JP2000228577A - Jet soldering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jet soldering device for which the soldering extent can be changed easily through simple operations and which hardly gets out of order, can be serviced in a short time, and can be reduced in manufacturing cost. SOLUTION: A soldering device which is used for soldering electronic parts 3 to a printed circuit board 2 by jetting molten solder from a jet 1 is provided with a plurality of nozzles 5 which are formed attachably to and detachably from the jet 1 and radially arranged around a vertical shaft 9. The nozzle holes 5a of the nozzles 5 are made different from each other and, at the same time, the nozzles 5 can be moved rotationally around the vertical shaft 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet-type soldering apparatus for jetting molten solder from a jet port and soldering an electronic component to a printed circuit board, and more particularly, to changing a soldering range. The present invention relates to a formed jet-type soldering device.

[0002]

2. Description of the Related Art Conventionally, as an apparatus of this kind formed so that the range of soldering can be changed and adjusted, for example, Japanese Patent Publication No.
Japanese Patent Application Laid-Open No. 4-41411 discloses a structure in which a shutter mechanism is provided at an ejection port (hereinafter, referred to as Conventional Example A), or a method as disclosed in Japanese Patent Application Laid-Open No. 6-633. There is one formed so that it can be adjusted and changed by a slide member (hereinafter referred to as Conventional Example B).

[0003]

By the way, in the case of this type of apparatus, it is inevitable that a mechanism for changing and adjusting the range of soldering comes into contact with the jetted solder. Therefore, this type of device is formed so that the operation is not hindered even if the solder adheres, the maintenance is easy, the running cost can be reduced, and the soldering range can be changed easily and easily. Is desirable.

However, in the case of the conventional example A, as described above,
Since the soldering area was changed by the shutter mechanism, according to this conventional product, the melted solder adhered to the shutter and was liable to break down, and the time and effort required for maintenance to remove the attached solder increased. However, there is a problem that the manufacturing cost cannot be reduced because of its complexity.

In the case of the conventional example B, when the soldering range is changed, the work of adjusting and fixing the slide member is involved. Therefore, if this conventional product is used, this kind of work takes time and effort, and the operation becomes difficult. There was a problem that it was troublesome.

The present invention has been proposed in view of such conventional problems. Therefore, the technical problem of the present invention is to provide a plurality of nozzles, which are formed so that they can be easily replaced, to eliminate the adverse effects caused by the adhesion of the molten solder, to be less likely to fail, and to reduce the time and labor required for maintenance. It is an object of the present invention to provide a jet-type soldering apparatus formed so that the operation for changing the range of soldering can be performed simply and easily as well as reducing the cost.

[0007]

The present invention employs the following technical means in order to solve the above-mentioned problems.

That is, as shown in FIG. 1, the present invention relates to a soldering apparatus for ejecting molten solder from an ejection port 1 and soldering an electronic component 3 to a printed circuit board 2. The nozzle 5 detachably formed with respect to 1
A plurality of nozzles 5 are provided radially around a vertical axis 9,
The injection port 5a is formed differently, and is formed so as to be rotatable and rotatable about the vertical axis 9 (claim 1).

Here, "removably formed with respect to the ejection port 1" means that it is formed so as to be able to move toward and away from the ejection port 1 at the time of soldering and to be attached and detached. In addition, here, the nozzles 5a are formed differently, specifically, the size (opening area) of the nozzles 5a.
Is different, it means that the plane shape of the injection port 5a is different.

When using the present invention, the printed circuit board 2
The nozzle 5 is appropriately selected according to the size, the area and the position to be soldered, and the selected nozzle 5 is rotated around the vertical axis 9 to be moved to the position of the ejection port 1 and attached to the ejection port 1. To jet the solder. In the case of the present invention,
The number of nozzles 5 is arbitrary. Further, the nozzle 5 itself may be formed to be replaceable so that the range of soldering can be changed more freely.

In the present invention, it is preferable that the rotation direction of the nozzle 5 is formed in one direction. In this case, the rotation control of the nozzle 5 can be simplified and simplified, and the manufacturing cost can be reduced accordingly.

In the present invention, it is preferable that the arrangement intervals of the nozzles 5 are equal (claim 3). In this case, since the rotation angle and rotation range of the nozzle 5 can be easily controlled, the rotation operation of the nozzle 5 can be simplified and facilitated.

Further, the present invention preferably comprises a driving device 10 for rotating the nozzle 5 (claim 4).

In this case, the movement of the nozzle 5 is controlled by the driving device 1.
0 can be automated. The driving device 10 includes, for example, an air cylinder and a motor. Specifically, as shown in FIGS. 3 and 4, the nozzle 5 is moved by moving the rack 11 forward and backward by an air cylinder serving as a driving device 10.
Or, as shown in FIG. 5, the driving device 10 is constituted by a motor, and a timing belt 17 is stretched around a rotating shaft of the motor and a pulley 16 of a vertical shaft 9. This is achieved by rotating 9 by a predetermined angle.

Further, in the present invention, it is preferable that the nozzle 5 is formed so as to be rotatable in the vertical direction about the horizontal axis 6 and is always disposed in an upwardly inclined state (claim 5).

In the case of the present invention, as long as the nozzle 5 is formed so as to be detachable from the jet port 1, the operation thereof is optional. Therefore, for example, it is also possible to first advance above the ejection port 1 and then descend and then attach / detach to the ejection port 1 with an advancing / retreating operation and an elevating operation. However, when the nozzle 5 is formed as in the present invention described in claim 5, since the nozzle 5 can be attached to and detached from the ejection port 1 only by rotating vertically, the operation time is shortened and the number of parts can be reduced. There is an advantage that the mechanism can be simplified.

The present invention also includes a spring 7 for rotating the nozzle 5 downward and pressing the nozzle 5 against the jet port 1 and an actuator 8 for lifting the nozzle 5 against the action of the spring 7 and disposing the nozzle 5 in an inclined manner. (Claim 6).

In this case, the arrangement of the nozzle 5 is performed by the action of the spring 7, so that the nozzle 5 is less likely to fail. The actuator 8 includes, for example, an air cylinder, a motor, a solenoid, and the like.

[0019]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1 and the like, reference numeral 1 denotes an ejection port. The apparatus of the present invention ejects molten solder from the ejection port 1 to solder an electronic component 3 to a printed circuit board 2.
The printed circuit board 2 is pressed by a pressing mechanism at the time of soldering so as not to be lifted by the flowing solder. The solder is stored in a solder tank 4 in a molten state, is convected by a screw, and is ejected from the ejection port 1 at a constant jet pressure.

Reference numeral 5 denotes a nozzle which is detachably formed with respect to the jet port 1. In the case of this embodiment, the nozzle 5 is formed so as to be rotatable up and down around a horizontal axis 6,
Normally, it is arranged to be inclined upward (see a chain line state in FIG. 1).

Reference numeral 7 denotes a spring for rotating the nozzle 5 downward and pressing the nozzle 5 against the ejection port 1. An actuator 8 lifts the nozzle 5 against the action of the spring 7 and arranges the nozzle 5 in an inclined manner. The actuator 8 is constituted by a single-acting air cylinder in this embodiment.

The device according to the invention comprises a nozzle 5 around a vertical axis 9.
Are provided radially (see FIG. 2), and as shown in the drawing, the nozzle 5 has a nozzle 5a having a horizontally long shape, a square shape, a circular shape, or the like.
Each is formed differently. In the case of this embodiment, a total of six nozzles 5 are arranged around the vertical axis 9 at equal intervals. The vertical shaft 9 is attached to a side wall of the solder bath 4. The vertical shaft 9 is formed with a compressed air supply hole 9a at an axial position, and is formed so that compressed air can be supplied to an air cylinder as the actuator 8 through the supply hole 9a.

The nozzle 5 is formed so as to be rotatable around a vertical axis 9. In this embodiment, the nozzle 5 is driven 60 degrees in one direction together with the vertical axis 9,
It is formed to rotate by the operation of the air cylinder as zero. The air cylinder 10 is mounted laterally on a side wall of the solder tank 4, and a rack 11 is connected to a rod 10a. The rack 11 is engaged with a gear 12 fixed to the vertical shaft 9. A one-way clutch 13 rotates the vertical shaft 9 in one direction. 14 is
This is a shock absorber for the rack 11.

Next, the operation of the present invention will be described. Nozzle 5
As shown in FIG. 1, in the case of the present invention, is normally arranged to be inclined upward about the horizontal axis 6. in this case,
The rod of the air cylinder as the actuator 8 extends and presses the mounting base end 15 of the nozzle 5. When the rod of the air cylinder 8 contracts during soldering, the nozzle 5 rotates downward with the horizontal shaft 6 stopped by the action of the spring 7, and is disposed at the ejection port 1. In this state, the solder flows through the nozzle 5a of the nozzle 5, and the electronic component 3 of the printed circuit board 2 is soldered.

When the range of soldering is to be changed, the nozzle 5 is rotated about the vertical axis 9 and a predetermined nozzle 5 is arranged at the position of the jet port 1. In the case of this embodiment, specifically, the rod 10a (see FIGS. 3 and 4) of the air cylinder as the driving device 10 is extended. Then, the rack 11 extends together with the rod 10a, and rotates the gear 12 by 60 degrees counterclockwise in FIG. As a result, the vertical axis 9 rotates by the same angle in the same direction, and another adjacent nozzle 5 is arranged at a position corresponding to the ejection port 1. In the present invention, such an operation is repeated, and the nozzle is changed to a predetermined nozzle 5 for use. Even if the rod 10a contracts and the rack 11 moves leftward in FIG. 4 and returns, the one-way clutch 13 prevents the vertical shaft 9 from rotating in the reverse direction.

[0027]

As described above, the apparatus according to the present invention is formed so that the nozzle is detachably formed with respect to the ejection port, the nozzle having a different ejection port is rotated and exchanged, and the soldering area can be changed. is there.

Therefore, when the present invention is used, the nozzle can be easily and easily replaced, the nozzle is less likely to be broken down, the time and labor for maintenance can be reduced, and the manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 shows a preferred embodiment of the apparatus of the present invention, and is a cross-sectional view of a principal part taken along line II of FIG.

FIG. 2 is a plan view of a main part of the device.

FIG. 3 is a side view of a main part of the device.

FIG. 4 is an enlarged sectional view of a main part taken along line IV-IV in FIG. 3;

FIG. 5 is a side view of a main part showing another embodiment of the same device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Spout 2 Printed circuit board 3 Electronic component 4 Solder tank 5 Nozzle 5a Spout 9 Vertical axis

Claims (6)

[Claims] 1. A jet-type soldering apparatus for jetting melted solder from an ejection port and soldering an electronic component to a printed circuit board, comprising a nozzle detachably formed with respect to the ejection port. A plurality of nozzles are provided radially around a vertical axis, and the nozzles are formed with different injection ports, and are formed so as to be rotatable and movable about the vertical axis. apparatus. 2. The jet-type soldering apparatus according to claim 1, wherein the rotation direction of the nozzle is one direction. 3. The jet-type soldering apparatus according to claim 1, wherein the nozzles are arranged at regular intervals. 4. A jet-type soldering apparatus according to claim 1, further comprising a driving device for rotating a nozzle. 5. The jet-type soldering apparatus according to claim 1, wherein the nozzle is formed so as to be rotatable up and down around a horizontal axis, and is always inclined upward. A jet-type soldering device, which is provided. 6. A jet-type soldering apparatus according to claim 5, wherein a spring which rotates the nozzle downward and presses the nozzle against the ejection port, lifts the nozzle against the action of the spring, and arranges the nozzle in an inclined manner. A jet type soldering apparatus, comprising: