JP2000196006A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2000196006A5 JP2000196006A5 JP1998367075A JP36707598A JP2000196006A5 JP 2000196006 A5 JP2000196006 A5 JP 2000196006A5 JP 1998367075 A JP1998367075 A JP 1998367075A JP 36707598 A JP36707598 A JP 36707598A JP 2000196006 A5 JP2000196006 A5 JP 2000196006A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- die pad
- semiconductor element
- sealing resin
- resin body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36707598A JP3606078B2 (ja) | 1998-12-24 | 1998-12-24 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36707598A JP3606078B2 (ja) | 1998-12-24 | 1998-12-24 | 半導体装置およびその製造方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003433161A Division JP2004104155A (ja) | 2003-12-26 | 2003-12-26 | 半導体装置 |
| JP2004114292A Division JP4308698B2 (ja) | 2004-04-08 | 2004-04-08 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000196006A JP2000196006A (ja) | 2000-07-14 |
| JP2000196006A5 true JP2000196006A5 (https=) | 2004-12-16 |
| JP3606078B2 JP3606078B2 (ja) | 2005-01-05 |
Family
ID=18488394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36707598A Expired - Lifetime JP3606078B2 (ja) | 1998-12-24 | 1998-12-24 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3606078B2 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3895570B2 (ja) | 2000-12-28 | 2007-03-22 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP3953746B2 (ja) * | 2001-04-13 | 2007-08-08 | ヤマハ株式会社 | 半導体パッケージ及び半導体パッケージの製造方法 |
| KR100688595B1 (ko) * | 2002-08-30 | 2007-03-09 | 페어차일드코리아반도체 주식회사 | 양호한 열 방출을 위한 패드 노출형 반도체 패키지 |
| JP4469654B2 (ja) | 2004-05-13 | 2010-05-26 | パナソニック株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2006135100A (ja) * | 2004-11-05 | 2006-05-25 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP2007194379A (ja) * | 2006-01-19 | 2007-08-02 | Matsushita Electric Ind Co Ltd | リードフレームおよび半導体装置および半導体装置の製造方法 |
| JP2010238947A (ja) * | 2009-03-31 | 2010-10-21 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
| JP6048893B2 (ja) | 2012-03-28 | 2016-12-21 | パナソニックＩｐマネジメント株式会社 | 樹脂パッケージ |
| JP5420737B2 (ja) * | 2012-09-21 | 2014-02-19 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| KR102457011B1 (ko) * | 2015-06-24 | 2022-10-21 | 르네사스 일렉트로닉스 가부시키가이샤 | 반도체 장치의 제조 방법 |
| KR102547235B1 (ko) * | 2018-04-20 | 2023-06-23 | 삼성디스플레이 주식회사 | 표시 장치 |
| WO2020115830A1 (ja) * | 2018-12-05 | 2020-06-11 | 三菱電機株式会社 | 半導体装置及びアンテナ装置 |
| CN110164827B (zh) * | 2019-05-22 | 2024-07-26 | 河源市富宇光电科技有限公司 | 一种一体化成形封装结构及其封装工艺 |
-
1998
- 1998-12-24 JP JP36707598A patent/JP3606078B2/ja not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000196006A5 (https=) | ||
| JP2001077232A5 (https=) | ||
| KR920702549A (ko) | 반도체 장치 및 그의 제조방법 | |
| JPH0477261U (https=) | ||
| JP2002110889A5 (https=) | ||
| JPS63283053A (ja) | 半導体装置のリ−ドフレ−ム | |
| JPS6379651U (https=) | ||
| JPH0272556U (https=) | ||
| KR20010058586A (ko) | 반도체패키지 및 이를 이용한 실장방법 | |
| JPS62185340A (ja) | 半導体装置 | |
| KR970030726A (ko) | 리드 프레임을 이용한 볼 그리드 어레이 패키지 | |
| JPH0336137U (https=) | ||
| JPH0459949U (https=) | ||
| JPS62180948U (https=) | ||
| JPH0531226U (ja) | ダイボンデイングペーストはみ出し防止枠付き混成集積回路基板 | |
| JPH0263553U (https=) | ||
| JPH0426547U (https=) | ||
| JPH03101524U (https=) | ||
| JPH01112044U (https=) | ||
| JPH03106740U (https=) | ||
| JPH03102745U (https=) | ||
| JPS6375046U (https=) | ||
| JPS63159847U (https=) | ||
| JPH0316346U (https=) | ||
| JPH01120343U (https=) |