JP2000267274A - Photosensitive resin composition and printed circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition usable for a soldering resist layer, an interlayer resin insulating layer, etc., and excellent in cracking resistance and adhesion to a conductor circuit under heat cycle conditions by using the (meth)acrylate of epoxy resin, a curing agent and a P-containing (meth)acrylic ester monomer. SOLUTION: The photosensitive resin composition comprises the (meth) acrylate of epoxy resin, a curing agent and a P-containing (meth)acrylic ester monomer. This monomer is preferably a compound of formula I or II. In the formula I and II, (n) is 0 or 1 and (a) to (c) are each 1 or 2. A resin layer obtained by curing the photosensitive resin composition has high flexibility because a reaction product of the P-containing (meth)acrylic ester monomer is contained and brittleness peculiar to the epoxy resin can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin composition and a printed wiring board used for a solder resist, a plating resist, an interlayer resin insulating layer, etc., and more particularly to a photosensitive composition having excellent heat cycle characteristics and a printed wiring board. And a printed wiring board using the same.

[0002]

2. Description of the Related Art In general, a printed wiring board has a solder layer as an outermost layer for the purpose of protecting a conductor circuit exposed on a surface layer and for preventing a solder body supplied to a surface of a conductor pad for mounting electronic components from flowing out or bridging. A resist layer is formed. When forming the solder resist layer, a solder resist layer is provided so as to cover the entire conductor circuit on the substrate, and then an opening is provided to expose a conductor pad portion formed for connection with an IC chip. Other conductor circuits are protected, and a spherical or protruding solder body called a solder bump for connecting to an IC chip is formed in this opening. At this time, the formed solder resist layer functions as a solder dam.

[0003] As such a solder resist layer,
It is desirable to use a composition mainly composed of (meth) acrylate of a novolak epoxy resin in which Pb migration hardly occurs. However, since this solder resist layer is mainly composed of a resin lacking in flexibility, there is a problem that cracks are likely to occur due to a difference in thermal expansion coefficient with the conductor layer during a heat cycle test.

[0004] In addition to the solder resist composition,
The same problem as in the above-mentioned solder resist composition also occurred in an interlayer resin insulating layer formed between the conductor circuits when the conductor circuits were laminated.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and its main purpose is to use it for a solder resist layer, an interlayer resin insulation layer and the like. An object of the present invention is to provide a photosensitive resin composition which is excellent in crack resistance under heat cycle conditions and adhesion to a conductor circuit.

[0006]

Means for Solving the Problems The inventors of the present invention have made intensive studies for realizing the above-mentioned object, and as a result, have completed the present invention having the following contents. That is, the photosensitive resin composition of the present invention is characterized by comprising a (meth) acrylate of an epoxy resin, a curing agent, and a (meth) acrylate monomer having a P atom in a molecule.
The (meth) acrylate monomer having a P atom in the molecule is represented by the following chemical formula (1) or (2)
Is desirable.

[0007]

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(Where n is 0 or 1, a and b are 1
Or 2 is represented. )

[0009]

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(In the formula, n represents 0 or 1, and c represents 1 or 2.) The photosensitive resin composition is formed as a solder resist layer or an interlayer resin insulating layer covering a conductor circuit. Alternatively, it may be formed as a plating resist between conductor circuits.

Further, the printed wiring board of the present invention is a printed wiring board in which a photosensitive resin layer is formed on a substrate on which a conductor circuit is formed, wherein the photosensitive resin layer is made of epoxy resin (meth) acrylate, And a reactant of a (meth) acrylate monomer having a P atom in the molecule.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The photosensitive resin composition of the present invention is characterized by comprising a (meth) acrylate of an epoxy resin, a curing agent and a (meth) acrylate monomer having a P atom in a molecule. The resin layer obtained by curing this photosensitive resin composition is highly flexible because it contains a reactant of a (meth) acrylate monomer having a P atom, and improves the fragility of the epoxy resin itself. can do. In addition, since the coefficient of thermal expansion can be reduced, when a conductor layer is formed on the photosensitive resin composition, the occurrence of cracks due to the difference in the coefficient of thermal expansion between the conductor layer and the photosensitive resin composition is reduced. Can be suppressed. Furthermore, since the compound having a P atom has excellent adhesion to a metal, the adhesion of a conductor circuit in contact with the photosensitive resin composition to the photosensitive resin composition can be improved.

The printed wiring board of the present invention having a solder resist layer, a plating resist, and an interlayer resin insulating layer formed using the resist composition having such a structure can be used in a heat cycle test. Excellent heat cycle characteristics without cracks in the insulating layer. In addition, since the adhesiveness to the conductor circuit is excellent, peeling hardly occurs.

The (meth) acrylic acid ester monomer having a P atom is not particularly limited as long as it has the P atom. For example, phosphinic acid or phosphonic acid is contained in the compound, and one end of the compound is used. Preferably have an acrylic acid or methacrylic acid ester structure. Examples of such a (meth) acrylate monomer include compounds represented by the above chemical formulas (1) and (2). These (meth) acrylate monomers may be used alone or in combination of two or more. Specifically, for example, KAYAMER PM-2 and LAY manufactured by Nippon Kayaku Co., Ltd.
AMAER PM-21, and the like. KAYAMER PM-2 manufactured by Nippon Kayaku Co., Ltd. contains a methacrylate monomer represented by the following chemical formula (3) as a main component,

[0015]

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This is a mixture containing methacrylic acid ester monomers represented by the following chemical formulas (4) and (5).

[0017]

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[0018]

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Also, LAYAMAER manufactured by Nippon Kayaku Co., Ltd.
PM-21 has a methacrylate monomer represented by the following chemical formula (6) as a main component,

[0020]

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This is a mixture containing methacrylic acid ester monomers represented by the following chemical formulas (7) and (8).

[0022]

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[0023]

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The phosphinic acid or phosphonic acid in these compounds improves the adhesion to the metal, and the straight-chain molecules provide flexibility.

The amount of the (meth) acrylate monomer having a P atom is preferably 0.5 to 20% by weight, more preferably 1 to 5% by weight, based on the total solid content of the resin matrix. If the amount of the (meth) acrylic acid ester monomer exceeds 20% by weight, the curing proceeds excessively when exposed to ultraviolet rays or the like, and shoulders and unopened portions are formed in the openings. If there is, the flexibility is reduced and the generation of cracks cannot be suppressed, and the adhesion to metal decreases.

The (meth) acrylate of the epoxy resin is obtained by reacting the epoxy resin with acrylic acid, methacrylic acid or the like. Examples of the epoxy resin used for the reaction include at least one selected from a novolak epoxy resin, a bisphenol epoxy resin, and an alicyclic epoxy resin.

The novolak type epoxy resin includes:
For example, a glycidyl ether of phenol novolak or cresol novolak is mentioned, and as a bisphenol type epoxy resin, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin and the like are mentioned. Epoxy resin itself is excellent in heat resistance and chemical resistance, but has low toughness and poor adhesion to metal,
In the present invention, the (meth) acrylate monomer having a P atom is blended in the photosensitive resin composition.
The disadvantages of such an epoxy resin can be improved.

The curing agent for the epoxy resin used in the present invention is desirably at least one selected from acid anhydrides, amine curing agents, and imidazole curing agents. In particular, imidazole curing agents are advantageous because their cured products are excellent in chemical resistance and heat resistance. Further, as the imidazole curing agent, it is desirable to use an imidazole curing agent that is liquid at 25 ° C. This is because uniform kneading is difficult with powder, and liquid can be kneaded more uniformly. As such a liquid imidazole curing agent, for example, 1-benzyl-
2-Methylimidazole (1B2M manufactured by Shikoku Chemicals)
Z), 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN, manufactured by Shikoku Chemicals), 4-methyl-2-ethylimidazole (2E4, manufactured by Shikoku Chemicals)
MZ). The amount of the imidazole curing agent to be added is 1 to the total solid content of the photosensitive resin composition.
Desirably, it is 10% by weight. The reason for this is that if the added amount is within this range, uniform mixing is easy.

The solder resist composition of the present invention uses a glycol ether-based solvent or the like as a solvent.
The viscosity at 25 ° C. is preferably 1 to 10 Pa · s, more preferably 2 to 3 Pa · s. The photosensitive resin layer formed by using the photosensitive resin composition adjusted to a viscosity of 1 to 10 Pa · s at 25 ° C. has a small gap between resin molecular chains, and diffusion of Pb moving through the gap ( As a result, the short circuit failure of the printed wiring board is reduced. Further, the viscosity of the solder resist composition at 25 ° C. is 1 to 10 Pa · s.
Therefore, even if the composition is applied simultaneously on both sides in a state where the substrate is set upright, the composition does not sag, and good application in the above-mentioned state is possible. However, if the viscosity of the solder resist composition exceeds 10 Pa · s at 25 ° C., the viscosity is too high and coating with a roll coater cannot be performed.

Further, the solder resist layer made of a solder resist composition using a glycol ether-based solvent as a solvent does not generate free oxygen, so that the surface of the copper pad is not oxidized. It is also less harmful to the human body. As the glycol ether solvent, for example,
Those having the chemical structure represented by the following general formula (9) are desirable, and more specifically, it is more desirable to use at least one selected from diethylene glycol dimethyl ether (DMDG) and triethylene glycol dimethyl ether (DMTG). These solvents are 30 to 5
This is because benzophenone and Michler's ketone, which are polymerization initiators, can be completely dissolved by heating at about 0 ° C. CH ₃ O— (CH ₂ CH ₂ O) _n —CH ₃ (9) (in the above formula, n is an integer of 1 to 5.) The glycol ether solvent is a photosensitive resin composition. Is preferably contained in an amount of 10 to 40% by weight based on the total weight of

The photosensitive resin composition of the present invention may contain inorganic particles or resin particles. When these particles are present, curing shrinkage of the photosensitive resin composition can be suppressed. Further, a roughened surface can be formed by dissolving or decomposing and removing the particles, and by performing electroless plating or electroplating on the roughened surface,
Conductive circuits can be formed. Examples of the inorganic particles include silica, alumina, talc, calcium carbonate, dolomite and the like. These may be used alone or in combination of two or more. Examples of the resin particles include an epoxy resin, an amino resin (urea resin, melamine resin, guanamine resin), a benzoguanamine resin, a polyester resin, and a phenol resin cured with an amine-based curing agent. These may be used alone or in combination of two or more. The particle size of the particles is desirably 0.1 to 10 μm.

The photosensitive resin composition of the present invention preferably contains a polymer of a (meth) acrylate having a molecular weight of about 500 to 5,000. This is because this polymer is liquid at 25 ° C., is easily compatible with cresol novolak epoxy resin (meth) acrylate, and has a leveling action and a defoaming action. For this reason, the solder resist layer containing the polymer of the (meth) acrylic ester is excellent in surface smoothness and free from repelling and air bubbles. In addition, this polymer has compatibility with the photosensitive resin component, and does not disperse in the resin component to lower the light transmittance, so that development residue hardly occurs.

The (meth) acrylic acid ester polymer used in the present invention is preferably an ester polymer of an alcohol having 1 to 10 carbon atoms and acrylic acid, methacrylic acid or a derivative thereof. As the alcohol having 1 to 10 carbon atoms, for example, propyl alcohol, isopropyl alcohol, n-butyl alcohol, tert-
Butyl alcohol, isobutyl alcohol, pentyl alcohol, hexyl alcohol, octyl alcohol,
Examples thereof include monohydric alcohols such as 2-ethylhexyl alcohol and amyl alcohol, and polyhydric alcohols such as 1,2-ethanediol. Among these, carbon number 3 ~
Eight alcohols are preferred.

The (meth) acrylic acid ester polymer is excellent in compatibility with cresol novolak resin, and particularly, 2-ethylhexyl (meth) acrylate, butyl (meth) acrylate, ethyl (meth) acrylate And at least one selected from hydroxyethyl (meth) acrylate.
Since 2-ethylhexyl (meth) acrylate is branched, it can impart a surfactant effect, and can prevent the plating resist from being repelled by dust or the like. Also, butyl (meth) acrylate is considered to have a leveling action and a defoaming action, and ethyl (meth) acrylate and hydroxyethyl (meth) acrylate are considered to improve compatibility. The above four types of (meth) acrylates may be used alone, each of which is polymerized alone, or two or more types may be used in combination. In addition, the above 4
One obtained by copolymerizing two or more acrylates selected from the (meth) acrylates may be used alone,
These may be mixed and used.

For example, when all of the above four (meth) acrylates are used, the weight ratio of 2-ethylhexyl acrylate / butyl acrylate is 40/60 to 60/4.
0 is desirable, the weight ratio of (mixture of 2-ethylhexyl acrylate and butyl acrylate) / ethyl acrylate is preferably 90/10 to 97/3, and (mixture of 2-ethylhexyl acrylate and butyl acrylate) / hydroxyethyl acrylate The weight ratio is 95 /
5 to 99/1 is desirable.

The molecular weight of such a (meth) acrylic acid ester polymer is preferably about 500 to 5,000 in this range, because the polymer is liquid at 25 ° C. This is because they are easily mixed. When the molecular weight exceeds 5,000, the viscosity increases, and the leveling action and the defoaming action decrease. Conversely, when the molecular weight is less than 500, no leveling action or defoaming action is observed. The particularly desirable molecular weight of the (meth) acrylate polymer is from 2,000 to 3,000. In this range, the viscosity becomes 250 to 550 cps (25 ° C.), and the photosensitive resin composition can be easily prepared.

The amount of the (meth) acrylate polymer to be added is 0.1 to 100 parts by weight of the photosensitive resin component.
5 parts by weight is desirable, and 0.2 to 1.0 parts by weight is more desirable. When the amount is less than 0.1 part by weight, the leveling action and the defoaming action are reduced, and Pb migration and cracks caused by bubbles are easily generated. Conversely, when the amount exceeds 5 parts by weight, the glass transition point is lowered. This is because heat resistance is reduced.

In addition to the above-described photosensitive resin compositions, various defoaming agents and leveling agents, thermosetting resins for improving heat resistance and base resistance and imparting flexibility, and for improving resolution. , A photosensitive monomer or the like can be added. Further, a dye or a pigment may be added to the photosensitive resin composition. This is because the wiring pattern can be hidden. It is desirable to use phthalocyanine green as this dye.

As the thermosetting resin, for example, a bisphenol type epoxy resin can be used. This bisphenol type epoxy resin includes bisphenol A
There are a type epoxy resin and a bisphenol F type epoxy resin. The former is preferably used when basic resistance is emphasized, and the latter is used when low viscosity is required (when applicability is emphasized).

As the photosensitive monomer, for example, a polyacrylic monomer can be used. As the polyvalent acrylic monomer, for example, a monomer having a chemical structure represented by the following formula (10) is desirable. Examples of the compound represented by the following formula (10) include DPE-6A manufactured by Nippon Kayaku.

[0041]

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The solder resist composition of the present invention contains benzophenone (B) as a polymerization initiator (reaction accelerator).
P), Michler's ketone (MK) and the following formula (1)
It is desirable to add a compound having the chemical structure of 1), and it is desirable to add a compound having the chemical structure of the following formula (12) as a photosensitizer. This is because these compounds are easily available and have high safety for the human body.

[0043]

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[0044]

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When benzophenone (BP) and Michler's ketone (MK) are added at the same time, it is desirable to simultaneously dissolve them in a glycol ether solvent heated to 30 to 70 ° C., mix them uniformly, and mix them with other components. . This is because there is no dissolution residue and it can be completely dissolved.

The printed wiring board of the present invention is a printed wiring board in which a photosensitive resin layer is formed on a substrate on which a conductive circuit is formed, wherein the photosensitive resin layer comprises a (meth) acrylate of an epoxy resin, a curing agent, It is characterized by comprising a reactant of a (meth) acrylate monomer having a P atom in the molecule. In a printed wiring board having such a structure, a conductive circuit including a pad (a portion formed for connection to an external connection terminal of an IC chip or an electronic component) and a photosensitive resin layer in contact therewith are strongly adhered. Also, since the photosensitive resin layer has flexibility, it has excellent heat cycle resistance.

In the printed wiring board of the present invention, the photosensitive resin layer preferably has a thickness of 5 to 50 μm. In the printed wiring board, the photosensitive resin layer may be a solder resist that covers a conductor circuit,
The plating resist existing between the conductor circuits may be used.
Furthermore, an interlayer resin insulating layer formed between a plurality of conductor circuits may be used.

Next, one method of manufacturing the printed wiring board of the present invention will be described. (1) First, a wiring board having an inner copper pattern (conductor circuit) formed on the surface of a core board is manufactured. When forming a conductor circuit for this core substrate, a method of etching the copper clad laminate into a specific pattern, a glass epoxy substrate,
A method of forming an adhesive layer for electroless plating on a substrate such as a polyimide substrate, a ceramic substrate, or a metal substrate, roughening the surface of the adhesive layer for electroless plating to a roughened surface, and then performing electroless plating. Alternatively, electroless plating is applied to the entire roughened surface, a plating resist is formed, electrolytic plating is applied to a portion where the plating resist is not formed, then the plating resist is removed, and an etching process is performed, so that the electrolytic plating film and the A method of forming a conductor circuit made of an electrolytic plating film or the like can be used.

Further, a roughened surface or a roughened layer can be formed on the surface of the conductor circuit of the wiring board. Here, the roughened surface or the roughened layer is desirably formed by any one of a polishing process, an etching process, a blackening reduction process, and a plating process. Of these treatments, when performing the blackening reduction treatment, NaOH (20 g
/ L), NaClO ₂ (50 g / l), Na ₃ PO ₄
(Oxidation bath) consisting of an aqueous solution containing (15.0 g / l), NaOH (2.7 g / l), NaBH ₄
A method of forming a roughened surface using a reducing bath composed of an aqueous solution containing (1.0 g / l) is desirable. When a roughened layer is formed by plating, copper sulfate (1 to 40 g /
l), nickel sulfate (0.1-6.0 g / l), citric acid (10-20 g / l), sodium hypophosphite (10
-100 g / l), boric acid (10-40 g / l), surfactant (Sufinol 465, manufactured by Nissin Chemical Industry Co., Ltd.)
It is preferable to form a roughened layer made of a Cu-Ni-P alloy by performing electroless plating in an electroless plating bath having a pH of 9 and containing 0.01 to 10 g / l. This is because the crystalline structure of the film deposited in this range has a needle-like structure, and thus has an excellent anchor effect. A complexing agent or an additive may be added to the electroless plating bath in addition to the above compounds. Examples of the etching method include a method in which an etching solution containing a cupric complex of an azole and an organic acid is allowed to act in the presence of oxygen to roughen the surface of a conductor circuit.

Incidentally, a through hole is usually formed in the core substrate, and the wiring layers on the front surface and the back surface are electrically connected through the through hole. Further, resin may be filled between the through-holes and the conductor circuits of the core substrate to ensure smoothness.

Further, the core substrate may have a conductor circuit in an inner layer thereof. The inner conductor circuit is connected to a conductor circuit on the surface of the core substrate by a through hole penetrating the core substrate. Furthermore, the through hole may be filled with a resin composition containing metal particles, inorganic particles and resin particles, and a conductor layer covering the filled resin may be formed on the surface. This is because via holes formed thereon can be connected to this conductor layer.

(2) Next, an interlayer resin insulation layer is formed on the substrate prepared in the above (1). The interlayer resin insulating layer is not particularly limited, but it is desirable to use the photosensitive resin composition of the present invention as an interlayer resin insulating material.

(3) After drying the photosensitive resin composition layer and the like formed in the above (2), openings for via holes are provided as necessary. At this time, the via hole opening is formed by exposing and developing and then thermosetting, or by performing laser processing.

(4) Next, the cured interlayer resin insulation layer is subjected to a roughening treatment. When the photosensitive resin composition containing the particles is used as an interlayer resin insulating layer, the particles present on the surface of the photosensitive resin composition are dissolved or decomposed by an acid, an oxidizing agent, or an alkali or the like. It is removed and the surface of the interlayer resin insulation layer is roughened. Examples of the acid include phosphoric acid, hydrochloric acid, sulfuric acid,
Organic acids such as formic acid and acetic acid may be mentioned, and among them, it is desirable to use organic acids. This is because when the roughening treatment is performed, the metal conductor layer exposed from the via hole is hardly corroded. Chromic acid,
It is desirable to use permanganate (such as potassium permanganate). As the alkali, an aqueous solution of sodium hydroxide, potassium hydroxide or the like is desirable.

(5) Next, a catalyst nucleus is applied to the wiring substrate having the interlayer resin insulating layer roughened. It is desirable to use a noble metal ion or a noble metal colloid for providing the catalyst nucleus, and generally, palladium chloride or a palladium colloid is used. Note that it is desirable to perform a heat treatment to fix the catalyst core. Palladium is preferred as such a catalyst core.

(6) Next, electroless plating is performed on the surface of the adhesive layer for electroless plating, and a thin electroless plating film having irregularities along the rough surface is formed on the entire roughened surface. At this time, the thickness of the electroless plating film is preferably 0.1 to 5 μm, and more preferably 0.5 to 3 μm. Next, a plating resist is formed on the electroless plating film. As the plating resist composition, for example, it is desirable to use a composition comprising a (meth) acrylate of a cresol novolak type epoxy resin or a phenol novolak type epoxy resin and an imidazole curing agent, and in addition, a commercially available dry film is used. You can also.

(7) Next, the substrate is washed with water at 10 to 35 ° C., preferably 15 to 30 ° C. Washing with water at 10 to 35 ° C. means that if the washing temperature exceeds 35 ° C., the water will evaporate,
This is because the surface of the electroless plating film is dried and oxidized, and the electrolytic plating film is not deposited. Therefore, the subsequent etching process dissolves the electroless plating film, and causes a portion where no conductor exists. On the other hand, 10
If the temperature is lower than 0 ° C., the solubility of contaminants in water decreases, and the cleaning power decreases. In particular, when the diameter of the land of the via hole is 200 μm or less, the plating resist repels water, so that the water is easily volatilized, and the problem that electrolytic plating is not deposited is apt to occur. In addition, various surfactants, acids, and alkalis may be added to the washing water. After the cleaning, the substrate may be washed with an acid such as sulfuric acid.

(8) Next, electrolytic plating is applied to the portion where no plating resist is formed to form a conductor circuit and a via hole. Here, it is desirable to use copper plating as the electrolytic plating.

(9) After removing the plating resist, the electroless plating film under the plating resist is dissolved and removed with a mixed solution of sulfuric acid and hydrogen peroxide or an etching solution such as sodium persulfate and ammonium persulfate. Conducted circuit.

(10) Next, a roughened layer or a roughened surface is formed on the surface of the conductor circuit. The formation of the roughened layer or the roughened surface,
This is performed by using the method described in the above (1).

(11) Next, a layer of a resin composition is formed as an interlayer resin insulation layer on the substrate by using, for example, the photosensitive resin composition of the present invention. (12) Further, by repeating the steps (3) to (9), a further upper layer conductive circuit is provided, and a flat conductive pad functioning as a solder pad and a via hole are formed thereon, thereby forming a multilayer wiring. Obtain a substrate. (13) Then, a roughened layer or a roughened surface is provided on the surface of the conductor pad and the via hole. The formation of the roughened layer or the roughened surface is performed by using the method described in the above (1).

(14) Next, a solder resist layer is formed on both surfaces of the multilayer wiring board thus obtained by using the above-described photosensitive resin composition of the present invention. When forming the solder resist layer, with the wiring board upright,
A method in which the wiring substrate is sandwiched between a pair of application rolls of a roll coater, and is conveyed from a lower side to an upper side by a roll to simultaneously apply a solder resist composition to both surfaces of a multilayer wiring substrate (hereinafter, referred to as a roll coating method). ) Is desirable. The reason is that the current basic specifications of printed wiring boards are on both sides, and the curtain coating method (a method of flowing resin from top to bottom like a waterfall and applying it by passing the substrate through this resin "curtain") This is because only one side can be applied. Since the solder resist composition described above can have a viscosity of 1 to 10 Pa · s at 25 ° C., if a solder resist composition having such a viscosity is used,
Even when the multilayer wiring board is applied vertically, the solder resist composition does not flow on the substrate, and the transfer state of the solder resist composition is good.

(15) Thereafter, the coating film of the solder resist composition is dried at 60 to 80 ° C. for 5 to 50 minutes, and
The photomask film having the opening drawn thereon is placed, exposed and developed to form an opening exposing the pad portion of the conductor circuit. The coating film having an opening formed in this way is further subjected to a temperature of 1 to 10 at 80 to 150 ° C.
It is cured by heat treatment for a time. This allows
The photosensitive resin layer (solder resist layer) having the opening is in close contact with the roughened layer provided on the surface of the conductor circuit.

Here, the opening diameter of the opening may be larger than the diameter of the pad, and the pad may be completely exposed. By doing so, even if the photomask is displaced, the pad is not covered with the solder resist, and the solder resist layer does not contact the solder body, and the solder body does not become constricted, so that cracks are generated. It becomes difficult.

On the contrary, the diameter of the opening can be smaller than the diameter of the pad. By doing so, the roughened layer on the pad surface and the solder resist layer adhere more closely. Further, when the so-called semi-additive method is adopted, the depth of the roughened layer of the adhesive for electroless plating is reduced (1 to 3 μm), and the pad is easily peeled off because there is no plating resist. The peeling of the pad can be suppressed by making the opening diameter of the portion smaller than the diameter of the pad and covering a part of the pad with a solder resist layer.

(16) Next, a metal layer made of "nickel-gold" is formed on the solder pad exposed from the opening.

(17) Next, a solder body is supplied onto the solder pad exposed from the opening. As a method of supplying the solder body, a solder transfer method or a solder printing method can be used. With the above solder transfer method, a solder foil was bonded to a prepreg, and a solder pattern was formed by etching the solder foil leaving only a portion corresponding to an opening portion to form a solder carrier film, which was produced by the above process. After applying a flux to the opening of the solder resist on the substrate, this solder carrier film is laminated so that the solder pattern is in contact with the pad, and this is heated and transferred. Also, the solder printing method
A metal mask with a through hole at the position corresponding to the pad is placed on the substrate, solder paste is printed and heated,
This is a method of forming a solder layer.

[0068]

Example (Example 1) A. Preparation of adhesive composition for electroless plating of upper layer 1) 25% acrylate of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., molecular weight: 2500) is dissolved in diethylene glycol dimethyl ether (DMDG) at a concentration of 80% by weight. 2. 35 parts by weight of resin solution, photosensitive monomer (KAYAMER PM-2 manufactured by Nippon Kayaku Co., Ltd.)
15 parts by weight, antifoaming agent (S-65, manufactured by San Nopco)
5 parts by weight and N-methylpyrrolidone (NMP) 3.6
A part by weight was placed in a container and mixed by stirring to prepare a mixed composition.

2) Polyether sulfone (PES) 12
Parts by weight, 7.2 parts by weight of an epoxy resin particle (manufactured by Sanyo Kasei Co., polymer pole) having an average particle size of 1.0 μm and 3.09 parts by weight of an epoxy resin particle having an average particle size of 0.5 μm were placed in another container and stirred. After mixing, 30 parts by weight of NMP was further added and stirred and mixed by a bead mill to prepare another mixed composition.

3) Imidazole curing agent (Shikoku Chemicals, 2
E4MZ-CN), 2 parts by weight of a photopolymerization initiator (Irgacure I-907, manufactured by Ciba-Geigy), 0.2 parts by weight of a photosensitizer (DETX-S, manufactured by Nippon Kayaku) and NMP1. 5 parts by weight were placed in another container and mixed by stirring to prepare a mixed composition. And 1),
An adhesive for electroless plating was obtained by mixing the mixed compositions prepared in 2) and 3).

B. Preparation of Lower Interlayer Resin Insulator 1) Resin solution 35 in which 25% acrylate of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., molecular weight: 2500) is dissolved in diethylene glycol dimethyl ether (DMDG) at a concentration of 80% by weight. Parts by weight, 4 parts by weight of a photosensitive monomer (KAYAMER PM-2 manufactured by Nippon Kayaku), 0.5 parts by weight of an antifoaming agent (S-65 manufactured by San Nopco) and 3.6 parts by weight of N-methylpyrrolidone (NMP) And mixed with stirring to prepare a mixed composition.

2) Polyether sulfone (PES) 12
14.49 parts by weight and epoxy resin particles (Polymer Pole, manufactured by Sanyo Kasei Co., Ltd.) having an average particle size of 0.5 μm
Transfer the parts by weight to another container, stir and mix.
30 parts by weight of P was added, and the mixture was stirred and mixed by a bead mill to prepare another mixed composition.

3) Imidazole curing agent (Shikoku Chemicals, 2
E4MZ-CN), 2 parts by weight of a photopolymerization initiator (Irgacure I-907, manufactured by Ciba-Geigy), 0.2 parts by weight of a photosensitizer (DETX-S, manufactured by Nippon Kayaku) and NMP1. 5 parts by weight were placed in another container and mixed by stirring to prepare a mixed composition. And 1),
An adhesive for electroless plating was obtained by mixing the mixed compositions prepared in 2) and 3).

C. Preparation of resin filler 1) 100 parts by weight of bisphenol F type epoxy monomer (manufactured by Yuka Shell Co., molecular weight: 310, YL983U), the average particle size of which surface is coated with a silane coupling agent is 1.6 μm, and the largest particle Having a diameter of 15 μm or less
iO ₂ spherical particles (CRS 1101- manufactured by Adtech Co., Ltd.)
CE), 170 parts by weight and 1.5 parts by weight of a leveling agent (Perenol S4 manufactured by San Nopco Co., Ltd.) are placed in a container, kneaded with a three-roll mill, and the viscosity is 45000 at 23 ± 1 ° C.
A resin filler of ４９49000 cps (45-49 Pa · s) was prepared. As a curing agent, 6.5 parts by weight of an imidazole curing agent (2E4MZ-CN, manufactured by Shikoku Chemicals Co., Ltd.) was used.

D. Manufacturing method of printed wiring board (1) 1 mm thick glass epoxy resin or BT (bismaleimide triazine) resin
A starting material was a copper-clad laminate on which an 8 μm copper foil 8 was laminated (see FIG. 1A). First, the copper-clad laminate was drilled, subjected to electroless plating, and etched in a pattern to form a lower conductor circuit 4 and through holes 9 on both surfaces of the substrate 1.

(2) Through-hole 9 and lower conductor circuit 4
After the substrate on which was formed was washed with water and dried, NaOH (2
0 g / l), NaClO ₂ (50 g / l), Na ₃ PO
Blackening treatment using an aqueous solution containing ₄ (15 g / l) as a blackening bath (oxidizing bath), NaOH (2.7 g / l), Na
A reduction treatment was performed using an aqueous solution containing BH ₄ (1.0 g / l) as a reducing bath, and roughened surfaces 4 a and 9 a were formed on the entire surface of the lower conductor circuit 4 including the through holes 9 (FIG. 1 (b)). )
reference).

(3) By applying the resin filler 10 to one surface of the substrate using a roll coater, the lower conductor circuit 4
After filling under the conditions of 70 ° C. and 20 minutes, the resin filler 10 is similarly filled between the conductor circuits 4 or into the through holes 9 on the other surface. It was dried by heating at 20 ° C. for 20 minutes (see FIG. 1C).

(4) One surface of the substrate after the treatment of the above (3) is subjected to belt sander polishing using # 600 belt polishing paper (manufactured by Sankyo Rikagaku) to form the surface of the inner layer copper pattern 4 and the through holes 9. Polishing was performed so that the resin filler 10 did not remain on the land surface, and then buffing was performed to remove scratches caused by the belt sander polishing. Such a series of polishing was similarly performed on the other surface of the substrate. Next, heat treatment was performed at 100 ° C. for 1 hour, at 120 ° C. for 3 hours, at 150 ° C. for 1 hour, and at 180 ° C. for 7 hours to cure the resin filler 10.

In this way, the surface layer of the resin filler 10 formed in the through-hole 9 and the portion where the conductor circuit is not formed and the surface of the lower conductor circuit 4 are flattened, and the resin filler 10 and the side surfaces of the lower conductor circuit 4 are flattened. 4a is firmly adhered through the roughened surface, and the inner wall surface 9a of the through hole 9 and the resin filler 10
Was obtained, thereby obtaining an insulating substrate firmly adhered through the roughened surface (see FIG. 1D). By this step, the resin filler 10
And the surface of the lower conductor circuit 4 are flush with each other. Here, the filled resin had a Tg point of 155.6 ° C. and a linear thermal expansion coefficient of 44.5 × 10 ⁻⁶ / ° C.

(5) On the inner layer conductor circuit 4 and the land upper surface of the through hole 9 exposed by the processing of the above (4), a thickness of 2.5
Roughened layer (concavo-convex layer) 1 made of μm Cu-Ni-P alloy
1 on the surface of the roughened layer 11.
A 3 μm Sn layer was provided (see FIG. 2A, except that Sn
The layers are not shown). The formation method is as follows. That is, copper sulfate (8 g / l), nickel sulfate (0.6 g / l), citric acid (15 g / l), sodium hypophosphite (29 g / l), boric acid (31 g / l),
Surfactant (Surfinol 46, manufactured by Nissin Chemical Industry Co., Ltd.)
5) The substrate was immersed in an electroless copper plating bath at pH = 9 consisting of an aqueous solution containing (0.1 g / l), and after 1 minute of immersion, vibrated vertically and horizontally at a rate of once every 4 seconds. The surface of the land of the lower conductor circuit and the through hole is
A roughened layer 11 of a needle-like alloy made of -Ni-P was provided. Furthermore, a temperature of 50 ° C. containing tin borofluoride (0.1 mol / l) and thiourea (1.0 mol / l), pH = 1.2
Cu-Sn substitution reaction was performed using the plating bath of No. 1, and a Sn layer having a thickness of 0.3 μm was provided on the surface of the roughened layer.

(6) An adhesive for electroless plating of B (viscosity: 1.5 Pa · s) is applied to both surfaces of the substrate by a roll coater, left in a horizontal state for 20 minutes, and then at 60 ° C. for 30 minutes. Was dried to form an adhesive layer 2a for electroless plating. Further, the adhesive for electroless plating (A) (viscosity: 7 Pa · s) is applied on the adhesive layer for electroless plating 2 a using a roll coater, and left in a horizontal state for 20 minutes. After drying for 30 minutes, an adhesive layer 2b was formed, and an adhesive layer 2 for electroless plating having a thickness of 35 μm was formed (see FIG. 2B).

(7) The adhesive layer 2 for electroless plating according to the above (6)
A photomask film on which a black circle having a diameter of 85 μm is printed is brought into close contact with both surfaces of the substrate 1 on which is formed, and is exposed at an intensity of 500 mJ / cm ² by an ultra-high pressure mercury lamp, and then DMDG
Spray developed with the solution. Thereafter, the substrate is further exposed to an ultrahigh pressure mercury lamp at an intensity of 3000 mJ / cm ² , and subjected to a heat treatment at 100 ° C. for 1 hour and at 150 ° C. for 5 hours to obtain a diameter excellent in dimensional accuracy equivalent to a photomask film. Thickness 3 having 85 μm via hole opening 6
An interlayer resin insulation layer 2 having a thickness of 5 μm was formed (see FIG. 2C). Note that the tin plating layer was partially exposed in the opening serving as the via hole.

(8) The substrate having the via hole opening 6 formed thereon was placed in a solution containing 800 g / l of chromic acid at 70 ° C. for 19 hours.
The surface of the interlayer resin insulation layer 2 is roughened (depth: 3 μm) by dissolving and removing the epoxy resin particles present on the surface of the interlayer resin insulation layer 2, and then neutralizing solution (manufactured by Shipley Co., Ltd.) ) And washed with water (Fig. 2)
(D)). Further, by applying a palladium catalyst (manufactured by Atotech) to the surface of the substrate subjected to the surface roughening treatment, catalyst nuclei were attached to the surface of the interlayer resin insulating layer 2 and the inner wall surface of the via hole opening 6.

(9) Next, the substrate was immersed in an electroless copper plating aqueous solution having the following composition to form a 0.6 μm-thick electroless copper plating film 12 on the entire rough surface (FIG. 3 (a)). )reference).
At this time, since the plating film was thin, irregularities were observed on the surface of the electroless plating film. [Electroless plating aqueous solution] EDTA 150 g / l Copper sulfate 20 g / l HCHO 30 ml / l NaOH 40 g / l α, α'-bipyridyl 80 mg / l Polyethylene glycol (PEG) 0.1 g / l Electroplating conditions] 30 minutes at a liquid temperature of 70 ° C

(10) A commercially available photosensitive dry film is stuck on the electroless copper plating film 12 and a mask is placed thereon,
Exposure at mJ / cm ² and development with a 0.8% aqueous sodium carbonate solution provided a plating resist 3 (see FIG. 3B).

(11) Then, the substrate was washed with water at 50 ° C., degreased, washed with water at 25 ° C., further washed with sulfuric acid, and then subjected to electrolytic copper plating under the following conditions to a thickness of 15 μm. (See FIG. 3C). [Electrolytic plating aqueous solution] Sulfuric acid 180 g / l Copper sulfate 80 g / l Additive 1 ml / l (Capparaside GL, manufactured by Atotech Japan) [Electroplating conditions] Current density 1 A / dm ² hours 30 minutes Temperature Room temperature

(12) After the plating resist 3 is peeled and removed with 5% KOH, the electroless plating film 12 under the plating resist 3 is dissolved and removed by etching with a mixed solution of sulfuric acid and hydrogen peroxide, and the electroless plating is performed. Copper plating film 12 and electrolytic copper plating film 1
A conductor circuit (including the via hole 7) 5 made of 3 and having a thickness of 18 μm was formed. Further, the surface of the interlayer resin insulating layer 2 between the conductor circuits located at the part where the conductor circuits are not formed is immersed in a 70 ° C. solution containing 800 g / l of chromic acid for 3 minutes, and the surface of the interlayer resin insulation layer 2 is etched by 1 μm. The resulting palladium catalyst was removed (see FIG. 3 (d)).

(13) The substrate on which the conductor circuit 5 was formed was coated with copper sulfate (8 g / l), nickel sulfate (0.6 g / l), citric acid (15 g / l), and sodium hypophosphite (29 g / l).
l), an aqueous solution containing boric acid (31 g / l) and a surfactant (Surfynol 465, manufactured by Nissin Chemical Industry Co., Ltd.) (0.1 g / l). After immersion, one minute after immersion, vibrating in the vertical and horizontal directions at a rate of once every 4 seconds, the surface of the land of the lower conductor circuit and the through-hole was roughened with a needle-like alloy made of Cu-Ni-P. An oxide layer 11 was provided (see FIG. 4A). At this time, when the formed roughened layer 11 was analyzed by EPMA (X-ray fluorescence spectrometer), Cu: 98 mol%, Ni: 1.
The composition ratio was 5 mol% and P: 0.5 mol%. Furthermore, a temperature of 50 ° C. containing tin borofluoride (0.1 mol / l) and thiourea (1.0 mol / l), pH = 1.2
Cu-Sn substitution reaction was performed using the plating bath of No. 1, and a Sn layer having a thickness of 0.3 μm was provided on the surface of the roughened layer. However, the Sn layer is not shown.

(14) By repeating the above steps (6) to (13), a conductor circuit of an upper layer was further formed to obtain a multilayer wiring board. However, Sn substitution was not performed (see FIGS. 4B to 5B).

(15) Next, a cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) dissolved in diethylene glycol dimethyl ether (DMDG) to a concentration of 60% by weight was used. 46.67 parts by weight of an oligomer for imparting properties (molecular weight: 4000), 6.67 parts by weight of a bisphenol A type epoxy resin (trade name: Epicoat 1001 manufactured by Yuka Shell Co., Ltd.) dissolved in methyl ethyl ketone, and also bisphenol 6.67 parts by weight of an A-type epoxy resin (manufactured by Yuka Shell Co., trade name: Epicoat E-1001-B80), imidazole curing agent (manufactured by Shikoku Chemicals, trade name: 2E)
4MZ-CN) 1.6 parts by weight, a photosensitive monomer (KAYAMER PM-21 manufactured by Nippon Kayaku Co., Ltd.) 6 parts by weight, and a leveling agent composed of an acrylate polymer (manufactured by Kyoei Chemical Co., trade name: Polyflow No. 75) ) 0.36 parts by weight was placed in a container, stirred and mixed to prepare a mixed composition, and 2.0 parts by weight of Irgacure I-907 (manufactured by Ciba Geigy) as a photopolymerization initiator was added to the mixed composition. Solder resist whose viscosity was adjusted to 1.4 ± 0.3 Pa · s at 25 ° C. by adding 0.2 parts by weight of DETX-S (manufactured by Nippon Kayaku Co.) as a sensitizer and 0.6 parts by weight of DMDG. A composition was obtained. The viscosity was measured with a B-type viscometer (DVL-B type, manufactured by Tokyo Keiki Co., Ltd.) when the rotor No. was 60 rpm. In the case of 4, 6 rpm, the rotor No. 3
According to

(16) Next, the solder resist composition is applied to both sides of the multilayer wiring board in a thickness of 20 μm,
After performing a drying process under the conditions of 20 ° C. for 20 minutes and 70 ° C. for 30 minutes, a 5 mm-thick photomask on which a pattern of the opening of the solder resist is drawn is brought into close contact with the solder resist layer, and an ultraviolet ray of 1000 mJ / cm ² is applied. Exposure with DM
Development was performed with a TG solution to form an opening having a diameter of 200 μm. Then, at 80 ° C. for 1 hour, and at 100 ° C. for 1 hour.
The solder resist layer was cured by heating at 120 ° C. for 1 hour and at 150 ° C. for 3 hours to form a solder resist pattern layer 14 having openings and a thickness of 20 μm.

(17) Next, the substrate on which the solder resist layer 14 was formed was replaced with nickel chloride (30 g / l), sodium hypophosphite (10 g / l), and sodium citrate (10 g / l).
g / l) in the electroless nickel plating solution with pH = 5.
This was immersed for 0 minutes to form a nickel plating layer 15 having a thickness of 5 μm in the opening. Further, the substrate was subjected to potassium gold cyanide (2 g / l), ammonium chloride (75 g / l),
It was immersed in an electroless plating solution containing sodium citrate (50 g / l) and sodium hypophosphite (10 g / l) at a temperature of 93 ° C. for 23 seconds to form a 0.03 μm thick nickel plating layer 15 on the nickel plating layer 15. A gold plating layer 16 was formed.

(18) Thereafter, a solder paste is printed on the opening of the solder resist layer 14 and reflowed at 200 ° C. to form a solder bump (solder body) 17.
A multilayer wiring printed board having the solder bumps 17 was manufactured (see FIG. 5C).

Comparative Example 1 A printed wiring board having solder bumps was manufactured in the same manner as in Example 1, except that a solder resist layer was formed using a solder resist composition having the following component composition. 60% by weight in DMDG
Of a cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd.) having an acrylated 50% epoxy group (molecular weight: 40).
00) 46.67 parts by weight, 80% by weight of a bisphenol A type epoxy resin (manufactured by Yuka Shell Co., trade name: Epicoat 1001) dissolved in methyl ethyl ketone 14.1
2 parts by weight, 1.6 parts by weight of an imidazole curing agent (trade name: 2E4MZ-CN, manufactured by Shikoku Chemicals), and a bifunctional acrylic monomer (trade name: R604, manufactured by Nippon Kayaku Co., Ltd.) which is a photosensitive monomer. 5 parts by weight, 6.0 parts by weight of a polyacrylic monomer (manufactured by Kyoei Chemical Co., Ltd., trade name: DPE6A), and a leveling agent composed of an acrylate polymer (manufactured by Kyoei Chemical Co., trade name: Polyflow No. 75) 0 .
36 parts by weight were placed in a container, stirred and mixed to prepare a mixed composition, and 2.0 parts by weight of Irgacure I-907 (manufactured by Ciba Geigy) as a photopolymerization initiator, and a photosensitizer as a photopolymerization initiator. DETX-S (manufactured by Nippon Kayaku Co., Ltd.)
By adding 0.2 part by weight and 1.0 part by weight of DMDG, a solder resist composition having a viscosity adjusted to 1.4 ± 0.3 Pa · s at 25 ° C. was obtained.

Comparative Example 2 A printed wiring board having solder bumps was manufactured in the same manner as in Example 1, except that an interlayer resin insulating material composition having the following component composition was used. A. Preparation of adhesive composition for electroless plating of upper layer 1) 25% acrylate of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., molecular weight: 2500) is dissolved in diethylene glycol dimethyl ether (DMDG) at a concentration of 80% by weight. 35 parts by weight of resin solution, photosensitive monomer (Aronix M315 manufactured by Toa Gosei Co., Ltd.) 3.15
A mixed composition was prepared by placing parts by weight, 0.5 parts by weight of an antifoaming agent (S-65 manufactured by San Nopco) and 3.6 parts by weight of N-methylpyrrolidone (NMP) in a container, and stirring and mixing.

2) Polyether sulfone (PES) 12
Parts by weight, 7.2 parts by weight of an epoxy resin particle (manufactured by Sanyo Kasei Co., polymer pole) having an average particle size of 1.0 μm and 3.09 parts by weight of an epoxy resin particle having an average particle size of 0.5 μm were placed in another container and stirred. After mixing, 30 parts by weight of NMP was further added and stirred and mixed by a bead mill to prepare another mixed composition.

3) Imidazole curing agent (Shikoku Chemicals, 2
E4MZ-CN), 2 parts by weight of a photopolymerization initiator (Irgacure I-907, manufactured by Ciba-Geigy), 0.2 parts by weight of a photosensitizer (DETX-S, manufactured by Nippon Kayaku) and NMP1. 5 parts by weight were placed in another container and mixed by stirring to prepare a mixed composition. And 1),
An adhesive for electroless plating was obtained by mixing the mixed compositions prepared in 2) and 3).

B. Preparation of Lower Interlayer Resin Insulator 1) Resin solution 35 in which 25% acrylate of cresol novolak type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., molecular weight: 2500) is dissolved in diethylene glycol dimethyl ether (DMDG) at a concentration of 80% by weight. Parts by weight, 4 parts by weight of a photosensitive monomer (Aronix M315, manufactured by Toa Gosei Co., Ltd.), 0.5 parts by weight of an antifoaming agent (S-65, manufactured by San Nopco) and 3.6 parts by weight of N-methylpyrrolidone (NMP) are placed in a container. Then, a mixed composition was prepared by stirring and mixing.

2) Polyether sulfone (PES) 12
14.49 parts by weight and epoxy resin particles (Polymer Pole, manufactured by Sanyo Kasei Co., Ltd.) having an average particle size of 0.5 μm
Transfer the parts by weight to another container, stir and mix.
30 parts by weight of P was added, and the mixture was stirred and mixed by a bead mill to prepare another mixed composition.

3) Imidazole curing agent (manufactured by Shikoku Chemicals Co., Ltd., 2
E4MZ-CN), 2 parts by weight of a photopolymerization initiator (Irgacure I-907, manufactured by Ciba-Geigy), 0.2 parts by weight of a photosensitizer (DETX-S, manufactured by Nippon Kayaku) and NMP1. 5 parts by weight were placed in another container and mixed by stirring to prepare a mixed composition. And 1),
An adhesive for electroless plating was obtained by mixing the mixed compositions prepared in 2) and 3).

With respect to the printed wiring boards of Example 1 and Comparative Examples 1 and 2 manufactured in this manner, -55 to 125
A heat cycle test was performed 1,000 times at ℃, and the occurrence of cracks in the interlayer resin insulating layer and the solder resist layer was observed with an optical microscope. In addition, temperature 12
The film was left at 8 ° C., a humidity of 85% and a pressure of 2 atm for 48 hours, and the interlayer resin insulating layer and the solder resist layer were observed with an optical microscope to confirm the presence or absence of peeling. The results are shown in Table 1 below.
It was shown to.

[0102]

[Table 1]

As is clear from the results shown in Table 1 above,
Printed wiring board using the photosensitive resin composition of the present invention,
No peeling of the interlayer resin insulation layer or the solder resist layer occurs, and the occurrence of cracks under heat cycle conditions can be suppressed.

[0104]

As described above, according to the photosensitive resin composition of the present invention, a photosensitive resin composition having excellent crack resistance under heat cycle conditions and excellent adhesion to a conductor circuit can be provided. . Further, according to the printed wiring board of the present invention, it is possible to provide a printed wiring board having excellent crack resistance under heat cycle conditions and excellent adhesion to a conductor circuit.

[Brief description of the drawings]

FIGS. 1A to 1D are cross-sectional views showing a part of a manufacturing process of a printed wiring board according to the present invention.

FIGS. 2A to 2D are cross-sectional views illustrating a part of a manufacturing process of a printed wiring board according to the present invention.

FIGS. 3A to 3D are cross-sectional views illustrating a part of the manufacturing process of the printed wiring board according to the present invention.

FIGS. 4A to 4C are cross-sectional views showing a part of the manufacturing process of the printed wiring board according to the present invention.

FIGS. 5A to 5C are cross-sectional views showing a part of the manufacturing process of the printed wiring board according to the present invention.

[Explanation of symbols]

 Reference Signs List 1 substrate 2 interlayer resin insulating layer (adhesive for electroless plating) 2a adhesive layer for electroless plating 2b adhesive layer for electroless plating 3 plating resist 4 lower conductive circuit (inner copper pattern) 5 upper conductive circuit 6 via hole Opening 7 via hole 8 copper foil 9 through hole 10 filling resin (resin filler) 11 roughening layer 12 electroless plating film 13 electrolytic plating film 14 solder resist layer 15 nickel plating layer 16 gold plating layer 17 solder bump

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/28 H05K 3/28 D // (C08F 290/06 230: 02) F-term (Reference) 2H025 AA00 AA14 AA20 AB15 AB16 AC01 AD01 BC14 BC31 BC34 BC43 BC74 BC83 BC84 CC17 DA20 4J011 QA13 QA22 QA25 QA42 QB20 QB22 SA01 SA15 SA16 SA21 SA64 WA01 4J027 AE01 AE02 AE03 AE04 BA02 BA03 BA07 BA15 BA25 CA25 BA27 CC24 BA27 AA32 AA33 CC01 FF01 GG09 GG11

Claims (3)

[Claims] 1. A (meth) acrylate of an epoxy resin,
A photosensitive resin composition comprising a curing agent and a (meth) acrylate monomer having a P atom in a molecule. 2. The photosensitive resin composition according to claim 1, wherein the (meth) acrylate monomer having a P atom in the molecule is represented by the following chemical formula (1) or (2). Embedded image (In the formula, n represents 0 or 1, a and b represent 1 or 2.) (In the formula, n represents 0 or 1, and c represents 1 or 2.) 3. A printed wiring board in which a photosensitive resin layer is formed on a substrate on which a conductive circuit is formed, wherein the photosensitive resin layer contains (meth) acrylate of an epoxy resin, a curing agent, and a P atom in a molecule. A printed wiring board comprising a reaction product of a (meth) acrylate monomer having the same.