JP2000194816A - Manufacture of non-contact data carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the warpage, twist, wrinkle and distortion of a non-contact data carrier, the withdrawal of resin and further a damage in the heat press, thus excellent providing a thin type non-contact data carrier. SOLUTION: On a thermoplastic non-foamable resin sheet 45, a thermoplastic foamable resin sheet 46 (first resin sheet) is stacked up and an internal component 3 is mounted. Then, the thermoplastic foamable resin sheet 47 (second resin sheet) provided with an opening 5 larger than the plane dimension of an IC chip 1b for constituting the internal component 3 by 0.5-2 mm and an almost triangle notch 6 on the respective sides of the peripheral edge of the opening 5 is piled up on the foamable resin sheet 46 and a space where fused resin flows in is formed between the side face of the IC chip 1b. Further, on the foamable resin sheet 47, the thermoplastic non-foamable resin sheet 48 (third resin sheet) is piled up. Thereafter, stainless plates 7 are stacked up on the outer surface of the non-foamable resin sheets 45 and 48 and thermally pressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a method for manufacturing a contactless data carrier. Specifically, the present invention relates to a method for manufacturing a non-contact data carrier which has an IC chip as a main internal component and transmits and receives signals to and from an external device in a non-contact manner.

[0002]

2. Description of the Related Art A non-contact data carrier system is composed of a transponder which is called a non-contact data carrier and an interrogator connected to a host. , Induction electromagnetic field, microwave (radio wave)
It is characterized in that communication is performed in a non-contact manner via a transmission medium such as the one described above. This system possesses a transponder or attaches it to various articles, remotely reads information about the person or article possessed by the interrogator, and provides the host with the information to realize information processing about the person or article.

[0003] As an information transmission system of a non-contact data carrier system, an electromagnetic coupling system, an electromagnetic induction system, a microwave system, an optical communication system, and the like are generally known. Among these methods, in the electromagnetic coupling method, the electromagnetic induction method, and the microwave method, the energy of the transmission signal from the interrogator can be used as the driving power of the transponder. Since the transmission signal itself can be used as a drive source, there is no deterioration in response capability due to a decrease in battery output, as compared with other similar systems in which a drive source such as a battery needs to be built in the transponder. There is a great advantage that there is no limit on the use of the transponder due to battery life.

FIG. 11 shows the overall structure of a contactless data carrier system. As shown in FIG. 1, the contactless data carrier system includes an interrogator 10 and a transponder (contactless data carrier) 20.

The interrogator 10 includes a main controller 11 for controlling the entire interrogator 10, an interface 11 for controlling data input / output with the host device, and tag information received from the non-contact data carrier 20. Read / store
A storage unit 13 such as a writable RAM, for converting transmission information from a parallel signal to a serial signal;
The signal conversion unit 14 converts the received signal from the serial signal 0 into a parallel signal from a serial signal, and converts the transmission signal into, for example, ASK (Am
Plitude Shift Keying), FSK (Frequency Shift)
t Keying) modulating section 15 for modulating the signal for transmission
And a demodulation unit 16 for demodulating a received signal;
7 and a receiving antenna 18.

The transponder (contactless data carrier) 20
A main control unit 21 for controlling the entire non-contact data carrier 20, a storage unit 22 such as an EEPROM for storing tag information which does not require a power supply backup, converting transmission information from a digital signal to an analog signal, and an interrogator 10; A signal converter 23 for converting a received signal from an analog signal to a digital signal, a modulator 24 for modulating a transmission signal into a signal for transmission by an ASK method, an FSK method or the like, and a demodulator 25 for demodulating a received signal. , A transmission antenna 26, and a reception antenna 27.

The basic communication procedure of this contactless data carrier system is as follows. First, the interrogator 10
An interrogation signal for reading tag information from the non-contact data carrier 20 is issued.

The contactless data carrier 20 receives the interrogation signal when it enters the receivable range, and
Is transmitted as a response signal.
The interrogator 10 receives and decodes this response signal and sends it to the host device as tag identification information. FIG. 12 is a plan view showing the configuration of such a transponder 20, FIG. 13 is a cross-sectional view showing the configuration of the transponder 20, and FIG. As described above, the transponder 20 (non-contact data carrier) is mainly composed of the antenna 2 and the circuit component 1 for transmitting and receiving signals to and from the interrogator 10, and takes into consideration durability and environmental resistance. , Usually the resin layer 4
It has a structure in which the internal components 3 such as the transmission / reception antenna 2 and the circuit component 1 are hermetically sealed by, for example. As the transmitting / receiving antenna 2, a coil formed of a copper conducting wire is frequently used in terms of cost and productivity, and as the circuit component 1, for example, a copper circuit pattern 1 c and terminals are provided on the surface of a circuit board 1 a such as an epoxy board. A part 1d is formed, and I
Generally, the C chip 1b is soldered or wire-bonded. Normally, two end wires (conductor portions) of a coil formed of a copper wire having an outer diameter of 30 to 200 μm are connected to the terminal portion 1 of the circuit component 1 by welding or solder 1e.
d. As the resin material for hermetically sealing these internal components 3, thermoplastic resins such as vinyl chloride resin, polyethylene terephthalate resin, acrylonitrile / butadiene / styrene copolymer resin, or epoxy resin, phenol resin, silicone resin, etc. Thermosetting resin such as the above thermosetting resin is used.

The transponder 20 is usually sealed by sandwiching the coil and the circuit component 1 between a plurality of resin sheets made of a thermoplastic resin or a thermosetting resin. That is, the resin sheets are overlapped from above and below the coil (transmitter / receiver antenna 2) and the circuit component 1, and the internal component 3 is sandwiched between the two resin sheets.

Next, the resin sheet sandwiching the internal component 3 is further sandwiched between two stainless plates, and the coil and the circuit component 1 are hermetically sealed with the resin layer 4 by hot pressing from both sides of the stainless plate. Thereafter, the transponder 20 is manufactured by punching to a predetermined size.

[0011]

By the way, the circuit component 1
Denotes an IC chip 1b mounted on a circuit board 1a,
In some cases, if necessary, as shown in FIG.
A sealing resin layer 1f is formed on the chip 1b. As a result, the circuit component 1 inevitably has a certain thickness, specifically, a thickness of about 0.45 mm to 0.5 mm in the area A shown in FIG. 14 on which the IC chip 1b is mounted. On the other hand, in the region B shown in FIG. 14 where the IC chip 1b does not exist even in the region where the circuit component 1 exists,
Except for the region where the solder 1e is present, most of the thickness is the thickness of the circuit board 1a. Further, even in the region where the internal component 3 exists, the region C shown in FIG. 14 where the circuit component 1 does not exist is almost the region where only the resin layer 4 exists. As described above, the thickness of the non-contact data carrier 20 differs in each of the areas A, B, and C.

As a result, the thickness of the non-contact data carrier 20 obtained by the above method varies as a whole. In addition, the contactless data carrier 20 includes:
In addition to causing warpage, twisting, warping, wrinkling or sinking of resin, ICs are also subject to pressure during hot pressing.
There is a problem that the chip 1b is damaged.
Also, as represented by an epoxy substrate, the circuit board 1
In many cases, a substrate made of a glass-thermosetting resin (epoxy resin, polyimide resin, benzotriazine resin, etc.) is used as a, and the properties of the two are very different from the thermoplastic resin of the resin sheet. . Therefore, when these are combined, distortion is likely to occur, and warpage, torsion, distortion, and the like increase. For example, when the circuit component 1 having the above thickness is used, the thickness of the non-contact data carrier 20 is set to a predetermined standard of 0.76 mm ±
It is very difficult to fit within 0.08 mm.

Further, since it is necessary to display the information stored in the non-contact data carrier 20, characters, figures, etc. must be written on the surface thereof by printing, laminating, etc. Is essential, and the above-described phenomena such as warpage, twisting, and distortion are extremely undesirable.

In order to solve these problems, it is conceivable to increase the thickness of the non-contact data carrier 20. However, in this case, the non-contact data carrier 20 is intended to be portable, thin and lightweight. You have to sacrifice.

On the other hand, in order to solve the above problems, it has been attempted to examine the materials to be used and the conditions at the time of hot pressing. However, warping, twisting, warping, wrinkling, resin sink, and the like due to the influence of internal parts have been attempted. It was not enough to solve it.
In particular, as the thickness of the non-contact data carrier 20 becomes thinner, it is not enough to solve the problem.

The present invention has been made in view of such circumstances, and prevents a non-contact data carrier from warping, twisting, wrinkling, warping, sinking of resin, and breaking during hot pressing. The aim is to obtain a good data carrier.

[0017]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention improves the flow of resin during hot pressing by subjecting a resin sheet used for sealing to a predetermined punching process, and at the same time improves the IC chip. The purpose is to prevent excessive pressure from being applied.

According to the method for manufacturing a non-contact data carrier of the present invention, a circuit component including a storage element for storing information, an antenna for transmitting and receiving signals to and from an external device in a non-contact manner, and the antenna and the circuit component In a method for manufacturing a card-shaped non-contact data carrier in which a conductor part for electrically connecting the internal parts is disposed on substantially the same plane with a resin layer, a first part on which the internal parts are placed is provided. A second resin sheet having an opening for forming a space for pouring a resin between the storage element and the side surface of the storage element is overlaid on the second resin sheet, and the first resin sheet is further placed on the second resin sheet. A third resin sheet sandwiching the internal component between the first resin sheet and the second resin sheet, and hot pressing to form the resin layer.

That is, by sandwiching another resin sheet (second resin sheet) that has been subjected to a piercing process between two resin sheets sandwiching the internal component, the volume of the storage element is formed between the resin sheet and the storage element. In order to reduce the variation in thickness, warping, twisting, and the like, a space corresponding to the thickness is provided so that the resin flows into the space.

Specifically, in the method of manufacturing a non-contact data carrier according to the present invention, the planar dimension of the opening is set to be larger by 0.5 to 2 mm than the planar dimension of the storage element. It is characterized by.

Further, in the method of manufacturing a non-contact data carrier according to the present invention, the storage element includes the sealing resin layer, and the plane size of the opening is reduced by the plane size of the storage element. It is characterized in that it is larger by 0.5 to 2 mm.

As described above, the present invention is a particularly effective method when the thickness of the storage element portion is increased due to the provision of the sealing resin layer.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a non-contact data carrier, wherein a notch is provided in a periphery of the opening.

As a result, it is possible to sufficiently cope with a case where variations in thickness, warpage, twist, and the like cannot be sufficiently absorbed by the opening alone.

According to a fifth aspect of the present invention, in the method of manufacturing a non-contact data carrier, the notch is provided symmetrically with respect to a center line of the opening.

As a result, the resin flows symmetrically from the left and right with respect to the opening, and the warp and twist of the non-contact data carrier can be further reduced.

Further, according to a sixth aspect of the present invention, in the method for manufacturing a non-contact data carrier, the circuit component includes:
A circuit board on which the storage element is mounted, wherein a center line in a thickness direction of the circuit board is aligned with a center line in a thickness direction of the non-contact data carrier.

As a result, warpage, torsion, and distortion can be further reduced.

According to a seventh aspect of the present invention, in the method for manufacturing a non-contact data carrier, the first resin sheet, the second resin sheet, and the third resin sheet are made of a thermoplastic resin sheet. It is characterized by being.

[0030] In the method of manufacturing a non-contact data carrier according to the present invention, the first and / or second thermoplastic resin sheet is a foamable sheet. I have.

As described above, the foamable sheet is used for the resin sheet (first resin sheet) disposed on the lower surface of the internal component and / or the resin sheet (second resin sheet) disposed around the memory element. Thus, the pressure applied to the storage element can be reduced. As a result, damage to the storage element can be reduced, and the yield of non-contact data carriers can be improved.

[0032]

FIG. 1 is a schematic explanatory view showing a method for manufacturing a non-contact data carrier according to the present invention, FIG. 2 is a plan view of a second resin sheet used in the method, and FIG. FIG. 4 is a plan view of another second resin sheet used in the manufacturing method, FIG. 4 is a cross-sectional view showing a schematic configuration of a non-contact data carrier obtained by the manufacturing method, and FIGS. Explanatory diagram showing an embodiment of a contact data carrier, FIGS.
FIG. 4 is an explanatory view showing a comparative example of a non-contact data carrier.
Hereinafter, the present invention will be described in detail with reference to the drawings.

As shown in FIG. 4, the non-contact data carrier 20 has an internal component 3 composed of a circuit component 1 and a transmitting / receiving antenna 2 sealed with a resin layer 4. As shown in FIG. 14, the circuit component 1 is a circuit board made of a thermosetting resin, such as an epoxy resin, a polyimide resin, or a benzotriazine resin, and a glass substrate. 1c and a terminal portion 1d are formed,
An IC chip 1b electrically connected by solder is used for this. The IC chip 1b incorporates each functional circuit unit except for the transmission / reception antenna 2 in the configuration of the transponder shown in FIG. Also, the IC chip 1b
Although not shown in FIG. 4, it is sealed by a sealing resin layer 1f made of a thermosetting resin by a method such as potting or transfer molding. Further, for example, a copper coil is used as the transmitting / receiving antenna 2 and the terminal portion 1d
Are electrically connected to each other by a solder 1e.

In the non-contact data carrier 20 shown in FIG. 4, the resin layer 40 for encapsulating the internal component 3 has a foamable resin layer 42 between a pair of non-foamable resin layers 41. It has a three-layer structure in which the non-foamable resin layer 41 is laminated on the upper and lower surfaces of the resin layer 42. Further, in the non-contact data carrier 20, the internal component 3 is embedded in the foamable resin layer.

The foamable resin used for the foamable resin layer 42 includes thermoplastic resins such as polystyrene, polyethylene, polypropylene, and polyvinyl alcohol, polyurethane, phenol resin, epoxy resin, acryl,
A thermosetting resin such as silicone can be used.
The method of foaming is not particularly limited, and foamed according to a conventional method can be used. For example, various types of foaming resins, such as foaming resins that are mechanically foamed by mixing a surfactant, foaming resins that are foamed by mechanically stirring with a reaction gas generated during the reaction, ammonium carbonate, diazoaminobenzene, etc. And a foaming resin foamed using the foaming agent.

The non-foamable resin used for the non-foamable resin layer 41 may be the same as the conventional resin layer 40, and may be a thermosetting resin such as an epoxy resin, a silicone resin, or a phenol resin. And thermoplastic resins such as vinyl chloride resin, polyethylene terephthalate resin, acrylonitrile / butadiene / styrene copolymer resin, and polystyrene resin.

The resin material of the foamable resin layer 42 and the resin material of the non-foamable resin layer 41 may be different resin materials. However, from the viewpoint of forming the resin layer 40 integrally, the same resin material may be used. In particular, it is preferable to use a thermoplastic resin material. This is because a thinner non-contact data carrier 20 can be obtained by using a thermoplastic resin material. Hereinafter, the resin layer 40 will be described as being made of a thermoplastic resin.

The non-contact data carrier 20 is manufactured, for example, as follows.

First, the terminal portion 1 of the circuit component 1 is arranged such that the circuit component 1 and the transmitting / receiving antenna 2 are arranged on substantially the same plane.
d and the transmitting / receiving antenna 2 are electrically connected to each other by a conducting wire portion (end line of the coil) to prepare the internal component 3 in advance.

Next, a foamable resin sheet 46 as a first resin sheet is superimposed on a non-foamable resin sheet 45 on which a non-foamable resin layer 41 on the lower surface of the non-contact carrier data 20 is formed. The internal component 3 is placed on the resin sheet 46.

The center line of the internal component 3 in the thickness direction of the circuit board 1a is aligned with the non-contact data carrier 20.
Is placed so as to coincide with the center line in the thickness direction of the. For this purpose, the thickness of the foamable resin sheet 46 or the like to be used is adjusted. However, the thickness is determined experimentally, and a plurality of foamable resin sheets 46 may be stacked as necessary. Good.

Thereafter, another foamable resin sheet 47 as a second resin sheet is overlaid on the foamable resin sheet 46. The foamable resin sheet 47 constitutes the foamable resin layer 42 for sealing the internal component 3 together with the foamable resin sheet 46 described above. Therefore, it is desirable that the foamable resin sheet 46 on which the internal component 3 is mounted and the foamable resin sheet 47 as the second resin sheet are made of the same resin material.

As shown in FIG. 2, the foamable resin sheet 47 has a substantially rectangular opening 5 into which the IC chip 1b can be fitted. The foamable resin sheet 47 is overlapped on the foamable resin sheet 46 so as to fit the IC chip 1b into the opening 5, and
Is sandwiched. The shape of the opening 5 is not limited to a substantially rectangular shape, of course, but the planar shape of the IC chip 1b (or the sealing resin layer 1f as described above).
When the sealing resin layer 1f is sealed by the sealing resin layer 1f, the planar shape of the sealing resin layer 1f. In the following description, the IC chip 1
As for b, the case where the semiconductor device is sealed with the sealing resin layer 4 as in the case of the IC chip 1b is also described as the IC chip 1b. ).

The opening 5 forms a space between the IC chip 1b and the side surface of the IC chip 1b so that the resin melted during the hot pressing (the resin melted from the second resin sheet) flows. When a resin sheet having no opening 5 is overlapped as in the related art, an amount of resin corresponding to the volume of the internal component 3 is left, and the surplus resin causes warpage, distortion, twist, and consequently the surface of the non-contact data carrier 20. This is considered to be a cause of unevenness. In other words, in the present invention, the opening is formed so as to eliminate the remainder of the resin, and to improve the flow of the resin by creating a space into which the resin flows around the IC chip 1b. . As a result, the resin efficiently flows around the IC chip 1b, and the thickness can be made uniform. In addition, warpage, twist, and distortion can be reduced.

Therefore, it is desirable that the space is set to an amount corresponding to the volume of the IC chip 1b. Specifically, the space varies depending on the thickness and foaming property of the second resin sheet used.
The size of the opening 5 is set to be larger than the plane size of the IC chip 1b by 0.
It is formed about 5 to 2 mm larger.

At this time, it is desirable that the thickness of the second resin sheet is set to be larger than the thickness of the internal component 3. As a result, the pressure due to the hot pressing is not directly applied to the IC chip 1b, and the internal components 3, especially the IC
This is because damage to the chip 1b can be reduced.

A triangular notch 6 is provided on the periphery of the opening 5. As described above, the IC chip 1
b is provided with a sealing resin layer 1f for enhancing moisture resistance, or when the thickness of the internal component 3 is relatively thicker than the thickness of the non-contact data carrier 20, only the opening 5 is provided. May not be sufficient. In this case, a notch 6 is provided on the peripheral edge of the opening 5 in order to further increase the space into which the resin flows. The shape and size are not particularly limited.
It can be formed in a circular shape, a semicircular shape, a semielliptical shape, a rectangular shape, or the like.

The position where the notch 6 is provided is not particularly limited, but is preferably provided symmetrically with respect to the center line of the opening 5 (dashed line shown in FIG. 3), as shown in FIG. When the rectangular opening 5 is provided, the opening 5
It is preferable to provide it on the four sides of the opening 5, up, down, left and right. By providing the notch 6 symmetrically with respect to the opening 5 in this manner, the resin flowing into the opening 5 and the notch 6 is made uniform left and right, and warpage and twisting can be further reduced.

Further, as shown in FIG. 4, a plurality of notches 6 may be provided on each side of the peripheral edge of the opening 5, but in this case, the center line of the opening 5 is also provided for the reason described above. It is preferable to provide the notch 6 symmetrically with respect to the left and right (dashed line shown in FIG. 4).

The size of these notches 6 is
That is, it can be calculated from the difference between the volume of all of the IC chip 1b, the circuit board 1a, and the antenna 2 (the internal component 3) and the volume of the space corresponding to the opening 5.
Actually, the size of the opening 5 is the same, but it is set experimentally so that the final distortion or the like is minimized.

In this manner, the second in which the opening 5 is formed
After superimposing the resin sheet (foamable resin sheet 47), the non-foamable resin sheet 48 as the third resin sheet is superposed so as to sandwich the internal component 3. The third resin sheet forms the non-foamable resin layer 41 on the upper surface of the non-contact data carrier 20.

Finally, the stainless steel plate 7 is overlaid on the outer surfaces of the non-foamable resin sheets 45 and 48 and hot pressed.
A non-contact data carrier 20 can be manufactured.

In the present invention, it is not always necessary to form the foamable resin layer 42 on the lower surface of the internal component 3 using the foamable resin sheet 46, and the non-foamable resin sheet 45 is not necessary.
May be used as the first resin sheet to form the resin layer 40. The reason why the internal component 3 is arranged on the foamable resin sheet 46 is that the stress applied to the internal component 3 can be reduced. On the other hand, the reason why the foamable resin sheet 46 is superimposed on the non-foamable resin sheet 45 is to form the non-foamable resin layer 41 on both the front and back surfaces of the non-contact data carrier 20,
This is because printability can be improved regardless of the front and back sides.

Further, a non-foamable resin sheet is used as the second resin sheet, an opening 5 and a notch 6 are provided in the non-foamable resin sheet, and the internal component 3 is sealed from the non-foamable resin layer. It is perfectly acceptable to do so.

[0055]

Next, an embodiment will be described. In the description of Examples and Comparative Examples, the same reference numerals are used for resin sheets made of the same material or the like.

(Example 1) An IC chip 1b having a plane size of 2 × 2 mm and a thickness of 0.2 mm is mounted on a circuit board 1a having a plane size of 12 × 8 mm and a thickness of 0.2 mm on which a circuit pattern is formed. Further, the antenna 2 wound in a coil shape having a diameter of 40 mm was electrically connected by solder. Next, the IC chip 1b was sealed with a liquid sealing resin to produce an internal component 3 as shown in FIG. The maximum thickness of the internal component 3 was about 0.45 to 0.5 mm in the IC chip 1b portion (A region in FIG. 14) on which the sealing resin layer 1f was formed.

Next, as shown in FIG. 5, a non-foamable resin sheet 51 having a thickness of 0.5 mm and having no opening is formed on a non-foamable resin sheet 52 having a thickness of 0.2 mm (first resin sheet). )
And the internal component 3 was placed.

Next, the area A (IC chip 1) shown in FIG.
A 0.5 mm-thick foamable resin sheet 53 (second resin sheet) provided with a rectangular opening 5 that is 2 mm larger than the planar dimension b) is fitted into the opening 5 so that the IC chip 1b is fitted therein. It was superimposed on the foamable resin sheet 52. Further, a non-foamable resin sheet 51 (third resin sheet) having a thickness of 0.2 mm and having no opening was laminated on the foamable resin sheet 53.

Thereafter, a stainless steel plate is superimposed on the outer surface of the non-foamable resin sheet 51 at 150 ° C. for 2 kg.
Hot press was performed at a pressure of / cm ² to obtain a non-contact data carrier of Example 1.

(Embodiment 2) Internal part 3 of Embodiment 1
As shown in FIG. 6, a foamable resin sheet 52 (first resin sheet) having a thickness of 0.5 mm and having no opening is superimposed on a non-foamable resin sheet 51 having a thickness of 0.2 mm and having no opening. ,
The internal component 3 was placed.

Next, the area A (IC chip 1) shown in FIG.
b), and two isosceles triangular notches 6 each having a base of 2 mm and a height of 3 mm on each side of the periphery of the rectangular opening 2 which is 2 mm larger than the center line of the opening 5. A foamable resin sheet 54 (second resin sheet) having a thickness of 0.5 mm and symmetrically provided is superposed on the foamable resin sheet 52 such that the IC chip 1b is fitted into the opening 5. .

Further, a non-foamable resin sheet 51 (third resin sheet) having a thickness of 0.2 mm and having no opening was laminated on the foamable resin sheet 52. Hereinafter, in the same manner as in Example 1, a non-contact data carrier of Example 2 was obtained.

(Embodiment 3) Internal part 3 of Embodiment 1
7, a non-foamable resin sheet 51 having a thickness of 0.2 mm and having no opening (first resin sheet) is laminated on a non-foamable resin sheet 51 having a thickness of 0.2 mm and having no opening. Then, the internal component 3 was placed.

Next, the area A (IC chip 1b) shown in FIG.
Opening 5 and opening 5 that are 2 mm larger than
A non-foamable resin sheet having a thickness of 0.2 mm, provided with two isosceles triangular notches 6 each having a base of 2 mm and a height of 3 mm on each side of the periphery of the opening 5 symmetrically with respect to the center line of the opening 5 55 (second
(A resin sheet) was placed on the non-foamable resin sheet 51 such that the IC chip 1b was fitted into the opening 5.

Further, on the non-foamable resin sheet 55, a non-foamable resin sheet 51 having a thickness of 0.2 mm and having no opening (the third
Resin sheets). Hereinafter, in the same manner as in Example 1, a non-contact data carrier of Example 3 was obtained.

Next, a comparative example will be described.

(Comparative Example 1) Internal part 3 of Example 1 above
As shown in FIG. 8, a foamable resin sheet 52 (first resin sheet) having a thickness of 0.5 mm and having no opening is superimposed on a non-foamable resin sheet 51 having a thickness of 0.2 mm and having no opening. ,
The internal component 3 was placed.

Next, a foamable resin sheet 52 having a thickness of 0.5 mm and having no opening was superimposed on the foamable resin sheet 52.

Further, a non-foamable resin sheet 51 (third resin sheet) having a thickness of 0.2 mm and having no opening was laminated on the foamable resin sheet 52. Hereinafter, a non-contact data carrier of Comparative Example 1 was obtained in the same manner as in Example 1.

(Comparative Example 2) Internal part 3 of Example 1 above
As shown in FIG. 9, a non-foamable resin sheet 51 having a thickness of 0.5 mm and a non-foamable resin sheet 52 (first resin sheet) is superimposed on a non-foamable resin sheet 51 having a thickness of 0.2 mm. ,
The internal component 3 was placed.

Next, the area A (IC chip 1b) shown in FIG.
A 0.5 mm thick foamable resin sheet 56 (a second resin sheet) provided with a rectangular opening 5a having the same size as that of the IC chip 1b is inserted into the opening 5a. It was superimposed on the foamable resin sheet 52.

Further, a non-foamable resin sheet 51 (third resin sheet) having a thickness of 0.2 mm and having no opening was laminated on the foamable resin sheet 56. Hereinafter, in the same manner as in Example 1, a non-contact data carrier of Comparative Example 2 was obtained.

(Comparative Example 3) Internal part 3 of Example 1
As shown in FIG. 10, a non-foamable resin sheet 51 having a thickness of 0.2 mm and having no opening (first resin sheet) is stacked on a non-foamable resin sheet 51 having a thickness of 0.2 mm and having no opening. Then, the internal component 3 was placed.

Next, the area A (IC chip 1b) shown in FIG.
A non-foamable resin sheet 57 (second resin sheet) having a rectangular opening 5a having the same size as that of the non-foamable resin sheet 57 (second resin sheet) is fitted into the opening 5 so that the IC chip 1b is fitted into the opening 5. And on the non-foamable resin sheet 51.

Further, on the non-foamable resin sheet 51,
A non-foamable resin sheet 51 (third resin sheet) having a thickness of 0.2 mm and having no opening was overlapped. Thereafter, in the same manner as in Example 1, a non-contact data carrier of Comparative Example 3 was obtained.

Table 1 shows the characteristics of the non-contact data carriers produced by these Examples and Comparative Examples. The thickness of the foamable resin sheet after hot pressing is 0.2 mm regardless of the presence or absence of openings (and notches), and the thickness of the non-foamable resin sheet after hot pressing is equal to the openings (and notches). ) Was kept at 0.2 mm with or without.

[0077]

[Table 1] As can be seen from Table 1, in the non-contact data carrier of each embodiment, the thickest portion where the IC chip exists (A region shown in FIG. 14) and the thinnest portion where the internal component does not exist (FIG. 14). (C region) is very small, and wrinkles, warpage, twist, and the like are hardly observed. Further, the defect rate of the IC chip was also extremely reduced, and when the opening and the notch were provided, it could be reduced by up to 15% as compared with the case where the opening was not provided.

[0078]

As described above, according to the method for manufacturing a non-contact data carrier of the present invention, unevenness in thickness, warpage, torsion, distortion, wrinkles, and resin sink of the obtained non-contact data carrier are generated. Thus, a non-contact data carrier having an excellent appearance with few irregularities on the surface can be manufactured.

Further, it is possible to remarkably reduce the destruction of the internal storage element due to the pressure at the time of production, the disconnection of the connection part, etc., and to remarkably improve the reliability of the obtained non-contact data carrier, thereby improving the productivity and the yield. It can be greatly improved.

[Brief description of the drawings]

FIG. 1 is a schematic explanatory view showing a method for manufacturing a non-contact data carrier of the present invention.

FIG. 2 is a plan view of a second resin sheet used in the manufacturing method of FIG.

FIG. 3 is a plan view of another second resin sheet used in the method for manufacturing a non-contact data carrier of the present invention.

FIG. 4 is a sectional view showing a schematic configuration of a non-contact data carrier obtained by the manufacturing method of FIG. 1;

FIG. 5 is an explanatory view showing the manufacturing method according to the first embodiment.

FIG. 6 is an explanatory view showing a manufacturing method according to a second embodiment.

FIG. 7 is an explanatory view showing a manufacturing method according to a third embodiment.

FIG. 8 is an explanatory view showing a manufacturing method of Comparative Example 1.

FIG. 9 is an explanatory view showing a manufacturing method of Comparative Example 2.

FIG. 10 is an explanatory view showing a manufacturing method of Comparative Example 3.

FIG. 11 is a block diagram showing a general overall configuration of a contactless data carrier system.

FIG. 12 is a plan view showing the configuration of the contactless data carrier of FIG. 11;

FIG. 13 is a sectional view showing the configuration of the contactless data carrier of FIG. 11;

FIG. 14 is a detailed sectional explanatory view showing the configuration of the contactless data carrier of FIG. 11;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Circuit component 2 ... Transmission / reception antenna 3 ... Internal component 5 ... Opening provided in the 2nd resin sheet 6 ... Notch provided in the periphery of the opening 7 ... Stainless steel plate 20 ... Non-contact Data carrier 40: Resin layer for sealing internal components 41: Non-foamable resin layer forming resin layer 42: Foamable resin layer forming resin layer 46: Opening of first resin sheet No foamable resin sheet 47... Foamable resin sheet with openings provided as second resin sheet 48... Non-foamable resin sheet as third resin sheet

Claims (8)

[Claims] A circuit component including a storage element for storing information, an antenna for transmitting and receiving signals to and from an external device in a non-contact manner, and a conducting wire portion for electrically connecting the antenna and the circuit component are substantially provided. In a method for manufacturing a card-shaped non-contact data carrier in which internal components arranged on the same plane are sealed with a resin layer, the method for manufacturing the storage element includes: A second resin sheet provided with an opening forming a space for pouring a resin between the first resin sheet and the side surface of the second resin sheet is superimposed on the second resin sheet. A non-contact data carrier, wherein a third resin sheet sandwiching the first resin layer is overlapped and hot-pressed to form the resin layer. 2. The method for manufacturing a non-contact data carrier according to claim 1, wherein a plane dimension of the opening is larger than a plane dimension of the storage element by 0.5 to 2 mm. 3. The non-contact device according to claim 1, wherein the storage element includes the sealing resin layer, and a plane dimension of the opening is larger by 0.5 to 2 mm than a plane dimension of the storage element. Data carrier manufacturing method. 4. The method for manufacturing a non-contact data carrier according to claim 1, wherein a notch is provided in a periphery of said opening. 5. The method according to claim 4, wherein the notch is provided symmetrically with respect to a center line of the opening. 6. The circuit component includes a circuit board on which the storage element is mounted, and a center line in a thickness direction of the circuit board coincides with a center line in a thickness direction of the non-contact data carrier. The method for manufacturing a non-contact data carrier according to claim 1. 7. The method according to claim 1, wherein the first resin sheet, the second resin sheet, and the third resin sheet are thermoplastic resin sheets. 8. The method according to claim 7, wherein the first and / or the second thermoplastic resin sheet is a foamable sheet.