JP2000243557A - Organic electroluminescence element and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic electroluminescence element capable of efficiently, stably suppressing time-dependent enlargement of a dark spot and provide its production method. SOLUTION: A luminescent layer containing a first electrode 2 formed on a substrate 1, a thin film layer formed on the first electrode 2 and containing a luminescent layer 6 made of at least an organic compound, and a second electrode 8 formed on the thin film layer is sealed with the substrate 1 and a sealing plate 21 arranged on the second electrode 8 side, and heat resistant temperature after curing of adhesive resin used in sealing is specified to higher than 80 deg.C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent device that can be used in fields such as display devices, flat panel displays, backlights, and interiors, and a method for manufacturing the same.

[0002]

2. Description of the Related Art An organic electroluminescent device emits light when holes injected from an anode and electrons injected from a cathode are recombined in an organic light emitting layer sandwiched between both electrodes.
A typical structure is a transparent first electrode (anode), hole transport layer, organic light emitting layer, and second electrode (cathode) on a glass substrate.
The light emission generated by the driving is extracted to the outside through the first electrode and the glass substrate. Such an organic electroluminescent element can be thin, emit high-intensity light under low-voltage driving, and emit multicolor light by selecting an organic light-emitting material. Applications to light-emitting devices and displays are being studied. .

One of the problems in the organic electroluminescent device is that the area of a non-light-emitting portion called a dark spot increases with time. It is known that the cause of such characteristic deterioration is moisture.
That is, moisture enters the organic thin film layer due to a defect of the second electrode or the like, and inactivates the element.

[0004] In order to prevent such dark spots from expanding, it is necessary to keep the organic electroluminescent device in a low humidity atmosphere. Usually, the organic electroluminescent device is sealed for the purpose of protecting the device from an external environment such as moisture. Stop means have been used. In this method, when the element and the sealing material are sealed via the bonding means, the element is sealed with two substrates (Japanese Patent Laid-Open No. 1-31).
3892) and a method of forming a protective film having a moisture shielding property such as an oxide or a fluoride (Japanese Patent Laid-Open No. 4-2).
12284), and a method of encapsulating a desiccant in a sealing element (Japanese Patent Application Laid-Open No. 6-176867).

[0005]

However, in the prior art, the penetration of water into the element mainly due to the decrease in the moisture shielding ability of the bonding means, and the inorganic protective film having the moisture shielding ability may damage the element at the time of film formation. There are many problems such as ease of use, and the enlargement of dark spots cannot be sufficiently suppressed.

An object of the present invention is to solve such a problem and to provide an organic electroluminescent device capable of sufficiently and stably suppressing the temporal expansion of a dark spot without a desiccant or the like, and a method of manufacturing the same. It is.

[0007]

SUMMARY OF THE INVENTION The present invention provides a first electrode formed on a substrate, a thin film layer formed on the first electrode, the light emitting layer comprising at least an organic compound, and a thin film layer formed on the thin film layer. The light-emitting element including the second electrode formed on the substrate is sealed with a substrate and a sealing plate disposed on the second electrode side, and the heat-resistant temperature after curing of the adhesive resin used for sealing is higher than 80 ° C. An organic electroluminescent device and a method for manufacturing the same.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below, but the present invention is not limited to a method of manufacturing an organic electroluminescent device having the exemplified form and structure. Therefore,
Single light emitting element, segment type, simple matrix type, active matrix type and other light emitting element types, colors,
The present invention can be applied to an organic electroluminescent device having an arbitrary structure irrespective of the number of emission colors such as monochrome.

The components of the organic electroluminescent device according to the present invention include, for example, a substrate 1 and a sealing plate 2 in the device shown in FIG.
1, all the members in contact with the sealing internal space 23, such as the bonding means 22, are included. Depending on the element configuration, a wiring, a connector, a lead electrode, a protective film covering the element surface, and the like may be included, and the constituent members are not particularly limited.

The bonding means 22 is made of a heat-resistant resin which maintains stable bonding strength at room temperature or higher. As the resin, an epoxy-based material, a silicone-based material, an acrylic-based material, a urethane-based material, or the like can be used, and it is preferable to use an epoxy-based adhesive having relatively excellent heat resistance and adhesiveness. There are various types of epoxy resins, such as a one-component curing type, a two-component curing type, and an ultraviolet curing type, but any one may be used.

Since the organic electroluminescent device has excellent characteristics such as thinness and high-brightness light emission under low voltage driving, applications in various fields are being studied. For example, when used as an in-vehicle display or a display for outdoor exhibition, the temperature in storage and use environment ranges from below freezing to a high temperature of 80 ° C. or higher. It is necessary to use an adhesive resin having a temperature range as wide as possible. In particular, at high temperatures, infiltration of impurities and moisture from the outside becomes remarkable at the high temperature, moisture and volatile components are generated from inside the resin, and moisture and the like enter the inside of the element due to interface peeling due to a decrease in adhesive strength. To enlarge dark spots. In order to prevent such element deterioration, the heat resistance temperature of the adhesive resin needs to be higher than the temperature in the use environment, and specifically, it is preferably higher than 80 ° C, more preferably 100 ° C or higher. preferable. Here, the heat-resistant temperature of the adhesive resin in the present invention is defined by JIS
It refers to the upper limit of the temperature range in which the tensile shear adhesive strength based on the K 6850 standard maintains 3 N / mm ² or more.

In order to further reduce the water permeability and the water absorption, a filler can be mixed into the adhesive resin. The filler is a fine particle made of an inorganic material such as silica, and the size, shape, and mixing ratio of the particle are not particularly limited, and are optimized as needed.

The viscosity of the resin used in the present invention is preferably in the range of 5,000 cP to 50,000 cP at the time of sealing. When performing sealing using a resin having a viscosity greater than 50,000 cP, it is difficult to completely fill the voids caused by minute irregularities on the surface of the substrate or the sealing plate,
Moisture or the like invades the inside of the element through this gap, causing dark spots to expand. In addition, bubbles in the resin can serve as a permeation path for moisture and the like, but when the viscosity of the resin is as high as 50,000 cP or more, a process such as vacuum degassing is required separately to remove the bubbles. On the other hand, when the viscosity of the resin is 5
When it is smaller than 000 cP, an extremely thin portion of the resin layer locally exists between the substrate and the sealing plate at the time of sealing, and this unstable interface becomes a path for moisture and the like to enter. Further, when such a low-viscosity resin is used as the bonding means, there is a problem that the resin easily enters the inside of the element at the time of sealing, and the element is deteriorated.

The state of the interface between the substrate or the sealing plate and the resin is very important. In many cases, a stress is generated at the bonding interface when the resin is cured, and the bonding stress may cause separation at the bonding interface. is there. The interface from which the resin is peeled becomes a path through which moisture or the like easily passes, and causes deterioration of the element. The strain stress becomes a problem particularly when the resin is cured. Therefore, after the resin starts to be cured, the JIS K 68
Tensile shear bond strength based on 50 standard is 10N /
When the time to reach mm ² is the curing time, the curing time needs to be slowly cured in order to alleviate the strain stress at the time of curing the adhesive and to suppress peeling. It is desirable that Specifically, when the curing time at room temperature is 20 hours or more, the strain stress can be effectively reduced.

When sealing with these resins, it is not limited to curing at room temperature, but it goes without saying that temperature conditions can be selected as needed. In order to further improve the adhesion between the resin and the sealing plate, it is effective to wash the sealing plate with an appropriate solvent or to perform a UV treatment to clean the surface of the sealing plate. It is.

The sealing method in the present invention is not particularly limited, as long as the substrate and the sealing plate are bonded together. Therefore, the sealed internal space can be filled with a low-humidity liquid or gas. Examples of the former include inert liquids such as silicone oil, grease, and fluorocarbon oil. Examples of the latter include rare gases such as helium and argon, and inert gases such as nitrogen and carbon dioxide. These may contain a relatively small amount of a relatively active gas such as oxygen, and it is also possible to positively introduce a supporting gas, but in general to obtain a good sealing effect,
It is desirable that the atmosphere be an inert atmosphere having an oxygen concentration of 1% or less, more preferably 10 ^-2 % or less, and still more preferably 10 ^-4 % or less. Further, the inside of the sealed space can be kept at a vacuum.

The above method of filling the sealing space with a low-humidity gas can be easily achieved by bonding the substrate and the sealing plate in a low-humidity atmosphere. In order to obtain a sufficient sealing effect, the dew point in a low humidity atmosphere is preferably -30 ° C or lower, -60 ° C or lower, and more preferably -1 ° C or lower.
It is more preferable that the temperature is not higher than 00 ° C.

As the sealing plate, a plate or film formed of a material having low moisture permeability such as glass, resin, or metal such as aluminum or stainless steel can be used. These may be a single type or a composite type obtained by depositing a metal such as aluminum on a resin film such as polyethylene.

The shape of the sealing plate 21 is not particularly limited.
The adhesion position between the substrate and the sealing plate can be defined by forming a recess 24 as shown in FIG. 4 or forming a leg 25 as shown in FIG. By doing so, it is also possible to secure a volume for filling the sealing internal space 23 with gas or oil or for providing a moisture absorbent. Similar effects can be obtained by increasing the thickness of the bonding means. Furthermore, if the sealing method of the present invention is used, a getter film having a moisture absorbing effect or the like, or a black film or a light absorbing film having an anti-reflection effect is formed on the surface of the sealing plate in advance as necessary. You can also. As the hygroscopic agent, silica gel, zeolite, activated carbon, calcium oxide, germanium oxide, barium oxide, magnesium oxide, phosphorus pentoxide, calcium chloride and the like, and as the getter film aluminum, magnesium, barium, titanium and other metal deposited film. Examples can be given.

The bonding position between the substrate and the sealing plate is not particularly limited, and the bonding means may be positioned so as to cover the entire device. However, from the viewpoint of light emission stability, the bonding means is in contact with the light emitting region. It is preferable that they are not located. Furthermore, from the viewpoint of power supply, it is preferable that each of the first electrode and the second electrode is sealed so as to be exposed to the outside. Further, it is also possible to take out the electrode through a through hole provided in the substrate.

On the substrate of the light emitting device of the present invention, a spacer having a height at least partially exceeding the thickness of the thin film layer can be formed. This spacer functions as a partition for patterning the second electrode in the partitioning method, functions as a layer for preventing the shadow mask from damaging the thin film layer in the mask deposition method, defines a light emitting region, and defines the first electrode. Can be functioned as an insulating layer or the like for covering the edge portion.

The first electrode and the second electrode serve to supply a sufficient current for light emission of the device.
It is desirable that at least one of them is transparent in order to extract light. Usually, the first electrode formed on the substrate is a transparent electrode, and this is an anode.

Preferred transparent electrode materials include tin oxide,
Zinc oxide, indium oxide, ITO, and the like can be given. For the purpose of patterning, it is preferable to use ITO having excellent workability.

When patterning the first electrode, a photolithography method involving wet etching can be used. The pattern shape of the first electrode is not particularly limited, and an optimum pattern may be selected depending on the application. In the present invention, a plurality of stripe-shaped electrodes arranged at regular intervals can be cited as a preferred example.

In order to lower the surface resistance of the transparent electrode and to suppress the voltage drop, ITO may contain a small amount of metal such as silver or gold, and tin, gold, silver, zinc, indium, Aluminum, chromium, and nickel can also be used as ITO guide electrodes. In particular, chromium is a suitable metal because it can have both functions of a black matrix and a guide electrode. From the viewpoint of power consumption of the device, it is desirable that ITO has low resistance. For example, an ITO substrate of 300Ω / □ or less (ITO
If it is a transparent substrate on which a thin film is formed), it functions as an element electrode, but at present, an ITO substrate of about 10 Ω / □ can be supplied, so that a low-resistance product can be used. The thickness of ITO has a relationship with the resistance value and cannot be specified unconditionally, but is usually 50 to 300 nm. ITO
The film forming method is not particularly limited, such as an electron beam method, a sputtering method, a chemical reaction method, and a coating method.

Although the use of the transparent electrode does not cause any major obstacle as long as the visible light transmittance is 30% or more, it is ideally close to 100%. Basically, it is preferable to have the same transmittance in the entire visible light range, but if it is desired to change the emission color, it is possible to positively impart light absorbency. In such a case, it is technically easy to change the color using a color filter or an interference filter.

The material of the substrate is not particularly limited as long as it has optical transparency, mechanical strength, heat resistance, etc. suitable for functioning as a display or a light emitting element. Although plastic plates and films such as polymethyl methacrylate, polycarbonate and amorphous polyolefin can be used, it is most preferable to use a glass plate. As the glass material, non-alkali glass, soda lime glass coated with a barrier coat such as a silicon oxide film, or the like can be used. Since the thickness only needs to be sufficient to maintain the mechanical strength, 0.5 mm or more is sufficient. In addition, an antireflection function can be added to the first electrode or the substrate by using a known technique.

Since the above-described spacer is often formed in a state of being in contact with the first electrode, it is preferable that the spacer has sufficient electric insulation. A conductive spacer can be used, but in that case, an electrically insulating portion for preventing a short circuit between the electrodes may be formed. As the spacer material, a known material can be used. For an inorganic material, an oxide material such as silicon oxide, a glass material, a ceramic material, and the like, and for an organic material, a polyvinyl, polyimide, polystyrene, acrylic, and novolak are used. Preferred examples include polymer-based resin materials such as silicone-based and silicone-based resins. Further, by blackening the entire spacer or a portion in contact with the substrate or the first electrode, a function like a black matrix that contributes to an improvement in display contrast of the organic electroluminescent device can be added to the spacer. In such a case, as a spacer material, an inorganic substance such as silicon, gallium arsenide, manganese dioxide, titanium oxide or a laminated film of chromium oxide and metal chromium, and an organic substance to the above-described resin material, and a surface layer for enhancing electrical insulation. Known pigments and dyes such as treated carbon black, phthalocyanine, anthraquinone, monoazo, bisazo, metal complex salt type monoazo, triallylmethane, aniline, or the above inorganic material powder were mixed. Materials can be mentioned as preferred examples.

The method of patterning the spacer is not particularly limited, but a method of forming a spacer layer on the entire surface of the substrate after the step of patterning the first electrode and patterning the spacer layer using a known photolithography method is easy in terms of process. The spacer may be patterned by an etching method using a photoresist or a lift-off method, or by patterning by directly exposing and developing a spacer layer using a photosensitive spacer material obtained by adding photosensitivity to the above-described resin material. You can also.

The thin film layers included in the organic electroluminescent device include 1) a hole transport layer / a light emitting layer, 2) a hole transport layer / a light emitting layer / an electron transport layer, 3) a light emitting layer / an electron transport layer, and 4) And e) a light-emitting layer in which the above-mentioned combined substances are mixed in a single layer. That is, if a light-emitting layer made of an organic compound is present as an element configuration, a light-emitting material alone or a light-emitting material and a hole-transport material or an electron-transport, as described in 4), in addition to the multi-layer structure of 1) to 3) above Only one light-emitting layer containing a material may be provided.

The hole transporting layer is formed of a hole transporting substance alone or a hole transporting substance and a polymer binder.
As the hole transporting substance, N, N'-diphenyl-N,
N'-di (3-methylphenyl) -1,1'-diphenyl-4,4'-diamine (TPD) and N, N'-diphenyl-N, N'-dinaphthyl-1,1'-diphenyl-
Triphenylamines represented by 4,4'-diamine (NPD), N-isopropylcarbazole, biscarbazole derivatives, pyrazoline derivatives, stilbene compounds, hydrazone compounds, oxadiazole derivatives and phthalocyanine derivatives Heterocyclic compounds, in the polymer system, polycarbonate and polystyrene derivatives having the monomer in the side chain, polyvinyl carbazole, polysilane, polyphenylene vinylene and the like are preferable,
There is no particular limitation.

The material of the light emitting layer formed by patterning on the first electrode is anthracene, pyrene, and 8-hydroxyquinoline aluminum, for example, bisstyrylanthracene derivative, tetraphenylbutadiene derivative, coumarin derivative, Oxadiazole derivatives,
A distyrylbenzene derivative, a pyrrolopyridine derivative, a perinone derivative, a cyclopentadiene derivative, a thiadiazolopyridine derivative, and a polymer system include polyphenylenevinylene derivatives, polyparaphenylene derivatives, and polythiophene derivatives. As the dopant to be added to the light emitting layer, rubrene, quinacridone derivative, phenoxazone 660, DCM1, perinone, perylene, coumarin 540, diazaindacene derivative, and the like can be used as they are.

As the electron transporting substance, it is necessary to efficiently transport electrons from the cathode between the electrodes to which an electric field is applied, and it is desirable to have a high electron injection efficiency and to transport the injected electrons efficiently. . For this purpose, it is required that the material has a high electron affinity, a high electron mobility, a high stability, and a small amount of impurities serving as traps during production and use. As materials satisfying such conditions, 8-hydroxyquinoline aluminum (Alq ₃ ), hydroxybenzoquinoline beryllium, 2- (4-biphenyl) -5- (4-t-butylphenyl) -1,3,4-oxadiene Azole (t-Bu
Oxadiazole derivatives such as PBD) and 1,3 oxadiazole dimer derivatives having improved thin film stability
-Bis (4-t-butylphenyl-1,3,4-oxadizolyl) biphenylene (OXD-1), 1,3-bis (4-t-butylphenyl-1,3,4-oxadizolyl) phenylene (OXD- 7), triazole derivatives, phenanthroline derivatives and the like.

The above materials used for the hole transporting layer, the light emitting layer and the electron transporting layer can be used alone to form each layer. As the polymer binder, polyvinyl chloride, polycarbonate, polystyrene, poly (N- (Vinyl carbazole), polymethyl methacrylate, polybutyl methacrylate, polyester, polysulfone, polyphenylene ether, polybutadiene, hydrocarbon resins, ketone resins, phenoxy resins, polyurethane resins, and other solvent-soluble resins, phenol resins, xylene resins, petroleum resins,
Urea resin, melamine resin, unsaturated polyester resin,
It is also possible to use the resin dispersed in a curable resin such as an alkyd resin, an epoxy resin, and a silicone resin.

The method for forming the organic layers such as the hole transport layer, the light emitting layer and the electron transport layer includes resistance heating evaporation, electron beam evaporation, and sputtering. Although not particularly limited, an evaporation method such as resistance heating evaporation or electron beam evaporation is usually preferable in terms of characteristics. Although the thickness of the layer depends on the resistance value of the organic layer and cannot be limited, it is empirically selected from the range of 10 to 1000 nm.

The cathode serving as the second electrode is not particularly limited as long as it can efficiently inject electrons into the light emitting layer of the device. Therefore, it is possible to use a low work function metal such as an alkali metal, but considering the stability of the electrode, platinum, gold,
Preferable examples include metals such as silver, copper, iron, tin, aluminum, magnesium and indium, and alloys of these metals with low work function metals. In addition, a stable electrode can be obtained while maintaining high electrode injection efficiency by doping the organic layer with a small amount of a low work function metal in advance and then forming a film of a relatively stable metal as a cathode. These electrodes are also manufactured by resistance heating evaporation,
Dry processes such as electron beam evaporation, sputtering, and ion plating are preferred.

A protective layer can be formed on the second electrode as needed. As the protective layer, in addition to the first electrode and second electrode materials already exemplified, inorganic materials such as silicon oxide, gallium oxide, titanium oxide, and silicon nitride, various polymer materials, and organic materials constituting an organic electroluminescent element are used. Can be used. Among them, silicon nitride is a suitable protective layer material having excellent moisture barrier properties. These protective films are formed by an evaporation method, a sputtering method, a CVD method, or the like.

[0038]

The present invention will be described below with reference to examples and comparative examples, but the present invention is not limited to these examples.

Example 1 An ITO substrate (manufactured by Geomatic) having a 130-nm thick ITO transparent electrode film formed on a 1.1 mm-thick non-alkali glass surface by a sputtering deposition method was prepared. After patterning this ITO film using a photolithography method, it was cut into a size of 46 mm × 38 mm, and patterned so that a 12 mm-wide ITO film (first electrode) was present at the center of the substrate to prepare a substrate. .

After washing the substrate, it was set in a vapor deposition machine and evacuated to a vacuum of 2 × 10 ⁻⁴ Pa. With a shadow mask for a light emitting layer having an opening of 15 mm square arranged, copper phthalocyanine 20 nm, N, N'-diphenyl-N, N'-
Dinaphthyl-1,1′-diphenyl-4,4′-diamine (α-NPD) 100 nm and tris (8-quinolinolato) aluminum (Alq ₃ ) 100 nm were deposited. After that, the thin film layer was exposed to lithium vapor to dope (0.5 nm in equivalent film thickness). Next, the shadow mask was replaced with a shadow mask for a second electrode having four 5 × 12 mm openings, and aluminum was removed at a vacuum degree of 3 × 10 ⁻⁴ Pa in 2012.
The second electrode was patterned by evaporation to a thickness of 0 nm. Thus, an organic electroluminescent device having four green light emitting regions on the substrate was manufactured.

The device was taken out of the vapor deposition machine, kept in a reduced pressure atmosphere by a rotary pump for 20 minutes, and then transferred to an argon atmosphere having an oxygen concentration of 10 ^-4 % and a dew point of -100 ° C. Under the dry atmosphere, the resin viscosity before curing is 100.
00cP, heat resistant temperature after curing is 100 ° C, curing time is 2
After 4 hours, epoxy resin mixed with silica filler (AW136N + HY994, Ciba Specialty Co., Ltd.)
(Manufactured by Chemicals Co., Ltd.) as the bonding means. When the obtained device was left in an atmosphere of 60 ° C. and 80% RH, the dark spot diameter, which was 15 μm on average in the initial state, was 30 μm after 200 hours, and a sufficient dark spot suppressing effect was obtained.

Example 2 A resin having a resin viscosity of 25000 cP and a heat resistance temperature of 120 was used for the bonding means.
Epoxy resin (XNR3101
+ XNH3101 (manufactured by Ciba Specialty Chemicals) was used, and an element was produced in the same process as in Example 1. When the obtained device was left in an atmosphere of 60 ° C. and 80% RH, the dark spot diameter, which was 22 μm on average in the initial state, was 25 μm after 200 hours, and a sufficient dark spot suppression effect was obtained.

Example 3 As in Example 2, the adhesive resin had a resin viscosity of 25,000 c.
A device was manufactured in the same process as in Example 1 except that an epoxy resin (XNR3101 + XNH3101, manufactured by Ciba Specialty Chemicals) having a heat resistance of 120 ° C. and a curing time of 24 hours was used. The obtained device was heated at 80 ° C. for 8 hours.
When left in an atmosphere of 0% RH, the dark spot diameter, which averaged 25 μm in the initial state, was 38 μm after 200 hours, and a sufficient dark spot suppression effect was obtained.

Comparative Example 1 The adhesive resin had a resin viscosity of 35,000 cP and a heat resistance temperature of 80.
Epoxy resin (AW2104 + H
W2934, manufactured by Ciba Specialty Chemicals)
An element was manufactured in the same steps as in Example 1 except that When the obtained device was left in an atmosphere of 60 ° C. and 80% RH, the dark spot diameter which was 55 μm on average in the initial state was 200 μm after 100 hours, and a sufficient dark spot suppression effect was not obtained. .

Comparative Example 2 The adhesive resin had a resin viscosity of 380000 cP and a heat resistance temperature of 80.
Epoxy resin (XNR3311
+ XNH3311 (manufactured by Ciba Specialty Chemicals) was used, and an element was produced in the same process as in Example 1. When the obtained device was left in an atmosphere of 60 ° C. and 80% RH, the dark spot diameter which was 45 μm on average in the initial state was 220 μm after 200 hours, and a sufficient dark spot suppressing effect was not obtained. .

Comparative Example 3 The adhesive resin had a resin viscosity of 33000 cP and a heat resistance temperature of 60.
℃, epoxy resin (AW106 + H
An element was manufactured in the same manner as in Example 1 except that Y994 (manufactured by Ciba Specialty Chemicals) was used.
When the obtained device was left in an atmosphere of 60 ° C. and 80% RH, the dark spot having an average of 20 μm in the initial state was 270 μm after 200 hours, and a sufficient dark spot suppressing effect was not obtained. .

[0047]

According to the organic electroluminescent device of the present invention, by using a resin having a heat-resistant temperature after curing of more than 80 ° C. as the adhesive resin, it is possible to suppress the temporal expansion of dark spots with good reproducibility.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of an organic electroluminescent device manufactured according to the present invention.

FIG. 2 is a cross-sectional view showing another example of the organic electroluminescent device manufactured by the present invention.

FIG. 3 is a cross-sectional view showing another example of the organic electroluminescent device manufactured by the present invention.

FIG. 4 is a cross-sectional view showing another example of the organic electroluminescent device manufactured by the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 1st electrode 3 Drive source 5 Hole transport layer 6 Light emitting layer 8 2nd electrode 9 Protective layer 21 Sealing plate 22 Adhesive resin 23 Sealing internal space 24 Depression 25 Leg

Claims (6)

[Claims] A first electrode formed on a substrate, a thin film layer formed on the first electrode, the light emitting layer including at least an organic compound, and a second electrode formed on the thin film layer. Wherein the light-emitting element containing is sealed by a sealing plate arranged on the substrate and the second electrode side, and the heat-resistant temperature after curing of the adhesive resin used for sealing is higher than 80 ° C. element. 2. The organic electroluminescent device according to claim 1, wherein the heat resistant temperature of the cured adhesive resin is 100 ° C. or higher. 3. The adhesive resin has a viscosity of 5 at room temperature before curing.
2. The organic electroluminescent device according to claim 1, wherein the curing temperature is in the range of 000 cP to 50,000 cP and the curing time at room temperature is 20 hours or more. 4. The organic electroluminescent device according to claim 1, wherein the adhesive resin is an epoxy resin. 5. The method for manufacturing an organic electroluminescent device according to claim 1, wherein the substrate and the sealing plate are bonded in a low humidity atmosphere having a dew point of −60 ° C. or less. Manufacturing method. 6. The method according to claim 5, wherein the substrate and the sealing plate are bonded in an inert atmosphere having an oxygen concentration of 1% or less.