tool having a polishing surface corresponding to the surface to be polished on the outer periphery of the disk-shaped work. Can be improved. Since a cylindrical polishing drum is formed by the polishing tools provided on each of the plurality of polishing arms, and the polishing tool is brought into contact with the polishing tool over a wide range of the outer periphery of the work, the polishing efficiency can be improved. it can. Since the polishing tool comes into contact with the surface to be polished on the outer periphery of the workpiece with a uniform pressing force, the polishing amount can be set substantially the same on the entire surface to be polished, and the processing accuracy can be improved. Can be improved. It is possible to rotate not only the rotating body but also the work at the time of polishing, but it is possible to carry out the polishing without rotating the work. Polishing can be performed.

[Brief description of the drawings]

FIG. 1A is a plan view showing a semiconductor wafer as an example of a disc-shaped work, FIG. 1B is an enlarged cross-sectional view along line 1B-1B in FIG. 1A, and FIG. () Is an enlarged sectional view along line 1C-1C in FIG.

FIG. 2 is a process chart showing a polishing procedure of a workpiece polishing method according to an embodiment of the present invention.

FIG. 3 is a perspective view showing a polishing apparatus according to an embodiment of the present invention.

FIG. 4 is an enlarged sectional view of FIG. 3;

FIG. 5 is a perspective view showing another type of polishing apparatus.

FIG. 6 is an enlarged sectional view of FIG. 5;

FIG. 7 is a perspective view showing another type of polishing apparatus.

FIG. 8 is a sectional view of FIG. 7;

FIGS. 9A and 9B are cross-sectional views showing another polishing method using the polishing apparatus shown in FIGS. 7 and 8;

FIG. 10 is a perspective view showing a main part of another type of polishing apparatus.

11 is an enlarged sectional view taken along line 11-11 in FIG.

FIG. 12 is a sectional view taken along line 12-12 in FIG. 11;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Polishing apparatus 11 Rotating body 12 Polishing tool 13 Polishing surface 14 Drive shaft 15 Work holding tool 20 Polishing apparatus 21 Rotating body 22 Polishing tool 23 Polishing surface 24 Drive shaft 25 Work holding tool 30 Polishing device 31 Rotating body 32 Connecting rod 34 Drive shaft 35 Support Pin 36 Polishing Arm 37 Polishing Tool 38 Polishing Surface 43 Tension Coil Spring 44 Weight

Continued on the front page (72) Inventor Katsunori Nagao 2-951-6, Nanyo, Nagaoka-shi, Niigata F-term in System Seiko Co., Ltd. (Reference) 3C049 AA04 AA16 AB04 CA01 CB01 CB03

Claims (6)

[Claims] 1. A method of polishing a peripheral surface of a disk-shaped work, wherein the peripheral surface of the disk-shaped workpiece is polished, wherein the polishing tool has a polishing surface corresponding to the surface to be polished and is provided on a rotating body. A method for polishing the outer periphery of a work, wherein the outer periphery of the work is pressed against a polishing surface and the polishing tool is rotated so that the surface to be polished can be polished without rotating the work. . 2. A polishing method for polishing an outer peripheral surface of a disk-shaped work, the polishing tool having a polishing surface in contact with an entire surface of the polished surface and provided on a rotating body. Pressing the outer periphery of the work against the polishing surface,
A method for polishing the outer periphery of a work, characterized in that the surface to be polished can be polished without rotating the work by rotating the polishing tool. 3. A polishing method of a workpiece outer periphery for polishing a surface to be polished on an outer periphery of a disk-shaped work, comprising: a rotating body having a polishing surface in contact with an entire surface of a chamfer surface formed on the outer periphery of the work. A step of pressing the chamfer surface on one side of the work against the polishing surface while rotating, and polishing the chamfer surface on one side while rotating the chamfer surface on the other surface side of the work while rotating the rotating body. A step of pressing against the polishing surface to polish the other chamfer surface; and a rotating body provided with a plurality of polishing arms having a polishing tool having a concave polishing surface corresponding to the outer peripheral surface of the work. Polishing the outer peripheral surface by pressing the polishing tool against the outer peripheral surface of the work, and rotating the work with the chamfer surface and the outer peripheral surface. The polishing method of the work outer periphery, characterized in that the Ku to be polished. 4. A polishing apparatus for polishing an outer peripheral surface of a disk-shaped work, which is provided with a polishing tool having a spherical concave polishing surface; A driving means for driving the body to rotate; and a work holder for holding the work and pressing the chamfer surface on the outer periphery of the work against the polishing surface, and polishing the entire chamfer surface against the polishing surface. An apparatus for polishing a periphery of a work, wherein the polishing is performed. 5. A polishing apparatus for polishing an outer peripheral surface of a disk-shaped work, the polishing tool having a chamfer polishing surface having an inclination angle corresponding to a chamfer surface on an outer peripheral surface of the work. A rotating body, a driving unit that rotationally drives the rotating body, and a workpiece holder that holds a workpiece and presses the chamfer surface against the chamfer polishing surface, wherein the entire surface of the chamfer surface is subjected to the chamfer polishing. A polishing apparatus for the outer periphery of a work, wherein the polishing is performed by pressing the surface. 6. A polishing apparatus for polishing an outer peripheral surface of a disk-shaped workpiece, the polishing apparatus comprising: a plurality of polishing arms provided with a polishing tool having a concave-shaped polishing surface; A rotating body that rotatably supports the rotating body; a driving unit that rotationally drives the rotating body; a work holder that holds the work in a polishing drum formed by the plurality of polishing arms; A spring member for urging a spring force in a direction separating from the outer periphery of the work, and a weight for bringing the polishing tool closer to the outer periphery of the work by centrifugal force when the rotating body is rotationally driven; A polishing apparatus for the outer periphery of a workpiece, wherein an arc-shaped outer peripheral surface is simultaneously polished by the plurality of polishing arms.