JP2000266465A - Apparatus and method for drying substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove a treating liquid adhered to a rear end of a substrate without increasing a total amount of gas supplied to an air knife, by increasably switching an amount of the gas flowing to a second main tube by a second flow switching means, and additionally supplying a reduced amount of the gas in the first tube to a second main tube. SOLUTION: A flow controller 4 receiving an OFF signal from a first sensor PS1 and an ON signal from a second sensor PS2 sets an opening/closing valve V11 to a closed state, an opening/closing valve V21 to an open state, and an opening/closing valve V22 to a closed state. As a result, a gas supplied from a gas supply source to a main supply tube and branched to a first main tube L1 is branched to a bypass tube L11, then again returned to the tube L1, and supplied to a first air knife AK1. Contrarily, a gas branched to a second main tube L2 side is supplied to a second air knife AK2 without branching to a bypass tube 21. Thus, splash of cleaning liquid scattered from a substrate W can be prevented from being invaded into the knife AK1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention removes a processing liquid attached to various substrates such as a flat panel display (FPD) substrate such as a substrate for a liquid crystal display, a photomask substrate, and a semiconductor substrate and dries the substrate. The present invention relates to a substrate drying apparatus and a substrate drying method.

[0002]

2. Description of the Related Art As a substrate drying apparatus for drying a substrate having a processing liquid adhered to its main surface, for example, Japanese Utility Model Publication No. 8-30001
The one disclosed in Japanese Patent Application Laid-Open Publication No. H10-260, 1993 is known. This substrate drying device sprays a gas in a layer form from two air knives arranged along the transport direction of the substrate onto the main surface of the substrate to which the pure water cleaning liquid that is the processing liquid is attached and transported by the roller conveyor, The pure water cleaning solution is blown off from the main surface of the substrate and removed, and the substrate is dried. The two air knives are connected to two branch pipes branched from an air supply passage connected to the air supply fan. As described above, a configuration is also common in which the air supply path is connected to gas supply equipment installed as factory equipment without using an air supply fan in the substrate drying apparatus.

[0003]

When the gas supply from the air supply fan or the gas supply equipment to the two air knives is not sufficient, the processing liquid adhered to the rear end of the substrate in the substrate transport direction. Is not sufficiently removed. In order to solve this problem, it is conceivable to install an air supply fan having a high air supply capacity in the substrate drying apparatus. However, other problems such as an increase in apparatus cost and an increase in the size of the apparatus occur. It is also conceivable to increase the amount of gas supplied from the gas supply equipment to the substrate drying apparatus. In this case, however, another cost such as an increase in product cost in producing a product such as a liquid crystal display is increased. Problems arise.

In view of the above, an object of the present invention is to provide
Provided is a substrate drying apparatus capable of sufficiently removing a processing liquid attached to a rear end of a substrate without increasing the total amount of gas supplied to two air knives from a gas supply source such as an air supply fan or a gas supply facility. Is to do. It is another object of the present invention to increase the total amount of gas supplied from a gas supply to at least two air knives.
An object of the present invention is to provide a substrate drying method capable of sufficiently removing a processing liquid attached to a rear end of a substrate.

[0005]

According to a first aspect of the present invention, there is provided a substrate drying apparatus for drying a substrate by spraying a gas in a layered manner on a main surface of a substrate to which a processing liquid is attached. Transport means for transporting the substrate having the processing liquid attached to its main surface in a predetermined transport direction along the main surface;
A first air knife that blows gas in a layered manner onto a main surface of a substrate conveyed by the conveyance means, and is separated from the first air knife downstream of the first air knife by a dimension smaller than a length dimension of the substrate in the conveyance direction. A second air knife, which is disposed at a position and sprays gas in a layered manner on the main surface of the substrate conveyed by the conveying means, and a branch from a main supply pipe connected to a gas supply source and connected to a first air knife. A first main pipe, a first flow switching means interposed in the first main pipe and switching a flow rate of gas flowing through the first main pipe;
A second main pipe branched from the main supply pipe and connected to the second air knife in a flow path; a second flow rate switching unit interposed in the second main pipe and switching a flow rate of gas flowing through the second main pipe; and a first air knife. First position detecting means for detecting the position of the substrate with respect to the first gas blowing position, second position detecting means for detecting the position of the substrate with respect to the second gas blowing position by the second air knife, and first blowing After the first position detecting means detects that the rear end of the substrate has passed the position,
In the substrate rear end processing time until the second position detecting means detects that the rear end of the substrate has passed the second spray position, the amount of gas flowing through the first main pipe is reduced by the first flow rate switching means. The amount of gas flowing through the second main pipe is switched by the second flow rate switching means so as to be increased.
Flow rate control means for additionally supplying a reduced amount of gas in the main pipe to the second main pipe.

[0006] The invention according to claim 2 is based on the first aspect.
The flow rate switching means includes a first main pipe opening / closing valve provided in the first main pipe and a first main pipe opening / closing valve bypassing the first main pipe opening / closing valve.
A first bypass pipe connected to the main pipe and flowing a smaller amount of gas than the first main pipe.

Further, the invention according to claim 3 is characterized in that the first bypass pipe is provided with a first bypass pipe opening / closing valve.

According to a fourth aspect of the present invention, the first flow rate switching means has a first flow rate control valve interposed in the first main pipe and capable of adjusting the amount of gas flowing through the first main pipe. It is characterized by.

[0009] The invention according to claim 5 is the above-mentioned second aspect.
The flow rate switching means includes a second main pipe opening / closing valve provided in the second main pipe and a second main pipe opening / closing valve bypassing the second main pipe opening / closing valve.
A second bypass pipe connected to the main pipe and flowing a smaller amount of gas than the second main pipe.

Further, the invention according to claim 6 is characterized in that the second bypass pipe is provided with a second bypass pipe opening / closing valve.

Further, in the invention according to claim 7, the second flow rate switching means has a second flow rate control valve interposed in the second main pipe and capable of adjusting the amount of gas flowing through the second main pipe. It is characterized by.

[0012] The invention according to claim 8 is that at least two branches branched from the main supply pipe connected to the gas supply source.
Each of the branch pipes is connected to one of the branch pipes, and is separated from each other by a dimension smaller than the length of the substrate in the direction of transport of the substrate. In a substrate drying method for removing a processing liquid adhered to a substrate by spraying a gas onto the surface in a layered manner, a rear end of the substrate to be transported is first blown by a first air knife disposed upstream in the transport direction. Gas supply amount to the first air knife until the rear end of the substrate passes the second air knife blowing position by the second air knife disposed downstream of the first air knife after passing through the application position. To reduce
The amount of decrease in the amount of gas is additionally supplied to the second air knife to increase the amount of gas discharged from the second air knife.

According to a ninth aspect of the present invention, when the first spraying position and the second spraying position are on the main surface of the substrate to be conveyed, the discharge amount of the gas from the first air knife and the second spraying position are determined.
The discharge amount of gas from the air knife is made substantially equal.

According to a tenth aspect of the present invention, the second air knife is supplied to the second air knife until the front end of the conveyed substrate passes through the first spray position and the front end of the substrate reaches the second spray position. It is characterized in that the supply amount of gas is reduced.

Still further, the invention according to claim 11 is characterized in that the amount of gas supply from the first air knife is increased by additionally supplying the reduced amount of gas supply to the second air knife to the first air knife. I do.

[0016]

Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram showing a first embodiment of the present invention. In FIG. 1, a substrate cleaning apparatus 1 cleans a substrate W by supplying a cleaning liquid as a processing liquid to a main surface of a rectangular substrate W for a liquid crystal display. The substrate drying device 2 removes the cleaning liquid attached to the main surface of the substrate W cleaned by the substrate cleaning device 1.

The substrate cleaning apparatus 1 is provided with a substantially box-shaped cleaning tank 11 that covers the periphery of the substrate W to which the cleaning liquid CL is supplied. A carry-in port 12 for carrying the substrate W into the cleaning tank 11 is formed on the upstream side surface of the cleaning tank 11, and a carry-out port 13 for carrying out the substrate W from the cleaning tank 11 is formed on the downstream side surface. Have been. The bottom surface of the cleaning tank 11 is funnel-shaped, and near the center of the bottom surface, the cleaning liquid CL supplied to the substrate W and the atmosphere in the cleaning tank 11 are filled with the cleaning tank 11.
A discharge port 14 for discharging to the outside is formed.

Inside the cleaning tank 11, a plurality of transport rollers for transporting the substrate W in a transport direction (rightward in FIG. 1) along its main surface at a transport speed of, for example, 100 cm / min while supporting the substrate W substantially horizontally. 15 are arranged in parallel with each other along the transport direction. Above the plurality of transport rollers 15, a plurality of nozzles 16 for supplying the cleaning liquid CL to the upper main surface of the substrate W are arranged by a mounting member (not shown) fixed to the cleaning tank 11. The cleaning liquid supply pipes 17 connected to the cleaning liquid supply source LS installed as factory equipment outside the substrate cleaning apparatus 1 are connected to the respective nozzles 16 by flow paths.

A substrate drying device 2 is disposed downstream of the substrate cleaning device 1. The substrate drying device 2 includes a drying tank 21 that covers the periphery of the substrate W to be dried. The upstream side surface of the drying tank 21 is in contact with the downstream side surface of the cleaning tank 11. Also, on the upstream side surface of the drying tank 21,
A carry-in port 22 for carrying the substrate W into the drying tank 12 is formed so as to communicate with the carry-out port 13 of the cleaning tank 11. On the downstream side surface of the drying tank 21, an outlet 23 for unloading the substrate W from the inside of the drying tank 21 is formed. The bottom of the drying tank 21 has a funnel shape, and a discharge port 24 for discharging the cleaning liquid removed from the substrate W and the atmosphere in the drying tank 21 to the outside of the drying tank 21 is formed near the center of the bottom. .

Inside the drying tank 21, there are provided a plurality of transport rollers for transporting the substrate W at a transport speed of, for example, 100 cm / min in a transport direction (rightward in FIG. 1) along its main surface while supporting the substrate W substantially horizontally. 25 are arranged in parallel with each other along the transport direction. Above the plurality of transport rollers 25, a first air knife AK1 and a second air knife AK
Numerals 2 are arranged in parallel with each other in the substrate transport direction by a mounting member (not shown) fixed to the upper inner surface of the drying tank 21. Also, as shown in FIG.
The K1 and the second air knife AK2 are inclined within a range of, for example, 10 degrees to 50 degrees with respect to the vertical direction, and also, for example, 5 degrees to 50 degrees with respect to a direction orthogonal to the transport direction as shown in FIG. It is inclined within the range.

The first air knife AK1 and the second air knife AK2 have the same structure, and have a tip slightly opposite to the upper main surface of the substrate W to be transported, which is slightly larger than the width of the substrate orthogonal to the substrate transport direction. A slit-shaped discharge port having a length dimension is formed.

The first air knife AK1 and the second air knife AK2 are provided with a main supply pipe LS connected to a gas supply source AS installed as factory equipment outside the substrate drying apparatus 21.
The first main pipe L1 and the second main pipe L2, each of which is branched from, are connected to the respective flow paths. A filter FL for purifying gas flowing in the main supply pipe LS is interposed in the main supply pipe LS.

The first main pipe L1 and the second main pipe L2 are provided with a flow rate switching section 3. The flow switching unit 3 includes a first flow switching unit 31 provided in the first main pipe L1 and a second flow switching unit 32 provided in the second main pipe L2. First
The flow rate switching unit 31 includes an on-off valve V11 provided on the first main pipe L1 and a bypass pipe L11 connected to the first main pipe L1 so as to bypass the on-off valve V11. An opening / closing valve V12 is provided in the bypass pipe L11.

The pipe diameter of the bypass pipe L11 is the first main pipe L
1, and as a result, the bypass pipe L11
The amount of gas flowing in the inside becomes smaller than the amount of gas flowing in the first main pipe L1. Specifically, the first main pipe L1 is capable of flowing gas of, for example, 300 L / min (liter / minute) or less, and the bypass pipe L11 is, for example, 1 L / min.
It is possible to flow gas at an amount of 0 L / min or less.

The second flow rate switching section 32 includes an on-off valve V21 interposed in the second main pipe L2, and a bypass pipe L21 connected to the second main pipe L2 so as to bypass the on-off valve V21. I have. An open / close valve V22 is interposed in the bypass pipe L21. The pipe diameter of the bypass pipe L21 is smaller than the pipe diameter of the second main pipe L2. As a result, the amount of gas flowing in the bypass pipe L21 is smaller than the amount of gas flowing in the second main pipe L2. Specifically, the second
The main pipe L2 is, for example, 600 L / min (liter / minute).
The following amount of gas can flow, and the bypass pipe L
For example, the gas 21 can flow a gas of 300 L / min or less. In FIG. 1, the open / close valve V11 and the open / close valve V22 are each in an open state, and the open / close valve V12 and the open / close valve V21 are in a closed state. In FIG. 1 and each of the drawings described later, in order to clarify the open / closed state of each valve, the valve in the open state is shown in black, and the valve in the closed state is shown in white.

The first air knife AK1 blows the gas a1 below the first spray position p1 and the second air knife AK2 blows the gas a2.
Below the blowing position p2, a first sensor PS1 and a second sensor PS2 are arranged along the transport direction. Each of the first sensor PS1 and the second sensor PS2 is a pendulum-type sensor, and includes a pendulum unit that can swing around a fulcrum and a detection unit that detects displacement of the pendulum unit. The height position of the first sensor PS1 and the second sensor PS2 is set at a position where the pendulum in the upright state is pushed down by the front end F of the substrate W to be transported.

Since the height positions of the sensors PS1 and PS2 are set as described above, the front end F of the substrate W to be transported is placed in an upright state by its own weight.
1. By touching the tip of the pendulum part of PS2 and pushing down the pendulum part, the pendulum part of each of the sensors PS1 and PS2 inclines about the fulcrum and becomes in an inclined state. This inclined state
It is maintained while the tip of the pendulum part is in contact with the lower main surface of the substrate. Each detecting unit detects the displacement of each pendulum unit from the upright state to the inclined state, and detects that the front end F of the substrate W has passed over each of the sensors PS1 and PS2.

When the rear end R of the substrate W passes over the sensors PS1 and PS2 as the substrate W is transported, the front ends of the pendulums of the sensors PS1 and PS2 and the lower main surface of the substrate W Are no longer in contact with each other, and each pendulum in the inclined state returns to the upright state by its own weight. Each detecting unit detects the displacement of each pendulum from the inclined state to the upright state, and the rear end R of the substrate W is connected to each of the sensors PS1 and PS.
2 is detected.

The first sensor PS1 has a first signal line SL1
Is electrically connected to the second sensor PS2.
One end of the second signal line SL2 is electrically connected.
The other ends of the first signal line SL1 and the second signal line SL2 are electrically connected to the flow control unit 4, respectively. The flow control unit 4 is provided in a control device including a microcomputer that controls the substrate drying device 2 and the like.
The flow control unit 4 includes a first sensor PS1 and a second sensor P
Based on signals transmitted from S2 via the first signal line SL1 and the second signal line SL2, each of the open / close valves V11,
A signal for instructing the opening / closing operation is transmitted to V12, V21, and V22. The flow control unit 4 may be configured by a logic circuit separate from the control device.

Next, the operation of the above-described substrate cleaning apparatus 1 and substrate drying apparatus 2 will be described. As shown in FIG.
The substrate W loaded from the loading port 12 of the cleaning tank 11 is transported in a direction along the main surface thereof while being supported substantially horizontally by the plurality of transport rollers 15 in the cleaning tank 11. Substrate W
When a sensor (not shown) detects that the cleaning liquid has been carried into the cleaning tank 11, the cleaning liquid supplied to the plurality of nozzles 16 from the cleaning liquid supply source LS via the cleaning liquid supply pipe 17 respectively flows from the discharge ports of the plurality of nozzles 16. The liquid is discharged toward the upper main surface of the substrate W to be transported. Multiple nozzles 1
The cleaning liquids respectively discharged from 6 are supplied to the upper main surface of the substrate W, and the upper main surface of the substrate W is cleaned. The cleaning liquid supplied to the substrate W and flowing down from the substrate W is discharged from the discharge port 14 to the outside of the cleaning tank 11. Substrate W after cleaning process
Is carried out toward the substrate drying apparatus 2 through the carry-out port 13.

The substrate W carried out of the substrate cleaning apparatus 1 and having the cleaning liquid adhered to the upper main surface thereof is carried into the drying tank 21 of the substrate drying apparatus 2 through the carry-in port 22. In FIG.
FIG. 3 is a schematic diagram showing a state before a front end F of a substrate W carried into a drying tank 21 reaches a first spraying position p1. Also,
FIG. 4A is a plan view for explaining the state shown in FIG. As shown in FIG. 2, before the front end F of the substrate W reaches the first blowing position p1, the pendulum portions of the first sensor PS1 and the second sensor PS2 are both in an upright state.
At this time, the first sensor PS1 and the second sensor PS2
Transmits an OFF signal indicating that the pendulum is in the upright state to the flow controller 4 via the first signal line SL1 and the second signal line SL2. Upon receiving these OFF signals, the flow control unit 4 opens and closes the on-off valve V11,
A signal is transmitted to each of the on-off valves V11, V12, V21, and V22 so that the on-off valve V12 is closed, the on-off valve V21 is closed, and the on-off valve V22 is opened.

Upon receiving the signal from the flow controller 4, the open / close valve V11 is opened, the open / close valve V12 is closed, the open / close valve V21 is closed, and the open / close valve V22 is open. As a result, the gas supplied from the gas supply source AS to the main supply pipe LS and branched to the first main pipe L1 side is supplied to the first air knife AK1 without branching to the bypass pipe L11. Further, the gas branched to the second main pipe L2 side is branched to the bypass pipe L21 and then again to the second main pipe L2.
Is returned to the second air knife AK2. As described above, the first main pipe L1 and the bypass pipe L21 have a capacity of 300 L /
min or less, it is possible to flow the gas from the gas supply source AS to the main supply pipe LS, for example, 600 L / mi.
When the gas of n amount is supplied, the gas of 300 L / min is branched from the main supply pipe LS to the first main pipe L1 side,
The gas at a rate of 300 L / min branches to the main pipe L2 side.
Then, the first air knife AK1 and the second air knife A
The same amount (about 300 L / min) of gas is discharged from K2.

Then, the substrate W is transported by the plurality of transport rollers 25, as shown in FIGS. 1 and 4 (b).
The first spray position p1 and the second spray position p2 correspond to the substrate W
Are located on the upper main surface. At this time, gases a1 and a2 are blown in layers from the respective air knives AK1 and AK2 in a direction opposite to the transport direction over a width direction orthogonal to the transport direction of the substrate W to be transported. The cleaning liquid adhering to the main surface is blown off from the main surface toward the upstream side in the transport direction and is removed. Further, the pendulum portions of the sensors PS1 and PS2 are both in the inclined state, and an ON signal is transmitted to the flow control unit 4, respectively. Also in this state, the state where the same amount of gas is discharged from each of the air knives AK1 and AK2 is continued.

Next, as shown in FIGS. 3 and 4C, the rear end processing of the substrate W until the rear end R of the substrate W passes through the first blowing position p1 and passes through the second blowing position p2. The operation at time will be described. During the substrate rear end processing time, the pendulum portion of the first sensor PS1 is displaced in an upright state by its own weight because the front end thereof is not in contact with the lower main surface of the substrate W. The detection unit of the first sensor PS1 detects that the pendulum unit is in the upright state, and an OFF signal is transmitted from the first sensor PS1 to the flow control unit 4. On the other hand, the tip of the pendulum of the second sensor PS2 is kept in contact with the lower main surface of the substrate W, so that the pendulum is maintained in an inclined state. The detector of the second sensor PS2 detects that the pendulum is in an inclined state, and an ON signal is transmitted from the second sensor PS2 to the flow controller 4.

The OFF signal from the first sensor PS1 is output to the second sensor PS1.
The flow controller 4 receiving the ON signals from the sensors PS2 respectively closes the open / close valve V11, opens the open / close valve V12, opens / closes the open / close valve V21, and closes the open / close valve V22 as shown in FIG. Set each state. As a result, the gas supplied from the gas supply source AS to the main supply pipe LS and branched to the first main pipe L1 side is supplied to the bypass pipe L1.
After branching to No. 1, the air returns to the first main pipe again and the first air knife A
It is supplied to K1. On the other hand, the gas branched to the second main pipe L2 side is supplied to the second air knife AK2 without branching to the bypass pipe 21. As described above, since the bypass pipe L11 can flow gas only at an amount of 10 L / min or less, in the state shown in FIG. 3, the amount of gas branched from the main supply pipe LS to the first main pipe L1 is 10 L / min. Become. On the other hand, since the second main pipe L2 can flow gas at a rate of 600 L / min, 290 L / min, which is a decrease in gas in the first main pipe L1, is additionally supplied to the second main pipe L2 side. 590L / mi in the second main pipe L2.
A quantity n of gas flows. And the first air knife AK1
The discharge rate of gas from is reduced to about 10 L / min.
The discharge amount of gas from the air knife AK2 is about 590 L / m
increase to in.

As described above, during the substrate rear end processing time, a large amount of gas is discharged from the second air knife AK2 to the rear end of the substrate W, and the cleaning liquid attached to the rear end of the substrate W is sufficiently removed. . Further, the amount of gas supplied to the first air knife AK1 is reduced, and the reduced amount is used as the second air knife A1.
Since the gas is additionally supplied to K2, the total amount of gas supplied from the gas supply source AS to the first air knife AK1 and the second air knife AK2 is constant at, for example, 600 L / min. Further, since a small amount of gas is discharged from the first air knife AK1, it is possible to prevent the cleaning liquid splashed from the substrate W into the first air knife AK1 from entering the first air knife AK1. Re-contamination of the substrate due to contamination can be prevented.

The substrate rear end processing time is continued until the rear end R of the substrate W passes through the second spray position p2. That is, as shown in FIG. 4D, when the rear end R of the substrate W passes through the second spray position p2, the pendulum of the second sensor PS2 does not contact the lower main surface of the substrate W. It is displaced upright by its own weight. As a result, as shown in FIG.
The sensor PS1 and the second sensor PS2 are both in the upright state, and the first air knife AK1 and the second
Almost the same amount (about 300 L / mi) from the air knife AK2
While discharging the gas of n), as shown in FIG. 4D, a state is established in which the substrate W2 to be dried next is on standby.

Next, a modified example of the flow rate switching unit 3 will be described with reference to FIG. In FIG. 5, the members denoted by the same reference numerals as those in FIG. 1 indicate the same members as the members illustrated in FIG. 1, and the detailed description thereof will be omitted. FIG.
, C1, c2, c3, and c4 are connection portions with the first main pipe L1 and the second main pipe L2.

As shown in FIG. 5A, the bypass pipe L1
2. A configuration may be adopted in which the flow rate is switched only by the open / close valves V11 and V21 without providing the open / close valve in L22. In particular,
During the above-described substrate rear end processing time (FIG. 4C), the open / close valve V11 is closed and the open / close valve V21 is opened. In the states shown in FIGS. 4A, 4B, and 4D, the open / close valve V11 is opened and the open / close valve V2 is opened.
1 is closed.

As shown in FIG. 5B, instead of providing a bypass pipe in the first main pipe L1, a valve V13 with a slow leak function may be provided in the first main pipe L1. Bubble 1
Reference numeral 3 denotes a valve that can flow a small amount of gas (for example, 10 L / min) in a closed state. Specifically, during the above-described substrate rear end processing time (FIG. 4C), the valve V1
3 is closed, the on-off valve V21 is opened, and the on-off valve 22 is closed. 4 (a) and 4 (b)
In the state shown in (d), the valve V13 is opened, the open / close valve V21 is closed, and the open / close valve 22 is open.

As shown in FIG. 5 (c), the first main pipe L1 and the second main pipe L2 each have a valve 1 having a flow control function.
4 and 24 may be interposed respectively. This valve 1
Numerals 4 and 24 change the opening of the orifice diameters in the valves 14 and 24 based on an electric signal from the flow control unit 4 and can adjust the amount of gas flowing in the valves 14 and 24. Specifically, the above-described substrate rear end processing time (FIG. 4)
In (c)), the opening is changed so that the orifice diameter in the valve 14 becomes smaller, and the opening is changed so that the orifice diameter in the valve V24 becomes larger. FIG.
(A) In the state shown in (b) and (d), the valve V1
The respective opening degrees are changed so that the orifice diameter in 4 and the orifice diameter in the valve V24 become equal.

Further, in the first embodiment shown in FIG. 3, during the substrate rear end processing time, both of the open / close valves 11 and 12 may be closed to stop the gas discharge from the first air knife AK1.

Next, as shown in FIG. 6A, the front end R of the substrate W passes through the first blowing position p1 and the second blowing position p.
A modified example in the substrate front end processing time until passing through No. 2 will be described. In this substrate front end processing time, FIG.
As shown in (b), the opening and closing valves 21 and 22 are both closed, and the discharge of gas from the second air knife AK2 is stopped. Then, the open / close valve 11 is opened, and the open / close valve V
12 is closed, and a gas of, for example, about 300 L / min is discharged only from the second air knife AK2.

Further, using the flow rate switching section 3 shown in FIG. 5C, the pipe diameter of the first main pipe L1 and the second main pipe L2
May be set to a pipe diameter capable of flowing a gas of, for example, an amount of 600 L / min. Then, when the opening degrees of the orifices of the valves 24 and 14 are respectively changed so as to reduce the orifice diameter of the valve 24 and increase the orifice diameter of the valve 14, a large amount (for example, 590 L / min) of gas flows into the first main pipe L1. Flow, second main pipe L
A small amount (for example, 10 L / min) of gas flows through 2.
As a result, a large amount of gas is discharged from the first air knife AK1 toward the front end of the substrate W, and the cleaning liquid attached to the front end of the substrate W is efficiently removed. Also, a small amount of gas is discharged from the second air knife AK2 and the second air knife A
Contamination in K2 can be prevented.

The present invention is not limited to the above embodiments. For example, the processing liquid removed from the main surface of the substrate W by the substrate drying device 2 may be various processing liquids such as a developing liquid, an etching liquid, and a stripping liquid. In each of the above-described embodiments, the substrate W is transported while being horizontally supported by the plurality of transport rollers 15 and 16. However, the main surface of the substrate W is tilted left and right in the transport direction of the substrate W. The substrate W may be transported in the direction along. In this case, it is preferable that the air knives are installed in parallel with the substrate W in order to make the distance between the slit-shaped discharge ports of the air knives AK1 and AK2 and the main surface of the substrate W constant. Further, the substrate may be transported vertically along the main surface of the substrate. Further, each of the air knives AK1 and AK2 may be arranged in parallel with a direction orthogonal to the transport direction of the substrate W. Further, each of the air knives AK1 and AK2 may be inclined in directions different from each other with respect to a direction orthogonal to the transport direction, and may be arranged in a C shape in plan view. Furthermore, each air knife AK1, AK
2 may be arranged on the lower main surface side of the substrate W to remove the processing liquid attached to the lower main surface, or may be arranged on both main surface sides. For example, an air supply fan or the like may be installed in the substrate drying device 2 as the gas supply source AS. Also,
Each of the sensors PS1 and PS2 may be an optical sensor. The substrate to be dried may be a substantially circular semiconductor wafer.

[0046]

As described above in detail, according to the first or eighth aspect of the present invention, the amount of gas supplied to the first air knife is reduced during the substrate rear end processing time,
Since the reduced amount of the gas can be additionally supplied to the second air knife to increase the discharge amount from the second air knife, without increasing the total amount of gas supplied to the first air knife and the second air knife, The processing liquid attached to the rear end of the substrate can be sufficiently removed.

According to the invention of any one of claims 2 to 7, the amount of gas supply to the first air knife and the second air knife can be switched with a simple configuration.

Further, according to the ninth aspect of the present invention, the first
When the spray position and the second spray position are on the main surface of the substrate, the discharge amounts of the gas from the first air knife and the second air knife can be made substantially equal, so that a uniform drying process can be performed. Become.

According to the tenth aspect of the present invention, when only the first spraying position is on the main surface of the substrate, the amount of gas supplied to the second air knife is reduced. And production costs of products can be reduced.

Further, according to the eleventh aspect of the present invention, the reduced amount of gas supply to the second air knife can be supplied to the first air knife to increase the amount of gas discharged from the first air knife. Without increasing the total amount of gas supplied to the first air knife and the second air knife,
The removal efficiency of the processing liquid attached to the front end of the substrate can be improved by the air knife.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing a state before a front end of a substrate reaches a first spraying position in the first embodiment.

FIG. 3 is a schematic diagram illustrating a state of a substrate rear end processing time in the first embodiment.

FIG. 4 is a plan view for explaining a positional relationship between each spraying position and a substrate in the first embodiment.

FIG. 5 is a schematic diagram showing a modification of the flow switching unit.

FIG. 6 is an explanatory diagram for explaining a modification in the substrate front end processing time.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 substrate cleaning device 2 substrate drying device 3 flow rate switching unit 4 flow rate control unit 15, 25 transport roller W, W1, W2 substrate AK1 first air knife AK2 second air knife AS gas supply source LS main supply pipe L1 first main pipe L11, L12 , L21, L22 Bypass pipe L2 Second main pipe p1 First blowing position p2 Second blowing position PS1 First sensor PS2 Second sensor V11, V12, V21, V22 Open / close valve V13, V14, V24 Valve F Front end of substrate Back end of board

Claims (11)

[Claims] 1. A substrate drying apparatus for drying a substrate by spraying a gas onto the main surface of the substrate to which the processing liquid has adhered in a layered manner, wherein the substrate having the processing liquid attached to the main surface is transported along the main surface in a predetermined manner. Transport means for transporting the substrate in a direction, a first air knife for blowing gas in a layered manner on a main surface of the substrate transported by the transport means, and a length of the substrate in the transport direction downstream of the first air knife in the transport direction. A second air knife disposed at a position separated by a dimension smaller than the dimension and spraying a gas in a layered manner on the main surface of the substrate conveyed by the conveying means, and branching from a main supply pipe connected to a gas supply source in a flow path. , First
A first main pipe connected to the air knife, a first flow switching means interposed in the first main pipe for switching a flow rate of gas flowing through the first main pipe, a branch from the main supply pipe, and a flow path to the second air knife A second main pipe connected to the second main pipe; second flow rate switching means interposed between the second main pipe and switching a flow rate of gas flowing through the second main pipe; and detecting a position of the substrate with respect to a first spray position of gas by the first air knife. First position detecting means, second position detecting means for detecting a position of the substrate relative to a second blowing position of the gas by the second air knife, and first detecting that the rear end of the substrate has passed the first blowing position.
In the substrate rear end processing time from the detection by the position detection means to the detection of the passage of the rear end of the substrate by the second position by the second position detection means, the first main pipe is switched by the first flow rate switching means. The amount of gas flowing through the second main pipe is reduced by switching the amount of gas flowing through the second main pipe by the second flow switching means while the amount of gas flowing through the first main pipe is increased. Control means;
A substrate drying apparatus comprising: 2. The first main pipe connected to the first main pipe so as to bypass the first main pipe opening / closing valve and the first main pipe opening / closing valve provided in the first main pipe. The substrate drying apparatus according to claim 1, further comprising a first bypass pipe through which a smaller amount of gas flows than the first gas. 3. The substrate drying apparatus according to claim 2, wherein the first bypass pipe is provided with a first bypass pipe opening / closing valve. 4. The substrate according to claim 1, wherein the first flow rate switching means has a first flow rate control valve interposed in the first main pipe and capable of adjusting the amount of gas flowing through the first main pipe. Drying equipment. 5. The second main pipe connected to the second main pipe so as to bypass the second main pipe opening / closing valve and a second main pipe opening / closing valve provided in the second main pipe. The substrate drying apparatus according to any one of claims 1 to 4, further comprising a second bypass pipe through which a smaller amount of gas flows than the first gas. 6. The substrate drying apparatus according to claim 5, wherein a valve for opening and closing the second bypass pipe is provided in the second bypass pipe. 7. The apparatus according to claim 1, wherein the second flow rate switching means has a second flow rate control valve interposed in the second main pipe and capable of adjusting the amount of gas flowing through the second main pipe. The substrate drying apparatus according to any one of the above. 8. A flow path connected to at least two branch pipes each branched from a main supply pipe connected to a gas supply source, and separated from each other by a dimension smaller than the length of the substrate in the substrate transport direction. A substrate drying method for removing a processing liquid adhered to the substrate by spraying gas in a layered manner on a main surface of the substrate to be transported by at least two air knives arranged along the transport direction. The rear end of the substrate passes through a first spray position of the gas by the first air knife disposed on the upstream side in the transport direction, and the rear end of the substrate is formed by the second air knife disposed on the downstream side of the first air knife. The gas supply amount to the first air knife is reduced until the second air knife passes the second blowing position, and the reduced amount of the gas is supplied to the second air knife. A method for drying a substrate, characterized by increasing the amount of gas discharged from a second air knife by additionally supplying. 9. The discharge amount of gas from the first air knife and the discharge amount of gas from the second air knife when the first spray position and the second spray position are on the main surface of the substrate to be conveyed. 9. The method for drying a substrate according to claim 8, wherein 10. A supply amount of gas to a second air knife is reduced until a front end of a substrate to be conveyed passes through a first spray position and the front end of the substrate reaches a second spray position. The substrate drying method according to claim 8, wherein the substrate is dried. 11. The discharge amount of gas from the first air knife is increased by additionally supplying a decrease in the amount of gas supply to the second air knife to the first air knife.
3. The method for drying a substrate according to item 1.