JP2000273415A5 - - Google Patents
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- Publication number
- JP2000273415A5 JP2000273415A5 JP1999081078A JP8107899A JP2000273415A5 JP 2000273415 A5 JP2000273415 A5 JP 2000273415A5 JP 1999081078 A JP1999081078 A JP 1999081078A JP 8107899 A JP8107899 A JP 8107899A JP 2000273415 A5 JP2000273415 A5 JP 2000273415A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- layer
- adhesive
- compound
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 12
- 230000001070 adhesive Effects 0.000 description 11
- 239000010410 layer Substances 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 125000004432 carbon atoms Chemical group C* 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 125000000962 organic group Chemical group 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08107899A JP4359954B2 (ja) | 1999-03-25 | 1999-03-25 | 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08107899A JP4359954B2 (ja) | 1999-03-25 | 1999-03-25 | 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2000273415A JP2000273415A (ja) | 2000-10-03 |
JP2000273415A5 true JP2000273415A5 (ru) | 2006-03-30 |
JP4359954B2 JP4359954B2 (ja) | 2009-11-11 |
Family
ID=13736369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP08107899A Expired - Fee Related JP4359954B2 (ja) | 1999-03-25 | 1999-03-25 | 半導体装置用接着剤シートおよびそれを用いた部品ならびに半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4359954B2 (ru) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4721309B2 (ja) * | 2001-02-14 | 2011-07-13 | 日東電工株式会社 | 熱硬化性樹脂組成物および半導体装置 |
JP2002241469A (ja) * | 2001-02-14 | 2002-08-28 | Nitto Denko Corp | 熱硬化性樹脂組成物および半導体装置 |
JP2010006929A (ja) * | 2008-06-26 | 2010-01-14 | Shin-Etsu Chemical Co Ltd | 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム |
TW201305306A (zh) * | 2011-07-25 | 2013-02-01 | Nitto Denko Corp | 接著片及其用途 |
-
1999
- 1999-03-25 JP JP08107899A patent/JP4359954B2/ja not_active Expired - Fee Related
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