JP2000223379A - 電子的複数素子ユニット - Google Patents
電子的複数素子ユニットInfo
- Publication number
- JP2000223379A JP2000223379A JP2000016722A JP2000016722A JP2000223379A JP 2000223379 A JP2000223379 A JP 2000223379A JP 2000016722 A JP2000016722 A JP 2000016722A JP 2000016722 A JP2000016722 A JP 2000016722A JP 2000223379 A JP2000223379 A JP 2000223379A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- layer
- element unit
- dielectric
- current supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19903456A DE19903456A1 (de) | 1999-01-28 | 1999-01-28 | Mehrkomponenten-Bauteil |
| DE19903456:7 | 1999-01-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000223379A true JP2000223379A (ja) | 2000-08-11 |
| JP2000223379A5 JP2000223379A5 (https=) | 2007-03-22 |
Family
ID=7895722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000016722A Withdrawn JP2000223379A (ja) | 1999-01-28 | 2000-01-26 | 電子的複数素子ユニット |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6507498B1 (https=) |
| EP (1) | EP1024593B1 (https=) |
| JP (1) | JP2000223379A (https=) |
| DE (2) | DE19903456A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6780494B2 (en) * | 2002-03-07 | 2004-08-24 | Tdk Corporation | Ceramic electronic device and method of production of same |
| DE102005036102A1 (de) * | 2005-08-01 | 2007-02-08 | Epcos Ag | Elektrisches Bauelement |
| JP4654854B2 (ja) * | 2005-09-13 | 2011-03-23 | パナソニック株式会社 | 積層コンデンサ及びモールドコンデンサ |
| KR101514562B1 (ko) * | 2013-11-06 | 2015-04-22 | 삼성전기주식회사 | 적층 세라믹 전자 부품 및 그 실장 기판 |
| US10381161B2 (en) * | 2017-11-06 | 2019-08-13 | Advanced Semiconductor Engineering, Inc. | Capacitor structure |
| CN116387025A (zh) * | 2023-04-13 | 2023-07-04 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | 一种多芯组模压表贴瓷介电容器及其制备方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3660342D1 (en) * | 1985-01-17 | 1988-07-28 | Siemens Ag | Voltage-dependent electric resistance (varistor) |
| US4714981A (en) * | 1986-04-09 | 1987-12-22 | Rca Corporation | Cover for a semiconductor package |
| JPS62265796A (ja) * | 1986-05-14 | 1987-11-18 | 株式会社住友金属セラミックス | セラミツク多層配線基板およびその製造法 |
| JP2790640B2 (ja) * | 1989-01-14 | 1998-08-27 | ティーディーケイ株式会社 | 混成集積回路部品の構造 |
| JPH03203212A (ja) * | 1989-12-28 | 1991-09-04 | Nippon Chemicon Corp | 複合チップ部品及びその製造方法 |
| US5548474A (en) * | 1994-03-01 | 1996-08-20 | Avx Corporation | Electrical components such as capacitors having electrodes with an insulating edge |
| US5576925A (en) * | 1994-12-27 | 1996-11-19 | General Electric Company | Flexible multilayer thin film capacitors |
| US5889445A (en) * | 1997-07-22 | 1999-03-30 | Avx Corporation | Multilayer ceramic RC device |
-
1999
- 1999-01-28 DE DE19903456A patent/DE19903456A1/de not_active Withdrawn
-
2000
- 2000-01-21 DE DE50014073T patent/DE50014073D1/de not_active Expired - Lifetime
- 2000-01-21 EP EP00200236A patent/EP1024593B1/de not_active Expired - Lifetime
- 2000-01-26 US US09/491,626 patent/US6507498B1/en not_active Expired - Lifetime
- 2000-01-26 JP JP2000016722A patent/JP2000223379A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP1024593A2 (de) | 2000-08-02 |
| EP1024593B1 (de) | 2007-02-21 |
| EP1024593A3 (de) | 2003-12-10 |
| DE50014073D1 (de) | 2007-04-05 |
| DE19903456A1 (de) | 2000-08-10 |
| US6507498B1 (en) | 2003-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070124 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070124 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20070124 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070322 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20080428 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20090911 |