JP2000243557A5 - Organic electroluminescent device - Google Patents
Organic electroluminescent device Download PDFInfo
- Publication number
- JP2000243557A5 JP2000243557A5 JP1999358652A JP35865299A JP2000243557A5 JP 2000243557 A5 JP2000243557 A5 JP 2000243557A5 JP 1999358652 A JP1999358652 A JP 1999358652A JP 35865299 A JP35865299 A JP 35865299A JP 2000243557 A5 JP2000243557 A5 JP 2000243557A5
- Authority
- JP
- Japan
- Prior art keywords
- organic electroluminescent
- electroluminescent device
- curing
- electrode
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004840 adhesive resin Substances 0.000 description 4
- 229920006223 adhesive resin Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Description
【特許請求の範囲】
【請求項１】基板上に形成された第一電極と、前記第一電極上に形成された少なくとも有機化合物からなる発光層を含む薄膜層と、前記薄膜層上に形成された第二電極とを含む発光素子が、基板と第二電極側に配置された封止板によって封止され、封止に用いられる接着樹脂の硬化後の耐熱温度が８０℃より大きく、硬化前の室温における接着樹脂の粘度が５０００ｃＰ以上５００００ｃＰ以下の範囲にあり、かつ、室温におけるその硬化時間が２０時間以上であることを特徴とする有機電界発光素子。
【請求項２】硬化後の接着樹脂の耐熱温度が１００℃以上であることを特徴とする請求項１記載の有機電界発光素子。
[Claims]
1. A first electrode formed on a substrate, a thin film layer including a light emitting layer made of at least an organic compound formed on the first electrode, and a second electrode formed on the thin film layer. light-emitting element including a is sealed by a sealing plate arranged on the substrate and the second electrode side, the heat resistance temperature after curing of the adhesive resin used for the sealing is rather greater than 80 ° C., the adhesive at room temperature before curing An organic electroluminescent element having a resin viscosity in the range of 5000 cP or more and 50,000 cP or less and a curing time of 20 hours or more at room temperature.
2. The organic electroluminescent device according to claim 1, wherein the heat-resistant temperature of the adhesive resin after curing is 100 ° C. or higher.
【０００７】
【課題を解決するための手段】
本発明は、基板上に形成された第一電極と、前記第一電極上に形成された少なくとも有機化合物からなる発光層を含む薄膜層と、前記薄膜層上に形成された第二電極とを含む発光素子が、基板と第二電極側に配置された封止板によって封止され、封止に用いられる接着樹脂の硬化後の耐熱温度が８０℃より大きく、硬化前の室温における接着樹脂の粘度が５０００ｃＰ以上５００００ｃＰ以下の範囲にあり、かつ、室温におけるその硬化時間が２０時間以上であることを特徴とする有機電界発光素子である。
0007
[Means for solving problems]
In the present invention, a first electrode formed on a substrate, a thin film layer including a light emitting layer made of at least an organic compound formed on the first electrode, and a second electrode formed on the thin film layer are provided. light-emitting element including is sealed by a sealing plate arranged on the substrate and the second electrode side, the heat resistance temperature after curing of the adhesive resin used for the sealing is rather greater than 80 ° C., the adhesive resin at room temperature before curing viscosity is in 50000cP the range above 5000 cP, and an organic electroluminescent element, wherein the curing time at room temperature is not less than 20 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11358652A JP2000243557A (en) | 1998-12-22 | 1999-12-17 | Organic electroluminescence element and its manufacture |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-365600 | 1998-12-22 | ||
| JP36560098 | 1998-12-22 | ||
| JP11358652A JP2000243557A (en) | 1998-12-22 | 1999-12-17 | Organic electroluminescence element and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000243557A JP2000243557A (en) | 2000-09-08 |
| JP2000243557A5 true JP2000243557A5 (en) | 2007-02-01 |
Family
ID=26580823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11358652A Withdrawn JP2000243557A (en) | 1998-12-22 | 1999-12-17 | Organic electroluminescence element and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000243557A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4632337B2 (en) * | 2000-11-10 | 2011-02-16 | 株式会社半導体エネルギー研究所 | Light emitting device |
| TW522577B (en) | 2000-11-10 | 2003-03-01 | Semiconductor Energy Lab | Light emitting device |
| JP4801278B2 (en) | 2001-04-23 | 2011-10-26 | 株式会社半導体エネルギー研究所 | Light emitting device and manufacturing method thereof |
| KR20030063990A (en) * | 2002-01-25 | 2003-07-31 | (주)네스디스플레이 | Method of preparing a sealing cover for an organic electroluminescent device |
| JP5222927B2 (en) * | 2010-11-19 | 2013-06-26 | 株式会社半導体エネルギー研究所 | Light emitting device |
| JP5548795B2 (en) * | 2013-03-12 | 2014-07-16 | 株式会社半導体エネルギー研究所 | Light emitting device |
-
1999
- 1999-12-17 JP JP11358652A patent/JP2000243557A/en not_active Withdrawn
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