JP2000165019A - Image forming method, apparatus therefor, electric circuit board and apparatus therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a fine picture on a medium by comprising steps of losing the viscosity and adhering picture forming elements to viscid part. SOLUTION: A medium 11 is coated with a viscid agent, an ultraviolet setting type adhesive is drained on its surface 11, an ultraviolet ray is irradiated to harden the ultraviolet setting adhesive, thereby forming nonviscid part 12, a first conductive powder 14 is sown over viscid part 33 and adhered to form an electric pattern, extra parts of the first conductor 14 not adhered to the viscid part are removed, an insulation layer is formed on the electronic circuit pattern formed by the powder 14, an ultraviolet setting type adhesive 35 is drained on the insulation layer, a second conductive powder 37 is adhered to the drained ultraviolet setting type adhesive 35 and a second layer electronic circuit pattern is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image forming method using a liquid discharge system, an apparatus therefor, a method for manufacturing an electric circuit board, and an apparatus therefor. The present invention relates to an apparatus and a method for forming an electric circuit pattern by using a conductor, and an apparatus therefor.

[0002]

2. Description of the Related Art There are various ink jet recording methods. For example, in the case of a continuous type in which ink droplets are continuously ejected and formed into particles, a charge control type, a divergence control type, and the like. Pressure control method for ejecting ink droplets from the orifice by mechanical vibration of the pressure, a heat control method using a heating resistor element, and the like.

[0003] These ink jet recording methods are extremely excellent as recording methods which generate little noise and can perform high-speed printing and multicolor printing.

[0004] However, this ink jet recording method also has a problem that the discharge port of the nozzle is clogged.
In order to prevent clogging, the material of the coloring material had to be limited. Further, a metal powder or the like cannot be used as a coloring material, and it has been impossible to form an image using the metal powder.

Several methods have been proposed as a method for solving the above-mentioned problem, that is, a method capable of selecting a free material as a coloring material without causing nozzle clogging.

One of the methods is disclosed in Japanese Patent Application Laid-Open No. 9-216.
As in the invention disclosed in Japanese Patent No. 351, there is a method in which an adhesive liquid is discharged onto a medium by an inkjet method, and a powder coloring material is attached to the adhesive solution that has landed on the medium.

Another method is disclosed in Japanese Patent Laid-Open No. 9-216.
As in the invention disclosed in Japanese Patent No. 453, a colorless resin-soluble liquid is discharged onto a medium by an inkjet method to form a pattern portion on the medium, and a resin soluble in the liquid is mainly used. There is a method of attaching toner as a component.

[0008] Alternatively, as another method, Japanese Patent Application Laid-Open No. 7-4
As in the invention disclosed in Japanese Patent No. 7756, a resin exhibiting tackiness by a solvent is applied on a medium to obtain a recording paper, and the solvent is ejected on the recording paper by an ink jet method, and the adhesive on the recording paper is obtained. After forming the part having the property,
There is a method of adhering powder to an adhesive portion.

[0009]

However, in the method disclosed in Japanese Patent Laid-Open No. 9-216351, a liquid having an adhesive property is ejected by an ink jet method. It can cause clogging.

In the method disclosed in Japanese Patent Application Laid-Open No. Hei 9-216453, a toner mainly composed of a resin which can be dissolved in a colorless resin-soluble liquid must be used as a coloring material. However, the material of the coloring material is limited. For this reason, further improvement is desired from the viewpoint of providing a method capable of selecting a free material as a coloring material.

In the method disclosed in Japanese Patent Application Laid-Open No. 7-47756, a resin is coated on a medium to form a recording sheet, and the recording is performed on the recording sheet. It takes time and money. Further, since the surface of the recording paper is made of a resin, the material of the coloring material must be selected in consideration of the properties of the resin. Furthermore, since the medium is a resin, the properties of the medium cannot be used.

Therefore, in order to solve the above-mentioned problems, the present invention can select a free material for the coloring material without causing clogging of the nozzle, and can provide a fine image on the medium. An object of the present invention is to provide an image forming method and an image forming apparatus capable of forming an image. It is another object of the present invention to provide a method and an apparatus for forming an electric circuit pattern using a conductor as a coloring material.

[0013]

In order to achieve the above object, the present invention provides a method for forming a non-tacky portion and a tacky portion for forming an image on a medium having a tacky surface.
After applying the photo-curable adhesive to the place where the non-tacky portion is to be formed on the medium, the photo-curable adhesive is applied on the medium by irradiating the photo-curable adhesive with light and curing. A first step of losing the tackiness of the spot, and a second step of attaching an element for forming an image to the tacky portion of the medium on which the photocurable adhesive has not been applied, And thereby forming an image on the medium.

Further, the present invention provides a method for forming a non-adhesive portion on a medium having an adhesive surface to form a non-adhesive portion and an adhesive portion for forming an image on the medium having an adhesive surface. Applying means for applying a light-curable adhesive to a desired position, and irradiating the light-curable adhesive with light to cure the light-curable adhesive, thereby losing the tackiness of the medium on the medium where the light-curable adhesive is applied. Means for causing an image to be formed on the medium, and means for adhering an element for forming an image to an adhesive portion of the medium on which the photocurable adhesive is not applied, and forming an image on the medium. It is characterized by the following.

Further, the present invention provides a method for forming a non-adhesive portion on a medium having an adhesive surface and an adhesive portion for forming an electric circuit pattern by forming the non-adhesive portion on the medium. After applying the photocurable adhesive to the portion to be formed, the photocurable adhesive is irradiated with light and cured to lose the tackiness of the medium on the medium where the photocurable adhesive is applied. A first step, a second step of attaching a conductor to an adhesive portion of the medium on which the photocurable adhesive is not applied, and a step of forming an insulating layer on a portion where the conductor is attached. A third step of applying a light-curable adhesive, and irradiating light to a portion to which the light-curable adhesive has been applied, thereby curing the applied light-curable adhesive, thereby forming an electric device comprising the conductor. And forming a circuit pattern on the medium. In this case, an electric circuit pattern is formed.

Further, the present invention provides a method for forming a non-adhesive portion on a medium having an adhesive surface and an adhesive portion for forming an electric circuit pattern by forming the non-adhesive portion on the medium. After applying the photocurable adhesive to the portion to be formed, the photocurable adhesive is irradiated with light and cured to lose the tackiness of the medium on the medium where the photocurable adhesive is applied. A first step, a second step of attaching a conductor to an adhesive portion of the medium on which the photocurable adhesive is not applied, and a step of forming an insulating layer on a portion where the conductor is attached. A third step of applying a light-curable adhesive, and irradiating light to a portion to which the light-curable adhesive has been applied, thereby curing the applied light-curable adhesive, thereby forming an electric device comprising the conductor. A fourth step of forming a circuit pattern and forming by the fourth step A fifth step of applying a photo-curable adhesive to a portion where a second electric circuit pattern is to be formed on the insulating layer thus formed; A sixth step of attaching a conductor, a seventh step of applying a photocurable adhesive for forming an insulating layer to a portion where the second conductor is attached, and applying the photocurable adhesive. Forming a multilayer electric circuit pattern on the medium by performing the fifth step, the sixth step, the seventh step, and the eighth step at least once in this order. It is characterized by doing.

Further, the present invention provides a method for forming a non-adhesive portion on a medium having an adhesive surface and an adhesive portion for forming an electric circuit pattern by forming the non-adhesive portion on the medium. Application means for applying a photocurable adhesive to a portion to be formed, and adhesion of the photocurable adhesive on the medium by irradiating the photocurable adhesive with light to cure the photocurable adhesive. Means to lose the, the adhesive portion of the medium to which the photocurable adhesive has not been applied, an attaching means for attaching a conductor, and a place where the conductor is attached,
An applying means for applying a photocurable adhesive for forming an insulating layer, and curing the applied photocurable adhesive by irradiating light to a portion to which the photocurable adhesive is applied. Means for forming an electric circuit pattern made of a conductor, wherein the electric circuit pattern is formed on the medium.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail.

Embodiment 1 FIG. 1 is a schematic view showing an example of an electric circuit board manufacturing apparatus to which the present invention is applied. FIG.
In the drawings, 1 is an on-demand type liquid ejection type ejection head for ejecting an ultraviolet curing adhesive, 2 is an ultraviolet curing adhesive tank for supplying the ultraviolet curing adhesive to the ejection head 1, and 3 is a conductor. A conductive diffusion chamber for diffusing and discharging a conductive substance from a lower hole;
A conductive tank for supplying a conductive material to the air, a blow pipe for creating an air flow for diffusing the conductive material in the conductive diffusion chamber 3,
6 is a pneumatic suction device for removing excess powder on the non-adhesive part, 7 is an ultraviolet irradiation unit, 8 is a collection duct for collecting the conductor sucked by the pneumatic suction device 6, and 9 is a collection duct for the conductor. A conductor transfer pump for refluxing from 8 to the conductor tank 4,
Reference numeral 10 denotes a conductor forming an electric circuit, 11 denotes a medium having an adhesive surface, 12 denotes a non-adhesive portion obtained by curing an ultraviolet curable adhesive, and 13 denotes a non-adhesive portion. Surplus powder, 14 is a conductor scattered on the adhesive portion on the medium 11, 15 is a liquid ejection type ejection head for ejecting an ultraviolet curable adhesive, and 16 is an ultraviolet curable adhesive for the ejection head 15. An ultraviolet-curable adhesive tank to be supplied, 17 is an insulating layer formed by curing the ultraviolet-curable adhesive by irradiation of ultraviolet light, 20 is a transport belt that transports the medium 11, 21 is a driven roller, and 22 is a drive roller. It is a roller. The apparatus shown in FIG. 1 performs the process shown in FIG.

FIG. 2 shows an electric circuit board manufacturing method for manufacturing an electric circuit board to which the present invention is applied. FIG. 2A is a diagram of a medium having an adhesive surface, 31 is an adhesive surface, and 11 is a medium. FIG. 2 (b) shows a step of forming a non-adhesive part. Reference numeral 12 denotes a state in which the ultraviolet-curable adhesive is applied and then irradiated with ultraviolet light to cure the ultraviolet-curable adhesive to become non-adhesive. 33 is a remaining adhesive portion. FIG. 2C shows a step of attaching a conductor to the adhesive portion on the medium, and reference numeral 14 denotes a first conductive powder. FIG. 2D is a view in which the excess conductive powder that has not adhered to the adhesive portion in FIG. 2C has been removed. FIG.
(e) is a diagram in which an insulating layer is formed on an electric circuit pattern portion formed of a conductive powder, and 17 is an insulating layer. FIG. 2 (f) shows a step of applying an ultraviolet-curable adhesive on the formed insulating layer. Reference numeral 35 denotes the applied ultraviolet-curable adhesive. FIG. 2 (g) shows a step of attaching a conductive powder on the ultraviolet curing adhesive 35 given in FIG. 2 (f), and 37 is a second conductive powder. FIG.
(h) shows the second conductive powder adhered to the ultraviolet-curable adhesive 35 after removing the excess second conductive powder not adhered to the ultraviolet-curable adhesive 35 in FIG. In this step, an insulating layer is formed by applying an ultraviolet-curable adhesive to the substrate 37 and irradiating it with ultraviolet light to cure the adhesive.

Hereinafter, a method for manufacturing an electric circuit board will be described in detail with reference to FIG.

First, as a first stage, as shown in FIG. 2A, a step of applying an adhesive on a medium is performed.

In the second step, an ultraviolet curable adhesive is discharged from the liquid discharge type discharge head onto the surface to which the adhesive has been applied. Thereafter, ultraviolet light is irradiated to cure the ultraviolet curable adhesive, thereby forming the non-adhesive portion 12 as shown in FIG. 2B.

As the liquid discharge method that can be used in the present invention, conventionally known various methods and apparatuses can be applied. For example, in the case of a continuous type in which droplets are continuously ejected to form particles, the present invention can be applied to a charge control type, a divergence control type, and the like. In addition, the on-demand type can be applied to a pressure control method in which liquid droplets are ejected from an orifice by mechanical vibration of a piezoelectric vibrating element, a heat control method using a heating resistor element, and the like. It is not limited.

The formulation of the ultraviolet-curable adhesive usable in the present invention is shown below. For example, as a monomer, DA
A liquid containing 10% of -314 (manufactured by Nagase Kasei Kogyo Co., Ltd.), 2% of IC-2959 (manufactured by Ciba Specialty Chemicals), 30% of isopropyl alcohol, and 58% of water can be used. However, usable monomers are not limited to those described above. For example, 1,4-butanediol diacrylate, 1,6-hexanediol acrylate, diethylene glycol diacrylate, neopentyl glycol diacrylate, polyethylene glycol 400 diacrylate, Tripropylene glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, ethylene glycol diacrylate, triethylene glycol diacrylate, polypropylene glycol diacrylate, and the like. . Examples of additives include benzoin alkyl ether, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, chlorinated acetophenone derivatives, 2-hydroxy-2-methylpropiophenone, and 2-isopropyl-2. -Hydroxypropiophenone, α-acyloxime ester, benzophenone, benzyl, methyl-orthobenzoyl-benzoate, thioxanthone derivatives, 4,4′-bisdiethylaminobenzophenone, and the like. The ultraviolet-curable adhesive is used by dissolving or dispersing it in water or an organic solvent to adjust to a solution having a viscosity in the range of 1 to 10 CPS so that the adhesive can be ejected from the ejection head of the liquid ejection device. Can be

As a third stage, as shown in FIG.
A step of forming a conductive layer (electric circuit pattern) is performed. An electric circuit pattern is formed by sowing and attaching the first conductive powder 14 to the adhesive portion 33. Further, a fixing method and a fixing device used in a copying machine or a printer conventionally used to enhance the fixing property can be used.

As a fourth stage, as shown in FIG.
In FIG. 2C, excess first conductive powder 14 not adhering to the adhesive portion is removed using a pneumatic suction device.

As a fifth stage, as shown in FIG.
An insulating layer is formed on the electric circuit pattern formed by the first conductive powder. As a method of forming an insulating layer, on the electric circuit pattern portion, an ultraviolet curable adhesive is discharged from a discharge head of a liquid discharge system, and then the ultraviolet curable adhesive is irradiated with ultraviolet rays and cured. it can. Thus, the manufacture of the one-layer electric circuit board is completed.

As a sixth step, as shown in FIG.
The step of discharging the ultraviolet curable adhesive 35 onto the insulating layer formed up to the fifth stage is performed. The location where the ultraviolet curable adhesive is discharged is a location that will be the second-layer electrical circuit pattern portion.

As a seventh step, as shown in FIG.
The step of attaching the second conductive powder 37 to the ultraviolet curable adhesive 35 discharged in FIG. 2F is performed. Here, the second conductive powder to be attached may be the same as or different from the first conductive powder to be attached in the third step.

Finally, as an eighth step, as shown in FIG. 2H, a step of completing a second-layer electric circuit pattern is performed. First, in FIG. 2G, excess second conductive powder 37 not adhered to the ultraviolet curable adhesive 35 is removed by a pneumatic suction device. Next, in FIG. 2G, the ultraviolet-curable adhesive is discharged onto the second conductive powder 37 attached to the ultraviolet-curable adhesive 35. Thereafter, the insulating layer is formed by irradiating the ultraviolet curable adhesive with ultraviolet light to cure the adhesive.
As described above, by forming the second-layer electric circuit pattern on the first-layer electric circuit board, a multilayer electric circuit board is manufactured.

In the above method, a two-layer electric circuit board is manufactured. By repeating the sixth to eighth steps,
A multilayer electric circuit board can be manufactured.

The conductor forming the electric circuit pattern in this embodiment is not limited at all.
Platinum, silver, palladium and the like can be used. Also tin,
Low melting point metals such as lead, gallium, mercury and solder can also be used. When using these low-melting metals, it is desirable to dissolve and combine them to enhance conductivity. Further, two or more types of conductors may be used at the same time, such as using copper and a low melting point metal at the same time. The conductors described above can be used, but are not limited to these.

The medium that can be used in the present invention is not particularly limited, and examples thereof include paper, plastic films, insulated metal plates, and wood.

Conventionally, an electric circuit board has been prepared through a plurality of processes such as photolithography, etching, and screen printing. As described above, in the present embodiment, the electric circuit board is easily formed using a liquid discharge method. It has become possible to create circuit boards. This makes it possible to produce an electric circuit board in a short time and at low cost. Further, since the ejected liquid does not include a substance that causes clogging of the nozzle, clogging of the nozzle does not occur.

Example 1 A solution obtained by mixing 9 parts by weight of an acrylic adhesive Olivine BPS3233D (manufactured by Toyo Ink Co., Ltd.), 20 parts by weight of ethyl acetate and 20 parts by weight of n-hexane was coated on a high-quality paper with a bar coder. By coating, a recording paper with an adhesive was obtained.

After the recording paper was obtained, a liquid containing 10 parts by weight of an acrylic water-soluble monomer, 1.5 parts by weight of ammonium persulfate, 30 parts by weight of isopropyl alcohol, and 58.5 parts by weight of pure water was used as an ink-jet type Canon Electronics ( Using a Kraft Printer CP-620 (trade name) manufactured by Co., Ltd., the paper was discharged onto recording paper and irradiated with ultraviolet light (500 W high-pressure mercury lamp, wavelength 365 nm, 15 mW / cm ² ) for 30 seconds in a nitrogen atmosphere. Thereby, the liquid is cured, and the portion where the liquid is discharged becomes a non-adhesive portion.

Thereafter, by immediately sowing the gold powder, the gold powder adheres to the adhesive portion of the medium. Excess gold powder not attached to the sticky part was sucked by a pneumatic suction machine. Thus, a linear electric circuit pattern having a length of 3 cm and a width of 3 mm was formed on the medium.

Thereafter, leaving only both ends of the line of the electric circuit pattern, 10 parts by weight of an acrylic water-soluble monomer, 1.5 parts by weight of ammonium persulfate, and 3 parts by weight of isopropyl alcohol
0 parts by weight and 58.5 parts by weight of pure water are used as ink jet system Canon Electronics Co., Ltd. Kraft Printer CP
-620 (trade name), discharged on an electric circuit pattern, and irradiated with ultraviolet light (500 W high-pressure mercury lamp,
A wavelength of 365 nm, 15 mW / cm ² ) for 30 seconds,
An insulating layer was created. When continuity was measured, continuity was obtained at both ends of the pattern.

Example 2 A linear electric circuit pattern having a length of 3 cm and a width of 3 mm orthogonal to the electric circuit pattern of Example 1 was formed on the electric circuit pattern prepared in Example 1 by the following method. .

A liquid made up of 10 parts by weight of an acrylic water-soluble monomer, 1.5 parts by weight of ammonium persulfate, 30 parts by weight of isopropyl alcohol, and 58.5 parts by weight of pure water was used in an inkjet system.
Using P-620 (trade name), a pattern surface was formed by discharging onto the insulating layer covering the electric circuit pattern of Example 1.

Thereafter, gold powder was immediately adhered to the pattern surface and irradiated with ultraviolet light (500 W high-pressure mercury lamp, wavelength 365 nm, 15 mW / cm ² ) for 30 seconds in a nitrogen atmosphere. Thus, a linear electric circuit pattern having a length of 3 cm and a width of 3 mm orthogonal to the electric circuit pattern of Example 1 was formed. When continuity was measured at both ends of the wire, continuity was observed. Further, it was insulated from the electric circuit pattern created in Example 1.

Example 3 Double-sided adhesive tape (Plus Co., Ltd.)
Was attached to a polyester film (125 μm thick), and the release paper was peeled off to obtain a sheet with an adhesive.

After obtaining the sheet with the adhesive, 10 parts by weight of an acrylic water-soluble monomer, 1.5 parts by weight of ammonium persulfate, 30 parts by weight of isopropyl alcohol, and 58.5 parts of pure water
The liquid in a weight part is ejected onto a recording paper by using an inkjet system Kraft Printer CP-620 (trade name) manufactured by Canon Electronics Co., Ltd., and ultraviolet light (5
00W high pressure mercury lamp, wavelength 365nm, 15mW / cm
² ) was irradiated for 30 seconds. Thereby, the liquid is cured, and the portion where the liquid is discharged becomes a non-adhesive portion.

Thereafter, a 1: 1 mixed powder of tin and gallium is immediately sprayed, so that the mixed powder adheres to the adhesive portion of the medium. Excessive mixed powder not adhered to the adhesive portion was sucked by a pneumatic suction machine.

Thereafter, in order to improve conductivity, 100
The mixture was heated to ℃ to dissolve and bind the mixed powder. Thus, a linear electric circuit pattern having a length of 3 cm and a width of 3 mm was formed on the medium.

Thereafter, leaving only both ends of the line of the electric circuit pattern, 10 parts by weight of an acrylic water-soluble monomer, 1.5 parts by weight of ammonium persulfate, and 3 parts of isopropyl alcohol
0 parts by weight and 58.5 parts by weight of pure water are used as ink jet system Canon Electronics Co., Ltd. Kraft Printer CP
-620 (trade name), discharged on an electric circuit pattern, and irradiated with ultraviolet light (500 W high-pressure mercury lamp,
A wavelength of 365 nm, 15 mW / cm ² ) for 30 seconds,
An insulating layer was created. When the continuity was measured, the continuity was obtained at both ends of the pattern.

Embodiment 2 In order to form a non-adhesive part and an adhesive part for forming an image on a medium having an adhesive surface, a non-adhesive part on the medium is formed. After the light-curable adhesive is discharged to a desired location, the light-curable adhesive is irradiated with light to cure the light-curable adhesive, thereby losing the tackiness of the medium on the medium to which the light-curable adhesive is applied.

Then, an image is formed on the medium by attaching an element for forming an image to the adhesive portion of the medium to which the photocurable adhesive has not been applied.

In the first embodiment, the conductive powder is attached to the adhesive portion on the medium. However, the present invention is not limited to this. Inorganic pigments, organic pigments, resin powder, metal powder, metal foil, ceramic powder, An image may be formed by attaching an element such as glass beads.

Finally, the element that is not attached to the adhesive portion is removed. This removing method is not limited to the method of suctioning with the pneumatic suction device used in the first embodiment, but may be any method that can remove excess element bodies, such as a method using electrostatic force, a method using a brush-like object, and the like. Good.

As described above, in this embodiment, the non-adhesive portion is formed by discharging the photocurable adhesive onto the medium having the adhesive surface and curing the photocurable adhesive.
Thereafter, the element is attached to the adhesive portion remaining on the medium to form an image, so that the element (coloring material) can be freely selected.

Further, since the image position is formed by using the liquid discharge method, it is possible to form a fine image on the medium.

[0054]

As described above, according to the present invention, a non-tacky portion is formed by discharging a photocurable adhesive onto a medium having a tacky surface and curing the photocurable adhesive. Then, since the element is attached to the adhesive portion remaining on the medium to form an image, the element (coloring material) can be freely selected. In addition, clogging of the nozzle hardly occurs.

Further, when a conductor is used as an element body, an electric circuit board can be easily manufactured in a short time and at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic view illustrating an example of an electric circuit board manufacturing apparatus according to a first embodiment of the present invention.

FIG. 2 is a schematic view illustrating a method for forming an electric circuit pattern according to a first embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Discharge head 2 Ultraviolet curing adhesive tank 3 Conductor diffusion chamber 4 Conductor tank 5 Air blow pipe 6 Pneumatic suction device 7 Ultraviolet irradiation unit 8 Collection duct 9 Conductor transfer pump 10 Conductor 11 Medium 12 Ultraviolet curing adhesive Non-adhesive part with cured 13 Excessive powder scattered on non-adhesive part 14 Conductor (first conductive powder) scattered on sticky part on medium 11 15 Discharge head 16 Ultraviolet curing type bonding Agent tank 17 Insulating layer 20 Conveyor belt 21 Follower roller 22 Driving roller 31 Adhesive surface 33 Adhesive portion remaining on medium 35 UV-curable adhesive 37 Second conductive powder

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tetsuhiro Ohashi 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Yoshikazu Omata 3-30-2 Shimomaruko, Ota-ku, Tokyo Kyano (72) Inventor Masataka Eida 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term (reference) 2H086 BA01 BA11 BA15 BA51 BA55 5E343 BB22 BB23 BB24 BB25 BB33 BB34 BB48 BB49 BB54 BB67 BB78 CC01 EE42 ER33 GG11 GG20

Claims (16)

[Claims] 1. A method for forming a non-adhesive portion on a medium having an adhesive surface and an adhesive portion for forming an image on a medium having a non-adhesive portion on a medium having an adhesive surface. After applying the curable adhesive, a first step of irradiating the photocurable adhesive with light to cure the light, thereby losing the tackiness of the portion of the medium where the photocurable adhesive has been applied, A second step of attaching an element for forming an image to an adhesive portion of the medium to which the photocurable adhesive is not applied, wherein an image is formed on the medium. Image forming method. 2. The device according to claim 1, wherein the element body is at least one selected from the group consisting of an inorganic pigment, an organic pigment, a resin powder, a metal powder, a metal foil, a ceramic powder, and glass beads. The image forming method described in the above. 3. A method for forming a non-adhesive portion on a medium having an adhesive surface and an adhesive portion for forming an image on a medium having a non-adhesive portion on a medium having an adhesive surface. Means for applying a curable adhesive, means for irradiating the photocurable adhesive with light and curing to lose the tackiness of the portion where the photocurable adhesive is applied on the medium, An adhesive unit for attaching an element for forming an image to an adhesive portion of the medium to which the photocurable adhesive is not applied, wherein an image is formed on the medium. Image forming device. 4. The image forming apparatus according to claim 3, further comprising a removing unit that removes the element body that has not adhered to the adhesive portion on the medium from the medium. 5. The method according to claim 1, wherein the applying unit includes a discharge port that discharges the liquid, and a thermal energy generation unit that generates a bubble by heat in the liquid and discharges the liquid from the discharge port based on the generation of the bubble. 5. The image forming apparatus according to claim 3, wherein: 6. A place where a non-adhesive portion is to be formed on a medium having an adhesive surface in order to form a non-adhesive portion and an adhesive portion for forming an electric circuit pattern on the medium. After applying the photocurable adhesive to the first step of irradiating the photocurable adhesive with light and curing to lose the tackiness of the portion of the medium where the photocurable adhesive has been applied, A second step of attaching a conductor to an adhesive portion of the medium to which the photocurable adhesive is not applied; and a photocurable bond for forming an insulating layer at a location where the conductor is attached. A third step of applying an agent, and irradiating light to a portion to which the photocurable adhesive has been applied, thereby curing the applied photocurable adhesive to form an electric circuit pattern made of the conductor. And an electric circuit pattern on the medium. Method for producing an electric circuit board and forming a over emissions. 7. A place where a non-adhesive portion is to be formed on a medium having an adhesive surface in order to form a non-adhesive portion on the medium and an adhesive portion for forming an electric circuit pattern. After applying the light-curable adhesive to the first, the light-curable adhesive is irradiated with light to cure the light-curable adhesive, thereby losing the adhesiveness of the portion of the medium to which the light-curable adhesive has been applied.
And a second step of attaching a conductor to the adhesive portion of the medium to which the photocurable adhesive has not been applied, and a photocuring process for forming an insulating layer on the portion where the conductor has adhered. A third step of applying a mold adhesive; and irradiating light to the area to which the photocurable adhesive has been applied, thereby curing the applied photocurable adhesive to form an electric circuit pattern made of the conductor. Forming a second step on the insulating layer formed up to the fourth step.
A fifth step of applying a photo-curable adhesive to a portion where the electric circuit pattern is to be formed; and a sixth step of attaching a second conductor to the portion to which the photo-curable adhesive is applied. A seventh step of applying a photocurable adhesive for forming an insulating layer to a location where the second conductor is attached; and an eighth step of irradiating light to the location where the photocurable adhesive is applied. Wherein the fifth step, the sixth step, the seventh step, and the eighth step are performed at least once in this order to form a multilayer electric circuit pattern on the medium. Substrate manufacturing method. 8. The method according to claim 6, wherein the conductor is at least one selected from the group consisting of gold, silver, platinum and palladium. 9. The method according to claim 1, wherein the conductor comprises copper and tin, lead, gallium,
8. The method for manufacturing an electric circuit board according to claim 6, comprising a combination of mercury and solder. 10. The electric circuit according to claim 6, wherein the conductor is made of a metal powder or a metal foil, and further comprising a step of dissolving and bonding the conductor to enhance conductivity. Substrate manufacturing method. 11. The method according to claim 10, wherein the conductor is made of a combination of copper and tin, lead, gallium, mercury, and solder. 12. The method according to claim 10, wherein the conductor is at least one selected from the group consisting of tin, lead, gallium, mercury, and solder. 13. A place where a non-adhesive portion on a medium having an adhesive surface is to be formed in order to form a non-adhesive portion and an adhesive portion for forming an electric circuit pattern on the medium. Means for applying a photo-curable adhesive to the medium, and means for irradiating the photo-curable adhesive with light to cure the photo-curable adhesive, thereby losing the adhesiveness of the portion of the medium to which the photo-curable adhesive has been applied. An adhesion unit for adhering a conductor to an adhesive portion of the medium on which the photocurable adhesive is not applied, and a photocurable adhesive for forming an insulating layer at a location where the conductor is attached. Applying means for applying an agent; and irradiating light to a portion to which the photocurable adhesive has been applied, thereby curing the applied photocurable adhesive to form an electric circuit pattern made of the conductor. Means, and an electric circuit on the medium. Electric circuit board manufacturing apparatus, and forming a turn. 14. The electric circuit board according to claim 13, wherein the conductor is made of a metal powder or a metal foil, and further comprising a melting means for melting and bonding the conductor to enhance conductivity. manufacturing device. 15. The electric circuit board manufacturing method according to claim 13, further comprising removing means for removing, from the medium, the element body that is not attached to the adhesive portion on the medium. apparatus. 16. The method according to claim 16, wherein the applying unit includes a discharge port for discharging the liquid, and a thermal energy generating unit for generating a bubble by heat in the liquid and discharging the liquid from the discharge port based on the generation of the bubble. Claims 13 to 1
6. The electric circuit board manufacturing apparatus according to any one of 5.