JP2000181072A - Liquid treating device for substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To keep a treating liquid so as not to lower the temp., while the treating liquid spreads on the whole surface of a substrate by supplying hot water to the back surface side of the substrate to heat to accurately control the temp. of the treating liquid supplied to the substrate in a wet process performed by supplying the treating liquid to the substrate as the substrate is rotated. SOLUTION: This treating liquid controlled to a prescribed temp. is supplied to the surface side 10a of the substrate 10 from a liquid supply nozzle and also the hot water is supplied to the back surface side 10b by forming a rotary shaft 12 for rotationally driving the substrate 10 into a hollow rotary shaft and arranging a substrate heating means 60 inside. The substrate heating means 60 is constituted of a hot water tank 61 provided with a heating means, a hot water pipe line 62 and a nozzle tip 63 provided at the tip of the hot water pipe line 62 and in the middle of the hot water pipe line 62, a temp. sensor 64, a pressure control valve 65 and a stop valve 66 are mounted successively from the tip side and plural hot water jetting ports 68 are opened on the conical surface of the nozzle tip 63.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate liquid processing apparatus for applying a processing liquid to a surface of a substrate such as a TFT substrate of a liquid crystal panel, a color filter, and a semiconductor wafer.

[0002]

2. Description of the Related Art For example, in a process of manufacturing a TFT substrate of a liquid crystal panel, a required wet process such as application of a developing solution, application of an etching solution, and supply of a stripping solution for stripping a resist film is required. Is performed. In such a liquid processing of the substrate, the substrate is mounted on the rotation driving means,
What is performed by supplying the processing liquid to the surface while rotating it has been widely used conventionally.

In the above-mentioned wet process, a plurality of processes, for example, a process of applying a developing solution and then performing a washing or rinsing process using pure water in a single apparatus are disclosed in, for example, JP-A-10-57877. It is known in the gazette. In this known substrate liquid processing apparatus, a substrate rotating unit is disposed in a cup-shaped housing, and the substrate rotating unit is provided by connecting an arm in a cross shape to an upper end of a rotating shaft that is rotationally driven by a motor, A plurality of support pins and positioning pins are erected at predetermined positions on the arm, and the substrate is placed on these pins and the rotary shaft is rotationally driven to hold and rotate the substrate in a horizontal state. . A processing liquid supply nozzle is disposed opposite to the upper position of the substrate, and the processing liquid is supplied from the nozzle onto the substrate while the substrate is rotated at a high speed by the rotation axis, and the centrifugal force due to the rotation is generated by the action of the centrifugal force. Is applied, and the processing liquid is applied evenly to the entire substrate.

A surplus of the processing liquid supplied to the substrate is scattered from an edge portion of the substrate. In order to collect such scattered processing liquid, the substrate is provided so as to be surrounded by a housing, and the apparatus is provided. The surrounding area is prevented from being stained, and the processing liquid is recovered. Furthermore, a liquid film of pure water is formed on the back surface of the substrate in order to prevent the treatment liquid from flowing around to the back surface side of the substrate. In this liquid film formation, the rotating shaft is made hollow, a pure water supply pipe is inserted through the inside of the rotating shaft, and pure water is jetted from the tip of the pure water supply pipe to supply the pure water to the back side of the substrate. Is what you do. In addition, when the supply pipe is doubled and a nitrogen gas is supplied to the inner pipe side to spin-dry the substrate after performing the liquid treatment, the substrate is dried at a rotation center position of the substrate where a rotation peripheral speed does not occur. The gas is supplied.

[0005]

When a processing solution is applied to a substrate, for example, when a developing solution or a stripping solution for a resist film is applied, the processing solution is heated to a predetermined temperature. Spraying from the supply nozzle is desirable in terms of controlling the viscosity of the processing liquid. In performing the processing, if the rotation speed of the substrate is constant, the coating accuracy changes depending on the viscosity of the processing liquid supplied onto the substrate. That is, if the temperature of the processing liquid is lower than the set value and the state is high viscosity, the spreading of the processing liquid on the substrate is hindered, and it becomes difficult to spread the processing liquid uniformly over the entire surface of the substrate. . On the other hand, if the temperature of the processing liquid is higher than the set value and the viscosity is too low, the flow of the processing liquid toward the peripheral portion due to the action of the centrifugal force becomes too fast, and the contact time of the processing liquid with the substrate is shortened, This results in a loss of efficiency of the liquid treatment. For example,
The resist film stripping process is to remove a part of the film with a stripping solution after developing the substrate on which the photoresist film has been formed. In addition, it is necessary to prevent the use of the stripping solution from being wasted. The treatment liquid is heated for the purpose of stabilizing the viscosity and the like for the above-described reasons.

By the way, even if the temperature of the processing liquid is strictly controlled and the processing liquid at a constant temperature is supplied, it must be maintained so that the temperature of the processing liquid does not decrease while being supplied to the substrate and spreading around. In this case, uniform processing is not performed over the entire substrate. In particular, the substrate is rotated at a high speed in order to effectively apply a centrifugal force to the processing liquid. As the rotation speed of the substrate increases, the temperature of the substrate and the processing liquid supplied to the substrate decrease more rapidly. Moreover, when the substrate is rotated, the peripheral speed of the peripheral portion is higher than that of the central portion of the rotation, so that the processing solution is cooled rapidly as it goes to the peripheral portion. However, there is a problem that a large gradient is generated in the temperature of the coating liquid, and uneven coating or the like occurs, and the coating state of the processing liquid becomes unstable.

The present invention has been made in view of the above points, and an object of the present invention is to make it possible to accurately control the temperature of a processing liquid supplied to a substrate in a wet process. An object of the present invention is to prevent the temperature from decreasing while the liquid spreads over the entire surface of the substrate.

[0008]

In order to achieve the above-mentioned object, the present invention provides a substrate rotating means for holding a substrate in a horizontal state and driving it to rotate, and at least a surface of the substrate rotated by the substrate rotating means. A processing liquid supply means mounted on an arm that is displaceable between a working position for disposing one type of processing liquid at a predetermined temperature at an opposing position to the substrate and a retracted position for opening an upper portion of the substrate. And a substrate heating means for injecting hot water toward the back side of the substrate so that the substrate has a temperature substantially the same as the temperature of the processing liquid. Things.

Here, the substrate heating means does not have a structure in which a nozzle tip for jetting hot water with a predetermined spread according to the size thereof is detachably attached to the front end of the hot water pipe on the back surface of the substrate. It is desirable to form a plurality of hot water jets capable of jetting hot water toward substantially the entire back surface of the substrate by the nozzle chips. Therefore, in the case where a substrate of a different size is configured to be processed, a nozzle chip having a different ejection angle according to the size of the substrate can be replaced and mounted. The processing liquid supplied to the substrate includes a developing liquid, an etching liquid,
There are stripping solutions and the like.
It is applied when performing processing with a processing liquid that needs to be temperature-controlled.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, FIGS. 1 to 5 show a specific configuration of a liquid processing apparatus according to an embodiment of the present invention. Here, in the following, an example of a substrate to be processed is a TFT substrate constituting a liquid crystal panel, and a description will be given assuming that a wet process is performed by supplying a developing solution or a stripping solution for a resist film to the substrate. I do. However, the present invention can also be applied to perform various liquid treatments required when manufacturing a color filter of a liquid crystal panel or a substrate such as a semiconductor wafer which is another substrate.

First, in FIGS. 1 and 2, reference numeral 10 denotes a substrate, and this substrate 10 is formed of a rectangular thin glass substrate as shown in FIG. Reference numeral 11 denotes a substrate rotating means. The substrate rotating means 11 has a rotating shaft 12, which is rotatably supported by a bearing 15 on a holding cylinder 14 erected on a base 13. At the upper end of the rotating shaft 12, four arms 16 extend in the horizontal direction. Each of the arms 16 has a plurality of support rods 17 standing upright. It has a spherical shape. Further, a pair of positioning rods 18 are provided upright at the distal end of each arm 16. Substrate 1
Numeral 0 is placed on a plurality of support rods 17 in a point contact state to maintain flatness, and the four corners are regulated by a pair of positioning rods 18 so that they cannot be moved in the horizontal direction. It is designed to be installed in such a way as to be done.

The rotating shaft 12 of the substrate rotating means 11 is
, And a pulley 19 is provided at an end thereof so as to be connected thereto. The motor 2 is located at the lower position of the base 13.
A drive pulley 21 is connected to an output shaft of the motor 20, and a transmission belt 22 is wound between the drive pulley 21 and the pulley 19 of the rotary shaft 12. Therefore, when the rotation shaft 12 is driven to rotate by the motor 20, the substrate 10 placed on the arm 16 rotates. During rotation of the substrate 10, its surface 10a
On the side, for example, a processing liquid such as a resist film stripping liquid is applied.

In the liquid processing described above, the processing liquid is diffused along the surface 10a of the substrate 10 by applying a centrifugal force to the processing liquid by driving the substrate 10 to rotate. The surplus processing liquid scatters from the edge of the substrate 10 in a substantially horizontal direction. In order to collect the scattered liquid, the substrate 10 is surrounded by a housing 23 having an open upper end. The board 1 is located at a position outside the housing 23.
A supply means for supplying a processing liquid or the like to 0 is provided. FIG. 3 shows the configuration of the processing liquid supply unit 24.
The processing liquid supply means 24 includes a support arm 2 provided in a horizontal direction.
The support arm 25 is provided with a plurality of liquid supply nozzles 26 in its longitudinal direction. Support arm 2
5 is connected to a mounting plate 28 at the base end thereof, and a distal end of a spline shaft 29 is connected to the mounting plate 28. The spline shaft 29 is inserted into a rotating shaft 30 and can be moved up and down. , Are connected so that they cannot rotate relative to each other. And the rotating shaft 3
Numeral 0 is rotatably supported by a bearing member 31 mounted on the base 13.

The rotating shaft 30 extends below the base 13, and the spline shaft 29 extends further below the rotating shaft 30. Elevating drive means 32 is provided at the end of the spline shaft 29, and rotation drive means 33 is provided at the end of the rotation shaft 30. The lifting drive means 32
A connecting plate 35 is connected to a rod of the cylinder 34, and the connecting plate 35 is connected to a bearing 36.
Are connected to the spline shaft 29 via the. Therefore, when the cylinder 34 is operated, the spline shaft 29 can be displaced up and down between a lower position shown by a solid line and an upper position shown by a virtual line. The rotation driving means 33 is provided with an operating lever 3 fixedly provided on the rotation shaft 30.
By rotating the operating lever 37 in the horizontal direction, the rotating shaft 30 connected to the operating lever 37 is rotated to a position separated from the housing 23 as shown by a solid line in FIG. As shown by the imaginary line in the same figure, it reciprocates between a position facing the opening at the top of the housing 23.

By configuring the processing liquid supply means 24 as described above, the support arm 25 is raised and positioned outside the housing 23 to be in the retracted position, and the substrate 10 mounted on the substrate rotation means 11 By facing and lowering to a predetermined height position, the liquid supply nozzle 26 is brought into an operating position where the processing liquid can be supplied close to the surface 10a of the substrate 10. In the retracted position of the support arm 25,
The substrate 10 is transferred to the substrate rotating means 11 by appropriate handling means.
And the substrate 10 can be taken out from the substrate rotating means 11. Then, the liquid supply nozzle 26 is jetted at a plurality of locations so that the jetted cleaning liquid spreads smoothly, reliably, and evenly over the entire surface of the substrate 10.

Since the application of the processing liquid is performed by utilizing the action of the centrifugal force due to the rotation of the substrate 10, excess processing liquid is scattered from the edge portion on the outer periphery of the substrate 10. Therefore, in order to effectively collect the scattered treatment liquid, a housing 23 constituting a liquid treatment tank is provided. In the housing 23, an outer peripheral wall 23b and an inner peripheral wall 23c whose upper ends are bent inward are continuously provided around a bottom wall 23a. Thus, a first liquid recovery chamber 40 is formed between the outer peripheral wall 23b and the inner peripheral wall 23c, and a second liquid recovery chamber 41 is formed inside the inner peripheral wall 23c. With this configuration, when two different types of processing liquids are applied by the liquid processing apparatus, they can be collected in separate liquid recovery chambers 40 and 41, respectively. When a single processing liquid is applied, it is not necessary to provide the second liquid recovery chamber.

The upper ends of the outer peripheral wall 23b and the inner peripheral wall 23c of the housing 23 are oriented substantially horizontally.
The diameter of these openings is not greater than at least the length of the diagonal line of the substrate 10 so that the substrate 10 can be loaded and unloaded. Further, the bottom wall 23a surrounds the periphery of the holding cylinder 14, and a central portion thereof is a cylindrical portion 23d which rises in a cylindrical shape. Further, the bottom wall 23a is inclined toward the outer peripheral side, and the outer peripheral wall 23b and the inner peripheral wall 23c have a vertical wall and an inclined wall. Therefore, the first liquid recovery chamber 40 or the second
The processing liquid scattered toward the liquid recovery chamber 41 flows down these vertical walls and inclined walls. One or a plurality of suction pipes 4 are provided on the bottom surfaces of the first liquid collecting chamber 40 and the second liquid collecting chamber 41, respectively.
2 and 43 are connected. These suction pipes 42 and 43 are connected to negative pressure pumps 44 and 45, and
6, 47.

Therefore, when applying one processing liquid to the substrate 10, the substrate 10 is positioned between the outer peripheral wall 23b and the inner peripheral wall 23c, and the negative pressure pump 44 is operated to activate the outer peripheral surface of the substrate 10. Excess processing liquid scattered from the edge is taken into the first liquid recovery chamber 40, and the processing liquid in the first liquid recovery chamber 40 is recovered in the recovery tank 46 by negative pressure suction by the negative pressure pump 44. When supplying another processing liquid (including a cleaning liquid), the housing 23 is raised to raise the inner peripheral wall 23 c to a position above the position of the substrate 10, and the negative pressure pump 45 is operated. . Thus, other processing liquid scattered from the substrate 10 is taken into the second liquid recovery chamber 41 and can be recovered from the suction pipe 43 to the recovery tank 47.

For the above reasons, the housing 23 can be moved up and down. In order to raise and lower the housing 23,
As shown in FIG. 4, brackets 48 are connected to both sides of the housing 23, and a lifting rod 49 is connected to both brackets 48. And this lifting rod 4
Numeral 9 extends downward through a bearing member 50 attached to the base 13, and an elevating plate 51 is attached so as to bridge the lower ends of these two elevating rods 49. further,
Fixing plates 52, 53 having both ends fixed are provided on the lifting plate 51.
The slide member 5 is attached to the guide rod 54 connected between
5, and a nut 57 into which a feed screw 56 provided between the fixed plates 52 and 53 is inserted is connected. A drive motor 58 is connected to the feed screw 56. When the feed screw 56 is rotated by the drive motor 58, the elevating plate 51 moves up and down.
The housing 23 is moved up and down from 1 via a lifting rod 53 so as to move up and down to a position where the first liquid recovery chamber 40 faces the extension of the edge of the substrate 10 and a position where the second liquid recovery chamber 41 faces. Will be done.

The treatment liquid is supplied to the substrate 10 in a state where the treatment liquid is heated up to a predetermined temperature, for example, for viscosity control, though it varies depending on the kind and composition of the treatment liquid. The processing liquid supplied to the substrate 10 in this manner must be maintained at a constant temperature state until it is scattered from the edge in the outer peripheral portion. For this purpose, the substrate 1
It is necessary to keep 0 at a temperature substantially equal to the temperature of the processing liquid. Therefore, in the present invention, first, while the substrate 10 is rotating, in order to heat the substrate 10, hot water is sprayed toward the rear surface side. Here, the hot water is obtained by heating pure water containing no impurities to a predetermined temperature.

The hot water is supplied to the back surface 10b side of the substrate 10. For this purpose, a rotating shaft 12 for rotating the substrate 10 is formed as a hollow rotating shaft, and a substrate heating means 60 is disposed therein. ing. The substrate heating means 60 includes a hot water tank 61 provided with a heating means such as a heater as a hot water supply source, a hot water pipe 62, and a nozzle tip 63 provided at a tip of the hot water pipe 62. In the middle of the hot water pipe 62, a temperature sensor 64, a pressure regulating valve 65, and an on-off valve 66 are mounted from the tip side. Hot water piping 62
Is inserted into the hollow rotary shaft 12 and held by a bearing 67 so as to be relatively rotatable. This hot water pipe 62
The nozzle tip 63 connected to the front end is provided in a state facing the rotation center position of the substrate 10 mounted on the rotation shaft 12 at a predetermined interval. Then, for example, by pressurizing the hot water tank 61, the hot water in the hot water tank 61 is pressure-fed into the hot water pipe 62 and ejected from the nozzle chip 63 toward the back surface of the substrate 10.

As shown in FIG. 5, the outer shape of the nozzle tip 63 has a substantially conical or frustoconical main body 63a.
And a skirt portion 63b is continuously provided.
3b is connected to the distal end portion of the hot water pipe 62 with a predetermined fitting length. A plurality of hot water jets 68 are opened on the conical surface constituting the main body 63a of the nozzle tip 63. These hot water injection ports 68 are oriented vertically in the center, but are inclined toward the periphery. Here, the greater the angle of inclination of the hot water injection port 68 with respect to the central axis of the hot water pipe 62, the wider the injection angle of hot water from the nozzle tip 63.
In addition, the hot water injected from each hot water injection port 68 diffuses more widely after exiting from the hot water injection port 68 as the pressure is higher, and therefore, the degree of spread of the injected hot water changes depending on the injection pressure. The angle of the hot water jet from the nozzle tip 63 is determined by the inclination angle of each hot water jet 68 and the supply pressure of the hot water, and the distance between the nozzle tip 63 and the substrate 10 is determined by the distance between the nozzle tip 63 and the substrate 10.
The hot water injection range for 0b can be set and adjusted. Here, the connection between the nozzle tip 63 and the hot water pipe 62 is fixed by a set screw 69 provided on the skirt 63b. The structure for fixing the connecting portion between the nozzle tip 63 and the hot water pipe 62 may be configured by a suitable means such as screwing, for example, in addition to the set screw 69.

Since the skirt portion 63b of the nozzle tip 63 is screwed to the hot water pipe 62, the nozzle tip 63 may be replaced with a nozzle tip having a hot water jet at a different angle. it can. Also,
Since the screw length of the nozzle tip 63 to the hot water pipe 62 can be adjusted, the distance between the nozzle tip 63 and the substrate 10 can be adjusted. Further, since the hot water pipe 62 is provided with a pressure regulating valve 65,
Thus, the pressure at which hot water is ejected from the nozzle tip 63 can be adjusted. Therefore, the range of hot water injection to the substrate 10 can be set arbitrarily by these variable elements. The reason why the hot water is supplied to the substrate 10 is to uniformly heat the entire substrate 10, so that the hot water is supplied to the substrate 10 as much as possible.
It is desirable to be able to spray over the entire surface. However,
Due to the rotation of the substrate 10, the hot water supplied to the back side thereof can be expected to spread to some extent by the action of the centrifugal force. For this reason, it is sufficient that warm water is directly sprayed on almost the entire surface of the substrate 10. However, spraying hot water over a wider range than the substrate 10 is not preferable because it not only wastes hot water but also hinders application of the processing liquid to the substrate 10.

With the above construction, the substrate 10 is set on the arm 16 provided with the support rod 17 and the positioning rod 18 in the substrate rotating means 11 and the support arm 25 of the processing liquid supply means 24 is rotated. In this state, the liquid supply nozzle 26 faces the substrate 10, the rotation shaft 12 is driven to rotate, and the processing liquid is ejected from the liquid supply nozzle 26 to perform the liquid processing on the surface 10 a of the substrate 10. It can be performed. Here, the processing liquid injected from the liquid supply nozzle 26 is, for example, 40 ° C. to 50 ° C.
For example, the substrate 10 is supplied to the substrate 10 in a state of maintaining the optimum application temperature condition according to the type, viscosity, and the like.
During this liquid processing, hot water is supplied at a predetermined pressure to a heating pipe 62 constituting a substrate heating means 60 provided inside the rotating shaft 12 so that the back surface 10b of the substrate 10 is Spray warm water almost all over the area. As a result, the temperature of the substrate 10 is maintained at substantially the same temperature as the temperature of the processing liquid, so that the temperature of the processing liquid supplied to the substrate 10 can be prevented from changing while it spreads around.

Here, the temperature of the hot water is not higher than or equal to the temperature of the processing solution, and extends from the hot water injection port 68 of the nozzle chip 63 to almost the entire back surface 10b of the substrate 10. Hot water will be injected like this. As a result, when the substrate 10 rotates,
Can be prevented from being partially cooled. However, substrate 1
If 0 is rotated at too high a speed, the flow of air becomes intensified by that much, and even if hot water is supplied, the temperature may drop. Therefore, the number of rotations of the substrate 10 by the substrate rotation means 11 can be such that the processing liquid supplied to the substrate 10 can be smoothly spread over the entire substrate 10, and partial cooling is performed by the air flow during the rotation. Select a rotation speed that does not occur. In addition, in order to suppress the generation of the air flow due to the rotation of the substrate 10, as shown in FIG. 1, an injection nozzle 59 is provided near the rotation shaft 12, and the heated clean air is supplied from the injection nozzle 59. Etc. may be ejected.

In some cases, the substrate 10 is in a low temperature state before the substrate 10 is carried into the liquid processing step. In this case, the substrate 10 is mounted on the substrate rotating means 11 and rotation starts. Immediately after the processing liquid is supplied from the processing liquid supply means 24, the temperature of the processing liquid supplied to the substrate 10 decreases before the substrate 10 is sufficiently heated by the substrate heating means 60. . In order to prevent such a situation from occurring, it is desirable that the substrate 10 be heated by injecting hot water onto the back surface of the substrate 10 before the processing liquid is supplied from the processing liquid supply unit 24. Also,
At the stage before the substrate 10 is mounted on the substrate rotating means 11, the substrate 10 can be heated by a heater or the like.

As described above, while the liquid processing of the substrate 10 is being performed, the substrate 10 can be maintained at a temperature substantially equal to the temperature of the processing liquid supplied. As a result, the coating efficiency of the processing liquid becomes extremely good. For example, in the case where the stripping liquid for the resist film is supplied to the substrate 10, the processing liquid surely becomes uneven due to pattern formation on the surface of the substrate 10. The viscous state is maintained, and the composition is smoothly spread over the entire circumference at a predetermined traveling speed by the action of the centrifugal force. In addition, the hot water is
0 is supplied to almost the entire back surface 10b, so that the back surface 10b side is maintained in a state where a film of warm water is formed, so that it is possible to prevent the processing liquid from flowing to the back surface side.

Here, mounted on the rotation drive means 11,
There are a plurality of types of sizes of the substrate 10 on which the liquid processing is performed, and there is a configuration in which a plurality of types having different sizes can be mounted by a single rotation driving unit 11. For this purpose, the arm 16 and its base 13
Can be attached to and detached from the rotating shaft 12, or the positions of the support rod 17 and the positioning rod 18 mounted on the arm 16 can be changed, or the support rod 17 and the positioning rod 18 can be changed.
To allow a plurality of sizes of substrates to be mounted as they are. As described above, even when substrates of different sizes are mounted, in order to supply hot water to almost the entire surface of the substrate, the nozzle tip 63 screwed to the tip of the hot water pipe 62 is required.
Can be replaced. Therefore, a structure capable of injecting hot water over the entire surface of a substrate of various sizes and even to a position not exceeding the edge, that is, a plurality of types of nozzle tips having different numbers of hot water injection ports and their inclination angles is prepared. In addition, a nozzle tip having an ejection angle corresponding to the size of the substrate to be mounted on the rotation driving means 11 is mounted on the tip of the hot water pipe 62, and the height position of the nozzle tip is appropriately adjusted, Further, the injection pressure of the hot water is adjusted by the pressure adjusting valve 65. This makes it possible to spray hot water over substantially the entire back surface of substrates of different sizes.

[0029]

As described above, according to the present invention, in a wet process performed by supplying a processing liquid to the front surface of a substrate while rotating the substrate, hot water is supplied to the back surface side of the substrate. Since the substrate is heated, the temperature of the processing liquid supplied to the substrate can be accurately controlled, and the temperature of the processing liquid can be prevented from lowering while spreading over the entire surface of the substrate. And so on.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a substrate liquid processing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a sectional view of a processing liquid supply unit.

FIG. 4 is an external view of FIG.

FIG. 5 is a sectional view showing a configuration of a substrate heating unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Substrate 11 Substrate rotation means 12 Rotation axis 24 Processing liquid supply means 27 Liquid supply nozzle 60 Substrate heating means 61 Hot water tank 62 Hot water piping 63 Nozzle chip 64 Temperature sensor 65 Pressure control valve 66 Open / close valve 68 Hot water jet

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Yoshiki Kikuchi 3-16-3 Higashi, Shibuya-ku, Tokyo Inside Hitachi Electronics Engineering Co., Ltd. (72) Ryo Izaki 3-3-1-3 Higashi, Shibuya-ku, Tokyo Hitachi Electronic Engineering Co., Ltd. F-term (reference) 2H025 AB16 AB17 EA05 FA15 FA24 FA40 FA48 4F042 AA07 EB25 EB28 EB30

Claims (3)

[Claims] A substrate rotating means for rotating the substrate while holding the substrate in a horizontal state; and a nozzle member for supplying at least one type of processing liquid at a predetermined temperature to a surface of the substrate rotated by the substrate rotating means, A processing liquid supply unit attached to an arm displaceable between an operating position disposed opposite to the substrate and a retracted position that opens an upper portion of the substrate, and the substrate is brought to a temperature substantially equal to the temperature of the processing liquid. A substrate heating means for injecting hot water toward the back side of the substrate. 2. The apparatus according to claim 2, wherein the substrate heating means is configured to detachably mount a nozzle tip having a plurality of hot water jets for jetting hot water with a predetermined spread to a back surface of the substrate at a tip of a hot water pipe. The substrate liquid processing apparatus according to claim 1, wherein: 3. A hot water jet port of the nozzle chip is capable of jetting hot water onto substantially the entire back surface of the substrate, and the nozzle tip having a different jet angle depending on the size of the substrate. 3. The liquid processing apparatus for a substrate according to claim 2, wherein said apparatus can be replaced and mounted.