JP2000269254A - Semiconductor package and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the thickness of, and improve the resistance to bending stress of, a semiconductor package by forming holes in a resin tape board and adhesive and connecting connecting terminals to wiring through the connecting holes filled with conductive resin. SOLUTION: A semiconductor chip 1 with an electrode pad 2 and a protective film 3 formed thereon is faced opposite to a resin tape 5 with a wiring 6 formed thereon, so that the non-wiring 6 formation side comes to the semiconductor chip side and they are bonded together via an adhesive 4. A through-hole is formed in the wiring 6, the resin tape 5 and the adhesive 4 in the position corresponding to the electrode pad 2 on the semiconductor chip 1 and conductive resin 8 are applied to the through-hole using a dispenser 7. The electrode pad 2 on the semiconductor chip 1 is connected with the wiring 6 formed on the resin tape 5 through the conductive resin 8 to form a semiconductor package.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor package, and more particularly, to a semiconductor package in which a semiconductor chip and external electrodes are connected by using a resin tape.

[0002]

2. Description of the Related Art As electronic devices become smaller and thinner,
Since the semiconductor devices used for this are also mounted at high density,
There is a demand for further miniaturization and thinning.

In order to realize this, an opening (device hole) is provided in a resin film tape, a semiconductor element is provided here, and an electrode of the semiconductor element is connected to an inner lead on the resin film tape. Semiconductor packages in which a sealing material made of a resin such as an epoxy resin is formed by printing or potting are manufactured. This is called TAB (Tape Automated Bonding) technology.

A conventional TAB will be described with reference to FIGS. This directly connects the electrode pads 2 of the semiconductor chip 1 and the inner leads 13 of the TAB tape 5, and is called single point bonding. In this structure, a device hole for arranging the semiconductor chip 1 on the TAB tape 5 and an inner lead 13 called a beam lead are formed, and a single pointing tool 14 is used to connect by applying a load, ultrasonic wave, and heat. FIG. 14 shows an enlarged view of the connection portion. The structure of the conventional TAB tape is not only costly, but also may be thicker depending on the shape of the outer lead, and it is difficult to maintain the flatness of a thin package that requires flatness. .

For this reason, as shown in FIGS. 15 and 16, there is a TAB tape structure in which wiring 6 is provided on the tape 5 and is directly connected to the semiconductor chip 1. However, when a single point bonding connection is performed with this structure, the load and the ultrasonic waves are not effectively transmitted to the bonding surface, resulting in poor bonding. In addition, when a load or the like is applied to a thin semiconductor chip, the wiring of the TAB tape may come into contact with the end face of the semiconductor chip after the destruction or connection of the semiconductor element, which may cause an electrical short failure.

[0006] As a novel use in which a thin semiconductor package is used, there is a thin base material such as an NTT telephone card. Some telephone cards have a structure in which a semiconductor element is embedded in a base material, and are considered to be used as non-contact telephone cards.
Such a thin base material may bend during use,
It will bend. A thin semiconductor package resistant to such bending stress has not been obtained until now.

[0007]

As described above, in the conventional TAB semiconductor package, the connection using the inner leads cannot satisfy the flatness required for a thin package. If single-point bonding is performed in a structure in which wiring is provided on a TAB tape in order to reduce the thickness, there is a possibility that an electrical failure may occur. There has been a demand for a semiconductor package having both resistance to bending stress and electrical reliability.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a thin semiconductor package which is thin and has both high resistance to bending stress and high electrical reliability, and a method of manufacturing the same.

[0009]

According to a semiconductor package of the present invention, a semiconductor element having connection terminals and a protective film formed so that the connection terminals are exposed, and a resin tape substrate provided with wiring are protected. A semiconductor package joined via an adhesive applied on a film, wherein a connection terminal is connected via a resin tape substrate and a connection hole filled with a conductive resin formed by perforating the adhesive. It is characterized by being connected to.

According to the semiconductor package of the present invention, the wiring of the resin tape substrate and the connection pads of the semiconductor chip are connected by the through holes filled with the conductive resin. TAB
It is possible to obtain a thinness that could not be realized by the method and, at the same time, an electrical reliability that could not be realized by the resin tape substrate provided with the conventional wiring.

In the semiconductor package according to the present invention, a step is formed in the cross section of the connection hole due to the formation of the adhesive recessed from the protective film, and the resin tape substrate is formed recessed from the adhesive. Steps are provided. That is, in the cross section of the connection hole, a step is formed between the protective film, the adhesive, and the resin tape substrate so that the connection hole gradually widens. This step may be inclined. In other words, the through hole is inclined so that the through hole, which is a connection hole, becomes wider as the distance from the connection pad increases, and the inclination angle is about 30 to 60 degrees. When the angle is in this range, the conductive resin can be easily inserted. If it is less than 30 degrees, it becomes difficult to insert it, and if it is more than 60 degrees, the through hole is too large to be realistic. Also, the retreat distance b of the adhesive and the resin tape substrate, which is a horizontal step between the protective film and the adhesive, and the adhesive and the resin tape substrate,
There is a relationship of the resin tape substrate thickness a and a / b = 2 to 2.5. However, the retreat distance b of the adhesive and the retreat distance b of the resin tape substrate do not necessarily have to match.

In the semiconductor package of the present invention, air is contained in the steps of the protective film, the adhesive and the resin tape substrate.

According to the semiconductor package of the present invention, since the step is formed so that the cross section of the through hole becomes wider as the distance from the connection pad is increased, air is contained therein.
Even if the thin substrate into which the semiconductor package is incorporated is bent, resistance to bending stress that can sufficiently absorb the bending can be obtained.

The conductive resin used for the semiconductor package of the present invention is an epoxy or acrylic resin containing silver.

The conductive resin used in the semiconductor package of the present invention is not particularly limited, but may be a conventional epoxy or acrylic resin containing a conductive substance such as silver or a low stress type resin. Things.

Such a conductive resin filled in the through hole makes it possible to electrically connect the electrode pads of the semiconductor chip and the wiring of the resin tape substrate with high reliability.

The method for manufacturing a semiconductor package according to the present invention comprises:
Bonding the semiconductor element having the connection terminal and the protective film formed so that the connection terminal is exposed and the resin tape substrate provided with the wiring with an adhesive, and connecting the resin tape substrate and the adhesive by perforating the adhesive; Forming a connection hole on the connection terminal; and filling the connection hole with a conductive resin to connect the connection terminal to the wiring. Thereafter, the semiconductor package is further connected to a motherboard or the surface is sealed. If the two protective members are joined with an adhesive so as to sandwich the semiconductor chip and the resin tape, the sealing step can be omitted.

In the method for manufacturing a semiconductor package according to the present invention, the conductive resin may be filled by direct application or printing. In the case of direct application, after filling, pressure may be applied using a pressing jig or the like.

In the semiconductor package of the present invention, the material of the resin substrate is, for example, polyimide or polyethylene terephthalate.

The thickness of the semiconductor package of the present invention is 120.
It is very thin, about μm, and can be applied to so-called prepaid or debit cards such as telephone cards such as NTT, highway cards, boarding cards and book cards, and thin base materials such as membership cards and customer cards. it can.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [Embodiment 1] An embodiment will be described with reference to FIGS.

As shown in FIG. 1, the semiconductor chip 1 on which the electrode pads 2 and the protective film 3 are formed and the resin tape 5 on which the wiring 6 is formed are bonded so that the sides on which the wiring 6 is not formed face each other. Bonding via agent 4.

Next, as shown in FIG.
Wiring 6, resin tape 5 at position corresponding to upper electrode pad 2
Then, a through hole is punched in the adhesive 4 with a punch or the like. FIG. 3 shows a plan view at this time. The electrode pad 2 is looking through the through hole.

Further, as shown in FIG. 4, a conductive resin 8 is applied to the through holes by a dispenser 7.

FIG. 5 is an enlarged view of the portion A in FIG. As shown in FIG. 5, the electrode pads 2 of the semiconductor chip 1 and the wirings 6 formed on the resin tape 5 are connected by the conductive resin 8 filled in the through holes to form a semiconductor package. FIG. 6 shows a plan view of this semiconductor package.

FIG. 7A is an enlarged view of the portion B in FIG. As shown in FIG. 7A, the wall surface of the through hole is tapered c. This taper angle is about 30
About 60 degrees. The adhesive 4 is applied from the protective film 3 to b
The resin tape 5 is also formed from the adhesive 4 by only b inside. For the thicknesses a and b of the resin tape, a / b = 2
The relationship of ~ 2.5 holds. Within this range, there is an advantage that the wall surface of the through hole has a gentle slope shape and the conductive resin can be easily inserted.

The thicknesses of the semiconductor chip 1, the protective film 3, the adhesive 4, and the resin tape 5 are, for example, 30 to 70, respectively.
μm, 5 μm, 20 μm, and 40 to 50 μm. At this time, b becomes 20 to 100 μm.

As described above, when the step or the taper is provided, air can be formed at the portion d in FIG. 7B, and play occurs due to the air. Then, when the substrate is bent, the stretched portion of the resin tape 5 can be absorbed by the air layer d, so that excellent resistance to bending and bending is exhibited.

Further, as shown in FIG. 8, pressure may be applied from above using a tool 9 such as a mold so that the conductive resin 8 is reliably filled in the through holes.

Further, as shown in FIG. 9, a protective material 10 such as a laminate is further joined via an adhesive 4 so as to sandwich the semiconductor chip 1 and the resin tape 5, so that a sealing material and a sealing step can be performed. Can be omitted.

[Second Embodiment] As shown in FIG. 10, a semiconductor package is prepared in the same manner as in the first embodiment, except that the wiring 6 is formed by printing or the like after applying the conductive resin 8.

[Embodiment 3] After the through holes are provided, as shown in FIG.
A mask 11 is placed on the upper surface, and the conductive resin 8 is applied thereon, and the conductive resin 8 is filled in the through holes using a squeegee 12 as shown in FIG.

[0033]

According to the present invention, since connection can be made via an adhesive without forming a bump or the like on an electrode pad portion of a semiconductor chip, not only is it thin and excellent in flatness, but also bending stress is reduced. A semiconductor package having high resistance to electric current and high electrical reliability can be provided at low cost. Also,
Because resin tape and semiconductor chip can be joined at low temperature,
The semiconductor package does not warp due to heat.

[Brief description of the drawings]

FIG. 1 is a diagram showing a manufacturing process according to an embodiment of a semiconductor package according to the present invention.

FIG. 2 is a diagram showing a manufacturing process according to an embodiment of the semiconductor package according to the present invention.

FIG. 3 is a plan view of the semiconductor package according to the present invention shown in FIG. 1;

FIG. 4 is a diagram showing a manufacturing process according to an embodiment of the semiconductor package according to the present invention.

FIG. 5 is a cross-sectional view of a semiconductor package according to the present invention.

FIG. 6 is a plan view of a semiconductor package according to the present invention.

FIG. 7 is an enlarged sectional view of a resin-filled portion of a semiconductor package according to the present invention.

FIG. 8 is a cross-sectional view showing how a resin is filled in the semiconductor package according to the present invention.

FIG. 9 is a cross-sectional view of a semiconductor package according to the present invention on which a protective material is laminated.

FIG. 10 is a sectional view of a semiconductor package according to another embodiment of the present invention;

FIG. 11 is a view showing a manufacturing process according to another embodiment of the semiconductor package according to the present invention.

FIG. 12 is a view showing a manufacturing process according to another embodiment of the semiconductor package according to the present invention.

FIG. 13 is a view showing a manufacturing process according to an embodiment of a conventional semiconductor package.

FIG. 14 is a diagram showing a manufacturing process according to one embodiment of a conventional semiconductor package.

FIG. 15 is a diagram showing a manufacturing process according to another embodiment of the conventional semiconductor package.

FIG. 16 is a view showing a manufacturing process according to another embodiment of the conventional semiconductor package.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Semiconductor chip 2 ... Electrode pad 3 ... Protective film 4 ... Adhesive 5 ... Resin tape 6 ... Wiring 7 ... Dispenser 8 ... Conductive resin 9 ... Mold 10 ... Protective material 11 ... Mask 12 ... Squeegee 13 ... Inner lead 14 … Single pointing tool

Claims (6)

[Claims] 1. A semiconductor element having a connection terminal and a protective film formed so that the connection terminal is exposed, and a resin tape substrate provided with wiring are coated with an adhesive applied on the protective film. Wherein the connection terminals are connected to the wiring via connection holes filled with a conductive resin formed by perforating the resin tape substrate and the adhesive. A semiconductor package characterized by the above-mentioned. 2. In the cross section of the connection hole, there is provided a step due to the formation of the adhesive retreating from the protective film, and the resin tape substrate is formed retreating from the adhesive. 2. The semiconductor package according to claim 1, wherein a step is provided. 3. The semiconductor package according to claim 2, wherein the step is inclined. 4. The semiconductor package according to claim 2, wherein said step region of said protective film, said adhesive and said resin tape substrate contains air. 5. The semiconductor package according to claim 1, wherein the conductive resin is an epoxy or acrylic resin containing silver. 6. A step of bonding, with an adhesive, a semiconductor element having a connection terminal and a protective film formed so as to expose the connection terminal and a resin tape substrate provided with wiring; Forming a connection hole on the connection terminal by piercing the adhesive; and connecting the connection terminal to the wiring by filling the connection hole with a conductive resin. Semiconductor package manufacturing method.