JP2000252267A5 - - Google Patents

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Publication number
JP2000252267A5
JP2000252267A5 JP1999365010A JP36501099A JP2000252267A5 JP 2000252267 A5 JP2000252267 A5 JP 2000252267A5 JP 1999365010 A JP1999365010 A JP 1999365010A JP 36501099 A JP36501099 A JP 36501099A JP 2000252267 A5 JP2000252267 A5 JP 2000252267A5
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JP
Japan
Prior art keywords
wiring
base
power supply
lower electrode
electrode structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999365010A
Other languages
English (en)
Japanese (ja)
Other versions
JP4463363B2 (ja
JP2000252267A (ja
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Publication date
Application filed filed Critical
Priority to JP36501099A priority Critical patent/JP4463363B2/ja
Priority claimed from JP36501099A external-priority patent/JP4463363B2/ja
Publication of JP2000252267A publication Critical patent/JP2000252267A/ja
Publication of JP2000252267A5 publication Critical patent/JP2000252267A5/ja
Application granted granted Critical
Publication of JP4463363B2 publication Critical patent/JP4463363B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP36501099A 1998-12-28 1999-12-22 下部電極構造およびそれを用いたプラズマ処理装置 Expired - Fee Related JP4463363B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36501099A JP4463363B2 (ja) 1998-12-28 1999-12-22 下部電極構造およびそれを用いたプラズマ処理装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP37202798 1998-12-28
JP10-372027 1998-12-28
JP36501099A JP4463363B2 (ja) 1998-12-28 1999-12-22 下部電極構造およびそれを用いたプラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2000252267A JP2000252267A (ja) 2000-09-14
JP2000252267A5 true JP2000252267A5 (https=) 2007-03-01
JP4463363B2 JP4463363B2 (ja) 2010-05-19

Family

ID=26581633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36501099A Expired - Fee Related JP4463363B2 (ja) 1998-12-28 1999-12-22 下部電極構造およびそれを用いたプラズマ処理装置

Country Status (1)

Country Link
JP (1) JP4463363B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10152101A1 (de) * 2001-10-23 2003-05-22 Infineon Technologies Ag Elektrostatische Wafer-Haltevorrichtung
US7736528B2 (en) 2005-10-12 2010-06-15 Panasonic Corporation Plasma processing apparatus and plasma processing method
JP4361045B2 (ja) * 2005-10-12 2009-11-11 パナソニック株式会社 プラズマ処理装置及びプラズマ処理方法
US9083182B2 (en) * 2011-11-21 2015-07-14 Lam Research Corporation Bypass capacitors for high voltage bias power in the mid frequency RF range
US9355776B2 (en) * 2014-04-09 2016-05-31 Applied Materials, Inc. Capacitor assemblies for coupling radio frequency (RF) and direct current (DC) energy to one or more common electrodes
US10991591B2 (en) 2018-01-29 2021-04-27 Ulvac, Inc. Reactive ion etching apparatus
JP7474651B2 (ja) * 2019-09-09 2024-04-25 東京エレクトロン株式会社 プラズマ処理装置
CN113270355B (zh) * 2021-05-14 2024-05-17 北京北方华创微电子装备有限公司 静电吸附承载装置
CN115050627B (zh) * 2022-06-29 2025-09-16 北京北方华创微电子装备有限公司 用于半导体工艺腔室的上电极组件及该半导体工艺腔室

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