JP4172077B2 - Substrate liquid processing method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention is a method for performing a predetermined liquid processing by supplying a processing liquid to the surface of a substrate such as a TFT substrate, a color filter, or a semiconductor wafer of a liquid crystal panel.And equipmentIt is about.
[0002]
[Prior art]
For example, in the process of manufacturing a TFT substrate of a liquid crystal panel, predetermined processing is performed by a wet process such as application of a developing solution, application of an etching solution, supply of a removing solution for removing a resist film, and the like. A washing step and a drying step are added between the processes. In such a liquid processing of the substrate, the substrate is mounted on a rotation driving means, and the processing liquid is supplied to the surface of the substrate while rotating the substrate, and the processing liquid is applied to the entire surface of the substrate by a centrifugal force due to the rotation. It is common to do so.
[0003]
A liquid processing apparatus for performing this wet process is disclosed in, for example, Japanese Patent Application Laid-Open No. 10-57877. That is, a substrate rotating means is disposed in a cup-shaped housing, and this substrate rotating means is provided by connecting an arm in a cross shape to the upper end of a rotating shaft that is driven to rotate by a motor. Positioning pins are erected at predetermined positions, and the substrate is placed in a horizontal state by rotating the rotating shaft while the substrate is placed on these pins. A processing liquid supply nozzle is disposed opposite to the upper position of the substrate, and the processing liquid is supplied onto the substrate while the substrate is rotated at a high speed by the rotation shaft, and spin is performed by the centrifugal force due to the rotation. The substrate is coated, and the processing liquid is evenly applied to the entire substrate.
[0004]
[Problems to be solved by the invention]
By the way, when applying a processing solution to a substrate, for example, when applying a developing solution or a resist film stripping solution, the processing solution changes its viscosity depending on the temperature or the reaction is affected. It sprays from a supply nozzle in the state heated so that it might become temperature. For this reason, in order to perform the liquid processing of the substrate, it is necessary to accurately control the temperature of the supplied processing liquid. For example, the resist film peeling process is to remove a part of the resist film according to the pattern shape after developing the substrate on which the photoresist film is formed. In order to prevent this from occurring, it is necessary to ensure that the stripping solution at a constant temperature spreads evenly over the entire substrate, and that the stripping solution is supplied more than necessary, so there is no waste in consumption. It is also necessary to do so. This is why the processing liquid is heated, and the viscosity and the like are made constant by accurately controlling the temperature of the processing liquid. Accordingly, it is necessary to keep the temperature of the processing liquid from decreasing while the processing liquid is supplied to the substrate and spreads around the substrate. In particular, in order to effectively apply a centrifugal force to the processing liquid, the substrate is rotated at a high speed. However, as the rotational speed of the substrate increases, the temperature drop of the substrate and the processing liquid supplied to the substrate becomes more severe. . In addition, there is a difference in the peripheral speed of the substrate, and the peripheral speed of the peripheral part is faster than that of the central part of the rotation, so that the processing liquid is rapidly cooled as it goes to the peripheral part. In addition, there is a problem that a large gradient occurs in the temperature of the processing liquid on the substrate, and the coating condition of the processing liquid on the entire substrate becomes unstable.
[0005]
The present invention has been made in view of the above points, and an object of the present invention is to strictly control the temperature so that the temperature does not decrease when the processing liquid is supplied to the substrate in the wet process. Is to make it.
[0006]
[Means for Solving the Problems]
  In order to achieve the aforementioned objectives,A substrate is supported by a rotation driving means comprising a plurality of support rods erected on a plurality of arms connected to a rotation shaft, and a predetermined processing liquid is added to the substrate while the rotation shaft is driven to rotate. Supply in a warm state and spread the treatment liquid on the entire surface of the substrate by the action of centrifugal forceSubstrate liquid processing methodAs an invention ofThe substrate by bringing a heater into contact with the back side of the substrateTheA substrate heating step for heating to the temperature of the liquid,The heated substrate is placed on the support rod of the rotation driving means, and the substrate is rotated by driving the rotating shaft, and during this time, the substrate is rotated on the surface of the substrate.A liquid treatment process for supplying a heated treatment liquid,During the liquid treatment step, the substrate is heated by spraying hot water from the substrate heating means arranged at the center of the rotating shaft to the back surface of the substrate so as to diffuse in an angle range not wider than the entire surface of the substrate. Warm upIt is characterized by that.
[0007]
  Further, the invention of the liquid processing apparatus includes a substrate heating unit that abuts the back surface of a substrate on which liquid processing is performed with a heated processing liquid and heats the substrate to the temperature of the processing liquid, and the substrate In order to support and rotate the substrate heated by the heating unit, a plurality of arms are connected to the rotation shaft, and each arm is provided with a plurality of support rods for supporting the back surface of the substrate. And a processing liquid supply means for supplying a processing liquid heated to a predetermined temperature to the surface of the substrate placed on the support rod and spreading the processing liquid over the entire surface of the substrate by the action of centrifugal force ,
  It is characterized by comprising a substrate heating means that is disposed at the center position of the rotating shaft and that sprays hot water to diffuse toward the back surface of the substrate. And as a structure of a board | substrate heating means, it has a nozzle tip with which it attached to the front-end | tip of a hot water piping, This nozzle tip is a cone-shaped thing, and the vertical hot water injection nozzle and the cone are in the center position. It is desirable to provide a plurality of hot water injection ports provided on the surface.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 to FIG. 6 show an apparatus configuration for carrying out the liquid processing method according to the embodiment of the present invention. In the following description, as an example of a substrate to be processed, a wet process in which a resist film stripping solution or the like is supplied to a TFT substrate constituting a liquid crystal panel will be described. However, it can also be applied to apply various processing liquids when applying other processing liquids, and also for manufacturing substrates such as liquid crystal panel color filters and other substrates such as semiconductor wafers. it can.
[0009]
First, FIG. 1 shows a schematic configuration of a liquid processing apparatus. In the figure, reference numeral 1 denotes a liquid processing station. The liquid processing station 1 is provided with a substrate carry-in / out unit 2, a substrate heating unit 3, and a liquid processing unit 4, and a substrate transfer robot. 5 is installed. Reference numeral 10 denotes a substrate, and the substrate 10 is transported to the substrate carry-in unit 2 by appropriate transport means. The substrate 10 transported to the position of the substrate carry-in / carry-out unit 2 is moved by the robot 5. Then, it is taken into the liquid processing station 1 from the substrate loading / unloading unit 2 and liquid processing such as resist stripping is performed.
[0010]
The substrate heating unit 3 is provided with a plate heater 6, and the substrate 10 carried in from the substrate carry-in / carry-out unit 2 by the robot 5 is placed on the plate heater 6 so as to be heated for a predetermined time. It has become. Then, when the substrate 10 is heated, it is taken out again by the robot 5 and predetermined liquid processing is performed by the liquid processing apparatus 7 provided in the liquid processing unit 4. Here, two substrates 10 are always located at the liquid processing station 1, and the other substrate 10 is subjected to the liquid processing while one of the substrates 10 is heated. When the substrate 10 that has been subjected to the liquid processing is unloaded from the substrate loading / unloading unit 2, the substrate heating unit 3 takes in the new substrate 10 and moves the new substrate 10 to the substrate heating unit 3. The substrate 10 heated in 3 is taken out and sent to the liquid processing unit 4. Therefore, the robot 5 is configured so that the two substrates 10 can be held simultaneously. As a result, processing efficiency can be improved.
[0011]
Next, the entire configuration of the liquid processing apparatus 7 for the substrate 10 is shown in FIGS. Reference numeral 11 denotes a substrate rotating means. The substrate rotating means 11 has a hollow rotating shaft 12, and the rotating shaft 12 is rotatably supported by a bearing 15 on a holding cylinder 14 standing on a base 13. . Four arms 16 extend in the horizontal direction at the upper end of the rotating shaft 12, and a plurality of support rods 17 are erected on each arm 16, and the tips of these support rods 17 have a spherical shape. It has become. A pair of positioning rods 18 are provided upright at the tip of each arm 16. As is clear from FIG. 3, the substrate 10 is composed of a rectangular glass plate or the like, and is placed in a point contact state on a plurality of support rods 17 erected on the arm 16 so as to have flatness. The four corners of the substrate 10 are restricted so that they cannot be moved in the horizontal direction by each pair of positioning rods 18.
[0012]
The rotating shaft 12 of the substrate rotating means 11 extends to a position below the base 13, and a pulley 19 is connected to the end of the rotating shaft 12. A motor 20 is provided at a lower position of the base 13, a drive pulley 21 is connected to the output shaft of the motor 20, and a transmission belt 22 is provided between the drive pulley 21 and the pulley 19 of the rotary shaft 12. It is provided by winding. Accordingly, when the rotary shaft 12 is driven to rotate by the motor 14, the substrate 10 placed on the arm 16 rotates. During the rotation of the substrate 10, a treatment liquid such as a resist film peeling liquid is applied to the surface 10 a side.
[0013]
In the above liquid treatment, the substrate 10 is rotationally driven to apply a centrifugal force to the treatment liquid, thereby diffusing the treatment liquid along the surface 10 a of the substrate 10. The surplus processing liquid scatters from the edge of the substrate 10 in a substantially horizontal direction. In order to collect the scatter liquid, the substrate 10 is surrounded by a housing 23 whose upper end is open. A supply means for supplying a processing liquid or the like to the substrate 10 is provided at a position outside the housing 23. FIG. 4 shows the configuration of the processing liquid supply unit 24. The processing liquid supply means 24 has a support arm 25 provided in the horizontal direction, and a liquid supply nozzle 26 is attached to the support arm 25. A base end portion of the support arm 25 is connected to a mounting plate 28, and a tip of a spline shaft 29 is connected to the mounting plate 28, and the spline shaft 29 is inserted into a rotating shaft 30 to be moved up and down. It is possible and it is connected so that relative rotation is impossible. The rotating shaft 30 is rotatably supported by a bearing member 31 mounted on the base 13.
[0014]
The rotating shaft 30 extends below the base 13, and the spline shaft 29 extends further below the rotating shaft 30. A lift drive means 32 is provided at the end of the spline shaft 29, and a rotation drive means 33 is provided at the end of the rotation shaft 30. The elevating drive means 32 has a cylinder 34, and a connecting plate 35 is connected to the rod of the cylinder 34. The connecting plate 35 is connected to the spline shaft 29 via a bearing 36 so as to be relatively rotatable. . Accordingly, when the cylinder 34 is operated, the spline shaft 29 can be moved up and down to a lowered position indicated by a solid line and an elevated position indicated by an imaginary line. Further, the rotation drive means 33 has an operation lever 37 fixedly attached to the rotation shaft 30, and the operation shaft 37 is rotated in the horizontal direction to rotate the rotation shaft 30 connected thereto. Thus, as shown by a solid line in FIG. 3, it reciprocates between a position removed from the housing 23 and a position facing the opening at the top of the housing 23 as shown by a virtual line in FIG.
[0015]
By configuring the processing liquid supply means 24 as described above, when the support arm 25 is raised and positioned outside the housing 23, it becomes a retracted position, and the robot 10 attaches the substrate 10 to the substrate rotating means 11, Then you can take it out. In addition, the liquid supply nozzle 26 is close to the surface 10a of the substrate 10 by being opposed to the substrate 10 placed on the substrate rotating means 11 and lowered to a predetermined height position, and an operating position. Become. The liquid supply nozzles 26 are provided at a plurality of locations on the support arm 25 so that the sprayed cleaning liquid spreads smoothly and surely over the entire surface of the substrate 10, and a predetermined amount is supplied from each of the liquid supply nozzles 26. The processing liquid is jetted. Further, the liquid supply nozzle 26 is ejected from an oblique direction with respect to the substrate 10, thereby preventing the sprayed processing liquid from splashing back from the substrate 10.
[0016]
Since the application of the processing liquid is performed using the action of the centrifugal force generated by the rotation of the substrate 10, excess processing liquid is scattered from the edge portion on the outer periphery of the substrate 10. Therefore, in order to effectively collect the scattering treatment liquid, a housing 23 constituting a liquid treatment tank is provided. In the housing 23, an outer peripheral wall 23b and an inner peripheral wall 23c, each having an upper end bent inward, are continuously provided around the bottom wall 23a. As a result, a first liquid recovery chamber 40 is formed between the outer peripheral wall 23b and the inner peripheral wall 23c, and a second liquid recovery chamber 41 is formed inside the inner peripheral wall 23c. With this configuration, when two different types of processing liquids (including cleaning liquid) are applied by the liquid processing apparatus 7, they can be recovered by separate liquid recovery chambers 40 and 41, respectively. When applying a single processing liquid, it is not necessary to provide a second liquid recovery chamber.
[0017]
The upper end portions of the outer peripheral wall 23b and the inner peripheral wall 23c in the housing 23 are oriented in a substantially horizontal direction, and the diameters of the openings are not at least larger than the length of the diagonal line of the substrate 10, whereby the substrate 10 can be loaded and unloaded. It has become. Further, the bottom wall 23a surrounds the periphery of the holding cylinder 14, and a central portion thereof is a cylindrical portion 23d that rises in a cylindrical shape. Further, the bottom wall 23a is inclined toward the outer peripheral side, and the outer peripheral wall 23b and the inner peripheral wall 23c are walls that are vertically downward and inclined upward. Accordingly, the processing liquid splashed toward the first liquid recovery chamber 40 and the second liquid recovery chamber 41 flows down through these vertical walls and inclined walls. One or a plurality of suction pipes 42 and 43 are connected to the bottom surfaces of the first liquid recovery chamber 40 and the second liquid recovery chamber 41, respectively, and these suction pipes 42 and 43 are connected to negative pressure pumps 44 and 45, respectively. In addition, it is connected to the recovery tanks 46 and 47.
[0018]
Therefore, when applying one processing liquid to the substrate 10, the substrate 10 is positioned between the outer peripheral wall 23b and the inner peripheral wall 23c, and excess processing liquid scattered from the outer peripheral edge of the substrate 10 is first filtered. The liquid is taken into the liquid recovery chamber 40 and the processing liquid in the first liquid recovery chamber 40 is recovered in the recovery tank 46 by the negative pressure suction force of the negative pressure pump 44. In addition, when other processing liquids (including cleaning liquid) are supplied, other processing liquids scattered by the rotation of the substrate 10 can be collected in the second liquid recovery chamber 41 so as not to be mixed with the processing liquid described above. it can. For this purpose, the housing 23 is raised, the inner peripheral wall 23c is lifted to a position above the position of the substrate 10, and the negative pressure pump 45 is operated. As a result, the processing liquid scattered from the substrate 10 is taken into the second liquid recovery chamber 41 and can be recovered from the suction pipe 43 to the recovery tank 47.
[0019]
For the above reasons, the housing 23 can be raised and lowered. In order to raise and lower the housing 23, as shown in FIG. 5, brackets 48 are connected to both sides of the housing 23, and a lifting rod 49 is connected to both the brackets 48. The elevating rod 49 extends downward through the bearing member 50 attached to the base 13, and an elevating plate 51 is attached so as to span the lower ends of the two elevating rods 49. Further, the lift plate 51 is connected to a guide rod 54 connected between fixed plates 52 and 53 with both ends fixed via a slide member 55, and provided between the fixed plates 52 and 53. A nut 57 into which the feed screw 56 is inserted is connected. A drive motor 58 is connected to the feed screw 56. When the feed screw 56 is rotated by the drive motor 58, the elevating plate 51 moves up and down, and the housing is moved from the elevating plate 51 through the elevating rod 53. 23 is moved up and down to be driven up and down to a position where the first liquid recovery chamber 40 faces the extended line of the substrate 10 and a position where the second liquid recovery chamber 41 faces.
[0020]
In order to perform liquid processing on the substrate 10 using the substrate liquid processing apparatus 7 having the above configuration, the robot 10 carries the substrate 10 into the liquid processing unit 4 provided with the liquid processing apparatus 7. At this time, the housing 23 is held in a lowered state, the substrate 10 is held at a predetermined position on the arm 16 in the rotation driving means 11, and the robot 5 is retracted from the liquid processing unit 4. The support arm 25 in the liquid supply means 24 is turned so as to face the substrate 10. When the rotating shaft 12 is rotationally driven by operating the motor 20 in this state, the substrate 10 is rotated. When the rotation of the substrate 10 is in a steady state, the liquid supply nozzle 26 provided on the support arm 25 is used. The treatment liquid is ejected. The processing liquid supplied to the substrate 10 spreads over the entire surface by the action of centrifugal force due to the rotation of the substrate 10, and excess processing liquid scatters from the edge of the substrate 10. The scattered processing liquid flows down, for example, along the inner peripheral wall 23c of the housing 23 that constitutes the first liquid recovery chamber 40, and the first liquid recovery chamber 40 is generated by the negative pressure suction force of the negative pressure pump 44. The processing liquid inside is recovered in the recovery tank 46.
[0021]
Here, although the processing liquid supplied to the substrate 10 varies depending on the type, composition, and the like, the processing liquid is heated to a predetermined temperature. As a result, a processing liquid having a constant viscosity is jetted and spreads over the entire surface of the substrate 10 so as to have a uniform film thickness, so that accurate and efficient liquid processing is performed. If the temperature of the substrate 10 itself is low, even if a heated processing liquid is supplied, the temperature of the processing liquid immediately decreases when it comes into contact with the substrate 10. In addition, the temperature of the processing liquid supplied to the substrate 10 further decreases while spreading on the substrate 10.
[0022]
Therefore, the substrate heating step for heating the substrate 10 in the substrate heating unit 3 is provided in the previous stage of the liquid processing step performed by carrying the substrate 10 into the liquid processing unit 4. That is, the substrate heating unit 3 is provided with a plate heater 6, and the substrate 10 taken in from the substrate carry-in / carry-out unit 2 is not directly transferred to the liquid processing unit 4 but is carried into the substrate heating unit 3. Then, the entire back surface 10 b of the substrate 10 is brought into contact with the plate heater 6 to heat the substrate 10. Here, the heating by the plate heater 6 is for bringing the substrate 10 to the same temperature as the processing liquid. Therefore, by keeping the substrate 10 in contact with the plate heater 6 for a predetermined time, the substrate 10 is substantially substantiated. To the same temperature as the treatment liquid.
[0023]
After passing the above substrate heating process, when the heated substrate 10 is carried into the liquid processing unit 4 and mounted on the substrate rotating means 11 and rotated, when the heated processing liquid is supplied to the substrate 10, The temperature of the processing liquid can be prevented from decreasing and the temperature of the processing liquid does not decrease while spreading along the surface of the substrate 10. As a result, the treatment liquid is uniformly applied to the entire surface of the substrate 10 with a constant viscosity state, and the application efficiency, the application accuracy, and the like become extremely good. In particular, when the resist film stripping solution is supplied to the substrate 10, the processing solution becomes familiar with the unevenness due to pattern formation on the surface of the substrate 10, and the contact time of the processing solution with the substrate 10 is increased. Since it becomes constant, the resist film at a necessary portion is peeled off quickly and efficiently, and there is no possibility that a peeling failure or the like will occur. Accordingly, it is not necessary to supply more stripping solution than necessary to the substrate 10, so that the consumption of the processing solution can be minimized.
[0024]
By the way, when the processing liquid is supplied to the substrate 10, the substrate 10 is rotated by the substrate rotating means 11. When the substrate 10 is rotated at a high speed, an air flow is generated along the front and back surfaces of the substrate 10. become. Therefore, even if the substrate 10 is heated by the plate heater 6, the temperature of the substrate 10 is lowered by this air flow. In particular, the air flow due to the rotation of the substrate 10 hardly occurs at the rotation center position, and the air flow increases as it goes to the peripheral portion, and the flow velocity is fastest at the peripheral edge portion. That is, when the substrate 10 is rotated at a high speed, even if the substrate 10 is heated, a temperature gradient that continuously decreases from the center of rotation toward the peripheral portion is generated.
[0025]
  Considering the above points, in order to maintain the temperature state of the substrate 10 during the rotation of the substrate 10, warm water is sprayed toward the back surface 10 b side to heat the substrate 10.Like. Here, the hot water is obtained by heating pure water not containing impurities to a predetermined temperature. And hot water is on the back side of the substrate 10From a position at a predetermined intervalSupply.
[0026]
For this purpose, the rotary shaft 12 for rotating the substrate 10 is formed as a hollow rotary shaft, and the substrate heating means 60 is disposed therein. The substrate warming means 60 includes a warm water tank 61 provided with warming means such as a heater as a warm water supply source, a warm water pipe 62, and a nozzle tip 63 provided at the tip of the warm water pipe 62. In the middle of the hot water pipe 62, a temperature sensor 64, a pressure adjustment valve 65, and an on-off valve 66 are mounted from the front end side. The hot water pipe 62 is inserted into the hollow rotary shaft 12 and is supported on the rotary shaft 12 by a bearing 67 so as to be relatively rotatable. The nozzle tip 63 connected to the tip of the hot water pipe 62 is formed on the substrate 10. It is provided in a state of facing the rotation center position with a predetermined interval. Then, for example, the hot water tank 61 is pressurized so that the hot water in the hot water tank 61 is pumped into the hot water pipe 62 and ejected from the nozzle chip 63 toward the back surface of the substrate 10.
[0027]
As shown in FIG. 6, the outer shape of the nozzle tip 63 is such that a skirt portion 63b provided with a screw on the inner surface is connected to a main body portion 63a having a substantially conical shape or a truncated cone shape, and the skirt portion 63b. Is screwed into the tip of the hot water pipe 62. The height position of the nozzle tip 63 can be adjusted by adjusting the screwing length. A plurality of hot water injection ports 68 are opened on the conical surface of the main body 63 a of the nozzle tip 63. These hot water injection ports 68 are oriented in the vertical direction at the center thereof, but are inclined with respect to the axis of the hot water piping 62 toward the periphery, and the inclination angle of each hot water injection port 67 is set. By appropriately setting, the hot water is ejected from the nozzle tip 63 so as to spread over a predetermined angle range. Further, when hot water is injected from each hot water injection port 67, the higher the pressure is, the more the water diffuses. Therefore, the spread of hot water also changes depending on the hot water injection pressure. Thus, the angle of each hot water injection port 67 and the supply pressure of the hot water determine the injection angle of the hot water from the nozzle tip 63, and the distance between the nozzle tip 63 and the substrate 10 determines the hot water with respect to the back surface 10b of the substrate 10. The injection range can be set and adjusted.
[0028]
Thus, the nozzle tip 63 is screwed to the hot water pipe 62 and has a predetermined screwing length. Therefore, if the nozzle tip 63 is replaced, the nozzle tip 63 has a different angle. The nozzle tip having the hot water injection port can be replaced and used, and the distance between the nozzle tip 63 and the substrate 10 can be adjusted by adjusting the screwing length of the skirt portion 63b of the nozzle tip 63 to the hot water pipe 62. it can. Furthermore, since the pressure adjustment valve 65 is provided in the hot water pipe 62, the pressure of the hot water from the nozzle tip 63 can be adjusted by the pressure adjustment valve 65, thereby allowing the hot water injection range to the substrate 10 to be arbitrarily set. Can be set. Since it is necessary to heat the entire substrate 10 evenly, it is desirable that the hot water be sprayed over the entire surface of the substrate 10 as much as possible. However, the hot water supplied to the back side of the substrate 10 by rotation of the substrate 10 can be expected to spread to some extent by the action of centrifugal force. Therefore, in practice, it is sufficient that the hot water is directly sprayed on almost the entire surface of the substrate 10. However, the injection range of the hot water should not be wider than the entire surface of the substrate 10.
[0029]
As described above, during the rotation of the substrate 10, the substrate 10 is held in the temperature state heated by the plate heater 6 in the substrate heating unit 3 by spraying warm water on the back surface 10 b side. Thus, the substrate 10 can be prevented from being cooled by the flow of air, and thus the substrate 10 is surely brought to a temperature state substantially equal to the processing liquid temperature even when the processing time by applying the processing liquid is long. The substrate is held at an optimum application temperature condition for the substrate 10. Here, in the case where the substrate rotating means 11 is configured so that a plurality of sizes of substrates 10 can be mounted, the nozzle chip 63 may be replaced and used in accordance with the size of the substrate 10.
[0030]
Further, in order to prevent the substrate 10 from being partially cooled by the air flow generated by the rotation of the substrate 10, the temperature of the substrate 10 can be further prevented from lowering during the rotation by adjusting the rotation speed of the substrate 10. . Therefore, as the number of rotations of the substrate 10 by the substrate rotating means 11, the processing liquid supplied to the substrate 10 can be smoothly spread over the entire substrate 10, and partial cooling is performed by the air flow during the rotation. Select a speed that does not occur. Further, in order to suppress the generation of an air flow due to the rotation of the substrate 10, an injection nozzle 59 is provided in the vicinity of the rotating shaft 12, as shown in FIG. Etc. can be ejected.
[0031]
In this way, by providing the substrate heating means 60, the entire substrate 10 is reliably maintained in a state substantially equal to the temperature of the processing liquid even when the processing time is long in the liquid processing step. At the same time, the hot water reaches almost the entire back surface 10b of the substrate 10, and therefore the back surface 10b is maintained in a state in which a film of hot water is formed, thereby preventing the treatment liquid from entering the back surface side. Can do.
[0032]
【The invention's effect】
  As described above, according to the present invention, in the wet process performed by supplying the processing liquid to the substrate while rotating the substrate, the substrate is set to a temperature substantially equal to the temperature of the processing liquid prior to the liquid processing step. Heating to beAnd supplying hot water in a state of diffusing to the back side of the substrate during the liquid treatment processThus, the temperature of the processing liquid supplied to the substrate can be accurately controlled, and the liquid processing of the substrate can be performed efficiently and reliably with a small amount of processing liquid.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of an apparatus for carrying out a substrate liquid processing method according to an embodiment of the present invention.
FIG. 2 is a schematic configuration diagram of a liquid processing apparatus.
FIG. 3 is a plan view of FIG. 2;
FIG. 4 is a cross-sectional view of a processing liquid supply unit.
FIG. 5 is an external view of FIG. 2;
FIG. 6 is a cross-sectional view showing the configuration of the substrate heating means.
[Explanation of symbols]
1 Liquid processing chamber 2 Substrate loading / unloading section
3 Substrate heating unit 4 Liquid processing unit
5 Robot 6 Plate heater
7 Liquid processing equipment 10 Substrate
11 Substrate rotating means 24 Processing liquid supply means
27 Liquid supply nozzle 60 Substrate heating means
61 Hot water tank 68 Hot water jet

Claims (4)

A substrate is supported by a rotation driving means comprising a plurality of support rods erected on a plurality of arms connected to a rotation shaft, and a predetermined processing liquid is added to the substrate while the rotation shaft is driven to rotate. In the liquid processing method for a substrate, which is supplied in a heated state and spreads the processing liquid on the entire surface of the substrate by the action of centrifugal force .
By abutting the heater on the back side of the substrate, and the substrate heating step of heating the substrate to a temperature treatment liquid,
A liquid processing step of placing the heated substrate on the support rod of the rotation driving means, rotating the substrate by driving the rotating shaft, and supplying a heated processing liquid to the surface of the substrate during this period ; Consists of
During the liquid treatment step, the substrate is heated by spraying hot water from the substrate heating means arranged at the center of the rotating shaft to the back surface of the substrate so as to diffuse in an angle range not wider than the entire surface of the substrate. liquid processing method of a substrate according to claim <br/> warming the. 2. The substrate liquid processing method according to claim 1, wherein in the liquid processing step, heated air is sprayed in the vicinity of a rotating shaft for rotating the substrate. A substrate heating unit that heats the substrate to the temperature of the processing liquid in contact with the back surface of the substrate on which the liquid processing is performed with the heated processing liquid,
In order to support and rotate the substrate heated by the substrate heating unit, a plurality of arms are connected to the rotation shaft, and a plurality of support rods for supporting the back surface of the substrate are provided on each arm. Rotational drive means;
A treatment liquid supply means for supplying a treatment liquid heated to a predetermined temperature to the surface of the substrate placed on the support rod and spreading the treatment liquid over the entire surface of the substrate by the action of centrifugal force;
A substrate heating means disposed at a central position of the rotating shaft and spraying so as to diffuse hot water toward a back surface of the substrate;
A liquid processing apparatus for a substrate, comprising: The substrate heating means has a nozzle tip attached to the tip of a hot water pipe, and this nozzle tip has a conical shape, and is provided at the center position with a vertical hot water injection port and a conical surface. The substrate liquid processing apparatus according to claim 3, comprising a plurality of hot water injection ports.

Images