KR101937892B1 - Method for bonding substrates and substrate for displays manufactured by same - Google Patents

Abstract

Disclosed is a method for adhering a substrate and a substrate for a display manufactured by the method, wherein not only the upper substrate and the lower substrate can be bonded at uniform intervals, but also bubbles generated at the time of adhering by the bubble outlet can be easily removed.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of bonding a substrate,

This application claims the benefit of US patent application Ser. Korean Patent Application No. 10-2016-0046172, filed on April 18, 2005, the contents of which are incorporated herein by reference.

The present invention relates to a method of bonding a substrate and a substrate for a display manufactured thereby, and more particularly, to a method of bonding a substrate to a substrate for a display, The present invention relates to a method of bonding a substrate and a substrate for a display manufactured thereby.

In recent years, functional films have been attached to substrates used in display devices in order to realize various functions. With the trend toward miniaturization and high performance of electronic devices among these functions, thinning and thinning of electronic products are required as technical problems . On the other hand, a conventional method of adhering and adhering a transparent adhesive sheet having a thickness of about 100 占 퐉 has been used for a conventional substrate glass and a film, but a problem that a display material of today's consumer is inadequate for satisfying the demand for high functionality, small size and slimness have. Thus, a printing technique such as bar coating or slot-die coating was used as a method of uniformly adhering the substrate glass and the film to a thin thickness of 10 mu m or less. However, such a method also has a limitation in that it can not be bonded with a uniform thickness of the substrate and the functional film, and can not achieve a sufficient thickness. In addition, there is no way to remove the bubbles generated when the substrate glass and the film are adhered concretely or efficiently, so that the problems caused by the residual bubbles, for example, the display visibility, , There is a problem that the adhesive area is also adversely affected and the adhesion failure is caused by the decrease in the overall adhesive force.

Japanese Patent Laid-Open No. 2006-036865

As described above, a functional film is attached to a substrate used in a display device in order to realize various functions, and a transparent adhesive sheet having a thickness of about 100 탆 is attached and adhered to the substrate glass and the film for light- However, there is a problem in that it is insufficient to satisfy the requirement for high functionality, small size and slimness of the display material of the consumer. In order to solve this problem, it is possible to use a printing technique for adhering thinner thicknesses. However, this method also has a limitation in that it can not be bonded with a uniform thickness of the substrate and the functional film, have. In addition, it is not easy to remove bubbles generated when the substrate glass and the film are adhered, and various problems due to residual bubbles may occur. Therefore, there is a need for a solution that can solve these problems.

Accordingly, it is an object of the present invention to provide a method of bonding a substrate using a printing process and a substrate for a display manufactured thereby.

Another object of the present invention is to provide a method of bonding a substrate and a method of manufacturing the same, which can bond a top substrate and a bottom substrate with a uniform thickness and a thin thickness by forming a spacer by a printing process using ink To provide a substrate.

It is still another object of the present invention to provide a method for adhering a substrate and a substrate for a display manufactured by the method, wherein bubbles generated upon adhering a substrate can be easily removed through an outlet.

According to an aspect of the present invention, there is provided a method of forming a pattern, comprising: (a) printing a photocurable adhesive ink on a lower substrate to form a pattern; (b) photocuring the pattern to form a spacer on the lower substrate and a dam positioned outside the spacer to prevent the adhesive ink from escaping to the outside of the adhesive surface; (c) printing a photocurable adhesive ink on the surface of the lower substrate on which the spacer and the dam are formed to form an adhesive layer; And (d) photocuring and laminating the adhesive layer and the upper substrate of the lower substrate, wherein the dot pitch in the step (a) is 20 [micro] m to 20 [micro] To 100 [micro] m.

In addition, the present invention provides a substrate for a display manufactured through a method of adhering the substrate.

According to the method for adhering a substrate according to the present invention and the substrate for display manufactured by the method, it is possible to uniformly adhere a substrate glass and a film to a thin thickness using a printing process using ink and a spacer formed by the process, It is possible to easily remove the bubbles generated when the substrate is adhered by the discharge port, thereby preventing or minimizing the problems caused by the residual bubbles.

1 and 2 are views for explaining a method of adhering a substrate according to an embodiment of the present invention.
3 is a schematic view of a pattern formed on a substrate according to an embodiment of the present invention.
FIG. 4 is a view illustrating a dam formed on an outer surface of a substrate according to an embodiment of the present invention. FIG.
5 is a plan view showing a position of a bubble outlet of a dam formed on a substrate according to an embodiment of the present invention.
6A and 6B show a top view and a cross-sectional view of a sample for adhesion strength evaluation.
7A and 7B are OM (optical microscope) images showing whether or not bubbles are generated in the samples according to Comparative Examples 13 and 6, respectively.
Fig. 8 shows the adhesion evaluation results for Example 6 and Comparative Example 13. Fig.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 and 2 are views for explaining a method of adhering a substrate according to an embodiment of the present invention. A method of bonding a substrate according to the present invention comprises the steps of: (a) printing a photocurable adhesive ink on a lower substrate to form a pattern; (b) Forming a spacer on the substrate and a dam positioned outside the spacer to prevent detachment of the adhesive ink to the outside of the adhesive surface; (c) forming a spacer and a dam on the lower substrate; (D) printing and curing the adhesive layer and the upper substrate of the lower substrate to form an adhesive layer, wherein the dot spacing dot in the step (a) pitch is 20 to 100 mu m based on an ink discharge amount of 10 to 80 pL.

Will be described more specifically with reference to Figs. 1 and 2. Fig. 1 (a) and 2 (a), a spacer 11 and a dam (not shown) formed by curing a photocurable adhesive pattern formed through an inkjet process are formed on a lower substrate 10 have. 1 (b) and Fig. 2 (b), a photocurable adhesive ink is jetted through the inkjet process onto the upper surface of the lower substrate 10 on which the spacer 11 and the dam are formed An adhesive layer 12 is formed. 1C and 2C show a state in which the adhesive layer 12 and the upper substrate 13 are joined by photo-curing so that the lower substrate 10 and the upper substrate 13 are bonded to each other .

More specifically, the step of printing the photocurable adhesive ink on the lower substrate in the step (a) may include the step of bonding the photocurable adhesive ink discharged through the head of the printer to the lower substrate 10 ), And forming a pattern with dots. The lower substrate 10 may be a glass or a film, and the film is not particularly limited as long as it is commonly used, and the substrate can be appropriately selected depending on the purpose for which the substrate is used. If a thermosetting adhesive ink is used, it is difficult to use a film as a substrate because it involves high temperature control. However, since a photocurable adhesive ink is used in the present invention, a film can be used without limitation on the use of the substrate.

On the other hand, the dot means a droplet formed on a substrate by discharging a photocurable adhesive through a head in a printing process.

The photocurable adhesive ink may be any one containing an epoxy compound, a photopolymerization initiator, a surfactant, a light stabilizer, and a solvent. In addition to the above components, any one of a corrosion inhibitor and a pH adjuster Or more. In addition, the photocurable adhesive ink may be used for UV curing or electron beam curing, preferably for UV curing.

The pattern of step (a) may include at least one of a dot pattern and a line pattern. Fig. 3 is a schematic view of a pattern formed on a substrate according to various embodiments of the present invention. Fig. 3 (a) is a dot pattern formed on a substrate, and Fig. 3 (b) Is formed on the substrate. The shape of such a pattern is maintained to form a spacer (11 in Figs. 1 and 2) or a dam (in the case of a dam, in particular, a dot pattern can be formed by a line pattern) Since there is almost no shrinkage after curing, the shape can be maintained in a circular state. However, depending on the viscosity or the surface tension, if the liquid is not hardened immediately after the droplet is ejected, a slight spread phenomenon may occur. Therefore, when the curing is carried out immediately after the droplet discharging, it can be considered that the error hardly occurs.

Meanwhile, when forming the pattern, the arrangement and shape of the upper substrate 13 should be adjusted so as to facilitate the discharge of air in the step (d) of joining the upper substrate 13. In other words, the pattern may be formed by controlling the diameter, height, and dot pitch of the dot during the printing in the step (a). The diameter, height and spacing of such dots can be adjusted through the composition of the photocurable adhesive ink or the like.

The dot pitch in the step (a) may be about 20 to 100 占 퐉 based on the ink ejection amount of 10 to 80 pL, as described above, and may be different depending on the ink ejection amount, The amount of ink to be ejected at one time increases. Therefore, in order to eject a larger amount of ink, it is necessary to further increase the dot interval. For example, when the ink ejection amount is 10 pL, the dot interval is 20 to 35 mu m, preferably about 30 mu m, and when the ink ejection amount is 30 pL, the dot interval is 40 to 60 mu m, preferably about 55 mu m And when the ink discharge amount is 50 pL, the dot interval is 50 to 80 mu m, preferably about 70 mu m, and when the ink discharge amount is 80 pL, the dot interval is 65 to 100 mu m, preferably about 90 mu m.

Next, a description will be given of a step of photocuring the photocurable adhesive ink pattern formed in the step (b), that is, the step (a), to form the spacer 11 and the dam on the lower substrate 10 The photocuring may be variously performed depending on the type of the photocurable adhesive ink used in step (a), and may be ultraviolet (UV) curing or electron-beam (E-beam) curing, May be ultraviolet curing. The ultraviolet curing may be performed by conventional ultraviolet curing methods, but is preferably performed for 5 to 500 seconds at an intensity of 50 to 500 mW / cm ² . Further, the electron beam curing may be performed for 5 to 500 seconds.

The spacer serves as a pedestal for bonding the lower substrate and the upper substrate at uniform intervals, and has a circular or square shape. The spacer has a pattern (i.e., a dot pattern or a line pattern) formed in the step (a) And may have the same shape and size. The thickness (height) of the spacer is 6 to 12 占 퐉, preferably 9 to 11 占 퐉. If the thickness of the spacer is less than 6 占 퐉, it is difficult to form the spacer and its role as a support may be incomplete, It may be difficult to form the adhesive layer thinly.

In order to form the spacer with the above thickness, it is necessary to set a proper pixel (px) in the design of the printing image. For example, in order to form the spacer with a thickness of about 10 μm, , It is preferable to set the size to about 12x12 to 16x16 pixels. At this time, when the size of the pixel is smaller than the corresponding range, there is a possibility that the ejection amount of the ink is insufficient and the thickness is thinner than the spacer of the desired thickness. When the size of the pixel exceeds the range, There is a possibility that the discharge amount of the spacer is excessively large and thicker than the spacer of the intended thickness. That is, in the case of the above example, when it is intended to form a spacer with a thickness of about 10 탆, if the size is less than 12 x 12 pixels, a discharge amount of ink may not be sufficient and a spacer having a thickness of 10 탆 or less may be formed. , The ejection amount of the ink becomes too large, and a spacer having a thickness exceeding 10 mu m may be formed.

The spacer pitch of the spacer 11 should be adjusted to be 0.1 to 1 cm (1,000 to 10,000 μm), preferably 0.2 to 0.5 cm, in order to form a uniform adhesive layer. When the spacing is less than 0.1 cm, superposition may occur in the formation of the spacers or it may be difficult to remove bubbles formed between the spacers. When the spacing of the spacers exceeds 1 cm, the upper substrate 13 (Slacking) occurs between the spacers, which may cause the bubbles to aggregate to one side.

Next, a dam formed on the lower substrate together with the spacer will be described. As described above, the dam is located outside the spacer to prevent the adhesive ink from deviating to the outside of the adhesive surface Therefore, it can also be referred to as a barrier rib pattern. FIG. 4 is a view showing a dam formed on the outer surface of a substrate according to an embodiment of the present invention, which is precisely, when printing the photocurable adhesive ink in the step (c) 4 (b) and 4 (c), the dam is provided with a bubble outlet for discharging bubbles generated when the upper and lower substrates are adhered to each other, May be formed. In addition, as the bubble outlet of the dam, the excess adhesive may be discharged to the outside when performing the step (c), which may facilitate the removal of the excess adhesive in the subsequent process.

FIG. 5 is a plan view showing a position of a bubble outlet of a dam formed on a substrate according to an embodiment of the present invention. As shown in FIG. 5, the bubble outlet may include a side wall portion or a corner but it is preferable to design it in such a form that it is formed at the corner (the dotted line arrow in FIG. 5) and the edge is removed so that the bubbles inside can be discharged more easily. Therefore, it is preferable that the bubble outlet of the dam is formed at 1 to 4 corners only, but it may be formed more than 4 so that it can be formed at a portion other than the corners. On the other hand, the bubble outlet is designed and designed simultaneously with dam design.

The thickness (height) of the dam is also equal to the thickness of the spacer, and is 6 to 12 占 퐉, preferably 9 to 11 占 퐉. If the thickness of the dam is less than 6 占 퐉, It may be incomplete, and if it exceeds 12 μm, it may be difficult to form the adhesive layer thinly.

In order to form the dam to have the same thickness as the above range, it is necessary to set an appropriate pixel (px) at the time of designing a printing image. Setting the width of the pixel to about 12 to 16 pixels desirable.

Subsequently, in step (c), the photocurable adhesive ink is printed on the upper surface of the spacer 11 and the lower substrate 10 on which the dam is formed, in accordance with the height of the spacer and the dam formed in the step (b) Wherein the thickness of the adhesive layer 12 is 6 to 12 占 퐉, preferably 9 to 11 占 퐉, corresponding to the thickness (height) of the spacer and the dam. The photocurable adhesive used in this step may be the same as the adhesive used in the step (a).

Conventionally, an adhesive layer is formed using an adhesive sheet, or an adhesive layer is formed by bar coating or slot coating. However, it is not easy to form an adhesive layer with a uniform gap and a thin thickness by these methods. Therefore, the present invention forms a spacer by a printing process and forms an adhesive layer according to the height of the spacer, so that not only a uniform gap but also a thin adhesive layer can be formed. Therefore, the alignment between the lower substrate 10 and the upper substrate 13 can be made uniform, and the thickness of the adhesive layer can be adhered to the same thickness as the spacer.

The dot pitch in the step (C) is the same as the dot spacing in the step (a), and is about 20 to 100 mu m based on the ink discharge amount of 10 to 80 pL, and varies depending on the ink discharge amount As the ink ejection size of the ink head increases, the amount of ink ejected at one time increases. Therefore, in order to eject a larger amount of ink, the dot interval must be further increased. For example, when the ink ejection amount is 10 pL, the dot interval is 20 to 35 mu m, preferably about 30 mu m, and when the ink ejection amount is 30 pL, the dot interval is 40 to 60 mu m, preferably about 55 mu m And when the ink discharge amount is 50 pL, the dot interval is 50 to 80 mu m, preferably about 70 mu m, and when the ink discharge amount is 80 pL, the dot interval is 65 to 100 mu m, preferably about 90 mu m.

If the dot spacing in the step (c) is out of the dot spacing range based on the ink discharge amount, the amount of the ink applied to the entire surface of the adhesive layer 12 is excessively overflowed, The amount of ink to be applied when the adhesive layer 12 is formed is so small that the upper substrate 13 may not adhere well. The dot spacing of step (a) is an interval for pattern formation, and the dot spacing of step (c) is an interval for forming the adhesive layer 12.

Finally, in the step (d), the upper substrate 13 is adhered to the adhesive layer 12 formed in the step (c), and is cured by light curing. The photo-curing in this step can proceed with photo-curing in accordance with the kind of the adhesive layer 12, and the photo-curable adhesive may be the same as the adhesive in the step (a). In addition, the upper substrate 13 may be glass or a film.

In the meantime, the printing process used in the bonding method of the substrate described above may be various printing processes using ink, but an inkjet printing method is the most preferable. As a result, in the present invention, an inkjet process is used, So that the lower substrate and the upper substrate can be bonded to each other with a uniform and thin thickness.

On the other hand, the present invention provides a display substrate manufactured by the above-described method for adhering a substrate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as set forth in the appended claims. Such changes and modifications are intended to be within the scope of the appended claims.

Example

[Example 1] Size change of spacer according to pixel size

A primary ink jetting was performed on a glass substrate using an SE head (Dimatix, Inc., USA) having an amount of UV adhesive ink ejected at one time of 30 pL. The dot pitch formed at the time of inkjet printing was 55 μm (462 dpi) to form a dot pattern. The formed point pattern was cured for about 5 seconds using a 395 nm UV lamp to form a spacer having a diameter of 1.3 mm and a thickness of 9.52 [mu] m when designed with 12 x 12 pixels, On top of the formed lower substrate, the same UV adhesive as the first ink jetting was applied (tilting and applying the ink jet head) to form an adhesive layer having the same thickness as the spacer. Subsequently, an upper substrate identical to the material of the lower substrate was attached to the upper part of the spacer and the adhesive layer, and then the substrate was cured by a UV lamp for about 5 seconds to manufacture a display substrate.

[Example 2] Size change of spacer according to pixel size

A substrate for display was manufactured in the same manner as in Example 1 except that spacers having a diameter of 1.4 mm and a thickness of 10.9 mu m were formed when designing 16 x 16 pixels.

[Comparative Example 1] Size change of spacer according to pixel size

A display substrate was manufactured in the same manner as in Example 1 except that spacers having a diameter of 0.6 mm and a thickness of 2.25 탆 were formed when designing 4 × 4 pixels.

[Comparative Example 2] Size change of spacer according to pixel size

A display substrate was manufactured in the same manner as in Example 1 except that spacers having a diameter of 0.9 mm and a thickness of 5.43 μm were formed when designing 8 × 8 pixels.

[Comparative Example 3] Size change of spacer according to pixel size

A substrate for display was manufactured in the same manner as in Example 1 except that spacers having a diameter of 2.2 mm and a thickness of 15.3 탆 were formed when designing 32 × 32 pixels.

Pixel size Spacer thickness (占 퐉) Spacer Diameter (mm) Example 1 12 x 12 9.52 1.3 Example 2 16 × 16 10.9 1.4 Comparative Example 1 4 × 4 2.25 0.6 Comparative Example 2 8 x 8 5.43 0.9 Comparative Example 3 32 x 32 15.3 2.2

In Table 1, the dot pitches of Examples 1 and 2 and Comparative Examples 1 and 3 were all set to 55 μm (462 dpi).

[Examples 1 to 2, Comparative Examples 1 to 3] Evaluation of the size change of the spacer according to the pixel size

Table 1 shows the thicknesses and diameters of the spacers formed during the fabrication of the substrates of Examples 1 to 2 and Comparative Examples 1 to 3 in accordance with the pixel size. As shown in Examples 1 to 2 and Comparative Examples 1 to 3 Likewise, when a pixel of a certain size is reached, the thickness of the spacer does not increase any more even if the pixel size is increased, and therefore, as the pixel size increases under the same dot pitch condition until the threshold value is reached The thickness and the diameter of the spacer were also increased. Therefore, in the case of Examples 1 and 2 in which the thickness of the spacer satisfies 6 to 12 占 퐉, it can be seen that the printing image before spacer formation must be designed with a size of 12 占 12 to 16 占 16 pixels (px).

[Examples 3 to 5] Changes in size of dams according to pixel sizes

The dams formed with the bubble discharges at the four positions shown in Fig. 5 were printed in the order of 15 x 15 pixels, 15 x 200 pixels and 15 x 350 pixels in the order of Examples 3 to 5, And the thickness and width as shown in Table 1. In addition, the processes required for manufacturing the substrate for display were performed in the same manner as in Example 1 above.

[Comparative Examples 4 to 6] Changes in size of dams according to pixel sizes

Comparative Examples 4 to 6 Printing images were designed in the order of 30 x 30 pixels, 30 x 200 pixels, and 30 x 350 pixels in order to form the dams having the bubble discharging ports in the thickness and width as shown in Table 2 below. The steps necessary for manufacturing the substrate for display were performed in the same manner as in Example 1 above.

[Comparative Examples 7 to 9] Changes in size of dams according to pixel sizes

Comparative Examples 7 to 9 Printing images were designed in the order of 60.times.60 pixels, 60.times.200 pixels and 60.times.350 pixels in order to form the bubble outlet formed in the thickness and width as shown in Table 2 below, The steps necessary for manufacturing the substrate for display were performed in the same manner as in Example 1 above.

[Comparative Examples 10-12] The size change of the dam (dam) of the pixel size

Comparative Examples 10 to 12 Printing images were designed in the order of 120.times.120 pixels, 120.times.200 pixels and 120.times.350 pixels in order to form the bubble outlet with the thickness and width as shown in Table 2 below. The steps necessary for manufacturing the substrate for display were performed in the same manner as in Example 1 above.

Pixel size Dam Thickness (㎛) Dam Diameter (mm) Example 3 15 x 15 9.18 1.45 Example 4 15 x 200 9.69 1.25 Example 5 15 x 300 9.44 1.2 Comparative Example 4 30 x 30 14 2.2 Comparative Example 5 30 x 200 12.5 2 Comparative Example 6 30 x 350 12.4 1.95 Comparative Example 7 60 x 60 13.5 3.7 Comparative Example 8 60 x 200 12.1 3.8 Comparative Example 9 60 x 350 12.1 3.7 Comparative Example 10 120 x 120 12.4 7 Comparative Example 11 120 x 200 13.1 7 Comparative Example 12 120 x 350 13.3 7

[Examples 3 to 5 and Comparative Examples 4 to 12] Evaluation of the size change of the dam according to the pixel size

Table 2 shows the thickness and width of the dam formed in the fabrication of the substrates of Examples 3 to 5 and Comparative Examples 4 to 12 according to the pixel size. The dam has a thickness (6 to 12 탆) (The dam thickness at this time is 9.18 mu m, 9.69 mu m, and 9.44 mu m in the order of Examples 3 to 5). Therefore, as shown in Table 2, when forming the dam, it can be seen that the width of the pixel in the printing image must be designed to be 12 pixels (px) to 16 pixels (px).

[Example 6]

The cleaned LCD glass substrate was used as the upper and lower substrates. As shown in FIGS. 6A and 6B, an adhesive layer was formed on the lower substrate to have a width of 1 cm and a thickness of 10 μm, and then the upper substrate was slightly shifted. The spacer had a pixel size of 15 × 15 in the same manner as in Example 3, and the dam thickness was formed to be 9.69 μm in the same manner as in Example 4. FIG. 6A is a plan view of the sample, and FIG. 6B is a schematic view of a cross section of the sample.

[Comparative Example 13]

A sample was prepared in the same manner as in Example 6 except that the bubble outlet was not formed integrally.

Bubble generation  Confirm

7A and 7B show an OM image of the adhesive layer. In the case of Comparative Example 13 having no bubble outlet, as shown in FIG. 7A, bubbles remain in the adhesive layer, whereas in Example 6, there is no bubble as can be seen in FIG. 7B.

Adhesion test

The adhesive-coated film (Nichiban's CT-24 adhesive tape) was cut to a width of 25 mm and a length of 50 to 100 mm and connected to the bottom surface of the upper substrate. While the lower substrate was fixed with a TA Texture Analyzer, the adhesive strength between the upper and lower sides was evaluated by applying a 90 ° adhesion test while pulling the end of the tape. Fig. 8 shows the evaluation result.

In case of Example 6, when the force of about 900 gf / cm was applied, the upper and lower substrates were not separated and the upper substrate was broken. Therefore, it can be seen that the adhesive force of the adhesive layer is 900 gf / cm or more.

In the case of Comparative Example 13, when the force of about 500 gf / cm was applied, the upper and lower substrates were separated.

From this, it can be confirmed that the adhesion force is remarkably improved when the bubble outlet is formed.

Claims (17)

A printing process capable of adjusting the thickness is used,
(a) printing a photocurable adhesive ink on a lower substrate to form a pattern;
(b) photocuring the pattern to form a spacer on the lower substrate and a dam positioned outside the spacer to prevent the adhesive ink from escaping to the outside of the adhesive surface;
(c) printing a photocurable adhesive ink on the surface of the lower substrate on which the spacer and the dam are formed to form an adhesive layer; And
(d) photocuring and laminating the adhesive layer and the upper substrate of the lower substrate,
The dot pitch in the step (a) is 20 to 100 占 퐉 based on an ink ejection amount of 10 to 80 pL,
Wherein at least one bubble outlet for discharging bubbles generated when the upper and lower substrates are bonded is formed in the dam, and the bubble outlet is formed at the same time when the dam pattern is formed. delete The method according to claim 1, wherein the bubble outlet is formed in one to four corners of the dam. The method according to claim 1, wherein the thickness of the dam is 6 to 12 占 퐉. 5. The method according to claim 4, wherein the width of the pixel is set to a size of 12 to 16 pixels in the printing image design so as to be the thickness of the dam. The method according to claim 1, wherein the lower substrate and the upper substrate are glass or a film. The method of bonding a substrate according to claim 1, wherein the pattern includes at least one of a dot pattern and a line pattern. The method according to claim 1, wherein the spacer has a thickness of 6 to 12 탆. 9. The method according to claim 8, wherein the thickness of the spacer is set to a size of 12x12 to 16x16 pixels in the printing image design. The method according to claim 1, wherein the spacing of the spacers is 0.1 to 1 cm. The method of bonding a substrate according to claim 1, wherein the thickness of the adhesive layer is 6 to 12 占 퐉. The method according to claim 1, wherein the dot interval in the step (C) is 20 to 100 占 퐉 based on an ink ejection amount of 10 to 80 pL. The method according to claim 1, wherein the photocurable adhesive ink is an ink selected from the group consisting of ultraviolet (UV) curing and electron beam curing. 14. The method according to claim 13, wherein the ultraviolet curing is performed for 5 to 500 seconds at an intensity of 50 to 500 mW / cm < ² >. 14. The method of claim 13, wherein the electron beam curing is performed for 5 to 500 seconds. The method of claim 1, wherein the printing is inkjet printing. A substrate for a display produced by a method for adhering a substrate according to claim 1.

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