JP2000244130A - Wiring board, core board, and their manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board having a structure which has a condenser built near a mounted IC chip, which is easily manufactured with high production yield, and a reduced loss in cost, even if a nonconformity of capacitor is found in a manufacturing process, a core board using the wiring board, and a method of manufacturing the core board easily at a low cost. SOLUTION: A wiring board 600 has a core board 610, resin-insulating layers 621, 631, 641, 651 laminated on each of the obverse and reverse surfaces 610A, 610B of the core board 110, and wiring layers 625, 635. The core board 610 has a base metal plate 601, a plurality of composite dielectric layers 611, 612, 613, 614 laminated alternately on the base metal plate 601 and its obverse and reverse surfaces 601A, 601B and containing epoxy resin and high dielectric power, and a plurality of metal layers 602, 603, 604, 605 each of which is thinner than the base metal plate 601, wherein these layers are face opposite each other with the composite dielectric layers 611 white sandwiching the layers 611 to constitute a laminated condenser C61.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board having a core board, a resin insulating layer and a wiring layer laminated on the front and back surfaces thereof, a core board, and a method of manufacturing the same. TECHNICAL FIELD The present invention relates to a wiring board, a core board, and a method of manufacturing the same, in which the above problem is prevented.

[0002]

2. Description of the Related Art Conventionally, a decoupling capacitor for removing noise has been provided between a ground wiring and a power supply wiring of an IC chip. For example, a chip capacitor is mounted on a front surface or a back surface of a wiring board. What was used is used. In the wiring board 300 shown in FIG. 22, three resin insulating layers 320, 340, 360, 330, 350, and 370 are provided on the front and back surfaces (upper and lower surfaces in the figure) of the core substrate 310, respectively.
Are formed in layers, and wiring layers 315, 325,
345, 335 and 355 are formed. Further, a chip capacitor CC is mounted on a wiring layer (pad) 355 by solder SL on the substrate back surface (lower surface in the figure) 300B of the wiring substrate 300. This wiring board 30
0, the two electrodes CCA, C of the chip capacitor CC
CB indicates each wiring layer 325 and the like and the through-hole conductor 31
6, the wiring is drawn to the upper surface 300A of the wiring substrate 300, that is, the wiring layer (pad) 345, and is connected to the IC chip connected to the upper surface 300A of the substrate.

[0003]

However, when such a chip capacitor is mounted and connected to a wiring board,
It takes man-hours for that. In addition, since chip capacitors will be placed on the back of the substrate and around the IC chip,
The distance from the IC chip to the chip capacitor becomes longer, and noise penetrates the wiring on the way. Therefore, in order to form the capacitor integrally with the wiring board and near the IC chip, it is conceivable to form a capacitor in which a part of the resin insulating layer is a dielectric layer in the wiring board.

However, the structure of a capacitor in which a thin dielectric layer is sandwiched between electrode layers having a large area is made up of a resin insulating layer 320 and wiring layers 315 and 325 in FIG. 22, for example. Attempts to achieve this will easily cause short-circuits and other inconveniences, and will greatly reduce the yield of wiring boards. In addition, when a resin insulating layer, a wiring layer, or the like is formed on the core substrate and a value is added, a defect of the formed capacitor is found, so that a loss amount due to disposal of the defective product increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has a capacitor built in near an electronic component to be mounted, is easy to manufacture, has a high yield, and has found a defect in the capacitor during the manufacturing process. It is an object of the present invention to provide a wiring board having a structure in which the amount of loss is small even if it is performed, a core board used for such a wiring board, and a method for manufacturing the core board easily and inexpensively.

[0006]

Means for Solving the Problems, Actions and Effects The means for solving the problems include a core substrate, a resin insulating layer laminated on the front and back surfaces of the core substrate, respectively, A wiring layer formed between the core substrate and the resin insulating layer and / or between the resin insulating layers, wherein the core substrate includes a base metal plate and a resin. And a plurality of composite dielectric layers containing high-dielectric powder, and a plurality of metal layers thinner than the base metal plate, wherein the composite dielectric layer and the metal layer are provided on the surface of the base metal plate. And the base metal plate and the metal layer adjacent thereto, or the base metal plate and the metal layer adjacent thereto and the adjacent metal layers, the composite dielectric layer Across A wiring substrate constituting the layered capacitor and.

[0007] In the wiring board of the present invention, a base metal plate and a metal layer adjacent to the base metal plate, or
There is provided a layered capacitor including a base metal plate, a metal layer adjacent to the base metal plate, adjacent metal layers, and a composite dielectric layer. For this reason, since a capacitor having a large capacitance can be arranged at a position close to an electronic component such as an IC chip, effects such as noise removal can be obtained satisfactorily. In addition, since the layered capacitor is built in the core substrate, the characteristics of the layered capacitor, the presence or absence of short-circuit, and the like are inspected, and the wiring substrate can be formed using only the passed core substrate, that is, the resin insulating layer and the wiring layer can be formed. Therefore, the yield can be increased in the production of the wiring board. Even if the built-in capacitor has a problem such as a short circuit, it can be discarded in the state of the core substrate on which the resin insulating layer and the wiring layer are not formed. Can be suppressed. Therefore, an inexpensive wiring board can be obtained.

Further, glass-BT is used as a base plate.
When an insulating plate such as a resin composite material or a glass-epoxy resin composite material is used, it is necessary to further form an electrode of the capacitor. On the other hand, in the wiring board of the present invention, since the core substrate uses the base metal plate as the base plate, it can be used as it is as one of the electrodes of the capacitor. Further, since the base metal plate is thicker than the metal layer, the rigidity of the core substrate and the wiring substrate can be supported to some extent by the base metal plate. Therefore, the handling is easy.

In order to allow the potential of the base metal plate or the metal layer forming the electrode of the layered capacitor to be taken out from the surface or the back surface of the core substrate, a through-hole conductor conducting to the base metal plate or a desired metal layer is provided. Preferably, it is formed on a substrate. Therefore, it is preferable to include a through-hole conductor that guides the potential of the predetermined metal layer located in the inner layer excluding the metal layer located on the core substrate surface among the base metal plate and the metal layer to the front surface and the back surface of the core substrate. . However, how this through-hole conductor is connected to the base metal plate and each metal layer depends on other types of wiring such as signal wiring formed on the wiring board, and the type and number of required power supply wiring and ground wiring. May be determined appropriately. The wiring extending from the base metal plate or the metal layer of the layered capacitor to the surface (electronic component mounting surface) of the wiring board may include a stacked via. This is because the wiring connecting the electronic component such as the IC chip and the electrode of the capacitor (base metal plate or metal layer) is made as short and as thick as possible so that the inductance of the wiring can be reduced and the penetration of noise can be suppressed. .

Here, the resin contained in the composite dielectric layer may be selected in consideration of the dielectric constant, heat resistance and the like, and examples thereof include resins such as epoxy resin, polyimide resin and BT resin. As the high dielectric powder, any powder of a substance having a high dielectric constant may be used.
TiO ₃ , PbTiO ₃ , PbZrO ₃ , Pb (Ti, Z
r) O ₃ (so-called PZT), Pb (Mn, Nb) O ₃ ,
High dielectric constant ceramic powders such as SrTiO ₃ , CaTiO ₃ , and MgTiO ₃ may be used. Further, in order to increase the dielectric constant of the composite dielectric layer, for example, Ag, Au, Cu,
Metal powders such as Ag-Pd, Ni, W, and Mo can also be included.

The base metal plate may be selected in consideration of availability, rigidity, workability, conductivity and the like. For example, in addition to Cu, phosphor bronze, nickel silver, brass, 194
Cu alloys such as alloys; Al alloys such as Al and duralumin; copper-invar-copper clad materials; copper-molybdenum-copper clad materials. Also, the base metal plate is
It is preferable to have substantially the same planar shape as the core substrate. This is because when the base metal plate is smaller than the core substrate, the strength is reduced at the end of the core substrate where the base metal plate does not exist, and chipping or the like is likely to occur.

Further, it is preferable that the wiring board is a wiring board to which a reinforcing plate for reinforcing the rigidity of the wiring board is attached.

In the wiring board of the present invention, since the reinforcing plate of the wiring board is further attached, it is not necessary to increase the rigidity of the wiring board itself. It is only necessary to secure rigidity to the extent that it does not occur. Therefore, as a base metal plate, for example,
A relatively thin material having a certain degree of rigidity, such as a thickness of 30 to 100 μm, can be used. As a result, the thickness of the entire wiring board can be reduced. Can be.

Further, in the wiring substrate according to any one of the above, the core substrate includes a through-hole conductor formed inside a through-hole penetrating between a front surface and a back surface of the core substrate. A first through-hole conductor connected to one electrode of the layered capacitor;
The wiring board may include a second through-hole conductor connected to the other electrode of the layered capacitor, and a third through-hole conductor insulated from both the one electrode and the other electrode.

Since the wiring board according to the present invention includes the first through-hole conductor and the second through-hole conductor, the potentials of the base metal plate and the metal layer forming the electrodes of the layered capacitor can be taken out from the front and back surfaces of the core substrate. . It also includes a third through-hole conductor that insulates any of the electrodes of the capacitor. Therefore, the signal wiring can be passed between the front and back of the core substrate by using the third through-hole conductor. As described above, in this wiring board, since three types of through-hole conductors extend to the front and back surfaces of the core substrate, the wiring layer formed on the back surface side of the core substrate and the wiring layer formed on the front surface side are Connection can be easily made with this through-hole conductor. Therefore, for example, if the wiring layer on the back side is connected to another wiring board such as a motherboard on the back side, and the wiring layer on the front side and an electronic component such as an IC chip are connected on the front side, through this through-hole conductor In addition, another wiring board can be connected to the electronic component.

Further, in the wiring substrate according to any one of the above, it is preferable that the through hole of the core substrate is a wiring substrate formed by laser processing.

In the wiring board of the present invention, since the through holes for forming the through-hole conductors are formed by laser processing in the core board, small-diameter (for example, φ150 μm or less) difficult to machine by drilling or the like. A through-hole or a through-hole with a narrow gap (for example, 500 μm or less)
It can be formed easily and accurately, and can be a cheap wiring board with good characteristics. In addition, by forming a plurality of through-hole conductors in parallel at close positions instead of one through-hole conductor, the inductance and resistance of the through-hole conductor as a whole can be further reduced. Further, even if some of the through-hole conductors are broken due to a failure, the other through-hole conductors ensure conduction, thereby preventing a decrease in yield and occurrence of a failure. That is, it is preferable that the through-hole and the through-hole conductor include a plurality of through-holes and through-hole conductors formed in parallel at adjacent positions.

Another solution is to provide a core substrate, a resin insulating layer laminated on the front and back surfaces of the core substrate, and a resin insulating layer laminated on the front and back surfaces of the core substrate. A wiring layer formed at least between the layers and between the resin insulating layers, wherein the core substrate comprises a base metal plate having a front surface and a back surface; A plurality of composite dielectric layers containing body powder, a plurality of metal layers thinner than the base metal plate, and a plurality of through-hole conductors, wherein the composite dielectric layer and the metal layer are The composite dielectric layer and the metal layer are alternately laminated on the front and back surfaces of the metal plate in this order. And core board table The outermost surface of the composite dielectric layer in the direction, the base metal plate and the metal layer adjacent thereto, or the base metal plate and the metal layer adjacent thereto and the adjacent metal layers are the composite dielectric layer. A plurality of through-hole conductors are formed in a through-hole penetrating the base metal plate, the plurality of composite dielectric layers and the plurality of metal layers; An even-numbered inner metal counting from the base metal plate, extending from the base metal plate to the base metal plate or the inner metal layer formed between the base metal plate and the composite dielectric layer. A plurality of first through-hole conductors directly connected to a layer; a plurality of second through-hole conductors directly connected to an odd-numbered inner metal layer of the inner metal layer counted from the base metal plate; Serial base metal layer and the plurality of third than either non-conduction of the inner metal layer
And a through-hole conductor.

In the wiring board of the present invention, since the core substrate is provided with the layered capacitor composed of the composite dielectric layer, the base metal plate and the metal layer, the core substrate is located at a position close to an electronic component such as an IC chip. Since a capacitor having a large capacitance can be arranged, effects such as noise removal can be obtained favorably. In addition, since the layered capacitor is built in the core substrate, the characteristics of the layered capacitor, the presence or absence of short-circuit, and the like are inspected, and the wiring substrate can be formed using only the passed core substrate, that is, the resin insulating layer and the wiring layer can be formed. Therefore, the yield can be increased in the production of the wiring board. Also, even if the built-in capacitor has caused a problem such as a short circuit,
Since it is only necessary to dispose in a state of the core substrate on which the resin insulating layer and the wiring layer are not formed, the added value is low, and the loss caused by the occurrence of a failure can be suppressed. Therefore, an inexpensive wiring board can be obtained. Further, in the wiring board of the present invention, unlike the case where an insulating plate is used as the base plate, the core substrate uses a conductive base metal plate, so that it can be used as it is as one of the electrodes of the capacitor. Can be. Further, since the base metal plate is thicker than the metal layer, the rigidity of the core substrate and the wiring substrate can be supported to some extent by the base metal plate. Therefore, the handling is easy.

In addition, since the core substrate includes the first through-hole conductor and the second through-hole conductor, the potentials of the base metal plate and the metal layer forming the electrodes of the layered capacitor can be taken out from the front and back surfaces of the core substrate. . Also, a third through-hole conductor that insulates both the base metal plate and the inner metal layer is included. Therefore, the signal wiring can be passed between the front and back of the core substrate by using the third through-hole conductor. As described above, in this wiring board, since three types of through-hole conductors extend to the front and back surfaces of the core substrate, the wiring layer formed on the back surface side of the core substrate and the wiring layer formed on the front surface side are Connection can be easily made with this through-hole conductor. Therefore, for example, if the wiring layer on the back side is connected to another wiring board such as a motherboard on the back side, and the wiring layer on the front side and an electronic component such as an IC chip are connected on the front side, through this through-hole conductor In addition, another wiring board can be connected to the electronic component.

Further, in the wiring board according to any one of the above, the plurality of through-hole conductors are filled with a plug material therein, and each of the plurality of through-hole conductors has a closing portion on a surface of the core substrate and a back surface of the core substrate. It is preferable that the wiring board be provided with a via conductor on the closed portion, which penetrates the resin insulating layer laminated on the surface of the core substrate, on the closed portion on the surface of the core substrate.

As described above, the plug material is filled in the through-hole conductor to form the closed portion, and the via conductor on the closed portion is formed, so that the electrode of the layered capacitor can be formed at a shorter distance through the through-hole conductor, and therefore, can be formed at a lower distance. The resistance and low inductance can be guided to the surface of the wiring board, and the intrusion of noise can be further prevented.

Further, it is preferable that the wiring board is a wiring board in which a via conductor is further stacked on the via conductor on the closed portion. As described above, when the structure of the stacked via in which the via conductor is further stacked on the closed portion upper via conductor is used, the closed portion upper via conductor and the via conductor thereon can be directly connected. Therefore, the electrodes of the layered capacitor can be guided to the surface of the wiring board through the through-hole conductor with a shorter distance, and therefore with a lower resistance and a lower inductance, and the intrusion of noise can be prevented.

Further, it is preferable that the wiring board is provided with a reinforcing plate attached to the wiring board to reinforce the rigidity of the wiring board.

In the wiring board according to the present invention, since the reinforcing plate of the wiring board is further adhered, it is not necessary to increase the rigidity of the wiring board itself. It is only necessary to secure rigidity to the extent that it does not occur. Therefore, as a base metal plate, for example,
A relatively thin material having a certain degree of rigidity, such as a thickness of 30 to 100 μm, can be used. As a result, the thickness of the entire wiring board can be reduced. Can be.

In any one of the above-mentioned wiring boards, it is preferable that the through-hole of the core board is a wiring board formed by laser processing.

In the wiring board of the present invention, since the through holes for forming the through-hole conductors are formed by laser processing in the core board, small-diameter (for example, φ150 μm or less) difficult to machine by a drill or the like. A through hole or a through hole with a narrow gap (for example, 500 μm or less)
It can be formed easily and accurately, and can be a cheap wiring board with good characteristics.

Further, in the wiring board according to any one of the above, at least one of the first through-hole conductor, the second through-hole conductor, and the through-hole conductor belonging to the third through-hole conductor is close to each other. Formed in the plurality of through-holes formed in the position, respectively,
In addition, it is preferable that the wiring board be a set of through-hole conductors composed of a plurality of through-hole conductors that conduct with each other.

In the wiring board of the present invention, instead of one through-hole conductor, a plurality of through-hole conductors are formed in the plurality of through-holes formed at positions adjacent to each other and are electrically connected to each other. A set of through-hole conductors is formed. For this reason, regarding this set of through-hole conductors, the inductance and the resistance can be further reduced as compared with the case where they are formed by one through-hole conductor. Furthermore, even if some of the through-hole conductors in the set are broken due to a failure, the other through-hole conductors ensure continuity, thereby preventing a reduction in yield and occurrence of a failure.

Further, in the wiring board according to any one of the above, the mounting position of an IC chip mounted on the surface of the wiring board in the core substrate is projected to an IC corresponding portion. The first through-hole conductor and the second through-hole conductor are formed out of the three types of through-hole conductors, and the third through-hole conductor is not formed, or the third through-hole conductor is formed in the IC corresponding portion. It is assumed that the wiring board is formed in a smaller number than the sum of the first through-hole conductor and the second through-hole conductor, and the third through-hole conductor is formed more in the peripheral portion of the IC corresponding portion than in the IC corresponding portion. good.

As described above, it is desirable to connect the power supply terminal or the ground terminal of the IC chip to the electrode of the capacitor formed on the wiring board, or the power supply wiring or the ground wiring as short as possible. This is because the wiring has low resistance and low inductance to prevent noise from entering. on the other hand,
The signal wiring connected to the signal terminal is not required to have lower resistance and lower inductance than the connection with the capacitor, the power supply wiring, and the ground wiring.

On the other hand, in the wiring board of the present invention, the third through-hole conductor used for the signal wiring and the like is formed more in the peripheral portion than in the IC corresponding portion. That is, many third through-hole conductors are formed on the peripheral edge of the IC corresponding portion. For this reason, the IC located immediately below the IC chip
In forming the first through-hole conductor and the second through-hole conductor in the corresponding portion, there is no need to consider or reduce the necessity of disposing the third through-hole conductor. Therefore, it is possible to arrange the first through-hole conductor and the second through-hole conductor at appropriate positions, and connect them to the power terminal and the ground terminal of the IC chip at a very short distance. As a result, the resistance and inductance between the first through-hole conductor and the second through-hole conductor and the power supply terminal and the ground terminal of the IC chip can be reduced as much as possible, and the noise that enters at this portion can be reduced. Further, in this wiring board, the first through-hole conductor and the second through-hole conductor
Since the layered capacitor is formed between the through-hole conductors, noise can be reduced in this respect as well.
In addition, as can be easily understood from the above, all the third through-hole conductors are formed on the peripheral portion of the IC corresponding portion,
The third through-hole conductor may not be formed in the C-corresponding portion, and this is more preferable.

Further, in the wiring substrate according to any one of the above, the thickness of the base metal plate is 30 μm or more,
It is preferable that the wiring board has a thickness of not more than 00 μm.

In the wiring board of the present invention, the thickness of the base metal plate is 30 to 100 μm. The reason why the thickness is set to 30 μm or more is that if the thickness is less than 30 μm, the rigidity of the base metal layer becomes low, and it becomes difficult to handle the core substrate in the manufacture of the wiring substrate, and thus the number of steps increases or the yield increases. This is because it is easy to decrease. On the other hand, 100 μm
This is because the rigidity of the base metal plate increases as the thickness increases, but the thickness of the core substrate and the wiring substrate increases accordingly, which is against the demand for a reduction in height. It is also possible to reduce the distance between wirings such as through-hole conductors formed on the core substrate to reduce the inductance and resistance of the wirings.

Another solution is to provide a core board for forming a resin insulating layer and a wiring layer on the front and back surfaces to form a wiring board, comprising a base metal plate, a resin and a high dielectric powder. A plurality of composite dielectric layers, and a plurality of metal layers having a thickness smaller than that of the base metal plate. And the base metal plate and the metal layer adjacent thereto, or the base metal plate and the metal layer adjacent thereto and the adjacent metal layers face each other with the composite dielectric layer interposed therebetween. It is a core substrate constituting a layered capacitor.

Since the core substrate of the present invention has a built-in layered capacitor, if a wiring substrate is formed using this core substrate, the capacitor can be arranged at a position close to an electronic component such as an IC chip. Effect is obtained favorably. Further, by incorporating a capacitor that easily causes a problem such as a short circuit into the core substrate, it is possible to determine the capacitance of the layer capacitor, the presence or absence of a short circuit, and the like when the core substrate is completed. Therefore, in forming the wiring board, only the core substrate that has passed the predetermined standard can be used, so that the yield of the entire wiring board can be increased. In addition, in the case where the resin insulating layer and the wiring layer are formed and added value is added, it is possible to reduce the number of cases in which defects such as short-circuits or defective capacitance of the layered capacitor are found and discarded, so that the amount of loss can be suppressed.

Further, as a base plate, glass-BT
When an insulating plate such as a resin composite material or a glass-epoxy resin composite material is used, it is necessary to further form an electrode of the capacitor. On the other hand, in the core substrate of the present invention, since the base metal plate is used as the base plate,
It can be used as it is as one of the electrodes of the capacitor.

When the wiring board is formed and reinforced by a reinforcing plate, it is not necessary to increase the rigidity of the wiring board itself and further the rigidity of the core board.
It is sufficient that rigidity can be ensured to such an extent that handling is not difficult in each step of manufacturing the core substrate and the wiring substrate. Therefore, as a base metal plate, for example, a thickness of 30 to 100 μm
For example, a relatively thin material having a certain degree of rigidity such as m can be used. Then, the thickness of the entire core substrate can be reduced, so that it is possible to meet the demand for a reduction in the height of the wiring substrate, and to shorten the distance of wiring such as through-hole conductors formed on the core substrate to reduce the inductance and resistance of the wiring. You can also lower it.

Further, the potential of the base metal plate or the metal layer forming the electrode of the layered capacitor is taken out from the front or back surface of the core substrate so that it can be easily connected to the wiring layer formed on the front or back surface side of the core substrate. For this purpose, it is preferable to form a through-hole conductor that is electrically connected to the base metal plate or a desired metal layer on the core substrate. Accordingly, a through-hole conductor that guides the potential of the base metal plate or a predetermined metal layer located in the inner layer excluding the metal layer located on the core substrate surface out of the base metal plate or the metal layer to the front surface or the back surface of the core substrate. Preferably, it is provided. However, how this through-hole conductor is connected to the base metal plate and each metal layer depends on other wiring such as signal wiring to be formed on the wiring board, the type and number of required power supply wiring and ground wiring, and the like. It may be determined appropriately.

Further, in the above core substrate, it is preferable that the through hole is a core substrate formed by laser processing. In this core substrate, a through hole for forming a through-hole conductor is formed by laser processing, so that a small-diameter (for example, φ150 μm or less) through-hole or a narrow gap (for example, , 500 μm or less) A through-hole can be easily and accurately formed, and a core substrate with good characteristics and low cost can be obtained.

Further, by forming a large number of through-hole conductors in parallel at adjacent positions instead of one through-hole conductor, the inductance and resistance of the through-hole conductor can be further reduced as a whole. . Further, even if some of the through-hole conductors are broken due to a failure, the other through-hole conductors ensure conduction, thereby preventing a decrease in yield and occurrence of a failure. That is, the through-hole and the through-hole conductor may include a plurality of through-holes and through-hole conductors formed in parallel at adjacent positions.

Still another solution is a core substrate for forming a wiring substrate by forming one or more resin insulating layers and wiring layers on the front surface and the back surface thereof, and a base metal plate having a front surface and a back surface. , A plurality of composite dielectric layers containing resin and high dielectric powder, a plurality of metal layers thinner than the base metal plate, and a plurality of through-hole conductors, wherein the composite dielectric layer and the metal layer Means that the composite dielectric layer and the metal layer are alternately laminated on the front and back surfaces of the base metal plate in this order, and the metal layer is formed between the composite dielectric layers, A rear surface of the dielectric layer and a surface of the composite dielectric layer outermost in the core substrate surface direction, the base metal plate and a metal layer adjacent thereto,
Or the base metal plate and the adjacent metal layer and the adjacent metal layer constitute a layered capacitor facing each other with the composite dielectric layer interposed therebetween, and the plurality of through-hole conductors are the base metal plate, Formed in a through hole penetrating a plurality of composite dielectric layers and a plurality of metal layers, extending to the core substrate front surface and the core substrate back surface, the base metal plate,
Or a plurality of first through-hole conductors directly connected to even-numbered inner metal layers counted from the base metal plate among the inner metal layers formed between the base metal plate and the composite dielectric layer, A plurality of second through-hole conductors directly connected to an odd-numbered inner metal layer counted from the base metal layer among the inner metal layers; and a plurality of non-conductive plurality of non-conductive ones of the base metal layer and the inner metal layer. And a third through-hole conductor.

According to the present invention, by incorporating a capacitor which is likely to cause a problem such as a short circuit into the core substrate, it is possible to determine the capacitance of the layered capacitor, the presence or absence of a short circuit, and the like when the core substrate is completed. it can. Therefore, in forming the wiring board, only the core substrate that has passed the predetermined standard can be used, so that the yield of the entire wiring board can be increased. In addition, in the case where the resin insulating layer and the wiring layer are formed and added value is added, it is possible to reduce the number of cases in which defects such as short-circuits or defective capacitance of the layered capacitor are found and discarded, so that the amount of loss can be suppressed.

Moreover, the potentials of the base metal plate and the metal layer forming the electrodes of the layered capacitor can be taken out from the front and back surfaces of the core substrate and easily connected to the wiring layers formed on the front and back surfaces of the core substrate. In order to achieve this, a first through-hole conductor and a second through-hole conductor for guiding the potential of the base metal plate and the inner metal layer formed between the layers to the front and back surfaces of the core substrate are provided. Also, a third through-hole conductor not connected to the inner metal layer is included. As described above, in this core substrate, the three types of through-hole conductors extend to the front surface and the back surface of the core substrate, respectively, so that the wiring layer formed on the back surface side of the core substrate and the wiring layer formed on the front surface side Can be easily connected with this through-hole conductor. Moreover, since a layered capacitor is formed in parallel between the first through-hole conductor and the second through-hole conductor, the power supply wiring and the ground wiring are connected to the first and second through-hole conductors, respectively. This makes it possible to easily and reliably remove noise between the power supply wiring and the ground wiring.

Further, in the core substrate, the composite dielectric layer and the metal layer formed on the front side of the base metal plate, and the composite dielectric layer formed on the back side of the base metal plate Preferably, the metal layer is a core substrate in which the number of layers, the material, and the thickness of each corresponding layer are equal. If the number of composite dielectric layers and metal layers, the material, and the thickness of each corresponding layer are different between the front side and the back side of the base metal plate, the coefficient of thermal expansion and shrinkage when forming the core substrate on both sides of the center substrate May become unbalanced, and the core substrate may be warped. In the present invention, since the number of layers, the material, and the thickness of each corresponding layer are made equal, the core substrate can be formed in a stable shape without warping of the core substrate.

Further, in the above core substrate, the plurality of through-hole conductors are filled with a plug material inside,
It is preferable that the core substrate has a closed portion on each of the front surface and the back surface of the core substrate. If a closed portion is formed in the through-hole conductor, a via conductor (via conductor on the closed portion) can be further formed on the closed portion. When the via conductor on the closed portion is formed, a wiring layer is not interposed between the through-hole conductor and the via conductor, and the via conductors are directly connected to each other, so that a low-resistance and low-inductance wiring can be realized.

Further, in the core substrate, the first substrate
At least one of the through-hole conductor, the second through-hole conductor, and the through-hole conductor belonging to the third through-hole conductor are respectively formed in a plurality of the through-holes formed in a position close to each other and forming a set, and The core substrate may be a set of through-hole conductors composed of a plurality of through-hole conductors that conduct with each other.

In the core substrate of the present invention, instead of one through-hole conductor, a plurality of through-hole conductors are formed in the plurality of through-holes formed at positions close to each other and are electrically connected to each other. A set of through-hole conductors is formed. For this reason, regarding this set of through-hole conductors, the inductance and the resistance can be further reduced as compared with the case where they are formed by one through-hole conductor. Further, even if some of the through-hole conductors in the set are disconnected due to a failure, conduction can be ensured by other through-hole conductors, so that a decrease in yield and occurrence of a failure can be prevented.

Further, in the above-mentioned core substrate, the first through-hole conductor and the second through-hole conductor among the three kinds of through-hole conductors are formed at the center of the core substrate in the plane direction. The three through-hole conductors are not formed, or are formed in a smaller number than the sum of the first through-hole conductor and the second through-hole conductor formed at the center thereof. Third
It is preferable that the core substrate has a larger number of through-hole conductors than the central portion.

When mounting an IC chip on a wiring board, the IC chip is generally mounted at the center of the wiring board. By the way, as described above, it is desirable to connect the power supply terminal and the ground terminal of the IC chip to the capacitor formed on the wiring board or the power supply wiring and the ground wiring as short as possible. This is because the wiring has low resistance and low inductance to prevent noise from entering. On the other hand, the signal wiring connected to the signal terminal is not required to have lower resistance and lower inductance than the capacitor, the power supply wiring, and the ground wiring.

On the other hand, in the core substrate of the present invention, the third through-hole conductor used for the signal wiring and the like is formed more at the periphery than at the center. That is, all or many of the third through-hole conductors are formed at the periphery. For this reason, in forming the first through-hole conductor and the second through-hole conductor in the central portion located immediately below the IC chip, it is not necessary or necessary to consider the arrangement of the third through-hole conductor. Therefore, it is possible to arrange the first through-hole conductor and the second through-hole conductor at appropriate positions, and connect them to the power terminal and the ground terminal of the IC chip at a very short distance. As a result, the resistance and inductance between the first through-hole conductor and the second through-hole conductor connected to each electrode of the layered capacitor and the power supply terminal and the ground terminal of the IC chip are reduced as much as possible, and noise entering at this portion is reduced. Can be reduced.

Still another solution is a base metal plate,
And a composite dielectric layer containing a resin and a high dielectric powder and a metal layer thinner than the base metal plate, the composite dielectric layer including a resin and a high dielectric powder laminated one by one on the front and back surfaces of the base metal plate. A method of manufacturing a core substrate in which a plate and the metal layer adjacent thereto are opposed to each other with the composite dielectric layer interposed therebetween to constitute a layered capacitor, wherein the insulating through hole is formed at a predetermined position. A laminate forming step of forming a laminate in which a composite dielectric layer and a metal foil are laminated in this order on each of the front and back surfaces of the base metal plate, and forming a through hole between the front and back surfaces of the laminate. Forming a through hole, wherein the inside of the insulating through hole formed in the base metal plate is penetrated while leaving the composite dielectric layer around, and the base metal plate is not exposed on the inner peripheral surface. Base insulation through hole and base metal plate A through-hole forming step of forming a base connection through-hole through which the base metal plate is exposed on the inner peripheral surface; and forming a through-hole conductor layer in the base insulation through-hole and the base connection through-hole. And a patterning step of forming the metal foils on the front and back surfaces of the laminated plate into metal layers of a predetermined pattern, respectively.

In the method of manufacturing a core substrate according to the present invention, since the insulating through-hole is formed in the base metal plate in advance, the through-hole conductor layer to be formed in the base insulating through-hole is formed of the base metal. Insulated from board. On the other hand, what is formed in the base connection through hole is electrically connected to the base metal plate. Therefore, while the base metal plate is kept at a certain potential (for example, a ground potential or a power supply potential) by the through-hole conductor layer formed in the through hole for connecting the base, a wiring of this potential (for example, the ground wiring or the power supply wiring) is connected to the core substrate. It can be passed between the front and back surfaces and taken out from the front and back surfaces. On the other hand, in the state insulated from the base metal plate by the through-hole conductor layer formed in the base insulating through-hole, signal wiring and other potential wiring (for example, power supply wiring and ground wiring) are connected to the front and back surfaces of the core substrate. And can be taken out from the front or back surface. How these through-hole conductors are connected to each metal layer depends on other types of wiring such as signal wiring formed on the wiring board, the type, position, number, etc. of required power supply wiring and ground wiring. It may be determined appropriately.

Further, in the above-mentioned method of manufacturing a core substrate, the step of forming a laminated board includes the step of forming a semi-cured composite dielectric material containing a semi-cured resin and a high dielectric powder on each of a front surface and a back surface of the base metal plate. A method of manufacturing a core substrate including a base laminating step of laminating a two-layer film in which a film and a metal foil are laminated and hot-pressing to form the laminate is preferable.

In the present invention, since a two-layer film in which a semi-cured composite dielectric film and a metal foil are laminated is used, a laminate can be easily formed, and therefore, a core substrate can be easily and inexpensively formed. Preferably, a double film with a reinforcing film having a metal foil, a semi-cured composite dielectric layer, and a reinforcing film in this order is formed in advance, the reinforcing film is peeled off, and the double films are laminated. The use of a two-layer film with a reinforcing film makes it easy to handle composite dielectric layers and metal layers, such as metal foil and (semi-cured)
Even when the thickness of the composite dielectric layer is reduced, the workability is good, so that the core substrate can be easily manufactured. Also,
Since the semi-cured composite dielectric layer is covered with a reinforcing film, it also prevents dust from adhering to the semi-cured composite dielectric layer that is sticky due to semi-curing, and also prevents problems caused by dust. This is because it can be prevented.

Still another solution is to provide a base metal plate, a plurality of composite dielectric layers containing resin and high dielectric powder, which are alternately laminated on the front and back surfaces of the base metal plate, and the base metal plate. A plurality of metal layers having a thickness smaller than that of the metal plate, wherein the base metal plate, the metal layer adjacent thereto and the adjacent metal layers are opposed to each other with the composite dielectric layer interposed therebetween, and a layered capacitor. The method for manufacturing a core substrate, comprising: a composite dielectric layer and a metal layer having a predetermined pattern in this order, on each of the front and back surfaces of the base metal plate formed with insulating through holes at predetermined positions. Laminated alternately, a laminated plate forming step of forming a laminated plate in which a metal foil is laminated on the outermost surface of the laminated outermost composite dielectric layer, and a through hole between the front surface and the back surface of the laminated plate. Forming through hole forming process A first through-hole in which the base metal plate or an even-numbered metal layer of the base metal plate and the metal layer of the predetermined pattern counted from the base metal plate is exposed on an inner peripheral surface; A second through-hole which penetrates through the hole, wherein the base metal plate is not exposed to the inner peripheral surface, and among the metal layers of the predetermined pattern, an odd-numbered metal layer counted from the base metal plate is exposed to the inner peripheral surface; A through-hole forming step of forming a third through-hole in which neither the base metal plate nor the metal layer of the predetermined pattern is exposed on the inner peripheral surface; forming a through-hole conductor layer in the through-hole; A patterning step of forming the metal foils on the front and back surfaces of the plate into metal layers of a predetermined pattern, respectively.

In the method of manufacturing a core substrate according to the present invention, three types of insulating through holes are formed in the base metal plate in advance, and the base metal plate and a predetermined metal layer are exposed or not exposed on the inner peripheral surface. Of the through-hole conductor layers formed in these through-holes forming the through-holes, those formed in the first through-hole are electrically connected to the base metal plate, or the base metal plate and the even-numbered metal layer counted therefrom. . On the other hand, what is formed in the second through hole conducts with the odd-numbered metal layer counted from the base metal plate. Also, what is formed in the third through hole is insulated from the base metal plate and the metal layer.

Accordingly, the base metal plate and the even-numbered metal layers counted from the base metal plate are placed at a certain potential (eg, ground potential or power supply potential) by the through-hole conductor layer formed in the first through hole.
In addition, the wiring of this potential (for example, a ground wiring or a power supply wiring) can be passed between the front surface and the back surface of the core substrate and taken out from the front surface or the back surface. On the other hand, while the odd-numbered metal layer counted from the base metal plate is kept at another potential (for example, power supply potential or ground potential) by the through-hole conductor layer formed in the second through-hole, a wiring of this potential (for example, power supply) Wiring or ground wiring) can be passed between the front and back surfaces of the core substrate and taken out from the front and back surfaces. Further, in a state in which the signal wiring is insulated from the base metal plate or the metal layer, the signal wiring can be passed between the front surface and the back surface of the core substrate and taken out from the front surface or the back surface. When the three types of through-hole conductors are formed as described above, the base metal plate and the even-numbered metal layers counted from the base metal plate and the odd-numbered metal layers counted from the base metal layer sandwich the composite dielectric layer therebetween. As a result, the stacked layered capacitors can be easily formed.

Further, in the above-mentioned method for manufacturing a core substrate, the step of forming a laminated plate may include the step of forming an intermediate laminated plate having a predetermined pattern of metal layer on each of the front and back surfaces of the base metal plate or on the front and back surfaces thereof. A semi-cured composite dielectric film and a metal foil are superimposed on each of the front and back surfaces of the base metal plate, and the composite dielectric layer and the metal foil are laminated on the front and back surfaces of the base metal plate or the intermediate laminate by hot pressing. A method of manufacturing a core substrate including a lamination pressing step and a metal foil patterning step of forming the metal foil into a metal layer having a predetermined pattern is preferable.

In the present invention, the semi-cured composite dielectric film and the metal foil are laminated on the front and back surfaces of the base metal plate or the intermediate laminate, respectively, and then the metal foil is patterned. As described above, since the laminate can be formed by sequentially laminating the laminate, the laminate and the core substrate can be easily and inexpensively formed. Note that a two-layer film in which a semi-cured composite dielectric film and a metal foil are laminated on the base metal plate and the intermediate laminated plate is preferably laminated. That is, in the method of manufacturing the core substrate, in the laminating step, on each of the front and back surfaces of the base metal plate, or on the front and back surfaces of the intermediate laminate having a predetermined pattern of metal layers on the front and back surfaces. It is preferable to adopt a method of manufacturing a core substrate, wherein a two-layer film in which the semi-cured composite dielectric film and the metal foil are laminated is stacked on each of the two. Since the two-layer film is used, the laminated board can be formed more easily, and the core substrate can be formed more easily and inexpensively.

Further, a double film with a reinforcing film having a metal foil, a semi-cured composite dielectric layer and a reinforcing film in this order is formed in advance, and the reinforcing film is peeled off.
It is good to laminate a double film. When the two-layer film with the reinforcing film is used, handling of the composite dielectric layer and the metal layer is easy, and the core substrate can be easily manufactured. Further, it is also possible to prevent the occurrence of trouble due to the attachment of dust.

Alternatively, in the method of manufacturing a core substrate, in the step of forming a laminate, the semi-cured composite dielectric material includes a semi-cured resin and a high dielectric powder on the front and back surfaces of the base metal plate, respectively. A semi-cured composite dielectric film containing a semi-cured resin and a high dielectric powder, and a metal foil in which at least one patterned two-layer film in which a film and a patterned metal foil formed in a predetermined pattern are laminated is laminated; It is preferable that the core substrate manufacturing method includes a two-layer film lamination press step of laminating a two-layer film on which the two layers are laminated and hot pressing to form the laminate.

In the present invention, the patterned two-layer film and the two-layer film are laminated on the front and back surfaces of the base metal plate, respectively, and hot-pressed to form the laminated plate at once.
The laminate can be easily formed, and therefore, the two-layer film and the patterned two-layer film can be separately formed in advance and laminated to form the laminate, thereby simplifying and shortening the core substrate manufacturing process. Thus, the core substrate can be manufactured at low cost.

As the two-layer film, a two-layer film with a reinforcing film having a metal foil, a semi-cured composite dielectric layer and a reinforcing film in this order was used. As the patterned two-layer film, a patterned metal foil and a semi-cured film were used. It is preferable to use a patterned two-layer film with a reinforcing film having a composite dielectric layer and a reinforcing film in this order. When these films are used, the handling of the composite dielectric layer and the metal layer is easy, and even when the thickness of the metal foil or the (semi-cured) composite dielectric layer is reduced, the workability is good. A substrate can be manufactured. In addition, since the semi-cured composite dielectric layer is covered with the reinforcing film, it is possible to prevent dust and the like from adhering to the semi-cured composite dielectric layer which is in a tacky state due to the semi-curing, and has a problem due to dust. This is because generation can be prevented.

Further, in any one of the above-described methods for manufacturing a core substrate, the step of forming a through-hole may be a method of manufacturing a core substrate in which the through-hole is formed by a laser.

In the present invention, a through hole is formed by a laser in the through hole forming step. For this reason, it is possible to easily and accurately form a through hole having a small diameter (for example, φ150 μm or less) or a narrow gap (for example, 500 μm or less) which is difficult to machine with a drill or the like. It is possible to accurately form a through-hole conductor having a small width, and to provide an inexpensive wiring board with good characteristics.
Further, by forming a plurality of through holes at close positions instead of one through hole and forming a plurality of through hole conductors in close proximity to each other, the inductance of the through hole conductor as a whole can be improved. And resistance can be further reduced. Further, even if some of the through-hole conductors are broken due to a failure, the other through-hole conductors ensure conduction, thereby preventing a decrease in yield and occurrence of a failure. That is, the through-hole includes a plurality of through-holes formed in proximity to each other, and the through-hole conductor is formed in parallel with the plurality of through-holes formed in the proximity to each other. It is preferable to include

[0067]

(Embodiment 1) Next, embodiments of a core substrate, a wiring substrate and a method of manufacturing the same according to the present invention will be described with reference to the drawings. The core substrate 610 shown in FIG.
A base metal plate 60 made of oxygen-free copper having a length of 40 mm × 40 mm and a thickness of 40 μm, and having an insulating through-hole 601 </ b> H.
The composite dielectric layers 611, 612, 613, 614, and the metal layers 602, 603, 604, 6 of a predetermined pattern are formed on the front and rear surfaces of the composite dielectric layer 611, two layers each on two sides.
05 are alternately stacked. Further, a through hole 661 penetrating between the lowermost composite dielectric layer 614 and the uppermost composite dielectric layer 613 in the figure is formed.
Are formed on the inner peripheral surface of the core substrate 610 to the front surface 610A and the back surface 610B, and a through-hole conductor 607 also made of Cu is formed. Also, the through-hole conductor 6
07 is filled with an epoxy resin to form a plug body 616.
Has made.

The base metal plate 601 and the metal layers 602 and 603 adjacent thereto, the metal layer 602 and a portion 604A of the metal layer 604 adjacent thereto, the metal layer 603 and a portion 605A of the metal layer 605 adjacent thereto and the like. Is a composite dielectric layer 61
1 and the like, and constitutes a layered capacitor C61 having five electrode layers and four dielectric layers. Among them, the base metal plate 601 located inside is provided with the core substrate surface 610A by the first through-hole conductor 607A.
Alternatively, conduction is made to portions 604A and 605A of the metal layers 604 and 605 on the back surface 610B. Also, the first metal layers 602 and 603 counted from the base metal plate are the second through-hole conductors 607B penetrating through the insulating through-holes 601H.
The other portions 604 of the metal layers 604 and 605 on the core substrate front surface 610A or the core substrate rear surface 610B
B, 605B. Thereby, by connecting one to the ground potential and the other to the power supply potential, for example, the base metal plate 601 and the metal layers 604A and 605A are set to the ground potential, and the metal layers 602 and 603 are connected to the power supply potential (for example, + potential). By doing so, it is possible to connect the layered capacitor C61 between the ground potential and the power supply potential and remove noise superimposed between them.

The through-hole conductor 607 has a third
Like the through-hole conductor 607C, the metal layer 6 is used to pass signal wiring and the like between the front and back surfaces of the core substrate 610.
04, 605 connected to other parts 604C, 605C,
Some that penetrate the insulating tube through hole 601H and do not conduct with the base metal plate 601 and the inner metal layers 602 and 603 are also formed. As can be understood from the above description, the outer metal layers 604 and 605 are used as the electrodes 604A and 605A constituting the layered capacitor C61.
Some parts are used as wiring layers.

The composite dielectric layers 611, 612, 613, 6
14 is a 50-μm-thick ceramic-metal-resin composite material in which 32 vol% of BaTiO ₃ powder and 20 vol% of Cu powder are dispersed in epoxy resin, and has a high dielectric constant (relative dielectric constant). The dielectric constant is made higher than that of ordinary resin by mixing BaTiO ₃ powder (εr = about 18000) and Cu powder (εr = 30). For this reason, the capacitance of the layered capacitor C61 formed (built-in) in the core substrate 610 has a relatively large value (capacitance 25n).
F).

Further, in the core substrate 610, the outer dimensions in the planar direction are substantially the same as the core substrate 610 at the center.
A base metal plate having a thickness of 40 μm and having rigidity is used, and a composite dielectric layer 611 and the like and a metal layer 602 and the like are laminated on the front and back surfaces (vertical direction in the figure). Therefore, the core substrate 6
The stiffness of the wiring board 10 is also increased to some extent.
In the case of manufacturing the core substrate 610, the handling of the core substrate 610 and the process flow product thereof becomes easy. Moreover, the base metal plate 601
The thickness is 40 μm, which is thinner as compared with the case where a material such as a glass-epoxy resin composite material is used as a base, whereas its thickness is usually about 0.8 to 1.2 mm. Therefore, the thickness of the entire core substrate 610 can be reduced. In addition, when an insulating material is used, it is necessary to separately form an electrode layer on the front surface, the back surface, and the like. On the other hand, since the base metal plate 601 is conductive, the layered capacitor C61 Can be used as one of the electrodes.

The core substrate 610 has a front surface 601 A and a back surface 6, centered on the base metal plate 601.
01B, two composite dielectric layers 611, 613, respectively.
, 612 and 614, respectively, and two metal layers 602,
604, 603, and 605 are alternately laminated. Moreover, regarding the layers whose surfaces correspond to the sum and the back side, these materials are made of the same material and have the same thickness. Therefore, the core substrate 610 is unlikely to be warped due to these imbalances.

Next, the wiring board 600 will be described. The wiring board 600 shown in FIG.
m, approximately 0.5 mm thick. As shown in FIG. 2, the front and back surfaces 610A, 610B of this core substrate 610
And two resin insulation layers 6 each made of epoxy resin.
21, 641, 631, 651 and wiring layers 625, 635 made of Cu. Wiring layer 625
Is formed between the resin insulating layers 621 and 641, and the wiring layer 635 is formed between the resin insulating layers 631 and 651, respectively.
Including via conductors 625V and 635V for connecting to metal layers 604 and 605 located below, respectively. In the wiring layer 625, the opening 641H of the resin insulating layer 641 is provided.
The pad portion 625P exposed to the inside is raised from the opening portion 641H, the top portion is flattened, and a solder bump 647 for connecting to an electronic component such as an IC chip is formed. On the other hand, among the wiring layers 635, the resin insulating layer 651
The portion exposed in the opening 651H is a land portion 635L for connecting to another wiring board such as a motherboard. Note that the resin insulating layers 641 and 651 also serve as a solder resist.

Since the wiring substrate 600 itself is made of the core substrate 610 and the resin insulating layer 621 and the like, the rigidity is not so high. Therefore, the wiring substrate 600 is reinforced in consideration of the reliability in handling and mounting the IC chip CH on the solder bumps 647. Reinforcement by a plate 680 is performed. That is, as shown in FIG. 3, a substantially square-shaped reinforcing plate made of oxygen-free copper and having a length of 40 mm × 40 mm, a thickness of 0.5 mm, and a 17 mm square through hole in the center, as shown in FIG. 680
Is stuck. Thus, the wiring board 600
Is reinforced by the reinforcing plate 680, and conversely, its rigidity is
Sufficient rigidity that does not cause difficulty in handling during or after manufacturing is sufficient. In addition, the rigidity of the core substrate 610 only needs to have such a rigidity that does not cause difficulty in handling during or after manufacturing. Therefore, as in the present embodiment, the core substrate 610 is configured around the relatively thin base metal plate 601. As a result, the thickness of the core substrate 610 and further the thickness of the wiring substrate 600 could be reduced by the reduced thickness of the base metal plate 601. Further, thereby, the dimension in the thickness direction (vertical direction in the figure) of the through-hole conductor 607 could be shortened, and the inductance and resistance of the through-hole conductor 607 could be reduced.

As can be easily understood from the above description, this wiring board 600 has a layered capacitor C61 formed on a core substrate 610 at a substantially central portion in the thickness direction thereof, and has a solder bump 647 to form a wiring board surface (IC).
An IC chip (not shown) mounted on the chip mounting surface (600A) and the layered capacitor C61 can be connected at a very short distance. Therefore, intrusion of noise during this time can be prevented, and noise can be reliably removed. Also,
For example, unlike the case where the resin wiring layers 621 and 631 themselves have a high dielectric constant, the signal of the wiring layers 625 and 635 formed between the resin insulating layers 621 and 641 and between the resin insulating layers 631 and 651 is different. Wiring can be designed and routed with the same line width as before. This is because the same epoxy resin as in the related art can be used for the resin insulating layer 621 and the like, so that their dielectric constants do not change, and therefore the impedance of the signal wiring does not change. Therefore, the design of the wiring layer 625 including the signal wiring layer and the like can be easily performed.

Next, a method of manufacturing the core substrate 610 will be described. First, the laminate forming step will be described. First, as shown in FIG. 4, at a predetermined position on an oxygen-free copper plate having a length and width of 40 mm and a thickness of 40 μm, as described later, a diameter φ200 for insulating a through-hole conductor to be formed later is used.
Base metal plate 6 having a through hole 601H for insulation of μm
01 is prepared. The base metal plate 601 is formed by etching. The thickness of the base metal plate 601 is selected so that rigidity can be secured to the extent that handling is not difficult during the manufacturing steps or steps described below.

Subsequently, the surface 610 of the base metal plate 601
A and Ba on epoxy resin paste on backside 601B
32 wt% of TiO ₃ powder and 20 wt% of Cu powder
A semi-cured composite dielectric film obtained by dispersing and semi-curing an epoxy resin, and copper foils 671 and 672 each having a thickness of 12 μm are stacked on each other and subjected to vacuum hot pressing. Thus, as shown in FIG. 5, an intermediate laminated plate 620 in which the composite dielectric layers 611 and 612 and the copper foils 671 and 672 are laminated on the front and back surfaces of the base metal plate 601 is formed. The base metal plate 601
The dielectric through-hole 601H formed in the above is also filled with the composite dielectric fluidized at the time of vacuum hot pressing, and the composite dielectric layer 6
11,612. The copper foils 671, 672
Although a thinner than the base metal plate 601 was used as
Since the rigidity of the intermediate laminated plate 620 can be secured to some extent by the base metal plate 601, there is no problem in handling.

Next, as a copper foil patterning step, the copper foils 671 and 672 of the intermediate laminate 620 are patterned into a predetermined pattern by etching, and as shown in FIG. 6, metal layers having openings 602H and 603H having a diameter of 200 μm, respectively. 602 and 603 are formed. further,
As a laminating step, a semi-cured composite dielectric film similar to the above, and a copper foil having a thickness of 12 μm are formed on the front surface 620A and the back surface 620B of the intermediate laminate 620, that is, the front surface 602A of the metal layer 602 and the back surface 603B of the metal layer 603. 673,6
74 are stacked and vacuum hot pressed. This allows
As shown in FIG. 7, the front and back surfaces 620 of the intermediate laminate 620 are shown.
A, 620B and composite dielectric layers 613, 614 and copper foil 6
A laminated plate 630 in which 73 and 674 are laminated is formed. That is, the composite dielectric layer 611 and the like and the metal layer 60 having a predetermined pattern are formed.
2 and the like are alternately laminated to form a laminated plate 630 in which metal foils 673 and 674 are laminated on the outermost surfaces 613A and 614B of the laminated outermost composite dielectric layers 613 and 614. The openings 602 formed in the metal plates 602 and 603
H, 603H is also filled with the composite dielectric fluidized during the vacuum hot pressing, and the composite dielectric layer 613 or 614 is filled.
Become a part of.

Subsequently, as a through-hole forming step, as shown in FIG. 8, a diameter φ6 is applied to a predetermined position between the front surface 630A and the back surface 630B of the laminated plate 630 by a YAG laser.
A 0 μm through hole 661 is formed. As can be easily understood from FIG. 8, the through hole 661 includes a base connection through hole 661A that penetrates the base metal plate 601 and exposes the base metal plate 601 on the inner peripheral surface. further,
Base insulating through-holes 661B and 661C which penetrate the inside of the insulating through-hole 601H formed in the base metal plate 601 except for the composite dielectric layers 611 and 612 and do not expose the base metal plate 601 on the inner peripheral surface are also included. These through holes 66
In one, the through-hole 661B passes through the first metal layers 602 and 603 counted from the base metal layer 601, respectively, and the metal layers 602 and 603 are exposed on the inner peripheral surface. Also,
The through hole 661C is formed by the insulating through hole 601H and the metal layer 6.
The base metal layer 601 and the metal layers 602 and 603 are not exposed on the inner peripheral surface through the openings 602H and 603H formed in the holes 02 and 603 except for the composite dielectric layers 611 to 614.

Thereafter, as a patterning step, through-hole conductor layers 607 are formed in the through holes 661 by known electroless and electrolytic plating techniques. Thereafter, the through-hole conductor 607 is filled with epoxy resin, the front surface 630A and the back surface 630B are leveled, and the copper foil 67
The 3,674 and the plating layer formed thereon are patterned into metal layers 604, 605 of a predetermined pattern by etching to complete the core substrate 610 shown in FIG.
As can be easily understood from the above, the first through-hole conductor 607A formed in the base connection through-hole 661A of the through-hole conductor layer 607 is directly connected to the base metal plate 601 and is insulated from the metal layers 602 and 603. Have been. On the other hand, the second through-hole conductor 607B formed in the base insulating through-hole 661B is insulated from the base metal plate 601 and is directly connected to the metal layers 602 and 603 to conduct. Further, the third through-hole conductor 607C formed in the base insulating through-hole 661C is connected to the base metal plate 601.
In addition, both the metal layers 602 and 603 are insulated.

Since the base metal plate 601 made of oxygen-free copper having a thickness of 40 μm was used, the rigidity of the core substrate 610 and the products on the way of the core substrate 610 could be maintained to some extent, and the handling was easy. Also, in the manufacturing process of the wiring substrate 600 described below, the handling of the wiring substrate 600 and the products in the middle of the process is easy. In addition, a commonly used glass-epoxy resin composite material having a thickness of, for example, about 0.8 mm to 1.2 mm is used. On the other hand, the thickness of the base metal plate 601 is about 1/20 of these, and the thickness of the core substrate 610 can be reduced accordingly. Therefore, the through-hole conductor layer 607
Can be reduced in the axial direction (vertical direction in the figure), so that the inductance and resistance of the through-hole conductor layer 607 can be reduced.

In this state of the core substrate 610, the presence or absence of short-circuit failure, insulation resistance, or capacitance of the layered capacitor C61 is checked. Thus, for example, when the base metal plate 601 and the metal layer 602 are in contact with each other and short-circuited, such as when the layered capacitor C1 is short-circuited, or when the capacitance is out of the standard range, the core is not formed. The substrate 610 is determined to be defective and is discarded. Since the noise removal ability increases as the capacitance of the capacitor increases, it is preferable to increase the capacitance as much as possible. For this purpose, the thickness of the composite dielectric layer 611 or the like is reduced, or the area of the core substrate 610 is reduced. (Specifically, the area of the base metal plate 601 and each metal layer 602, etc.)
Furthermore, a method of increasing the amount of metal powder such as copper powder to increase the dielectric constant of the composite dielectric layer is conceivable.

However, all of these methods tend to cause short-circuit failure of the capacitor.
Short-circuit failure of the layered capacitor increases, and the yield tends to decrease. On the other hand, in the present embodiment, since the layered capacitor can be checked in the state of the core substrate 610, defective products can be removed at a stage of the core substrate 610 having a relatively low added value without forming a resin insulating layer or the like. Therefore, during or after the manufacturing process of the wiring board 600 described below, it is possible to suppress a decrease in yield due to a defective layer capacitor and a loss due to waste products.

Next, as shown in FIG. 9, a photosensitive epoxy resin layer is formed on the front surface 610A and the back surface 610B of the core substrate 610, and via holes 621VH and 631VH are formed by photolithography and cured. Further, wiring layers 625 and 635 having vias 625V and 635V are formed by a semi-additive method or a subtractive method.

Similarly, a photosensitive epoxy resin layer is formed, and the openings 641H, 641H,
After the 651H is formed, it is cured, and a solder paste is applied in the opening 641H, heated and melted to form a solder bump 647, and the wiring board 600 shown in FIG. 2 is completed. The wiring substrate 600 and the products in the middle of the process could be handled and manufactured without any problem due to the rigidity of the base metal plate 601. Further, as described above, since the inductance and resistance of the through-hole conductor 607 in the core substrate 610 are small and the layered capacitor C61 is incorporated, the ground potential and the power supply potential of electronic components such as an IC chip mounted on the solder bump 647 are provided. Can be effectively removed.

As described above, in order to compensate for the rigidity of the wiring board 600 and secure the reliability when an IC chip or the like is mounted, a reinforcing plate 680 is attached to the wiring board surface 600A as shown in FIG. wear. Such a wiring board 60
In the case of No. 0, the rigidity can be ensured by the reinforcing plate 680, and the thickness of the wiring board 600 itself can be made relatively thin, so that it is possible to meet the demand for a reduction in height.

(Embodiment 2) Next, a second embodiment will be described. In this embodiment, a core substrate and a wiring substrate are formed in the same manner as the core substrate 610 and the wiring substrate 600 described in the above embodiment. However, in the first embodiment,
In manufacturing the core substrate 610, the semi-cured composite dielectric film and the copper foils 671 and 672 are laminated and hot-pressed,
Once the intermediate laminate 620 is formed, the copper foils 671 and 672 are patterned. Further, the semi-cured composite dielectric film and the copper foils 673 and 674 are laminated and hot-pressed to form a laminate 63.
0 was formed. On the other hand, the present embodiment is different in that a laminated plate is formed by laminating four composite dielectric layers and a metal layer (copper foil) by a single hot press. Therefore, different parts will be mainly described, and description of similar parts will be omitted or simplified.

In this embodiment, a two-layer film and a patterned two-layer film are formed prior to lamination. First, the step of forming a two-layer film will be described. FIG. 10 (a)
As shown in the figure, a copper foil 711 having a thickness of 18 μm is prepared, and an upper surface 711A is coated with an epoxy resin paste and BaTiO _3.
Powder and a composite dielectric paste in which Cu powder is dispersed is applied in a thickness of 10 to 100 μm (in this example, about 60 μm).
Apply to. This is semi-cured to form a semi-cured composite dielectric film (semi-cured composite dielectric layer) 712, and the copper foil 71
First, a two-layer film 710 in which a semi-cured composite dielectric film 712 is laminated is formed.

More specifically, as shown in FIG. 10B, a reinforcing film RF made of polyimide or polyester having a thickness of 200 μm is applied to a semi-cured composite dielectric film 71.
A two-layer film with a reinforcing film (hereinafter also referred to as a three-layer film) 730 having a copper foil 711, a semi-cured composite dielectric layer 712, and a reinforcing film RF in this order, which is laminated on the surface 712 </ b> A, is formed. This three-layer film 730
Is reinforced by the reinforcing film RF, so that even if the thickness of the copper foil 711 and the patterned copper foils 713 and 714 described later and the semi-cured composite dielectric layer 712 are thin, the rigidity to withstand handling in each step is improved. Therefore, the core substrate having the thin metal layer 602 and the like and the thin composite dielectric layer 611 and the like as shown in FIG. 1 can be easily formed.

Further, since the three-layer film 730 has a structure in which the adhesive semi-cured composite dielectric layer 712 is sandwiched between the copper foil 711 and the reinforcing film RF, the semi-cured composite dielectric layer 712 has dust. Is also prevented from adhering. Further, in the three-layer film 730, the copper foil 71
Since the composite dielectric paste was applied and semi-cured on 1 to form a semi-cured composite dielectric layer 712, no air or dust was interposed between the copper foil 711 and the semi-cured composite dielectric layer 712, Also, the adhesion between them is good. In order to further improve the adhesion between the two, the upper surface 71 of the copper foil 711
It is more preferable to previously roughen 1A by a method such as blackening treatment, needle-like plating, and roughening etching.

Next, the step of forming a patterned two-layer film will be described. As shown in FIG. 11A, a dry film DF is attached to the exposed surface 711B (the upper surface in the figure) of the copper foil 711 of the three-layer film 730, and is exposed and developed to form an opening DFO having a predetermined pattern. Then, FIG.
As shown in (b), the copper foil 711 is etched to form a first patterned copper foil 713 having a predetermined pattern such as an opening 713H, and the dry film DF is peeled off to form a first patterned two-layer with a reinforcing film. A film 731 is formed. Similarly, as shown in FIG.
4H and the like, and the first patterned two-layer film 73
A second patterned bilayer film 732 having a second patterned copper foil 714 different from one is also formed. Note that, in the laminated plate forming step described below, when laminated, the exposed surfaces of the patterned copper foils 713 and 714 are previously subjected to blackening treatment in order to improve the adhesion between the adjacent semi-cured composite dielectric films 712. It is more preferable that the surface is roughened by a technique such as needle plating or roughening etching.

Then, as a two-layer film lamination pressing step in the lamination plate forming step, first, as shown in FIG.
Centering on the same base metal plate 601 as in the first embodiment,
The formed patterned two-layer film and the two-layer film are laminated. That is, the surface 601A of the base metal plate 601
Then, the semi-cured composite dielectric film 712 is combined with the first patterned bilayer film 731 (FIG. 11).
(B), the first patterned two-layer film 721 from which the reinforcing film RF is peeled off is laminated. Further, a two-layer film 710 obtained by removing the reinforcing film RF from the three-layer film 730 is laminated on the first patterned copper foil 721 (upper side in the figure). On the other hand, the second patterned two-layer film 732 (see FIG. 11 (c)) is also provided on the back surface 601B so that the semi-cured composite dielectric film 712 is also fitted.
The second patterned two-layer film 722 from which the reinforcing film RF has been peeled off is laminated. Further, a two-layer film 710 obtained by removing the reinforcing film RF from the three-layer film 730 is laminated on the second patterned copper foil 722 (the lower part in the figure). Thereafter, a laminate 630 (see FIG. 7) similar to that of the first embodiment is formed all at once by vacuum hot pressing.

Thereafter, the core substrate and the wiring substrate are formed in the same manner as in the first embodiment, and the description is omitted. According to this embodiment, the two-layer film 710 in which the copper foil 711 and the semi-cured composite dielectric film 712 are laminated, and the patterned copper foils 713 and 714 in which a predetermined pattern is formed and the semi-cured composite dielectric film 712 The laminated patterned two-layer films 721 and 722 were laminated and pressed around the base metal plate 701 to form a laminated plate 730 at a stroke. For this reason, the number of times of vacuum heat press can be reduced. Since many types of patterned two-layer films 721 and 722 can be formed in parallel, the first embodiment is formed in order.
As a whole, the process is shorter than in the case of (1), and the core substrate and the wiring substrate can be formed more easily and inexpensively. Further, there is no danger of the epoxy resin and the like in the composite dielectric layer being deteriorated by repeating the hot pressing. In the present embodiment, 4
Although the example in which the core substrate in which the composite dielectric layers of the layers are stacked is shown, when a larger number of layers (for example, 6 layers, 8 layers, etc.) are stacked, the number of times of hot pressing can be further reduced.

In this embodiment, in order to facilitate handling by reinforcement and prevent dust adhesion, the three-layer film 730 in which the reinforcing film RF is attached to the two-layer film 710 or the patterned two-layer films 721 and 722 is used. Patterned two-layer films 731 and 732 with a reinforcing film were formed. However, when no reinforcement is required, the use of the reinforcing film FR can be omitted.

(Embodiment 3) Next, a third embodiment will be described. In the core substrate 610 according to the first and second embodiments, the through-hole conductor 607 penetrating between the front surface 610A and the back surface 610B is formed in a single cylindrical shape at any point. On the other hand, in the core substrate 810 according to the present embodiment, the metal layers on the front and back surfaces are connected by a set of a plurality of through-hole conductors formed in parallel at adjacent positions. Therefore, the first embodiment differs from the first embodiment only in the through-holes and the through-hole conductors formed in the laminated plate in which the composite dielectric layer and the metal layer are laminated. Simplify.

First, in the same manner as in the first embodiment,
30 are formed (see FIG. 7). However, among the laminated plates 830, the insulating through holes 801H of the base metal plate 801 have a diameter of φ350 μm, and the openings 802H of the metal layers 802 and 803 have the same diameter.
803H has a diameter φ350 μm, which is slightly larger than that of the first embodiment. Thereafter, as shown in FIG.
A through hole 8 having a diameter of 50 μm is formed at a predetermined position by a laser.
Drill 61. However, as can be understood from the drawing, a plurality of (two in FIG. 13) through holes 861 are formed in close proximity. That is, the through holes 661A, 66A in the first embodiment.
1B, 661C (see FIG. 8) instead of through-hole 861A
1 and 861A2, 861B1 and 861B2, 861C1
And 861C2 to form a pair.

Thereafter, similarly to the first embodiment, plating is formed in the through-hole 861 by electroless copper plating and electrolytic copper plating, and the through-hole conductor 807
To form Further, an epoxy resin is filled in the through-hole conductor 807 to form a plug body 816, and the surface 830A
And rear surface 830B, and further, copper foils 873, 87
4 and the plating layer formed thereon were formed into metal layers 804 and 805 of a predetermined pattern by etching,
4 is completed.

Similarly to the core substrate 610 of the first embodiment, a total of four composite dielectric layers 61 are provided on the front and back surfaces of the base metal plate 801 in the same manner as the core substrate 610 of the first embodiment.
1, 612, 613, 614 and metal layers 802, 803, 804, 805 of a predetermined pattern of Cu are alternately laminated. The base metal plate 801 and the metal layers 802 and 803 adjacent thereto, the metal layer 802 and a part 804A of the metal layer 804 adjacent thereto, and the metal layer 803 and a part 805A of the metal layer 805 adjacent thereto are combined. The layered capacitor C81 has five electrode layers and four dielectric layers facing each other with the dielectric layer 611 or the like interposed therebetween.

Further, the core substrate 810 is electrically connected to the base metal plate 801 and a part of the metal layers 804A and 805
The through-hole conductor connecting A is composed of two parallel through-hole conductors 807A1 and 807A2. Similarly, the base metal plate 801 is insulated and the metal layer 80
2, 803B and a part of the metal layer 804B and 805B
Are also composed of two parallel through-hole conductors 807B1 and 807B2. Therefore, the through-hole conductor has lower inductance and lower resistance than the through-holes 607A and 607B of the first embodiment.

The base metal plate 801, the metal layer 80
2, 803, and a part 804 of the metal layer.
The through-hole conductor connecting C and 805C is also composed of two parallel through-hole conductors 807C1 and 807C2. As described above, when the signal wiring and the like are also configured by a plurality of parallel through-hole conductors, the inductance and resistance of the signal wiring can be reduced. further,
Even if one through-hole conductor is disconnected for some reason, the other through-hole conductor is connected, so it does not become a fatal defect such as conduction failure, so the yield of the core substrate and wiring substrate can be reduced. Reliability can be improved.

In the above embodiment, two through holes are formed as one set. However, the greater the number of through holes included in each set, the more the inductance and resistance can generally be reduced. On the other hand, when a large number of through-holes are formed, man-hours are required and the formation tends to be difficult, for example, the gap between the through-holes is reduced. Therefore, it is preferable to form an appropriate number of through holes in consideration of inductance and the like.

(Embodiment 4) In the above Embodiments 1, 2 and 3, each of the base metal plate has two
The example in which the composite dielectric layers (total of four layers) and the metal layers are stacked is shown. However, the number of layers may be appropriately changed according to a desired capacitance value, and a larger number of composite dielectric layers and metal layers may be further laminated on the front and back surfaces of the base metal plate. The core substrate 910 and the wiring substrate 900 according to the fourth embodiment will be described with reference to the drawings. The core substrate 910 and the wiring substrate 900 according to the fourth embodiment are the same as the core substrates 710 and 810 and the wiring substrate 70 according to the first to third embodiments.
0, and has a substantially similar structure.

However, in the core substrate 910 of the present embodiment,
The difference is that three composite dielectric layers (a total of six layers) and a metal layer are laminated on the front and back surfaces of the base metal layer 901 respectively. In the wiring board 600 (see FIG. 2),
Although the upper and lower ends of the through-hole conductor 607 are not closed, in the present embodiment, the plug body is filled in the through-hole conductor and both ends thereof are closed. A substantially coaxial via conductor is formed (see FIG. 15). Furthermore, in the wiring board 900 of the present embodiment, three resin insulation layers are provided on the front surface and the back surface of the core substrate 910, respectively, and via conductors are stacked between them in the thickness direction as via conductors penetrating therebetween. It is formed in the form of a stacked via to be formed (see FIG. 17). In addition, 3 formed on the core substrate 910 of the present embodiment.
The difference is that the arrangement of the through-hole conductors 908A, 908B, 908C in the plane direction is characterized. Therefore, different portions will be mainly described, and similar portions will be omitted or simplified.

First, the core substrate 91 according to the fourth embodiment will be described.
0 will be described. As shown in the partial enlarged cross-sectional view of FIG. 15, the base metal plate 901 has an insulating through-hole 901H, like the base metal plate 601 of the first embodiment. Further, the front surface 901A and the back surface 90A of the base metal plate 901
1B includes three composite dielectric layers 911 and 91, respectively.
3,915,912,914,916 are laminated. Further, between the layers, the outermost surface in the back surface 901B direction of the core substrate, ie, the lower surface of the lowermost composite dielectric layer 916 in FIG. 15, and the outermost surface in the surface 901A direction, ie, the uppermost composite dielectric material in FIG. Each of the upper surfaces of the layers 915 has C
u, metal layers 902, 904, 906, 903, 9
05,907. Further, through holes 981 are formed to penetrate between the lower surface of the composite dielectric layer 916 and the upper surface of the composite dielectric layer 915.
0 to the front surface 910A and the back surface 910B,
Is provided. The inside of the through-hole conductor 908 is filled with a plug material 917 made of epoxy resin, respectively,
7 are closed by closing portions 906D and 907D formed respectively.

The through-hole 981 has a base metal plate 9
01 and even-numbered (specifically, second) first inner metal layers 90 counted from base metal plate 901 among inner metal layers 902 to 905 sandwiched between composite dielectric layers 911 and the like.
First through-hole 981A having 4,905 exposed on its inner peripheral surface
Is included. In addition, it penetrates through the insulating through-hole 901H,
Odd-numbered (specifically, 1
The second through-hole 981B in which the second inner metal layers 902 and 903 are exposed on the inner peripheral surface thereof, and the insulating through-hole 9
01H, the third through-hole 981 in which neither the base metal layer 901 nor the inner metal layer 902 is exposed on the inner peripheral surface.
C is also included.

Therefore, when through-hole conductors are formed in these through holes 981, the base metal plate 901 and the first inner metal layers 904, 9
05 is directly connected to the first through-hole conductor 908A,
Core substrate front surface 910A or core substrate back surface 9
Conduction is made to portions 906A and 907A of the outer metal layers 906 and 907 formed in 10B. On the other hand, the second through hole 9
81B, the second inner metal layers 902 and 903
It is directly connected to the through-hole conductor 908B and is similarly electrically connected to other portions 906B and 907B of the metal layers 906 and 907. In the third through-hole 981C, a third through-hole conductor 908C that is insulated from both the base metal layer 901 and the inner metal layer 902 and is electrically connected to other portions 906C and 907C of the metal layers 906 and 907 is provided. It is formed.
Part of the outer metal layers 906 and 907 (specifically, metal layers 906B and 907B) are used as electrodes constituting the layered capacitor C91. Other portions are also used as wiring layers.

In the core substrate 910, as described above, the base metal plate 901 and the metal layers 904, 905 and the portions 906A, 907A of the metal layers 906, 907 are electrically connected to each other. The metal layers 902 and 903 and the metal layer 9
The other parts 906B and 907B of the parts 06 and 907 are electrically connected to each other. Therefore, these metal layers are opposed to each other with the respective composite dielectric layers 911 and the like interposed therebetween, so that three layers are respectively provided on the front surface 901A and the back surface 901B of the base metal plate 901 as easily understood from FIG. Constitute a layered capacitor C91 having a total of six dielectric layers. Moreover, three types of through-hole conductors 908
A, 908B and 908C correspond to the surface 91 of the core substrate 910.
0A and the back surface 910B, the wiring layer formed on the back surface 910B side of the core substrate 910 and the wiring layer formed on the front surface 910A side are connected via these through-hole conductors 908 as described below. can do.
Here, for example, when the first through-hole conductor 908A is connected to the power supply wiring and the second through-hole conductor 908B is connected to the ground wiring, the layered capacitor C91 is inserted in parallel between the power supply potential and the ground potential. And the noise superimposed on these potentials can be absorbed. on the other hand,
By connecting the signal wiring and the like to the third through-hole conductor 908C, the signal wiring and the like can pass through the core substrate 910 while being insulated from the layered capacitor C91.

Next, the wiring board 9 according to the fourth embodiment will be described.
00 will be described. FIG. 17 is a partially enlarged sectional view of the wiring board 900, FIG. 18 is a plan view thereof, and FIG. 19 is a bottom view thereof. The wiring board 900 includes three resin insulation layers 921, 941, 961, 93 made of epoxy resin on the front and back surfaces 910A, 910B of the core substrate 910, respectively.
Two wiring layers 9 made of 1,951,971 and Cu
25,945,935,955.
Each wiring layer 925 and the like are formed between layers such as the resin insulating layer 921 and the via conductors 925V, 945V, 935V, and 95 for connecting to a metal layer and a wiring layer located below.
5V included.

The surface 900A of the wiring substrate 900
On the side, as shown in the plan view of FIG. 18, the IC chip CH is mounted at a substantially central portion in the plane direction, and the terminal CHB of the IC chip CH can be connected to the central portion by flip chip connection. A large number of openings 961H formed in the resin insulating layer 961 are formed in a substantially lattice shape. In this opening 961H, as can be easily understood from FIG.
The wiring layer 945 or the via conductor 945V is exposed. On the other hand, the back surface 900B side of the wiring substrate 900 is as shown in FIG.
As shown in the bottom view, openings 971H are formed in a grid pattern over substantially the entire surface of the resin insulating layer 971 in the plane direction, and wirings including via conductors 955V are provided in the openings 971H for connection with another wiring substrate such as a motherboard. Layer 955 is exposed. Note that a solder bump may be formed on the wiring layer 945 and the via conductor 945V in the opening 961H.

This wiring board 900 also has a built-in layered capacitor C91 formed on a core substrate 910, similarly to wiring board 600 of the first embodiment, and has an IC chip CH mounted on wiring board surface 900A which is an IC chip mounting surface. And the layered capacitor C91 can be connected at an extremely short distance. Therefore, noise can be reliably removed. Also, the signal wiring can be designed and routed with the same line width as the conventional one, and the design of the wiring layer including the signal wiring can be easily performed. This is because the same epoxy resin as in the related art can be used for the resin insulating layer 921 and the like, so that their dielectric constants do not change, and therefore the impedance of the signal wiring does not change. In addition, closing portions 906D and 907D are formed at both ends (upper and lower ends in the figure) of the through-hole conductor 908,
These and the wiring layers 925, 935 are connected to the closed portions 906D,
925V on the closed part directly connected on 907D,
There is also a portion forming 935V. In this part,
The through-hole conductor 908 and the via conductor 925V on the closed portion,
935 V can be connected at a very short distance, and the resistance and inductance of the wiring layer 925 and the like can be reduced.

Further, the wiring board 900 may be of a stacked via type in which via conductors 945V and 955V are stacked on the closed portion upper via conductors 925V and 935V, respectively. In particular, as shown by a two-dot chain line in FIG. 17, a portion corresponding to the IC chip when the IC chip CH is mounted on the wiring board 900, that is, an IC corresponding portion Q obtained by projecting the IC chip CH in the thickness direction. The wiring connecting the first through-hole conductor and the second through-hole conductor 908A and 908B and the terminal CHB of the IC chip CH in the above-described stacked via form, that is, the via conductor 92
The via conductor 945V is formed on 5V in a stacked form. When the stacked via type is used, the wiring between the layered capacitor C91 and the IC chip can be particularly shortened, so that the resistance and inductance are further reduced, which is useful for preventing the intrusion of noise.

Here, as described above, the wiring board surface 90
Since the IC chip CH is mounted on the 0A side and connected to another wiring substrate on the back surface 900B side, the wiring layer 945 and the via conductor 94 exposed in the opening 961H are formed in the wiring substrate 900.
A wiring connecting between 5 V and the wiring layer 955 exposed in the opening 971H is formed. Therefore, on the core substrate 910,
The three types of through-hole conductors 908 are formed as described above. In the core substrate 910 of the fourth embodiment, the through-hole conductors 908 are further arranged in the plane direction as shown in FIG. In this figure, the first through-hole conductor 908A and the second through-hole conductor 90
8B is represented by a black circle, and the third through-hole conductor 908C is represented by a white circle, so that the difference in arrangement depending on the type of the through-hole conductor is easily understood. Note that, also in this drawing, a portion surrounded by a two-dot chain line indicates the IC corresponding portion Q. The IC corresponding section Q is located at a substantially central portion of the core substrate 910. Further, the cross section PP ′ indicated by the dashed line corresponds to the cross section shown in FIG.

As can be easily understood from FIG. 16, in the IC corresponding portion Q which is the central portion of the core substrate 910, 3
Types of through-hole conductors 908A, 908B, 908C
Among them, many first through-hole conductors 908A and second through-hole conductors 908B indicated by black circles are formed. On the other hand, only a small number of third through-hole conductors 908C are formed,
A and the number of the second through-hole conductors 908B. On the other hand, on the outer peripheral portion of the IC corresponding portion Q,
A large number of third through-hole conductors 908C are formed.
The number formed in the peripheral portion is larger than the number formed in the C corresponding portion Q. That is, most of the third through-hole conductors 908C used for the signal wiring and the like are formed on the periphery of the IC corresponding portion Q rather than the IC corresponding portion Q.

The three kinds of through-hole conductors 908 are arranged in this manner for the following reasons. That is, the terminal CHB of the IC chip CH is connected to each electrode (base metal plate and metal layer) 901 of the layered capacitor C91 of the core substrate 910.
907, and therefore, the first through-hole conductor 908A and the second through-hole conductor 908B are preferably connected at a distance as short as possible. Therefore, the first through-hole conductor 908A and the second through-hole conductor 908B are
It is preferable to be located immediately below the C chip CH. Moreover, when a large number of first through-hole conductors 908A and a large number of second through-hole conductors 908B are formed and connected in parallel, respectively, the first through-hole conductor 908A and the second through-hole conductor 908B and these and the IC chip Can be further reduced. Therefore, immediately below the IC chip CH, that is, I
It is preferable to form a large number of first through-hole conductors 908A and second through-hole conductors 908B in the C corresponding portion Q.

On the other hand, the signal wiring or the like using the third through-hole conductor 980C is not required to have such low resistance and low inductance. Therefore, in terms of resistance and inductance, it is not necessarily formed in the IC corresponding portion Q. do not have to. Therefore, by arranging the third through-hole conductor 908C on the periphery of the IC corresponding part Q as much as possible, it is not necessary to consider the third through-hole conductor 908C, and a large number of the first through-hole conductors 908A and the second through-hole The conductor 908B can be easily arranged in the IC corresponding portion Q. That is, the layer capacitor C91 and the IC chip CH can be connected with lower resistance and lower inductance.

As described above, the wiring board 90 of the fourth embodiment is described.
0, the closing portion 906 provided in the through-hole conductor 908
D, 907D are not only formed by directly overlaying the closed via conductors 925V, 935V, but also via conductors 925V and 925V.
The wiring is formed in a stacked via format in which 45 V or via conductors 935 V and 955 V are stacked. Therefore, it can be connected to the IC chip CH with further lower resistance and lower inductance.

Further, in the wiring board 900 and the core board 910, in consideration of the arrangement of the three types of through-hole conductors 908, the first through-hole conductor 908A and the second through-hole conductor 908B Is arranged to be larger than the third through-hole conductor 908C,
In addition, the third through-hole conductor 908C is configured such that the number of peripheral portions formed in the IC corresponding portion Q is larger than the number formed in the IC corresponding portion Q. Second through-hole conductor 908B
Can be easily formed, and the layered capacitor C9 can be easily formed.
1 and the IC chip CH can be connected with lower resistance and lower inductance. As can be easily understood from the above, all the third through-hole conductors 908C are formed on the peripheral portion of the IC corresponding portion Q, and the third through-hole conductor is not formed in the IC corresponding portion Q. More preferably, only the first through-hole conductor 908A and the second through-hole conductor 908B are formed. IC corresponding part Q
This is because the degree of freedom in the arrangement of the first through-hole conductor 908A and the second through-hole conductor 908B is further increased.

Since the core substrate 910 and the wiring substrate 900 of this embodiment may be formed by the same method as described in the first to third embodiments, description of the same parts will be omitted. In the fourth embodiment, the core substrate 9
In FIG. 10, closing portions 906D and 907D are formed at both ends of the through-hole conductor 908.
Parts related to the formation of 907D will be additionally described.

First, the surface 901A of the base metal plate 901
And three layers of composite dielectric layers 91 on the back surface 901B.
1 to 916, and an inner metal layer 902 to 9 between these layers.
Then, a laminate is formed by laminating copper foils on the front and back surfaces, and a through-hole 981 is formed at a predetermined position. Thereafter, electroless copper plating and electrolytic copper plating are performed on the copper foil inside the through hole 981 and on the front and back surfaces, and a through hole conductor 908 is formed inside the through hole 981. A plug material 917 made of epoxy resin is provided in the through-hole conductor 908.
After filling the upper and lower surfaces, electroless copper plating and electrolytic copper plating are applied to the upper part of the copper foil and the end of the plug material.
Thereafter, the copper foil on the front and back surfaces of the laminate is etched by a subtractive method to form a metal layer 9 having a predetermined pattern.
06,907. Thereby, both ends of the through-hole conductor 908 are closed by the closing portions 906D and 907D, and the through-hole 981 and the through-hole conductor 90 are closed.
8, via conductors 925 and 935 can be formed on the closed portions 906D and 907D.

(Fifth Embodiment) Next, a fifth embodiment will be described. In the first, second, and third embodiments, two composite dielectric layers (a total of four layers) are respectively laminated on the front and back surfaces of the base metal plate. In this example, a total of six layers were stacked. On the other hand, in the fifth embodiment, one layer is laminated on each of the front and back surfaces of the base metal plate. That is, the core substrate 1010 of the present embodiment shown in FIG.
B shows a semi-cured composite dielectric film and a copper foil 67, respectively.
An intermediate laminate 620 (see FIG. 5) formed by laminating 1,672 layers and vacuum hot pressing is used as the laminate.

As a through-hole forming step, this laminated plate 620 is formed.
At a predetermined position, the base connection through-hole 10 penetrating the base metal plate 601 and exposing the base metal plate 601 on the inner peripheral surface.
Drill 61A. A base insulating through hole 1061B penetrates through the inside of the insulating through hole 601H formed in the base metal plate 601 except for the composite dielectric layers 611 and 612 around the base metal plate 601 and the base metal plate 601 is not exposed on the inner peripheral surface. , 1
061C is also drilled. Then, as a patterning step, through-hole 1 was formed by electroless copper plating and electrolytic copper plating.
061 is plated to form through-hole conductors 1007, respectively. Further, the plug body 10 is filled by filling the through-hole conductor 1007 with epoxy resin.
16, the front surface 620A and the back surface 620B are leveled, and the copper foils 671, 672 and the plating layer formed thereon are etched to form a metal layer 100 having a predetermined pattern.
2, 1003, and the core substrate 101 shown in FIG.
Complete 0.

In the fifth embodiment, the semi-cured composite dielectric film and the copper foils 671, 672 are used as the base laminating step, similarly to the formation of the intermediate laminate in the first embodiment.
Were stacked and vacuum hot pressed to form a laminate 620. However, as shown in FIG. 21, the two-layer film 710 used in the second embodiment is overlapped on the front and back surfaces of the base metal plate 601,
The laminate 620 may be formed by vacuum hot pressing. In this way, the semi-cured composite dielectric film and copper foil 6
The handling becomes easier than the case where 71 and 672 are separately stacked on the front and back surfaces of the base metal plate 601.

In the above, the present invention has been described with reference to the embodiments. However, the present invention is not limited to the above-described embodiments, and it is needless to say that the present invention can be appropriately modified and applied without departing from the gist thereof. Nor. For example, in the first embodiment, the semi-cured composite dielectric film and the copper foils 671, 672
Were separately laminated on the front and back surfaces of the base metal plate 601, or a semi-cured composite dielectric film and copper foils 673 and 674 were laminated on the front and back surfaces of the intermediate laminated plate 620 and vacuum hot pressed. However, similarly to the fourth embodiment, the two-layer film 710 used in the second embodiment can be stacked on the front and back surfaces of the base metal plate 601 and the intermediate laminated plate 620 and subjected to vacuum hot pressing. In this case, the number of times of hot pressing does not change, but the handling becomes easier than the case where the semi-cured composite dielectric film and the copper foil are separately laminated. Further, for example, in the first embodiment, the via holes 621VH and 631VH, the opening 6
Although the photolithography technique was used to form 41H and 651H, the resin insulating layers 621, 631, 641, 65
At the time of forming 1, holes may be formed by a laser such as YAG, CO 2, excimer, or the like.

[Brief description of the drawings]

FIG. 1 is a partially enlarged cross-sectional view of a core substrate according to a first embodiment.

FIG. 2 is a partially enlarged cross-sectional view of the wiring board according to the first exemplary embodiment.

FIG. 3 is a cross-sectional view of the wiring board according to the first embodiment, showing the entire wiring board including a reinforcing plate.

FIG. 4 is a partially enlarged cross-sectional view showing a copper plate having an insulating through-hole formed in the method of manufacturing the core substrate and the wiring substrate according to the first embodiment.

FIG. 5 is a partially enlarged cross-sectional view showing a state in which the composite dielectric layer and the copper foil are laminated on the front and back surfaces of the copper plate, that is, the intermediate laminated plate, in the method of manufacturing the core substrate and the wiring substrate according to the first embodiment. .

FIG. 6 is a partially enlarged cross-sectional view illustrating a state in which a metal layer is formed by patterning a laminated copper foil into a predetermined pattern in the method for manufacturing a core substrate and a wiring substrate according to the first embodiment.

FIG. 7 is a partially enlarged cross-sectional view showing a state in which a composite dielectric layer and a copper foil are further laminated in the method of manufacturing the core substrate and the wiring substrate according to the first embodiment.

FIG. 8 is a partially enlarged cross-sectional view showing a state in which a through hole is formed in the laminated board in the method of manufacturing the core board and the wiring board according to the first embodiment.

9 is a partially enlarged cross-sectional view showing a state in which a resin insulating layer and a wiring layer are formed on the front and back surfaces of the core substrate shown in FIG. 8 in the method of manufacturing the wiring board according to the first embodiment.

FIG. 10 shows a method for manufacturing a core substrate according to the second embodiment,
(A) is a partially enlarged sectional view of a two-layer film in which a semi-cured composite dielectric film is formed on a copper foil, and (b) is a partially enlarged view of a two-layer film with a reinforcing film further laminated with a reinforcing film (three-layer film). It is sectional drawing.

FIG. 11 shows a method for manufacturing a core substrate according to the second embodiment,
(A) is a state in which a resist layer is formed on a metal foil of a two-layer film with a reinforcing film, (b) is a partially enlarged cross-sectional view showing a state in which a patterned two-layer film (a patterned three-layer film) is formed, c) is a partially enlarged cross-sectional view of another patterned two-layer film.

FIG. 12 shows a method of manufacturing a core substrate and a wiring substrate according to the second embodiment, in which a patterned two-layer film and a two-layer film (a patterned three-layer film obtained by removing a reinforcing film, Three-layer film)
Is an explanatory view showing a laminating step of sequentially laminating the layers.

FIG. 13 is a partially enlarged cross-sectional view showing a state in which a through-hole is perforated in a laminated board in order to form a through-hole conductor formed in the core substrate in parallel according to the method of manufacturing the core substrate and the wiring substrate according to the third embodiment. It is.

FIG. 14 is a partially enlarged cross-sectional view of a core substrate according to a third embodiment.

FIG. 15 is a partially enlarged cross-sectional view of a core substrate according to a fourth embodiment.

FIG. 16 is a diagram illustrating an arrangement of through-hole conductors of a core substrate according to a fourth embodiment.

FIG. 17 is a partially enlarged sectional view of a wiring board according to a fourth embodiment;

FIG. 18 is a plan view of a wiring board according to a fourth embodiment.

FIG. 19 is a bottom view of the wiring board according to the fourth embodiment.

FIG. 20 is a partially enlarged cross-sectional view of a core substrate according to a fifth embodiment.

FIG. 21 is an explanatory view showing a base laminating step of laminating two-layer films (three-layer films from which a reinforcing film has been removed) on the front and back surfaces of a base metal plate, respectively, in the method for manufacturing a core substrate according to the fifth embodiment. is there.

FIG. 22 is a partially enlarged cross-sectional view showing a conventional wiring board having a chip capacitor mounted on a lower surface.

[Explanation of symbols]

610, 810, 910, 1010 Core substrate 610A, 810A, 910A Core substrate front surface 610B, 810B, 910B Core substrate rear surface 600, 900 Wiring substrate 601, 801 901 Base metal plate 601H, 801H, 901H Insulating through holes 611, 612 , 613,614,911,912,9
13,914,915,916 Composite dielectric layer 602,603,604,605,802,803,8
04,805,902,903,904,905,10
02,1003 Metal layer 661,861,981,1061 Through hole 607,807,908,1007 Through hole conductor C61, C81, C91 Layered capacitor 621,631,641,651,921,931,9
41,951,961,971 Resin insulating layer 625,635,925,935,945,955 Wiring layer 625V, 635V, 925V, 935V, 945V,
955V Via conductor 671, 672, 673, 674, 711 Copper foil (metal foil) 710 Two-layer film 730 Two-layer film with reinforcing film (three-layer film) 712 Semi-cured composite dielectric film 713, 714 Patterned copper foil (pattern) Metal foil) RF reinforcing film 630,830 Laminated plate

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yuki Ogawa 14-18 Takatsuji-cho, Mizuho-ku, Nagoya City, Aichi Prefecture Inside Japan Special Ceramics Co., Ltd. (72) Eiji Kodera 14th Takatsuji-cho, Mizuho-ku, Nagoya City, Aichi Prefecture No. 18 Japan Special Ceramics Co., Ltd.

Claims (20)

[Claims] A core substrate, a resin insulating layer laminated on the front surface and the back surface of the core substrate, and a resin substrate between the core substrate and the resin insulating layer on the front surface and the back surface of the core substrate; A wiring layer formed on at least one of the insulating layers, wherein the core substrate comprises: a base metal plate; a plurality of composite dielectric layers containing a resin and a high dielectric powder; A plurality of metal layers having a thickness smaller than that of the base metal plate; and the composite dielectric layer and the metal layer are alternately laminated on the front surface and the back surface of the base metal plate, respectively. And a metal layer adjacent thereto, or a wiring board which constitutes a layered capacitor in which the base metal plate and the metal layer adjacent thereto and the adjacent metal layers face each other with the composite dielectric layer interposed therebetween. 2. The wiring board according to claim 1, wherein a reinforcing plate for reinforcing the rigidity of the wiring board is attached to the wiring board. 3. The wiring board according to claim 1, wherein the core substrate is a through-hole conductor formed inside a through-hole penetrating between a front surface and a back surface of the core substrate. A first through-hole conductor connected to one electrode of the layered capacitor; a second through-hole conductor connected to the other electrode of the layered capacitor; and the one electrode and the other A third through-hole conductor insulated from any of the electrodes; 4. The wiring board according to claim 1, wherein the through holes in the core board are formed by laser processing. 5. A core substrate, a resin insulating layer laminated on a front surface and a rear surface of the core substrate, respectively, and a space between the core substrate and the resin insulating layer and the resin resin on a front surface and a rear surface of the core substrate. A wiring layer formed on at least one of the insulating layers, wherein the core substrate comprises: a base metal plate having a front surface and a back surface; and a plurality of resins including a resin and a high dielectric powder. A composite dielectric layer, a plurality of metal layers thinner than the base metal plate, and a plurality of through-hole conductors, wherein the composite dielectric layer and the metal layer are a front surface and a back surface of the base metal plate. Are alternately laminated in the order of the composite dielectric layer and the metal layer in this order. The metal layer is located between the composite dielectric layers, the outermost surface of the composite dielectric layer on the outermost side in the core substrate rear surface direction, and the outermost in the core substrate surface direction. On the outside Located on the surface of the composite dielectric layer, the base metal plate and the metal layer adjacent thereto, or the base metal plate and the metal layer adjacent thereto and the adjacent metal layers sandwich the composite dielectric layer The plurality of through-hole conductors are opposed to each other, and the plurality of through-hole conductors are formed in through-holes penetrating the base metal plate, the plurality of composite dielectric layers, and the plurality of metal layers. Extends to the back surface, and is directly connected to the base metal plate or to an even-numbered inner metal layer counted from the base metal plate among the inner metal layers formed between the base metal plate and the composite dielectric layer A plurality of first through-hole conductors; a plurality of second through-hole conductors directly connected to an odd-numbered inner metal layer of the inner metal layer counted from the base metal plate; A plurality of third through-hole conductors that are non-conductive to both the layer and the inner metal layer. 6. The wiring board according to claim 5, wherein a reinforcing plate for reinforcing the rigidity of the wiring board is attached to the wiring board. 7. The wiring board according to claim 5, wherein the through-hole of the core substrate is formed by laser processing. 8. The wiring board according to claim 5, wherein the first through-hole conductor, the second through-hole conductor, and the third through-hole conductor belong to the third through-hole conductor. At least one of the wiring boards is a set of through-hole conductors formed in a plurality of through-holes formed at positions adjacent to each other and formed of a plurality of through-hole conductors that are conductive to each other. 9. The wiring board according to claim 5, wherein a mounting position of an IC chip mounted on a surface of the wiring board in the core board is projected in a thickness direction. The first through-hole conductor and the second through-hole conductor among the three types of through-hole conductors are formed in the IC-compatible portion, and the third through-hole conductor is not formed, or The number of the first through-hole conductors and the number of the second through-hole conductors formed in the portion are smaller than the sum of the first through-hole conductors and the second through-hole conductors. Wiring board. 10. The wiring board according to claim 5, wherein said base metal plate has a thickness of 30 μm or more and 100 μm or more.
A wiring board that is: 11. A core substrate for forming a wiring substrate by forming a resin insulating layer and a wiring layer on the front and back surfaces thereof, comprising: a base metal plate; a plurality of composite dielectrics including a resin and a high dielectric powder. And a plurality of metal layers having a thickness smaller than that of the base metal plate. The composite dielectric layer and the metal layer are alternately stacked on the front surface and the back surface of the base metal plate, respectively. A core comprising a metal plate and a metal layer adjacent thereto, or the base metal plate and a metal layer adjacent thereto and adjacent metal layers facing each other with the composite dielectric layer interposed therebetween to constitute a layered capacitor; substrate. 12. A core substrate for forming a wiring substrate by forming one or more resin insulating layers and wiring layers on the front and rear surfaces thereof, comprising: a base metal plate having front and rear surfaces; A plurality of composite dielectric layers containing body powder, a plurality of metal layers thinner than the base metal plate, and a plurality of through-hole conductors, wherein the composite dielectric layer and the metal layer are The composite dielectric layer and the metal layer are alternately laminated on the front surface and the rear surface of the metal plate in this order, and the metal layer is between the composite dielectric layers and the back surface of the outermost composite dielectric layer in the core substrate rear surface direction. And located on the outermost surface of the composite dielectric layer in the core substrate surface direction, the base metal plate and the metal layer adjacent thereto, or the base metal plate and the metal layer adjacent thereto and the adjacent metal layer , The above composite dielectric A plurality of through-hole conductors are formed in a through-hole penetrating the base metal plate, the plurality of composite dielectric layers and the plurality of metal layers; An even-numbered inner metal layer extending from the base metal plate, extending to the front surface and the back surface of the core substrate, among the inner metal layers formed on the base metal plate or between the base metal plate and the composite dielectric layer A plurality of first through-hole conductors directly connected to the base metal layer; a plurality of second through-hole conductors directly connected to an odd-numbered inner metal layer counted from the base metal layer in the inner metal layer; And a plurality of third through-hole conductors that are non-conductive to any of the inner metal layers. 13. The core substrate according to claim 12, wherein at least one of the first through-hole conductor, the second through-hole conductor, and the through-hole conductor belonging to the third through-hole conductor are close to each other. A core substrate, which is a set of through-hole conductors formed in a plurality of through-hole conductors formed in a set and formed in a plurality of through-hole conductors and electrically connected to each other. 14. The core substrate according to claim 12, wherein the first through-hole conductor and the second through-hole conductor of the three types of through-hole conductors are provided at a central portion in the plane direction of the core substrate. A through-hole conductor is formed, and the third through-hole conductor is not formed, or is formed in a smaller number than the sum of the first through-hole conductor and the second through-hole conductor formed at the center thereof; A core substrate, wherein a larger number of the third through-hole conductors are formed at a peripheral edge in a planar direction of the substrate than at the central portion. 15. A base metal plate, a composite dielectric layer containing a resin and a high dielectric powder laminated one by one on the front and back surfaces of the base metal plate, and a metal thinner than the base metal plate. A method of manufacturing a core substrate, comprising: a base capacitor, wherein the base metal plate and the metal layer adjacent to the base metal plate face each other with the composite dielectric layer interposed therebetween to form a layered capacitor. A laminate forming step of forming a laminate in which a composite dielectric layer and a metal foil are laminated in this order on the front and back surfaces of the base metal plate having the through holes formed therein, respectively; A through-hole forming step of forming a through-hole between the base metal plate, and penetrates through the inside of the insulating through-hole formed in the base metal plate, leaving the composite dielectric layer therearound. Above the base where the base metal plate is not exposed And use the through-hole, and the base metal plate and the through-base connection through holes exposing the said base metal plate on the inner peripheral surface,
Forming a through-hole conductor layer in the base insulating through-hole and the base connecting through-hole, and forming the metal foils on the front and back surfaces of the laminate into metal layers of a predetermined pattern, respectively. And a patterning step. 16. The method for manufacturing a core substrate according to claim 15, wherein in the step of forming a laminated plate, a semi-cured resin and a high dielectric powder are respectively provided on a front surface and a back surface of the base metal plate. A method of manufacturing a core substrate, comprising a base laminating step of laminating a two-layer film in which a semi-cured composite dielectric film and a metal foil are laminated, and hot pressing to form the laminate. 17. A base metal plate, and a plurality of composite dielectric layers containing resin and high dielectric powder alternately laminated on the front and back surfaces of the base metal plate, respectively, and a thickness greater than that of the base metal plate. Core substrate having a plurality of thin metal layers, the base metal plate and the adjacent metal layers and the adjacent metal layers facing each other with the composite dielectric layer interposed therebetween to constitute a layered capacitor. The manufacturing method of, wherein a composite dielectric layer and a metal layer of a predetermined pattern are alternately laminated in this order on each of the front and back surfaces of the base metal plate formed with insulating through holes at predetermined positions, A laminate forming step of forming a laminate in which a metal foil is laminated on the outermost surface of the laminated outermost composite dielectric layer, and a through-hole forming a through-hole between the front surface and the back surface of the laminate Process A metal plate or a first through hole in which an even-numbered metal layer of the base metal plate and the predetermined pattern of metal layers counted from the base metal plate is exposed on an inner peripheral surface; and a through hole in the insulating through hole. A second through-hole in which the base metal plate is not exposed on the inner peripheral surface and an odd-numbered metal layer counted from the base metal plate among the metal layers of the predetermined pattern is exposed on the inner peripheral surface; And a third through-hole in which none of the metal layers of the predetermined pattern is exposed on the inner peripheral surface; and a through-hole forming step of forming: a through-hole conductor layer in the through-hole; A patterning step of forming each of the metal foils on the back surface into a metal layer having a predetermined pattern. 18. The method for manufacturing a core substrate according to claim 17, wherein the step of forming the laminated board includes the step of forming a metal layer having a predetermined pattern on each of a front surface and a back surface of the base metal plate. A semi-cured composite dielectric film and a metal foil are superimposed on each of the front and back surfaces of the intermediate laminate having, and hot pressed to form a composite dielectric layer and metal on the front and back surfaces of the base metal plate or the intermediate laminate. A method for manufacturing a core substrate, comprising: a laminating press step of laminating a foil; and a metal foil patterning step of forming the metal foil into a metal layer having a predetermined pattern. 19. The method for manufacturing a core substrate according to claim 17, wherein the step of forming the laminate includes a semi-cured resin and a high dielectric powder on each of a front surface and a back surface of the base metal plate. At least one or more patterned two-layer films in which a semi-cured composite dielectric film and a patterned metal foil formed in a predetermined pattern are laminated, and a semi-cured composite dielectric containing a semi-cured resin and a high dielectric powder A method for manufacturing a core substrate, comprising: a two-layer film laminating press step of laminating a two-layer film in which a body film and a metal foil are laminated, and hot pressing to form the laminate. 20. The method of manufacturing a core substrate according to claim 15, wherein said through hole forming step includes forming said through hole by a laser.