JP2000176386A5 - Substrate cleaning equipment and method - Google Patents
Substrate cleaning equipment and method Download PDFInfo
- Publication number
- JP2000176386A5 JP2000176386A5 JP1998358224A JP35822498A JP2000176386A5 JP 2000176386 A5 JP2000176386 A5 JP 2000176386A5 JP 1998358224 A JP1998358224 A JP 1998358224A JP 35822498 A JP35822498 A JP 35822498A JP 2000176386 A5 JP2000176386 A5 JP 2000176386A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cleaning
- rotating
- cleaning mechanism
- chuck
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims description 76
- 238000004140 cleaning Methods 0.000 title claims description 60
- 238000005498 polishing Methods 0.000 claims description 4
- 238000005201 scrubbing Methods 0.000 claims description 3
- 230000002093 peripheral Effects 0.000 claims description 2
- 239000000969 carrier Substances 0.000 claims 1
- 230000003749 cleanliness Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Description
【０００１】
【発明の属する技術分野】
本発明は、基板洗浄装置及び方法に係り、特に、半導体ウエハ、ガラス基板、液晶パネル等の高度の清浄度が要求される基板を洗浄するのに好適な基板洗浄装置及び方法に関する。
[0001]
[Technical field to which the invention belongs]
The present invention relates to a substrate cleaning apparatus and method , and more particularly to a substrate cleaning apparatus and method suitable for cleaning a substrate such as a semiconductor wafer, a glass substrate, and a liquid crystal panel, which requires a high degree of cleanliness.
本発明は、かかる実情に鑑みて、複数の洗浄工程を１台の装置構成で行なうことによって、装置の規模を縮小して設備コストを低減し、かつ処理時間を短縮することによりスループットを向上させるとともに、清浄度の高い基板を提供することができるような基板洗浄装置及び方法を提供することを目的とする。 In view of such circumstances, the present invention improves throughput by reducing the scale of the device, reducing the equipment cost, and shortening the processing time by performing a plurality of cleaning steps with one device configuration. At the same time, it is an object of the present invention to provide a substrate cleaning device and a method capable of providing a substrate having a high degree of cleanliness.
【００１４】
【課題を解決するための手段】
請求項１に記載の発明は、基板を保持し回転させて洗浄する第１洗浄機構と、前記基板を前記第１洗浄機構による回転よりも高速で回転させることが可能な運動機構を備えた第２洗浄機構と、前記第１洗浄機構と第２洗浄機構を選択的に切り換える切換手段とを有することを特徴とする基板洗浄装置である。
0014.
[Means for solving problems]
The invention according to claim 1, comprising a first cleaning mechanism for cleaning by rotating and holding the board, the movement mechanism capable of rotating the substrate at a speed higher than the rotation by the first cleaning mechanism The substrate cleaning device is characterized by having a second cleaning mechanism and a switching means for selectively switching between the first cleaning mechanism and the second cleaning mechanism.
請求項２に記載の発明は、前記第１洗浄機構は、基板の周囲に配置され、該基板の周縁部に当接して該基板を保持し回転を与える複数のローラを有することを特徴とする請求項１記載の基板洗浄装置である。
請求項３に記載の発明は、前記第２洗浄機構は前記基板と同軸の回転軸を有する回転把持体を備えていることを特徴とする請求項１又は２に記載の基板洗浄装置である。なお、この他に、ベルヌーイチャック機構、非接触回転機構等を用いることもできる。
The invention according to claim 2 is characterized in that the first cleaning mechanism is arranged around a substrate and has a plurality of rollers that abut on the peripheral edge of the substrate to hold the substrate and give rotation. The substrate cleaning device according to claim 1.
The invention according to claim 3 is the substrate cleaning apparatus according to claim 1 or 2 , wherein the second cleaning mechanism includes a rotating grip body having a rotating shaft coaxial with the substrate. In addition to this, a Bernoulli chuck mechanism, a non-contact rotation mechanism, or the like can also be used.
請求項４に記載の発明は、前記第１洗浄機構は、基板の表裏面に接離可能に設けられた一対のスクラブ洗浄部材を備えていることを特徴とする請求項１又は２に記載の基板洗浄装置である。それぞれが自転可能な複数のローラで基板を保持し回転させているので、基板の表裏面ともに開放されており、この空間をローラを出し入れさせてスクラブ洗浄することができる。 Invention according to claim 4, wherein the first cleaning mechanism according to claim 1 or 2, characterized in that it comprises a pair of scrubbing member provided separably on the front and back surfaces of the substrate It is a board cleaning device. Since the substrate is held and rotated by a plurality of rollers, each of which can rotate, both the front and back surfaces of the substrate are open, and the rollers can be moved in and out of this space for scrub cleaning.
請求項５に記載の発明は、前記切換手段は、前記第１洗浄機構又は第２洗浄機構の一方の構成部材を退避位置に置くことにより他方を使用位置に置くものであることを特徴とする請求項１又は２に記載の基板洗浄装置である。第１洗浄機構の複数のローラは基板に対して開閉可能とし、不要のときは外側に退避させ、第２洗浄機構の回転把持体は昇降可能とし、不要のときは下方に退避させる。 The invention according to claim 5 is characterized in that the switching means places one of the constituent members of the first cleaning mechanism or the second cleaning mechanism in the retracted position and the other in the used position. The substrate cleaning apparatus according to claim 1 or 2. The plurality of rollers of the first cleaning mechanism can be opened and closed with respect to the substrate and retracted to the outside when not needed, and the rotary grip body of the second cleaning mechanism can be raised and lowered, and retracted downward when not needed.
請求項６に記載の発明は、基板収容部と、基板研磨部と、請求項１乃至５のいずれかに記載の基板洗浄装置と、これらの装置機器間で基板を搬送する基板搬送機とを有することを特徴とする基板の研磨装置である。
請求項７に記載の発明は、基板をローラで保持し回転させながら洗浄部材を基板に接触させて基板のスクラブ洗浄を行なう第１洗浄機構と、基板をローラからチャックに持ち替えて基板の仕上げ洗浄を行なうとともに、基板をチャックで保持したまま高速で回転させて基板の脱水・乾燥を行なう第２洗浄機構とを有することを特徴とする基板洗浄装置である。
請求項８に記載の発明は、基板をローラで保持し回転させながら洗浄部材を基板に接触させて基板のスクラブ洗浄を行ない、基板をローラからチャックに持ち替えて基板の仕上げ洗浄を行ない、基板をチャックで保持したまま高速で回転させて基板の脱水・乾燥を行なうことを特徴とする基板洗浄方法である。
The invention according to claim 6 comprises a substrate accommodating portion, a substrate polishing portion, a substrate cleaning apparatus according to any one of claims 1 to 5, and a substrate transporter for transporting a substrate between these apparatus and devices. It is a substrate polishing apparatus characterized by having.
The invention according to claim 7 is a first cleaning mechanism for scrubbing the substrate by bringing a cleaning member into contact with the substrate while holding the substrate with a roller and rotating the substrate, and finishing cleaning of the substrate by changing the substrate from a roller to a chuck. The substrate cleaning apparatus is characterized by having a second cleaning mechanism for dehydrating and drying the substrate by rotating the substrate at a high speed while holding the substrate with a chuck.
According to the eighth aspect of the present invention, the substrate is held by a roller and rotated while the cleaning member is brought into contact with the substrate to scrub the substrate, and the substrate is changed from a roller to a chuck to perform finish cleaning of the substrate. This is a substrate cleaning method characterized in that the substrate is dehydrated and dried while being held by a chuck and rotated at a high speed.
Claims (8)
前記基板を前記第１洗浄機構による回転よりも高速で回転させることが可能な運動機構を備えた第２洗浄機構と、
前記第１洗浄機構と第２洗浄機構を選択的に切り換える切換手段とを有することを特徴とする基板洗浄装置。The first cleaning mechanism for cleaning by holding the board rotation,
A second cleaning mechanism having a motion mechanism capable of rotating the substrate at a speed higher than the rotation by the first cleaning mechanism,
A substrate cleaning apparatus comprising switching means for selectively switching between the first cleaning mechanism and the second cleaning mechanism.
基板をローラからチャックに持ち替えて基板の仕上げ洗浄を行なうとともに、基板をチャックで保持したまま高速で回転させて基板の脱水・乾燥を行なう第２洗浄機構とを有することを特徴とする基板洗浄装置。A substrate cleaning apparatus comprising: a second cleaning mechanism for performing substrate final cleaning by changing a substrate from a roller to a chuck, and rotating and rotating the substrate at a high speed while the substrate is held by the chuck. .
基板をローラからチャックに持ち替えて基板の仕上げ洗浄を行ない、Change the substrate from the roller to the chuck to perform final cleaning of the substrate,
基板をチャックで保持したまま高速で回転させて基板の脱水・乾燥を行なうことを特徴とする基板洗浄方法。A substrate cleaning method, wherein a substrate is dehydrated and dried by rotating the substrate at a high speed while being held by a chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10358224A JP2000176386A (en) | 1998-12-16 | 1998-12-16 | Substrate cleaning apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10358224A JP2000176386A (en) | 1998-12-16 | 1998-12-16 | Substrate cleaning apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000176386A JP2000176386A (en) | 2000-06-27 |
| JP2000176386A5 true JP2000176386A5 (en) | 2005-07-21 |
Family
ID=18458189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10358224A Pending JP2000176386A (en) | 1998-12-16 | 1998-12-16 | Substrate cleaning apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000176386A (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002011420A (en) * | 2000-06-28 | 2002-01-15 | Sumitomo Precision Prod Co Ltd | Device for treating substrate |
| KR100402901B1 (en) * | 2001-06-07 | 2003-10-22 | 주식회사 디엠에스 | Multi functional cleaning module of manufacturing apparatus for liquid crystal display device and Cleaning apparatus using the same |
| JP4755348B2 (en) * | 2001-02-06 | 2011-08-24 | 株式会社岡本工作機械製作所 | Substrate spin cleaning / drying apparatus and cleaning / drying method |
| JP2004273961A (en) * | 2003-03-12 | 2004-09-30 | Ebara Corp | Cleaning device of metal wiring forming substrate |
| JP2008198667A (en) * | 2007-02-08 | 2008-08-28 | Nec Electronics Corp | Semiconductor manufacturing apparatus and method of manufacturing the same |
| JP4660494B2 (en) * | 2007-02-15 | 2011-03-30 | 株式会社荏原製作所 | Polishing cartridge |
| KR101830238B1 (en) * | 2011-08-17 | 2018-03-29 | 세메스 주식회사 | Apparatus for treating substrate |
| KR101801162B1 (en) * | 2011-11-22 | 2017-11-27 | 세메스 주식회사 | A substrate cleaning apparatus |
| JP6113960B2 (en) | 2012-02-21 | 2017-04-12 | 株式会社荏原製作所 | Substrate processing apparatus and substrate processing method |
| TWI636518B (en) | 2013-04-23 | 2018-09-21 | 荏原製作所股份有限公司 | Substrate processing apparatus and a processed substrate manufacturing method |
| JP6125884B2 (en) * | 2013-04-23 | 2017-05-10 | 株式会社荏原製作所 | Substrate processing apparatus and manufacturing method of processing substrate |
| KR102063464B1 (en) * | 2013-11-28 | 2020-01-08 | 주식회사 케이씨텍 | Substrate cleaning apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60143634A (en) * | 1983-12-29 | 1985-07-29 | Fujitsu Ltd | Wafer treatment and device thereof |
| JPH10303170A (en) * | 1997-04-30 | 1998-11-13 | Dainippon Screen Mfg Co Ltd | Device and method for cleaning substrate |
| JPH1126408A (en) * | 1997-07-08 | 1999-01-29 | Matsushita Electric Ind Co Ltd | Method and apparatus for cleaning substrate |
-
1998
- 1998-12-16 JP JP10358224A patent/JP2000176386A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7061439B2 (en) | Board reversing device, board processing device and board support device | |
| JP2000176386A5 (en) | Substrate cleaning equipment and method | |
| US6547638B2 (en) | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device | |
| US6309279B1 (en) | Arrangements for wafer polishing | |
| US20010044979A1 (en) | Apparatus for processing a wafer | |
| EP0517033A1 (en) | Cleaning device for wafer mount plate | |
| JP6073192B2 (en) | Substrate cleaning apparatus, substrate cleaning system, and substrate cleaning method | |
| TWI601196B (en) | Substrate processing method | |
| WO2020078190A1 (en) | Cmp wafer cleaning apparatus, and wafer transfer manipulator and wafer overturn method for same | |
| JPS60143634A (en) | Wafer treatment and device thereof | |
| US20150298283A1 (en) | Substrate treatment device | |
| CN109560031B (en) | Substrate reversing device, substrate processing device, and substrate clamping device | |
| JP3892635B2 (en) | Cleaning device | |
| JP2000176386A (en) | Substrate cleaning apparatus | |
| JP2007044693A (en) | Washing device | |
| JPH07130692A (en) | Surface grinder | |
| JP7165104B2 (en) | Attachment/detachment jig for cleaning member | |
| KR102483735B1 (en) | Semiconductor wafer cleaning equipment using multi-function transfer robot | |
| JPH10177999A (en) | Substrate-transporting hand and polishing device | |
| JPH0393040A (en) | Cleaning and drying device for hard disk substrate | |
| JP2909432B2 (en) | Spin cleaning unit | |
| JPH11163089A (en) | Wafer attitude converter | |
| JPH1064860A (en) | Substrate processing device | |
| KR20070120373A (en) | Wafer buffer station apparatus for manufacturing semiconductors having the same | |
| KR20070095702A (en) | Substrate transpoting apparatus and chemical mechanical polishing apparatus with it |