JP3606078B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP3606078B2
JP3606078B2 JP36707598A JP36707598A JP3606078B2 JP 3606078 B2 JP3606078 B2 JP 3606078B2 JP 36707598 A JP36707598 A JP 36707598A JP 36707598 A JP36707598 A JP 36707598A JP 3606078 B2 JP3606078 B2 JP 3606078B2
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JP
Japan
Prior art keywords
die pad
semiconductor device
sealing resin
resin body
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP36707598A
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English (en)
Japanese (ja)
Other versions
JP2000196006A (ja
JP2000196006A5 (https=
Inventor
健一 伊東
秀一 尾方
敏行 福田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP36707598A priority Critical patent/JP3606078B2/ja
Publication of JP2000196006A publication Critical patent/JP2000196006A/ja
Publication of JP2000196006A5 publication Critical patent/JP2000196006A5/ja
Application granted granted Critical
Publication of JP3606078B2 publication Critical patent/JP3606078B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP36707598A 1998-12-24 1998-12-24 半導体装置およびその製造方法 Expired - Lifetime JP3606078B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36707598A JP3606078B2 (ja) 1998-12-24 1998-12-24 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36707598A JP3606078B2 (ja) 1998-12-24 1998-12-24 半導体装置およびその製造方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2003433161A Division JP2004104155A (ja) 2003-12-26 2003-12-26 半導体装置
JP2004114292A Division JP4308698B2 (ja) 2004-04-08 2004-04-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2000196006A JP2000196006A (ja) 2000-07-14
JP2000196006A5 JP2000196006A5 (https=) 2004-12-16
JP3606078B2 true JP3606078B2 (ja) 2005-01-05

Family

ID=18488394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36707598A Expired - Lifetime JP3606078B2 (ja) 1998-12-24 1998-12-24 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP3606078B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3895570B2 (ja) 2000-12-28 2007-03-22 株式会社ルネサステクノロジ 半導体装置
JP3953746B2 (ja) * 2001-04-13 2007-08-08 ヤマハ株式会社 半導体パッケージ及び半導体パッケージの製造方法
KR100688595B1 (ko) * 2002-08-30 2007-03-09 페어차일드코리아반도체 주식회사 양호한 열 방출을 위한 패드 노출형 반도체 패키지
JP4469654B2 (ja) 2004-05-13 2010-05-26 パナソニック株式会社 半導体装置及び半導体装置の製造方法
JP2006135100A (ja) * 2004-11-05 2006-05-25 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP2007194379A (ja) * 2006-01-19 2007-08-02 Matsushita Electric Ind Co Ltd リードフレームおよび半導体装置および半導体装置の製造方法
JP2010238947A (ja) * 2009-03-31 2010-10-21 Sanyo Electric Co Ltd 半導体装置及びその製造方法
JP6048893B2 (ja) 2012-03-28 2016-12-21 パナソニックＩｐマネジメント株式会社 樹脂パッケージ
JP5420737B2 (ja) * 2012-09-21 2014-02-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR102457011B1 (ko) * 2015-06-24 2022-10-21 르네사스 일렉트로닉스 가부시키가이샤 반도체 장치의 제조 방법
KR102547235B1 (ko) * 2018-04-20 2023-06-23 삼성디스플레이 주식회사 표시 장치
WO2020115830A1 (ja) * 2018-12-05 2020-06-11 三菱電機株式会社 半導体装置及びアンテナ装置
CN110164827B (zh) * 2019-05-22 2024-07-26 河源市富宇光电科技有限公司 一种一体化成形封装结构及其封装工艺

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JP2000196006A (ja) 2000-07-14

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