JP2000297093A - New organosilicon compound, its production and surface treating agent and resin additive using the same - Google Patents
New organosilicon compound, its production and surface treating agent and resin additive using the sameInfo
- Publication number
- JP2000297093A JP2000297093A JP11108237A JP10823799A JP2000297093A JP 2000297093 A JP2000297093 A JP 2000297093A JP 11108237 A JP11108237 A JP 11108237A JP 10823799 A JP10823799 A JP 10823799A JP 2000297093 A JP2000297093 A JP 2000297093A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- organosilicon compound
- formula
- treating agent
- surface treating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 0 CC(*)=NC(*)=C(*)NC(N*)=O Chemical compound CC(*)=NC(*)=C(*)NC(N*)=O 0.000 description 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、銅、鉄鋼、および
アルミニウム等の金属またはガラス繊維、シリカ、酸化
アルミニウム、水酸化アルミニウム等の無機物質と樹脂
との接着性の改善を行うための表面処理剤、または、エ
ポキシ樹脂等の樹脂の機械的強度の改善を行うための樹
脂添加剤およびさらに有用な有機ケイ素化合物に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment for improving the adhesion between a metal such as copper, steel and aluminum or an inorganic substance such as glass fiber, silica, aluminum oxide and aluminum hydroxide and a resin. The present invention relates to an agent or a resin additive for improving the mechanical strength of a resin such as an epoxy resin and a more useful organosilicon compound.
【０００２】[0002]
【従来の技術】電子機器のボードは銅箔と紙−フェノー
ル樹脂含浸基材やガラス−エポキシ樹脂含浸基材等を加
熱、加圧して銅張積層板を作成した後、エッチングして
回路網を形成し、これに半導体装置等の素子を搭載する
ことにより作られる。2. Description of the Related Art A board of an electronic device is manufactured by heating and pressing a copper foil and a paper-phenol resin impregnated base material or a glass-epoxy resin impregnated base material to form a copper-clad laminate, and then etching to form a circuit network. It is formed by forming and mounting an element such as a semiconductor device thereon.
【０００３】これらの過程では、銅箔と基材との接着、
加熱、酸やアルカリ液への浸漬、レジストインクの塗
布、ハンダ付け等が行われるため、さまざまな性能が要
求される。これらの要求を満たすために、銅箔は黄銅層
形成処理（特公昭５１−３５７１１号公報、同５４−６
７０１号公報）やクロメート処理、亜鉛または酸化亜鉛
とクロム酸化物とからなる亜鉛−クロム基混合物被覆処
理（特公昭５８−７０７７号公報）、シランカップリン
グ剤処理等が検討されている。また、樹脂は樹脂や硬化
剤の種類およびその配合量を変えたり、添加剤等によっ
て上記要求特性を満足させている。また、ガラス繊維は
シランカップリング剤等の表面処理等が検討されてい
る。しかしながら、最近、プリント回路が緻密化してい
るので、使用される電子機器用のボードに要求される特
性はますます厳しくなっている。In these processes, the bonding between the copper foil and the base material,
Heating, immersion in an acid or alkaline solution, application of resist ink, soldering, and the like are performed, so various performances are required. In order to satisfy these requirements, a copper foil is subjected to a brass layer forming treatment (Japanese Patent Publication No. 51-35711, JP-A-54-6).
No. 701), a chromate treatment, a zinc-chromium group mixture coating treatment comprising zinc or zinc oxide and chromium oxide (Japanese Patent Publication No. 58-7077), a silane coupling agent treatment, and the like. In addition, the resin satisfies the above-mentioned required characteristics by changing the type of the resin and the curing agent and the amount thereof, and by adding additives. For glass fibers, surface treatment with a silane coupling agent or the like has been studied. However, recently, as printed circuits have become finer, characteristics required for boards for electronic devices to be used have become increasingly severe.
【０００４】これに伴うエッチング精度の向上に対応す
るため銅箔のプリプレグと接着される粗化面（Ｍ面）に
はさらに低い表面粗さ（ロープロファイル）も求められ
ている。しかし、Ｍ面の表面粗さは一方ではプリプレグ
との接着にあたって、アンカー効果をもたらしているの
で、Ｍ面に対するこのロープロファイルの要求と接着力
の向上とは二律背反の関係にあり、ロープロファイル化
によるアンカー効果の低減分は別の手段による接着力の
向上で補償することが必要である。[0004] In order to cope with the improvement of the etching accuracy accompanying this, a further lower surface roughness (low profile) is required on the roughened surface (M surface) bonded to the prepreg of the copper foil. However, on the other hand, the surface roughness of the M surface has an anchor effect in bonding with the prepreg, so that the requirement of the low profile for the M surface and the improvement of the adhesive force are in a trade-off relationship, It is necessary to compensate for the reduction in the anchor effect by improving the adhesive force by another means.
【０００５】また、発電所などの高電圧・高容量の機器
や半導体の封止等に使われている電気絶縁用注型材料は
エポキシ樹脂のマトリックス中にシリカやアルミナ等の
無機物質を充填した複合材料である。これらの材料には
様々な電気的・機械的特性が要求されており、それらの
特性を満足させるためには、無機物質と樹脂の接着性を
向上させる必要がある。この対策としてシランカップリ
ング剤を樹脂中に添加したり、無機物質をシランカップ
リング剤で表面処理することが提案されているが、さら
なる樹脂／無機物質界面の改善が要求されている。[0005] In addition, a casting material for electrical insulation used for sealing high-voltage and high-capacity equipment such as power plants and semiconductors is a matrix of an epoxy resin filled with an inorganic substance such as silica or alumina. It is a composite material. These materials are required to have various electrical and mechanical properties, and in order to satisfy those properties, it is necessary to improve the adhesion between the inorganic substance and the resin. As measures against this, it has been proposed to add a silane coupling agent to the resin or to perform a surface treatment of an inorganic substance with the silane coupling agent, but further improvement of the resin / inorganic substance interface is required.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、こうした要
請に対応できる、すなわち銅、鉄鋼、およびアルミニウ
ム等の金属またはガラス繊維、シリカ、酸化アルミニウ
ム、水酸化アルミニウム等の無機物質と樹脂との接着性
を向上させることができる新規な有機ケイ素化合物、そ
の製造方法、並びにそれを用いた表面処理剤または樹脂
添加剤を提供することを目的とするものである。SUMMARY OF THE INVENTION The present invention can meet such a demand, that is, bonding of a resin such as a metal such as copper, steel and aluminum or glass fiber, an inorganic substance such as silica, aluminum oxide and aluminum hydroxide to a resin. It is an object of the present invention to provide a novel organosilicon compound capable of improving the properties, a method for producing the same, and a surface treating agent or a resin additive using the same.
【０００７】[0007]
【課題を解決するための手段】本発明者は、鋭意研究を
進めた結果、前記一般式（１）に示す新規有機ケイ素化
合物を金属または無機物質に表面処理した場合、樹脂と
の接着性を向上させることができ、また、エポキシ樹脂
等の樹脂に添加しても硬化反応が促進され、かつ機械的
強度が改善されることを見出した。Means for Solving the Problems As a result of intensive studies, the present inventor has found that when a novel organosilicon compound represented by the general formula (1) is surface-treated with a metal or an inorganic substance, the adhesion to a resin is reduced. It has been found that the curing reaction can be promoted and the mechanical strength can be improved even when added to a resin such as an epoxy resin.
【０００８】本発明は、かかる知見に基づきなされたも
のであり、その要旨は、 （１）下記一般式（１）で表される新規有機ケイ素化合
物、The present invention has been made based on such findings, and the gist of the present invention is as follows: (1) a novel organosilicon compound represented by the following general formula (1):
【０００９】[0009]
【化３】 Embedded image
【００１０】（ただし、式中、Ｒ1、Ｒ2、Ｒ3は水素、
炭素数が１〜２０のアルキル基、ビニル基、フェニル
基、又はベンジル基であり、Ｒ4、Ｒ5は炭素数１〜５の
アルコキシル基で置換された又は無置換の炭素数１〜５
のアルキル基であり、ｍは１〜１０、ｎは１〜３の整数
である。ただし、Ｒ2、Ｒ3は結合してベンゼン環になっ
ても良い。） （２）下記一般式（２）で表されるイミダゾール化合物
と下記一般式（３）で表されるイソシアネートシランを
３０〜１００℃で反応させることを特徴とする前記
（１）記載の有機ケイ素化合物の製造方法、(Wherein R 1 , R 2 and R 3 are hydrogen,
An alkyl group having 1 to 20 carbon atoms, a vinyl group, a phenyl group, or a benzyl group, and R 4 and R 5 are each substituted or unsubstituted with an alkoxyl group having 1 to 5 carbon atoms;
M is an integer of 1 to 10, and n is an integer of 1 to 3. However, R 2 and R 3 may combine to form a benzene ring. (2) The organosilicon according to (1), wherein the imidazole compound represented by the following general formula (2) is reacted with an isocyanate silane represented by the following general formula (3) at 30 to 100 ° C. A method for producing a compound,
【００１１】[0011]
【化４】 Embedded image
【００１２】（ただし、Ｒ1、Ｒ2、Ｒ3、Ｒ4、Ｒ5、
ｍ、ｎは一般式（１）と同義） （３）前記（１）に記載の有機ケイ素化合物を有効成分
とする表面処理剤、 （４）前記（１）に記載の有機ケイ素化合物を有効成分
とする樹脂添加剤、にある。(However, R 1 , R 2 , R 3 , R 4 , R 5 ,
m and n have the same meanings as in the general formula (1). (3) A surface treating agent containing the organosilicon compound according to the above (1) as an active ingredient. (4) An organosilicon compound according to the above (1) as an active ingredient. Resin additive.
【００１３】上記一般式（１）におけるＲ1、Ｒ2、Ｒ3
は、水素、炭素数１〜２０のアルキル基、ビニル基、フ
ェニル基、又はベンジル基であれば本発明の効果を十分
に発揮する。ただし、これらの置換基は使用する用途に
よって適したものを選定する必要がある。すなわち、フ
ィラーや金属等に水溶液で表面処理したい場合は、水素
または炭素数の少ないアルキル基が溶解性の点で好まし
い。In the general formula (1), R 1 , R 2 , R 3
Is hydrogen, an alkyl group having 1 to 20 carbon atoms, a vinyl group, a phenyl group, or a benzyl group, whereby the effects of the present invention are sufficiently exhibited. However, it is necessary to select these substituents depending on the intended use. That is, when it is desired to perform a surface treatment on a filler or a metal with an aqueous solution, hydrogen or an alkyl group having a small number of carbon atoms is preferable in terms of solubility.
【００１４】また、樹脂に添加する場合は、対象樹脂と
の相溶性が高い置換基を選定する必要がある。上記一般
式（１）におけるＲ4、Ｒ5は、炭素数１〜５のアルコキ
シル基で置換された又は無置換の炭素数１〜５のアルキ
ル基であるが、特には合成の容易性やシランの加水分
解、縮合のし易さの点からメチル基またはエチル基が好
適である。また、ｎは１〜３であるが、金属、無機物質
や樹脂との反応性や架橋性の高い方が接着特性が向上す
るため、ｎは２または３が好適である。また、ｍは１〜
１０である。When adding to a resin, it is necessary to select a substituent having high compatibility with the target resin. R 4 and R 5 in the general formula (1) are an alkyl group having 1 to 5 carbon atoms substituted or unsubstituted with an alkoxyl group having 1 to 5 carbon atoms. A methyl group or an ethyl group is preferred from the viewpoint of easy hydrolysis and condensation of the compound. In addition, n is 1 to 3. However, n is preferably 2 or 3, since the higher the reactivity or crosslinkability with a metal, an inorganic substance, or a resin improves the adhesive property. Also, m is 1 to
It is 10.
【００１５】以下に本発明をさらに詳細に説明する。Hereinafter, the present invention will be described in more detail.
【００１６】本発明の上記新規有機ケイ素化合物（１）
は下記反応式（４）で表される反応により合成される。
すなわち、イミダゾール化合物とイソシアネートシラン
を混合し、３０〜１００℃に加熱することにより製造す
ることができる。The novel organosilicon compound of the present invention (1)
Is synthesized by a reaction represented by the following reaction formula (4).
That is, it can be produced by mixing an imidazole compound and an isocyanate silane and heating the mixture to 30 to 100 ° C.
【００１７】[0017]
【化５】 Embedded image
【００１８】（反応式中、各記号は前記と同義）上記反
応式（４）のイミダゾール化合物とイソシアネートシラ
ンの反応モル比はイミダゾール化合物１モルに対して
０．１〜１０モルのイソシアネートシランを反応させる
ことにより製造できるが、イミダゾール化合物１モルに
対してイソシアネートシランを１モルで反応させること
が望ましい。(In the reaction formula, each symbol is as defined above.) The reaction molar ratio of the imidazole compound to the isocyanate silane in the above reaction formula (4) is 0.1 to 10 mol of isocyanate silane per 1 mol of the imidazole compound. However, it is preferable to react the isocyanate silane with 1 mol per 1 mol of the imidazole compound.
【００１９】上記、新規有機ケイ素化合物を金属または
無機物質の表面処理剤として用いる場合、その金属また
は無機物質には特に制限がない。例えば、金属では、
銅、鉄、アルミニウム、亜鉛等またはそれらの合金、無
機物質ではガラス繊維、シリカ、酸化アルミニウム、水
酸化アルミニウム、酸化マグネシウム、炭酸バリウム、
タルク等である。表面処理は、そのまま塗布しても良い
が、水、メタノール、エタノール、アセトン、酢酸エチ
ル、トルエン等の溶剤で０．００１〜２０重量％になる
ように希釈して噴霧するか、この液に金属または無機物
質を浸漬させる方法で塗布することが簡便で好ましい。When the novel organosilicon compound is used as a surface treatment agent for a metal or inorganic substance, the metal or inorganic substance is not particularly limited. For example, in metal,
Copper, iron, aluminum, zinc, etc. or their alloys, inorganic materials such as glass fiber, silica, aluminum oxide, aluminum hydroxide, magnesium oxide, barium carbonate,
Talc and the like. The surface treatment may be applied as it is, but it may be diluted with a solvent such as water, methanol, ethanol, acetone, ethyl acetate or toluene to a concentration of 0.001 to 20% by weight, or sprayed with a metal. Alternatively, application by a method of immersing an inorganic substance is simple and preferable.
【００２０】なお、この新規有機ケイ素化合物は単独で
用いても良いが、他のシランまたはチタネートカップリ
ング剤、防錆剤と混合しても良い。The novel organosilicon compound may be used alone or may be mixed with another silane or titanate coupling agent or rust inhibitor.
【００２１】上記、本発明の新規有機ケイ素化合物は樹
脂添加剤として用いる場合、その樹脂には特には制限が
なく、熱可塑性樹脂でも熱硬化性樹脂でも良いが、特に
はエポキシ樹脂に添加すると硬化剤または硬化促進剤と
して効果的に作用し、本発明の効果を十分に発揮するこ
とができる。本発明の新規有機ケイ素化合物は樹脂中の
そのまま添加してもアルコール系、芳香族系、脂肪族系
有機溶剤に溶解して添加しても良い。添加量は樹脂１０
０に対して０．００１〜５０添加すれば本発明の効果を
十分発揮できる。なお、本発明の新規有機ケイ素化合物
は、硬化剤、シランカップリング剤、可塑剤等の添加剤
等と併用しても良い。When the novel organosilicon compound of the present invention is used as a resin additive, the resin is not particularly limited, and may be a thermoplastic resin or a thermosetting resin. It effectively acts as an agent or a curing accelerator, and can sufficiently exert the effects of the present invention. The novel organosilicon compound of the present invention may be added as it is in the resin or may be added by dissolving it in an alcohol, aromatic or aliphatic organic solvent. Addition amount is resin 10
The effect of the present invention can be sufficiently exhibited by adding 0.001 to 50 to 0. The novel organosilicon compound of the present invention may be used in combination with additives such as a curing agent, a silane coupling agent, and a plasticizer.
【００２２】[0022]
【発明の実施の形態】実施例１ イミダゾール６．８ｇ（０．１モル）とイソシアネート
プロピルトリエトキシシラン２４．９ｇ（０．１モル）
を混合し、ジブチルスズラウレートを触媒として０．１
ｇ添加し、５０℃で１時間反応させ、下記式（５）の有
機ケイ素化合物を得た。反応の確認は液体クロマトグラ
フィーにより反応物の消失により行った。得られた化合
物はＦＴ−ＩＲ、ＮＭＲにより同定した。本化合物の1
Ｈ−ＮＭＲ、13Ｃ−ＮＭＲ、ＦＴ−ＩＲスペクトルを図
１〜３に示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS Example 1 6.8 g (0.1 mol) of imidazole and 24.9 g (0.1 mol) of isocyanatopropyltriethoxysilane
Are mixed, and dibutyltin laurate is used as a catalyst for 0.1%.
g was added and reacted at 50 ° C. for 1 hour to obtain an organosilicon compound of the following formula (5). Confirmation of the reaction was performed by disappearance of the reaction product by liquid chromatography. The obtained compound was identified by FT-IR and NMR. 1 of this compound
H-NMR, 13 C-NMR and FT-IR spectra are shown in FIGS.
【００２３】[0023]
【化６】 Embedded image
【００２４】実施例２表面処理剤としての適用 アルミ合金板（ＪＩＳ Ｈ４０００に規定するＡ２０２
４Ｐ、日本テストパネル製、厚さ１．６ｍｍ、２５×１
００ｍｍ）を上記実施例１で得られた有機ケイ素化合物
の０．４％メタノール溶液に浸漬した後、熱風乾燥する
ことにより表面処理した。この表面処理したアルミ合金
板２枚をエポキシ樹脂組成物［エピコート８２８（エポ
キシ樹脂、油化シェルエポキシ製）：１００部、ジシア
ンジアミド（関東化学（株）製）：５部、２−エチル−
４−メチルイミダゾール（四国化成製）：１部］により
１００℃で１時間＋１５０℃で１時間の硬化条件で接着
し、ＪＩＳ Ｋ６８５０に準じて引っ張り剪断接着試験
を行った。また比較として未処理のアルミ合金板、およ
び０．４％ ３−グリシドキシプロピルトリメトキシシ
ランのメタノール溶液で処理したアルミ合金板について
も同様に評価した。その結果を表１に示す。Example 2 Applicable aluminum alloy plate as surface treating agent (A202 specified in JIS H4000)
4P, made by Japan Test Panel, thickness 1.6mm, 25x1
00 mm) was immersed in a 0.4% methanol solution of the organosilicon compound obtained in Example 1 above, and then subjected to surface treatment by hot-air drying. Two pieces of the surface-treated aluminum alloy plate were used as an epoxy resin composition [Epicoat 828 (epoxy resin, manufactured by Yuka Shell Epoxy): 100 parts, dicyandiamide (Kanto Chemical Co., Ltd.): 5 parts, 2-ethyl-
4-methylimidazole (manufactured by Shikoku Chemicals): 1 part] under a curing condition of 100 ° C. for 1 hour and 150 ° C. for 1 hour, and a tensile shear adhesion test was performed according to JIS K6850. For comparison, an untreated aluminum alloy plate and an aluminum alloy plate treated with a methanol solution of 0.4% 3-glycidoxypropyltrimethoxysilane were similarly evaluated. Table 1 shows the results.
【００２５】[0025]
【表１】 [Table 1]
【００２６】実施例３樹脂への添加剤としての適用 未処理のアルミ合金板２枚をエポキシ樹脂組成物［エピ
コート８２８：１００部、ジシアンジアミド（関東化学
（株）製）：５部、実施例１で得られた有機ケイ素化合
物：１部］により１００℃で１時間＋１５０℃で１時間
の硬化条件で接着し、ＪＩＳ Ｋ６８５０に準じて引っ
張り剪断接着試験を行った。その結果を表２に示す。ま
た、比較として新規有機ケイ素化合物の代わりに、２−
エチル−４−メチルイミダゾール１部を用いて同様に評
価した。その結果を表２に示す。Example 3 Application as an Additive to Resin Two untreated aluminum alloy plates were treated with an epoxy resin composition [Epicoat 828: 100 parts, dicyandiamide (Kanto Chemical Co., Ltd.): 5 parts, Example 1] 1 part of the organosilicon compound obtained in [1] above, under a curing condition of 100 ° C. for 1 hour and 150 ° C. for 1 hour, and subjected to a tensile shear adhesion test according to JIS K6850. Table 2 shows the results. As a comparison, instead of the novel organosilicon compound,
The same evaluation was performed using 1 part of ethyl-4-methylimidazole. Table 2 shows the results.
【００２７】[0027]
【表２】 [Table 2]
【００２８】[0028]
【発明の効果】以上説明したように、本発明の新規有機
ケイ素化合物は表面処理剤、樹脂添加剤として金属と樹
脂との接着性を改善することができる。As described above, the novel organosilicon compound of the present invention can improve the adhesion between a metal and a resin as a surface treating agent and a resin additive.
【図１】実施例１で得られた有機ケイ素化合物の1Ｈ−
ＮＭＲチャート。FIG. 1 shows 1 H- of the organosilicon compound obtained in Example 1.
NMR chart.
【図２】同上、13Ｃ−ＮＭＲチャート。FIG. 2 is a 13 C-NMR chart, same as above.
【図３】同上、ＦＴ−ＩＲチャート。FIG. 3 is an FT-IR chart of the above.
Claims (4)
イ素化合物。 【化１】 （ただし、式中、Ｒ1、Ｒ2、Ｒ3は水素、炭素数が１〜
２０のアルキル基、ビニル基、フェニル基、又はベンジ
ル基であり、Ｒ4、Ｒ5は炭素数１〜５のアルコキシル基
で置換された又は無置換の炭素数１〜５のアルキル基で
あり、ｍは１〜１０、ｎは１〜３の整数である。ただ
し、Ｒ2、Ｒ3は結合してベンゼン環になっても良い。）1. A novel organosilicon compound represented by the following general formula (1). Embedded image (Where R 1 , R 2 and R 3 are hydrogen and have 1 to 1 carbon atoms)
20 alkyl groups, vinyl groups, phenyl groups, or benzyl groups; R 4 and R 5 are an alkyl group having 1 to 5 carbon atoms substituted or unsubstituted with an alkoxyl group having 1 to 5 carbon atoms; m is an integer of 1 to 10, and n is an integer of 1 to 3. However, R 2 and R 3 may combine to form a benzene ring. )
ル化合物と下記一般式（３）で表されるイソシアネート
シランを３０〜１００℃で反応させることを特徴とする
請求項１記載の有機ケイ素化合物の製造方法。 【化２】 （ただし、Ｒ1、Ｒ2、Ｒ3、Ｒ4、Ｒ5、ｍ、ｎは一般式
（１）と同義）2. The organosilicon according to claim 1, wherein an imidazole compound represented by the following general formula (2) and an isocyanate silane represented by the following general formula (3) are reacted at 30 to 100 ° C. A method for producing a compound. Embedded image (However, R 1 , R 2 , R 3 , R 4 , R 5 , m and n have the same meanings as in the general formula (1))
効成分とする表面処理剤。3. A surface treating agent comprising the organosilicon compound according to claim 1 as an active ingredient.
効成分とする樹脂添加剤。4. A resin additive comprising the organosilicon compound according to claim 1 as an active ingredient.
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| JP10823799A JP3555845B2 (en) | 1999-04-15 | 1999-04-15 | Novel organosilicon compound, method for producing the same, surface treating agent and resin additive using the same |
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