JP2000228325A - Ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reliably prevent heating exceeding the tolerances by cooling an electronic component element while arranging a cooling tube so as to be in contact with external terminals and allowing a cooling medium to pass through the cooling tube. SOLUTION: A ceramic electronic component is formed not only by bonding a pair of external terminals 5 through solder 6 to both faces of an electronic component element 14 which is formed by laminating ceramic electronic component elements 4, each having a pair of external electrodes 3 arranged on both faces thereof, but also by bonding U-shaped cooling tubes 7 to vertical portions 5a of the terminals 5. In this ceramic electronic component, each terminal 5 is formed by bending a metal plate at right angles, and has the portion 5a as a portion to be bonded to the element 14 and a horizontal portion 5b as a portion to be bonded to a board. A tube made of a metallic material having a high heat conductivity, such as copper, is used as the tube 7, and this tube 7 is bonded to the portion 5a of the terminal 5 through a solder 18. Then, the tube 7 is supplied with water 10 as a cooling medium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic electronic component, and more particularly, to a ceramic electronic component in which an external terminal is attached to an electronic component element in which an internal electrode is provided in a ceramic so as to conduct with the internal electrode. Related to parts.

[0002]

2. Description of the Related Art A multilayer ceramic capacitor, which is one of typical ceramic electronic components, has a plurality of internal electrodes 52 opposed to each other via a ceramic (ceramic layer) 51 as shown in FIG. And a pair of external electrodes 53, 53 arranged on both end surfaces of the ceramic electronic component element 54 whose one end sides are alternately drawn to different end surfaces so as to be electrically connected to the exposed internal electrodes 52. And a structure in which external terminals 55, 55 formed by bending a metal plate are bonded to a pair of external electrodes 53, 53 via a bonding material 56 such as solder, conductive adhesive, or conductive paste. There is.

In order to respond to the demand for large capacity, FIG.
As shown in FIG. 7, an electronic component element (stacked element) 64 formed by stacking a plurality of ceramic electronic component elements 54 each having an external electrode 53 formed so as to be electrically connected to an internal electrode 52 provided in a ceramic 51. There is a multilayer ceramic capacitor in which external terminals 55 are bonded via a bonding material 56 such as solder, conductive adhesive, or conductive paste.

[0004]

By the way, a multilayer ceramic capacitor as shown in FIGS.
Generates heat during use. In particular, in the case of a ceramic capacitor having a side of 10 mm or more or a stacked type ceramic capacitor in which a plurality of ceramic electronic component elements 4 are stacked as shown in FIG. Due to heat generation due to energization and poor heat radiation, the temperature may rise to a temperature exceeding an allowable range, and the multilayer ceramic capacitor itself may be damaged. Such problems are not limited to multilayer ceramic capacitors, but are common to ceramic electronic components such as varistors and inductors.

The present invention solves the above-mentioned problems, and does not cause an excessive rise in temperature to cause breakage even when used in a high-temperature environment, and is a highly reliable ceramic electronic component. The purpose is to provide.

[0006]

In order to achieve the above object, in a ceramic electronic component according to the present invention (claim 1), an internal electrode is provided in a ceramic in such a manner that a part thereof is exposed at an end face. Of the electronic component element or a stacked element (electronic component element) formed by stacking a plurality of the ceramic electronic component elements, and an internal electrode exposed at an end face of the electronic component element. It is characterized by comprising an external terminal made of a metal material joined to the end face, and a cooling pipe arranged to be in contact with the external terminal and configured to allow a cooling medium to pass therethrough.

A cooling pipe is provided so as to be in contact with an external terminal joined to an end face of the electronic component element, and a cooling medium is passed through the cooling pipe to cool the electronic component element so as to exceed an allowable range. Temperature rise can be reliably prevented, and reliability can be improved.

The end face of the electronic component element where the internal electrode is exposed is a face from which the internal heat is easily extracted from the internal electrode made of a metal material. By arranging the cooling pipe so as to be connected to the external terminal, heat inside the electronic component element can be efficiently extracted to the outside, and cooling can be surely performed.

In the present invention, the cooling pipe may be
It is possible to use a tube made of various materials such as a metal tube having high thermal conductivity, a ceramic tube having excellent corrosion resistance, and a resin tube.

In the present invention, the phrase "the external terminal is joined to the end face of the electronic component element so as to conduct with the internal electrode exposed at the end face of the electronic component element" means that the external terminal is directly connected to the internal electrode. It is not limited to the case where it is electrically connected to the external electrode formed on the end face of the electronic component element,
This is a broad concept including a mode in which electrical conduction is made via solder, a conductive adhesive, or the like.

Further, the ceramic electronic component according to claim 2 is
The cooling medium is water.

When water is used as the cooling medium, there is no need to prepare a special fluid as the cooling medium.
The ceramic electronic component can be efficiently cooled at low cost, and the present invention can be made more effective.

Further, the ceramic electronic component of claim 3 is:
The cooling tube is joined to the external terminal by any method selected from a method using a joining material such as a solder or an adhesive, a method by welding or welding, and a method of mechanically joining. .

[0014] The cooling pipe may be joined to an external terminal via a joining material such as solder or adhesive.
The cooling pipe may be held by holding claws or the like disposed on the external terminal to mechanically join the external terminal, or further, may be joined to the external terminal by welding or welding. .

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be shown and features thereof will be described in more detail.

[First Embodiment] FIG. 1 is a view showing a ceramic electronic component (a stacked type multilayer ceramic capacitor in this embodiment) according to an embodiment of the present invention. FIG. 2 is a sectional view showing a ceramic electronic component element constituting the ceramic electronic component of FIG.

As shown in FIG. 1, the ceramic electronic component (multilayer ceramic capacitor) according to the first embodiment is formed by stacking ceramic electronic component elements 4 having a pair of external electrodes 3 on both end surfaces. A pair of external terminals 5 and 5 are joined to both end surfaces of the component element (stacking element) 14 via solder (joining material) 6, and the external terminals 5 and 5 are joined together.
5 is formed by joining a U-shaped cooling pipe 7 to the vertical portion 5a.

The ceramic electronic component element 4 is shown in FIG.
As shown in the figure, a plurality of internal electrodes 2 are arranged so as to face each other via a ceramic (ceramic layer) 1, and one end side thereof is alternately drawn to an end face on a different side, and the exposed internal It has a structure in which a pair of external electrodes 3 and 3 are provided on both end surfaces so as to conduct with the electrode 2. This embodiment shows a case where the external electrode 3 is a thin film electrode formed by a thin film forming method such as a sputtering method. However, in the present invention,
As the external electrode 3, it is also possible to use a thick-film electrode formed by applying and baking a conductive paste.

Further, in the ceramic electronic component of this embodiment, the external terminal 5 is formed by bending a metal plate (for example, a Cu plate or an Ag plate) at a right angle, and is connected to the electronic component element 14. Vertical part 5a
And a structure having a horizontal portion 5b serving as a bonding portion to a substrate (not shown).

As the cooling pipe 7, a pipe made of a metal material having a high thermal conductivity such as copper is used. The cooling pipe 7 is connected to the vertical portions of the external terminals 5 and 5 via solder 18. 5a. And, in this cooling pipe 7,
It is configured such that water (cooling water) 10 is supplied as a cooling medium.

In the ceramic electronic component of this embodiment, the U-shaped cooling pipe 7 is in contact with the external terminals 5 and 5.
And water (cooling water) 10 as a cooling medium therein.
, It is possible to efficiently cool the electronic component element 14, reliably prevent the temperature from rising, and improve the reliability.

The end face of the electronic component element 14 from which the internal electrode 2 is exposed is a face from which internal heat is easily led out from the internal electrode 2, and is disposed on this end face so as to conduct with the internal electrode 2. Since the cooling pipe 7 is provided so as to be connected to the external terminals 5 and 5, the heat inside the electronic component element 14 can be efficiently extracted and the electronic component element 14 can be reliably cooled.

In the ceramic electronic component according to the first embodiment, the cooling pipe 7 is disposed so as to be joined to the vertical portion 5a of the external terminal 5, so that the electronic component element 1 is efficiently provided.
4 can be cooled.

Embodiment 2 FIG. 3 is a perspective view showing a ceramic electronic component according to another embodiment of the present invention. In this embodiment, the metal cooling pipe 7 is in contact with both the vertical part 5 a and the horizontal part 5 b of the external terminal 5.
It is joined to the external terminal 5 by the solder 18. Other configurations are the same as those in the first embodiment, and therefore, description thereof will be omitted to avoid duplication. In FIG. 3,
The parts denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding parts.

Also in the ceramic electronic component of the second embodiment, the cooling pipe 7 is joined to the external terminal 5, and water (cooling water) 10 is passed through the cooling pipe 7 so that the electronic component element 14 is formed.
Is cooled, so that the same effect as in the first embodiment can be obtained. In addition, also in the ceramic electronic component of the second embodiment, the cooling pipe 7 is disposed so as to be joined to the vertical portion 5a and the horizontal portion 5b of the pair of external terminals 5, 5, and a sufficient contact area is secured. Therefore, the electronic component element 14 can be efficiently cooled.

[Embodiment 3] FIG. 4 is a perspective view showing a ceramic electronic component according to another embodiment of the present invention. In the third embodiment, a metal plate (for example, a Cu plate or an Ag plate) is used.
An external terminal 5 formed by bending a plate or the like at a right angle is joined to the electronic component element 14 in such a manner that the horizontal portion 5b enters the lower surface side of the electronic component element 14. The vertical portions 5a, 5a of the external terminals 5
At the same time, cooling air (cooling air) 20 passes through the inside,
A straight cooling pipe 7 made of metal is joined by a welding method.

Further, in the ceramic electronic component of this embodiment, an opening is formed on the lower surface side, and an escape slit 8 for the cooling pipe 7 is formed on the side wall, and the case 9 is formed of the electronic component element 1.
4 from above.

The other configuration is the same as that of the first embodiment, and the description is omitted to avoid duplication. However, in FIG. 4, portions denoted by the same reference numerals as those in FIG. 1 indicate the same or corresponding portions.

Also in the ceramic electronic component of the third embodiment, the electronic component element 14 is cooled by joining the cooling pipe 7 to the external terminal 5 and passing the air (cooling air) 20 through the cooling pipe 7. Therefore, the same effect as in the first embodiment can be obtained.

Furthermore, since the electronic component element 14 is housed in the case 9, it is possible to improve weather resistance and environmental resistance, prevent damage due to contact with other components, and the like. It is possible to improve reliability.

It is possible to seal the electronic component element 14 by potting a resin in the case 9 to further improve the reliability.

Although the cooling tubes are joined to the external terminals by solder in the first to third embodiments, a brazing material is used as a joining material instead of solder, or an organic material is used. It is also possible to use a system or inorganic adhesive as a bonding material.

Also, instead of using a bonding agent, for example,
As shown in FIG. 5, the holding claws 11 are disposed on the external terminals 5,
It is also possible to configure so that the cooling pipe 7 is held by the holding claws 11.

In the above embodiment, the case where a metal pipe (copper pipe) is used as the cooling pipe has been described. However, as the cooling pipe, various pipes such as a ceramic pipe and a resin pipe having excellent corrosion resistance are used. Can be used. In the first to third embodiments, a cooling pipe having a circular cross section is used. However, cooling pipes having various shapes such as an elliptical or polygonal cross section can be used.

In the first to third embodiments,
Although the present invention has been described by taking a multilayer ceramic capacitor as an example, the present invention is not limited to the multilayer ceramic capacitor, and various types of ceramic electronic component elements having internal electrodes are provided on the surface thereof with external terminals arranged to be electrically connected to the internal electrodes. It is possible to apply to the ceramic electronic parts.

In the above embodiment, a stack type ceramic electronic component in which a plurality of ceramic electronic component elements are stacked has been described as an example. However, a ceramic electronic component in which external terminals are provided on a single ceramic electronic component element is described. It goes without saying that the present invention can be applied to parts. Further, the present invention can provide a remarkable effect particularly when applied to a large-sized ceramic electronic component element having one side dimension of 10 mm or more.

The present invention is not limited to the above-described embodiment in other respects, but includes the types of ceramics constituting the ceramic electronic component element, the patterns and constituent materials of the internal electrodes, and the arrangement of the external terminals. With respect to the position and the like, various applications and modifications can be made within the scope of the invention.

[0038]

As described above, in the ceramic electronic component of the present invention, the cooling pipe is disposed so as to be in contact with the external terminal joined to the end face of the electronic component element, and the cooling medium is passed through the cooling pipe. In addition, it is possible to reliably prevent the temperature of the electronic component element from exceeding the allowable range by cooling the electronic component element, thereby improving the reliability. The end face of the electronic component element where the internal electrode is exposed is a face from which the internal heat is easily led out from the internal electrode made of a metal material, and the end face has an external terminal disposed so as to conduct with the internal electrode. By arranging the cooling pipes so as to be joined, the heat inside the electronic component element can be efficiently led out to the outside, and the cooling can be surely performed. Therefore, it can be used without causing damage even in a high temperature environment, durability,
It is possible to provide a ceramic electronic component having excellent reliability.

In the case where water is used as the cooling medium as in the case of the ceramic electronic component of the second aspect, there is no need to prepare a special fluid as the cooling medium, so that the ceramic electronic component can be efficiently manufactured at low cost. Cooling can be performed, and the present invention can be made more effective.

Further, like the ceramic electronic component of the third aspect, the cooling tube may be joined to the external terminal via a joining material such as solder or an adhesive, and the cooling tube may be provided on the external terminal. It may be mechanically joined to the external terminal by a claw or the like, and furthermore, it is also possible to join to the external terminal by welding or welding.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a ceramic electronic component according to an embodiment (Embodiment 1) of the present invention.

FIG. 2 is a cross-sectional view showing a ceramic electronic component element constituting the ceramic electronic component according to one embodiment (Embodiment 1) of the present invention.

FIG. 3 is a perspective view showing a ceramic electronic component according to another embodiment (Embodiment 2) of the present invention.

FIG. 4 is a perspective view showing a ceramic electronic component according to still another embodiment (Embodiment 3) of the present invention.

FIG. 5 is a cross-sectional view showing a modification of the ceramic electronic component of the present invention.

FIG. 6 is a sectional view showing a conventional ceramic electronic component.

FIG. 7 is a cross-sectional view showing another conventional ceramic electronic component.

[Description of Signs] 1 Ceramic (ceramic layer) 2 Internal electrode 3 External electrode 4 Ceramic electronic component element 5 External terminal 5a Vertical portion of external terminal 5b Horizontal portion of external terminal 6 Solder (joining material) 7 Cooling tube 8 Release slit 9 Case 10 Water (cooling water) 11 Holding claw 14 Stacking element (electronic component element) 18 Solder joining cooling pipe 20 Air (cooling air)

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yasuhiko Kubota 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock Company Murata Manufacturing Co., Ltd. (72) Inventor Makoto Murata 2-26-10, Tenjin, Nagaokakyo-shi, Kyoto Prefecture F-term (reference) 5E034 CA03 CB01 DA07 DC10 DD01 5E070 AA01 AB01 BA12 CB02 CC01 DA01 DA12 DA18 EA02 5E082 AB03 BC25 CC05 FG26 GG08 GG11 GG22 JJ07 JJ27 KK08

Claims (3)

[Claims] 1. A ceramic electronic component element having a structure in which internal electrodes are arranged in a ceramic such that a part thereof is exposed on an end face, or a stacked element (hereinafter, referred to as a stacked element) obtained by stacking a plurality of ceramic electronic component elements (Hereinafter simply referred to as “electronic component element”), an external terminal made of a metal material joined to an end face of the electronic component element so as to be electrically connected to an internal electrode exposed on an end face of the electronic component element, and contacting the external terminal. A ceramic electronic component, comprising: a cooling pipe arranged so that a cooling medium passes therethrough. 2. The ceramic electronic component according to claim 1, wherein said cooling medium is water. 3. The cooling tube is connected to the external terminal by any one of a method using a bonding material such as solder or an adhesive, a method by welding or welding, and a method of mechanically bonding. The ceramic electronic component according to claim 1, wherein: