JP2002059557A - Method of positioning thin film body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of stably and flatly positioning a thin film body on a projected surface of a substrate having a projection without creating the deformation. SOLUTION: A thermosetting resin or ultraviolet curing resin is applied on a support glass substrate 1 in an extremely thin thickness of dozens of micrometers by a spin coating or roll coating method to be cured, thereby forming an orifice layer 2. A thin film of a thermoplastic polyimide resin with a thickness of approximately 2-5 μm is formed thereon as an adhesive 3. A body substrate 5 wherein an inner structure of a print head including a driving circuit, a wiring electrode, a heating section, a partition wall, an ink groove and an ink supply hole is formed thereon beforehand, is provided. The support glass substrate 1 is superposed on the body substrate 5 having the inner structure as a projection in an upside-down orientation to be stuck thereto by a pressing and heating treatment. After that, the support glass substrate 1 is removed by a wet-etching process. As a result, it is possible to stably and uniformly flatly position the orifice layer 2 thereon in the whole body substrate 5 without creating deformation or wrinkle irrespective of the size of the body substrate 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for stably installing a thin film on a surface of a convex portion of a substrate having the convex portion without bending.

[0002]

2. Description of the Related Art Conventionally, there are various devices having a structure in which a thin film is flatly stretched on a surface of another object having a convex portion. Such devices are found, for example, in liquid crystal displays, inkjet printheads, and the like.

[0003] Taking the structure of an ink jet print head as an example, a drive circuit, a heating element,
Electrodes and the like are formed, furthermore, about 10 μm high partition walls are formed on the surface of the above-described substrate, on which the partition walls having a height of about 10 μm for forming the ink flow paths serving as the convex sections are formed. It is constructed by attaching a resin thin film called an orifice plate.

In this attaching step, a thermoplastic resin layer having a thickness of several μm is previously formed as an adhesive on the surface to which the resin thin film is attached, and this resin thin film is placed on the surface of the convex portion of the substrate. Is carried out under pressure in a vacuum.

Next, a thin film made of Al or the like is formed as a metal mask on the resin thin film, a mask pattern is formed by photolithography, and this is dry-etched to form a discharge nozzle in the resin thin film. The ink jet print head is completed by installing and penetrating.

[0006]

However, it is difficult to install such a thin film having a thickness of about several tens of μm on a surface of another object having a convex portion without slack or wrinkles. This is an extremely difficult task.

Particularly, it is extremely difficult to attach an orifice plate stretched over the uppermost layer of a substrate in an ink jet print head so that a flat surface is formed uniformly, and the orifice plate itself has rigidity. Since there is no such material, inconveniences such as bending inward and falling or wrinkles on the surface are likely to occur. Such a problem also occurs in the case of a print head having a size of about 10 × 18 mm for a serial printer. However, a long print head formed to have a size corresponding to a printing area in a paper width direction for a line printer is used. When it is created, it appears remarkably.

[0008] The object of the present invention is to solve the above-mentioned conventional circumstances,
An object of the present invention is to provide a method of uniformly and stably installing a thin film on a surface of a substrate having a convex portion without bending.

[0009]

The structure of the method for installing a thin film according to the present invention will be described below. The method for installing a thin film body according to the present invention includes a step of installing the thin film body on a support, a step of preparing a substrate having a convex portion on the surface, A step of placing the support on the substrate so as to be in contact with the substrate, and a step of removing the support placed on the substrate.

It is preferable that the thin film is formed on the support by coating, for example. Preferably, the support is removed by etching, for example. Also, in the thin film body setting method, for example, the orifice layer in which a discharge nozzle of a jet print head is formed in which the thin film body applies pressure to the ink to eject the ink in a predetermined direction. The present invention can be suitably applied to a method of manufacturing an ink jet print head, which is a head substrate in which the above-mentioned substrate partitions the ink flow path, and the partition as the above-mentioned convex part is provided upright.

In this case, the discharge nozzle may be formed in the orifice layer after the support is removed, for example, as described in claim 5. As described above, the orifice layer formed on the support may be perforated.

The orifice layer may be formed on the support after forming a mask film for etching the discharge nozzle on the support, as described in claim 6, for example. Alternatively, for example, as described in claim 8, a protective film as an etching resist may be formed on the support and then laminated on the protective film.

Further, in a predetermined area on the surface of the orifice layer formed on the support, for example, a particle having a particle size corresponding to the height of an ink flow path for guiding ink to the discharge nozzle is provided. A gap holding layer containing particles may be selectively laminated, and a reinforcing layer may be selectively formed, for example, as described in claim 10. As described above, a column corresponding to the height of the ink flow path that guides the ink to the discharge nozzle may be selectively formed.

Further, in the above-mentioned method for installing a thin film, the thin film may be one of transparent substrates of a liquid crystal display cell in which liquid crystal is sealed between a pair of substrates. Is the other transparent substrate of the liquid crystal display cell, and the convex portion can be suitably applied to a method of manufacturing a liquid crystal display cell which is a sealing material for sealing a liquid crystal erected on the other transparent substrate.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a flowchart showing a process of manufacturing a print head of an ink jet printer formed by the method for installing a thin film member according to the first embodiment. The ink jet printer of the present embodiment is a thermal ink jet printer that generates bubbles by heating ink, and ejects ink by the pressure of the bubbles.

FIGS. 2 (a), 2 (b), 2 (c) and 2 (d) are diagrams schematically showing the configuration of the print head in the order of the manufacturing process. With reference to FIGS. 1 and 2 (a) to 2 (d), a method of installing a thin film body applied to the manufacture of the print head of this embodiment will be described. First, as shown as S101 in FIG. 1, an orifice layer serving as an orifice plate on which a discharge nozzle is formed is formed on a support. In this process, as shown in FIG. 2A, an organic resin material (orifice layer material) is applied to the support glass substrate 1 as a support by ultra-thin spin coating or roll coating (S101-1). ), The applied organic resin material is cured to form a thin film orifice layer 2 (S)
101-2). As a material of the orifice layer 2, for example, an organic resin such as polyimide is used. These resins include both a thermosetting type and an ultraviolet curing type, and either type may be used. This is formed so that the film thickness after curing becomes several tens μm.

Next, as shown in S102 of FIG. 1, an adhesive layer is formed. In this process, an adhesive is applied on the orifice layer 2 (S102-1), and the applied adhesive is dried (S102-2). Thus, as shown in FIG. 2 (b), an adhesive layer 3 for bonding the orifice layer 2 to another member is formed on the orifice layer 2 later. As a material of the adhesive layer 3, it is preferable to use a general thermoplastic polyimide resin as the adhesive. This thermoplastic polyimide resin is used to form a film after drying to have a thickness of 2 to 5 μm. Thus, the support substrate A in which the orifice layer 2 and the adhesive layer 3 are laminated on the support glass substrate 1 is obtained.

Subsequently, the bonding in S103 of FIG. 1 is performed. In this processing, first, a substrate B (hereinafter, referred to as a main substrate B) in which the internal configuration of the print head has been prepared in advance is prepared, and the support substrate A is turned upside down on the main substrate B. The main substrate B and the support substrate A are bonded by pressure and heat treatment (S103-2).

As a result, as shown in FIG. 2 (c), the internal structure 4 has already been formed on the main body glass substrate 5, whereby the main body substrate B having the upper surface (front surface) having the convex portion is formed.
A support substrate A with the top and bottom inverted is attached on the substrate.
Although the internal structure 4 of the main body substrate B is shown as a uniform component in the drawing, in practice, a drive circuit and a multi-layered electrode wiring having a thickness of 0.5 to 2.5 μm are used. In addition to the heat-generating part and the partition wall having a height of 10 μm, in particular, are arranged on the main body glass substrate 5 to form a surface on which convex portions are present over the entire surface. An ink groove is formed on the side of the substrate on which the ink is provided, and an ink supply hole is formed to communicate with the ink groove and penetrate the back surface of the substrate.

The main body glass substrate 5 may be a silicon wafer instead of glass if the substrate is small, but may be a glass substrate for a large print head such as a long print head. It is preferable to use Internal structure 4 formed on the surface of main body glass substrate 5
Although not particularly shown, the thickness of the driving circuit, Ta-Si-O-based or Ta-Si-ON-based member 100
A heating resistor film having a thickness of 0 to 5000 or 5000 to 18000, a base wiring film having a thickness of 1000 to 3000 which is made of a W-Ti-based member for driving the heating resistor, and a thickness of 3000 to be made of Au or the like laminated thereon. 10,000
本 About the height made of polyimide or the like for forming an ink flow path from the ink supply hole formed through the main wiring film and the glass substrate 5 to the heating portion formed by the heating resistor film. It is composed of a 10 μm partition wall or the like.

On the uppermost layer, that is, the partition wall of the main body substrate B which has a surface having a convex portion due to the internal structure 4 as described above, the support substrate A is provided with the adhesive material layer 3 on the orifice layer 2.
The thermoplastic adhesive is melted beyond the glass transition point by heat treatment, and the orifice layer 2 adheres to the partition wall via the adhesive layer 3 by pressure treatment. Thereafter, the melted adhesive is cured, and the orifice layer 2 is fixed on the partition walls of the internal structure 4 of the main substrate B.

Subsequently, as shown in S104 of FIG. 1, the supporting glass substrate 1 is removed. In this process, first, in order to protect the main glass substrate 5 from the etching agent, a resist is applied to the exposed surface, that is, the bottom surface and four side surfaces of the main glass substrate 5 (S104-1). Is performed (S104-2). For this etching, for example, wet etching with hydrofluoric acid is used. In this case, a resin or the like resistant to hydrofluoric acid is used for the resist.

Subsequently, washing with water is performed (S104-3).
After cleaning the residue generated by the above-described etching, the resist is peeled from the main glass substrate 5 (S104-
4) Then, washing is performed again (S104-5), and after cleaning the stain after the resist is stripped, the whole is dried (S104).
-6).

As a result, as shown in FIG. 2D, the supporting glass substrate 1 is removed from the internal structure 4 of the main body substrate B, that is, from the orifice layer 2 fixed on the partition walls. The head body is completed. As described above, after the orifice layer is formed on the glass having high hardness as a support, the surface on the orifice layer side is formed in advance on the surface of the main body substrate having the convex portion on which the internal structure such as the partition wall is formed. After attaching to the substrate, the support is removed, so the orifice layer (orifice plate) of the thin film body regardless of the size of the main body substrate
Can be uniformly and flatly disposed on the surface of the convex portion of the main body substrate without causing bending or wrinkling. This effect is particularly significant when the main body substrate is large, such as a long print head.

Thereafter, although not specifically shown, a metal mask pattern of Ti, Ni, Cu, Al or the like having a thickness of 0.5 to 1 μm is formed on the orifice layer 2 by sputtering, photolithography and etching. Then, dry etching is performed according to the metal mask pattern, and the diameter penetrating the orifice layer 2 and the adhesive layer 3 is 20 μm to
A discharge nozzle of 40 μm is formed at a predetermined position. Thereby, the print head is completed.

In the above embodiment, the support on which the orifice layer is formed is a glass substrate. However, the present invention is not limited to this, and a metal plate may be used. In this case, the step of removing the support glass substrate is a step of removing the metal plate, and an etchant capable of removing the metal forming the metal plate may be used.

FIG. 3 is a flowchart of a process for manufacturing a print head formed by the method for installing a thin film member according to the second embodiment. FIGS. 4A to 4E are diagrams schematically showing the configuration of the print head in the order of the manufacturing process. With reference to FIGS. 3 and 4 (a) to 4 (e), a method of installing a thin film body applied to the manufacture of the print head of this embodiment will be described.

First, as shown in S201 of FIG. 3, a metal mask is formed. In this process, as shown in FIG. 4A, a supporting Al substrate 6 is prepared as a support, and a Ti thin film serving as a metal mask for forming a discharge nozzle later on the supporting Al substrate 6 is formed. 7 is formed by sputtering or the like. The thickness of the Ti thin film 7 is 6000Å-7000
About Å is fine.

Subsequently, as shown in S202 of FIG. 3, an orifice layer is formed. In this process, an orifice layer 8 is formed on the Ti thin film 7 as shown in FIG. The step of forming the orifice layer 8 is the same as the step of forming the orifice layer 2 described in S101 of FIG.

Next, as shown in S203 of FIG. 3, an adhesive layer is formed. In this process, an adhesive layer 9 is formed on the orifice layer 8 as shown in FIG. The step of forming the adhesive layer 9 is performed in step S10 of FIG.
This is the same as the step of forming the adhesive layer 3 described in FIG. Thus, the support substrate A in which the Ti thin film 7, the orifice layer 8, and the adhesive material layer 9 are laminated on the support Al substrate 6 is obtained.

Subsequently, as shown in S204 of FIG. 3, bonding is performed. In this process, as shown in FIG. 4D, a main body substrate B having an internal structure 4 already formed on a main body glass substrate 5 is prepared in advance similarly to the case of FIG. A support substrate A, on which the above-described Ti thin film 7, orifice layer 8, and adhesive layer 9 are laminated on B, is overlaid and adhered upside down. This bonding step is the same as the bonding step described in S103 of FIG.

Subsequently, as shown in S205 of FIG. 3, the supporting Al substrate 6 is removed. In this process, first,
In order to protect the main body glass substrate 5 from the etching agent,
A resist is applied to the exposed surface of the main body glass substrate 5 (S2
05-1). Subsequently, the supporting Al substrate 6 is etched (S205-2). In this etching, the Ti thin film 7 is used.
Use an etchant that does not invade. Examples of such an etchant include “phosphoric acid + nitric acid + Cu + A”
l "is effective. Also in this case, a member that is resistant to the etchant is used as the resist.

Next, the residue generated by the above-mentioned etching is washed by washing with water (S205-3), the resist is stripped from the main glass substrate 5 (S205-4), and washed again with water to remove the dirt after the resist is stripped. After washing (S205
-5), and the whole is dried (S205-6).

As a result, as shown in FIG. 4E, a print head assembly in which the orifice layer 8 is coated with the Ti thin film 7 is completed. Thereafter, an opening pattern (not shown) corresponding to the arrangement of the discharge nozzles is formed on the Ti thin film 7 by a normal photolithography method, and the Ti thin film 7 is used as a metal mask. Then, by performing dry etching by helicon wave dry etching or the like in accordance with the metal mask, a discharge nozzle penetrating the orifice layer 8 and the adhesive material layer 9 is formed at a predetermined position, and the entire process is completed.

As described above, in the case of the present embodiment, at the end of the step of removing the supporting Al substrate 6 shown in FIG. 4E, the print head main body in which the mask metal film is formed in advance is completed. In comparison with the case of forming the metal film for the mask after bonding the orifice layer to the main substrate as in the example of FIG. Can be prevented.

In the step S201, the Ti thin film 7
May be performed to form a metal mask. According to this process, the support substrate A is
Since the opening patterning by photolithography is performed on the Ti thin film 7 before bonding to the substrate, it is possible to avoid the adverse effects of the thermal process and the etching solution on the internal structure 4 of the print head.

FIG. 5 is a flowchart of a process for manufacturing a print head formed by the method for installing a thin film member according to the third embodiment. FIGS. 6A to 6F are diagrams schematically showing the configuration of the print head in the order of manufacturing steps. With reference to FIGS. 5 and 6 (a) to 6 (f), a method of installing a thin film body applied to the manufacture of the print head of this embodiment will be described.

First, as shown in S301 of FIG. 5, a protective film is formed. In this process, an organic resin material such as epoxy or acrylic is applied on the support by ultra-thin spin coating or roll coating (S301-1), and the applied organic resin material is cured to form a protective film. Is formed (S301-2).

As a result, as shown in FIG. 6A, a protective film 12 having a thickness of several μm is formed on the supporting glass substrate 11 as a supporting body. The above-mentioned organic resin materials include both a thermosetting type and an ultraviolet curing type, and either type may be used.

The protective film 12 is provided to prevent the etchant from entering the internal structure 4 from the discharge nozzle when the supporting glass substrate 11 is removed by etching after bonding to the main substrate. . next,
An orifice layer is formed as shown in S302 of FIG. 5, and an adhesive layer is further formed as shown in S303. These processes are the same as the process of forming the orifice layer 2 described in S101 of FIG. 1 and the process of forming the adhesive layer 3 described in S102. Thus, an orifice layer 13 and an adhesive layer 14 are formed on the protective film 12, as shown in FIG.

Subsequently, as shown in S304 of FIG. 5, a discharge nozzle is formed. In this process, first, a photoresist is formed on the adhesive layer 14 (S304-
1) After an opening pattern corresponding to the arrangement of the discharge nozzles is patterned on the photoresist by photolithography (S304-2), the discharge nozzles are formed by wet etching (S304-3).

As a result, as shown in FIG. 6C, a plurality of discharge nozzles 15 are formed at predetermined positions through the adhesive layer 14 and the orifice layer 13. Following the above, bonding is performed as shown in S305 of FIG. In this process, as shown in FIG. 6 (d), a main substrate B on which the internal structure 4 of the ink jet printer is already formed on the main glass substrate 5 is prepared in advance, and the above-mentioned main substrate B is placed on the main substrate B. Orifice layer 13 and adhesive layer 1 having a protective film 12 and a discharge nozzle 15 perforated thereon as described above.
The support substrate A on which the substrate 4 is formed is overlaid and adhered with the top and bottom reversed. This bonding step is performed by the S
This is the same as the bonding step described in 103.

Next, as shown in S306 of FIG. 5, the supporting glass substrate 11 is removed. In this process, S1 in FIG.
The same application of the resist as described in 04-1 and (S30)
6-1), up to the etching of the supporting glass substrate 11 as described in S104-2 of FIG. 1 is performed (S306-
2) The processing after washing with water is not performed here.

In the etching of the supporting glass substrate 11, as shown in FIG. 6 (e), the protective film 12 remains until the end of the etching process to seal and protect the discharge nozzle 15 from the outside. There is no problem that the liquid enters the internal structure 4 and etches the electrode wiring and the heating resistor.

Subsequent to the above processing, step S307 in FIG.
As shown in (1), the protective film 12 is removed. In this process, after removing the protective film 12 by a method such as oxygen plasma dry etching (S307-1), the resist is stripped from the main glass substrate 5, (S307-2), and washed with water (S307-3). Drying (S307-4) is performed.
Thus, as shown in FIG. 6F, a print head having the orifice layer 13 in which the discharge nozzle 15 is formed is completed.

As described above, in this embodiment, since the orifice layer in which the discharge nozzle has been formed in advance is attached on the main body substrate B, the anisotropic layer such as dry etching is applied after the orifice layer is attached on the main body substrate B. Compared to the case where the ejection nozzles are collectively formed by etching, particularly when the substrate is a substrate in which a drive circuit using the diffusion layer is formed monolithically, adverse effects on the diffusion layer at the time of processing the ejection nozzles are eliminated.

Further, when the discharge nozzle is formed in advance in this manner, since the wet etching method can be easily used, the smoothing of the etching surface, that is, the inner wall of the discharge nozzle, which is an advantage of wet etching, is made smooth. Accordingly, it is possible to form a print head having discharge nozzles having good discharge performance of ink droplets.

FIG. 7 is a flowchart of a process for manufacturing a print head formed by the method for installing a thin film member according to the fourth embodiment. The manufacturing method according to the present embodiment is a multi-piece system in which a plurality of line-type print heads are formed on one substrate and are finally divided into individual line-type print heads.

FIGS. 8A to 8F are diagrams schematically showing the configuration of the print head in the order of manufacturing steps. These figures 7
8 (a) to 8 (f), a method of installing a thin film member applied to the manufacture of the print head of the present embodiment will be described. First,
As shown in S401 of FIG. 7, an orifice layer is formed. In this process, an orifice layer 17 is formed on a supporting glass substrate 16 as shown in FIG. The step of forming the orifice layer 17 is the same as the step of forming the orifice layer 2 described in S101 of FIG.

Next, as shown in S402 of FIG. 7, an adhesive layer is formed. In this process, an adhesive layer 18 is formed on the orifice layer 17 as shown in FIG. The step of forming the adhesive layer 18 is performed by the step S in FIG.
This is the same as the step of forming the adhesive layer 3 described in 102.

Next, as a feature of this example, S40 in FIG.
As shown in FIG. 3, a seal in which the gap members are dispersed is formed. In this process, as shown in FIG. 8C, a sealing material 19 as a gap holding layer is finally divided into individual print heads on an adhesive layer 18 formed on the supporting glass substrate 16. It is formed along a scribe line set for the purpose. In this sealing material 19, particles having the same size as the height of the partition wall, which is one component of the internal structure on the main body substrate side, are dispersed and mixed therein as gap members.

The sealing material 19 is formed by printing on a predetermined position on the support glass substrate 16, that is, on the adhesive layer 18 by screen printing, and then performing levelling drying by heat treatment. Thus, the orifice layer 17 and the adhesive layer 18 are formed on the supporting glass substrate 16.
Are laminated on each other, and a support substrate A in which a sealing material 19 is formed at a predetermined position thereon is obtained.

On the other hand, on the main substrate side, as a feature of the present embodiment, as shown in S404 of FIG. 7, the partition walls and the columns are formed of the same material in which the gap members are dispersed and mixed. Also in this case, particles having the same particle size as the height of the partition wall as the gap member are used. In this process, as shown in FIG. 5D, a first internal structure 21 such as a wiring electrode and a heating resistor (excluding partition walls) is formed on a body glass substrate 20 prepared in advance, and the first internal structure 21 is formed thereon. A second internal structure 22 composed of partitions and columns in which the gap members are dispersed and mixed is formed. Thus, the first internal structure 21 and the second
A main body substrate B in which the internal structures 22 are sequentially formed is obtained.

Then, as shown in S405 of FIG. 7, the support substrate A and the main substrate B are bonded to each other.
This bonding process is the same as the bonding process described in S103 of FIG. 1, but in this case, as shown in FIG. 8 (e), the second internal structure 22 on the main substrate B side and the support Substrate A
The first internal structure 21 and the orifice layer 17 which are the height of the ink flow path at the position where
(Strictly speaking, a predetermined gap between the adhesive layers 18) is firmly maintained.

As a result, the pressing force at the time of bonding can be increased, so that the orifice layer can be stuck on the main glass substrate 20 more uniformly and reliably. Subsequent to the above, as shown in S406 of FIG. 7, the supporting glass substrate 16 is removed. This removal processing is performed in step S in FIG.
Similar to the process described in 104, the process includes application of a resist, etching of a supporting glass substrate, washing with water, peeling of a resist, washing with water, and drying.

As a result, as shown in FIG. 8F, a print head body with the orifice layer 17 exposed is completed.
Thereafter, a discharge head is formed in the orifice layer 17 by the above-described method to complete a print head. As described above, according to the fourth embodiment, the sealing member in which the gap member is dispersed and mixed in advance is formed on the orifice layer so as to correspond to the scribe line. Since the partition walls and columns formed by mixing are pasted on the main body substrate on which they are formed, a predetermined gap is firmly maintained by these sealing materials, partition walls and columns, and therefore, the pressing force at the time of bonding is reduced. As a result, the thin orifice layer can be stuck on the main body substrate having an uneven surface more uniformly and reliably without generating a drop or a wrinkle.

FIG. 9 is a flowchart of a process for manufacturing a print head formed by the method of installing a thin film member according to the fifth embodiment. FIGS. 10A to 10E are diagrams schematically showing a method of manufacturing the print head in the order of the manufacturing steps.
FIG. 1F is a cross-sectional view of the finished product as viewed from the side. With reference to FIGS. 9 and 10 (a) to 10 (f), a method of installing a thin film body applied to the manufacture of the print head of the present embodiment will be described.

First, as shown in S501 of FIG. 9, an orifice layer is formed. In this process, an orifice layer 24 is formed on the supporting glass substrate 23 as shown in FIG. The step of forming the orifice layer 24 is the same as the step of forming the orifice layer 2 described in S101 of FIG.

Subsequently, in this example, as shown in S502 of FIG. 9, the partition / reinforcement beam layer 25 is formed. In this example, the same photosensitive resin is used as the material of the partition walls and the reinforcing beams, as shown in S502-1 of the same figure. And then,
On this, an adhesive layer is formed as shown in S503 of FIG. As a result, as shown in FIG.
A reinforcing beam layer 25 is formed over the orifice layer 24,
Further, an adhesive layer 26 is formed on one surface thereof.

Next, as shown in S504 of FIG. 9, patterning is performed. In this process, a pattern mask of partition walls and reinforcing beams is formed on the adhesive layer 26 (S50).
4-1) Exposure is performed according to this pattern (S50).
4-2), development according to this exposure is performed (S504-
3) Then, curing after development is performed (S504-).
4). As a result, as shown in FIG. 10 (c), on the orifice layer 24, the partition wall 2 with the adhesive layer 26 attached thereon is formed.
7 and the reinforcing beam 28 are formed.

Following the above, as shown in S505 of FIG. 9, bonding is performed. In this process, as shown in FIG. 10 (d), an internal structure 29 other than the partition walls, that is, a drive circuit, a heating unit, an electrode wiring, a connection terminal, etc., is formed on a main body glass substrate 30. The support substrate A is overlaid on the substrate B with the top and bottom reversed. The bonding process after the superposition is the same as the process described in S103-2 of FIG.

Subsequently, as shown in S506 of FIG. 9, the supporting glass substrate 23 is removed. This removal process
The same application of the resist as described in S104 of FIG.
It consists of etching, washing, resist peeling, washing and drying of the supporting glass substrate. As a result, FIG.
As shown in (2), a print head body with the orifice layer 24 exposed is completed. Thereafter, as shown in FIG. 10 (f), a discharge nozzle 31 is pierced in the orifice layer 24 by the above-described method such as dry etching to complete a print head. Although the adhesive layer 26 is shown as a layer having a certain thickness for easy understanding in the drawing, it is actually one layer thicker than the thickness (height) of the partition walls 27 and the reinforcing beams 28. /
This is a layer having a thickness of about 10 and so thin that it is difficult to show.

As shown in FIG. 11F, the extension of the ink supply groove 32 is formed on the lower surface of the orifice layer 24 at the portion corresponding to the upper portion of the ink supply groove 32 previously formed in the main body glass substrate 30. Since the reinforcing beam 28 is formed in a direction orthogonal or intersecting with the setting direction (perpendicular to the paper surface of the drawing), the orifice layer portion above the ink supply groove 32, which easily falls,
In other words, even in the orifice layer portion remote from the partition wall 27, the orifice layer 24 is kept horizontal without bending and falling, thereby preventing the orifice layer 24 from falling into the internal ink flow path.

FIG. 11 is a flowchart of a process for manufacturing a print head formed by the method for installing a thin film member according to the sixth embodiment. FIGS. 12A to 12E are diagrams schematically showing the configuration of the print head in the order of manufacturing steps.
(f) is a sectional view of the finished product as viewed from the side. With reference to FIGS. 11 and 12 (a) to 12 (f), a method of installing a thin film body applied to the manufacture of the print head of this embodiment will be described.

First, as shown in S601 of FIG. 11, an orifice layer is formed. In this process, as shown in FIG. 12A, an orifice layer 34 is formed on a supporting glass substrate 33.
Is formed. The step of forming the orifice layer 34 is the same as the step of forming the orifice layer 2 described in S101 of FIG.

Subsequently, in this example, as shown in S602 of FIG. 11, a reinforcing beam is formed. This includes S60 in FIG.
As shown in 2-1, a photosensitive organic resin material is applied. As the organic resin material, for example, a thermosetting or ultraviolet curable organic resin such as a polyimide resin, an epoxy resin, or an acrylic resin is suitably used.

Then, a pattern mask of a reinforcing beam is formed on the photosensitive organic resin material layer, exposure is performed according to the pattern (S604-2), and development is performed according to the exposure (S604-2). In step S604-3, curing after development is performed (S604-4). As a result, a reinforcing beam 35 is formed on the orifice layer 34 as shown in FIG.

The orifice layer previously formed is
Since sufficient thermosetting has been performed, the above-mentioned reinforcing beam 32
There is no adverse effect on the formation process of Following the above, an adhesive layer is formed as shown in S603 of FIG. In this process, a thermosetting or thermoplastic polyimide resin or the like is applied very thinly and dried. As a result, an adhesive layer 36 is formed on the reinforcing beams 35 and the exposed orifice layer 34 as shown in FIG.

Subsequently, as shown in S604 of FIG.
Laminate. In this process, as shown in FIG. 12D, a main body substrate B having an internal structure 37 already formed on a main body glass substrate 38 is prepared in advance, and this main body substrate B
The orifice layer 34 on the supporting glass substrate 33
The support substrate B on which the reinforcing beams 35 and the adhesive layer 36 are formed is superimposed and adhered with the top and bottom reversed. This bonding step is the same as the bonding step described in S103 of FIG.

The internal structure 37 shown in FIG. 12D has a uniform thickness for the sake of convenience in illustration.
In contrast to the case of the internal structure 4, the thick partition wall portion and the thin component portions such as the drive circuit, the heat-generating portion, and the wiring electrode are shown with some irregularities so as to be distinguished to some extent.

After the above, as shown in S605 of FIG. 11, the support glass substrate 33 is removed. This removal process is a process including application of a resist, etching of a support glass substrate, washing with water, peeling of a resist, washing with water, and drying, as described in S104 of FIG.

As a result, as shown in FIG. 12E, a print head body with the orifice layer 34 exposed is completed. Thereafter, as shown in FIG. 12F, a discharge nozzle 39 is formed in the orifice layer 34 by a method such as the dry etching described above. Thus, the print head is completed. Also in this case, the adhesive layer 36 is actually a thin layer that is difficult to show as compared with the thickness (height) of the partition walls and the reinforcing beams 35 of the internal structure 37.

In this embodiment, as shown in FIG. 11F, the orifice layer 34 at a portion corresponding to the upper portion of the ink supply groove 41 formed in the main body glass substrate 38 in advance.
Since the reinforcing beam 35 is formed on the lower surface in a direction orthogonal to or intersecting with the extending direction of the ink supply groove 41 (perpendicular to the plane of the drawing), the orifice layer above the ink supply groove 41, which easily falls down, is also clogged. The orifice layer portion that is separated from the partition wall of the internal structure 37 and is kept horizontal without bending and falling, thereby preventing the orifice layer 34 from falling into the internal ink flow path.

FIG. 13 (a) is a flow chart of a manufacturing process of a print head formed by the method for installing a thin film member according to the seventh embodiment, and FIGS. It is a figure which shows typically the manufacturing method of a head in a manufacturing process order, and the figure (d) is sectional drawing of the finished product seen from the side surface direction.
With reference to FIGS. 13A to 13D, a method of installing a thin film body applied to the manufacture of the print head of the present embodiment will be described.

First, as shown in S701 of FIG. 13A, an orifice layer is formed. In this process, FIG.
As shown in FIG. 5, an orifice layer 43 is formed on a supporting glass substrate. The step of forming the orifice layer 43 is the same as the step of forming the orifice layer 2 described in S101 of FIG.

Subsequently, in this example, S702 in FIG.
As shown in FIG. In this process,
As shown in (c), a support 44 is formed on the orifice layer 43. This support 44 is different from the reinforcing beam 35 shown in FIG.
The material and the forming method are the same as those of the reinforcing beam 35.

Subsequently, the process of forming the adhesive layer in S703, the bonding process in S704, and the process of S7 in FIG.
The support glass substrate 42 is removed in step S <b> 05. However, the processing in steps S <b> 703, S <b> 704, and S <b> 705 differs only in that the support 44 and the reinforcing beam 35 are replaced, and
The processing is the same as the processing described in S604 and S605.

When the supporting glass substrate 42 is removed, as shown in FIG. 13D, the adhesive layer 47 is directed downward on the uppermost layer of the internal structure 46 above the main glass substrate 45. Orifice layer 43 laminated and exposed to the outside
Next, a discharge nozzle 48 is formed by a method such as the dry etching described above. Thus, the print head is completed.

In this example, as shown in FIG.
In the vicinity of the edge of the ink supply groove 49 formed in advance in the main body glass substrate 42 on the side of the ejection nozzle 48, a support 44 is disposed, and the support 44 supports the orifice layer 43 from the internal structure 46 side. Therefore, the portion of the orifice layer 43 that is located above the ink supply groove 49 and is not supported by the partition walls is kept horizontal without bending, and this causes a problem that the orifice layer 43 falls into the internal structure 46. Is prevented.

By the way, the thin film member of the present invention in which the extremely thin layer member such as the orifice layer is stuck on the surface of the convex portion of another member while maintaining a very small constant gap. The method is not limited to a print head of an ink jet printer, and can be applied to, for example, a manufacturing process of a liquid crystal display cell.

In the case of a liquid crystal display device, a glass substrate is often used as a substrate. In recent years, a light and thin resin film has been used. Such a resin film material has properties such as heat resistance, melting resistance, gas barrier properties, surface flatness, dimensional stability, light transmittance, and non-optical anisotropy required for a substrate of a liquid crystal display cell. Those that are easy to fill and handle, such as polyether sulfone resin and thermosetting acrylic resin, are suitable.

However, it has been difficult to bond the above-mentioned thin film resin film materials while maintaining a predetermined gap uniformly. However, by using the thin film body setting method of the present invention, a pair of thin film resin films can be formed. It is possible to manufacture a liquid crystal display cell in which the substrates can be bonded together without dropping and a predetermined gap between the substrates is kept uniform. An example in which the present invention is applied to the manufacture of a liquid crystal display cell will be described below as an eighth embodiment.

FIGS. 14A to 14E are diagrams showing a process of manufacturing a liquid crystal display cell according to the eighth embodiment. The liquid crystal display cell of this example is of a so-called simple matrix type, and the manufacturing process is as follows. First, as shown in FIG. 2A, an upper transparent film substrate 52 is formed on a supporting glass substrate 51. . At this time, although not particularly shown, a display drive segment electrode is also formed on the upper transparent film substrate 52.

On the other hand, as shown in FIG.
The lower transparent film substrate 54 is formed on the base 53. At this time, a display drive common electrode is also formed on the lower transparent film substrate 54, though not particularly shown. next,
In a predetermined area of the lower transparent film substrate 54 on the base 53, a sealing material 55 is formed by printing as shown in FIG. The thickness (height) of the sealing material 55 is formed to a thickness corresponding to the gap for sealing the liquid crystal formed between the upper and lower transparent film substrates.

On a base 53 having a lower transparent film substrate 54 on which the sealing material 55 is formed, as shown in FIG. 3D, a supporting glass substrate 51 on which the upper transparent film substrate 52 is formed is mounted. Overlap and glue it upside down. Thereafter, as shown in FIG.
When 1 is removed, the upper transparent film substrate 52 having a flat surface corresponding to the flat support surface of the removed support glass substrate 51 is moved downward while maintaining a predetermined gap held by the sealing material 55. The liquid crystal display cell 56 in a state where the liquid crystal display cell 56 is attached to the transparent film substrate 54 is completed.

In this manner, the upper transparent film substrate and the lower transparent film substrate, both of which are both made of a thin resin film, can be easily bonded together with the predetermined gap kept without falling down, and the predetermined substrate gap is uniform. It is possible to stably manufacture a liquid crystal display cell comprising a thin film substrate held in a liquid crystal display.

In the above embodiment, the thin film is formed on the support by coating. However, the present invention is not limited to this, and the thin film may be stuck on the support. In addition, the method of the present invention is applicable to various cases in which a thin-film body other than a thermal inkjet head, such as a piezoelectric inkjet head, or a thin-film body other than an inkjet head or a liquid crystal display cell is disposed on the surface of the convex portion. Can be applied.

[0088]

As described in detail above, according to the present invention, the thin film body is placed on the surface of the projection while the thin film body is held on the support, and then the support is removed. It can be stably installed uniformly and flat on a substrate having no.

When the present invention is applied to a method for manufacturing an ink jet print head as in the first embodiment, a glass having high hardness is used as a support, and an orifice layer is stuck thereon. Since the surface on the side of the orifice layer is previously attached to the uppermost layer of the surface of the main substrate having a convex portion on which the internal structure of the pressure energy generating element, the wiring electrode, and the like is formed, the support substrate is removed. Regardless of the size of the main body substrate, the orifice layer can be uniformly and flatly disposed on the main body substrate having a convex portion without causing bending or wrinkling. This effect is particularly advantageous when the main body substrate is large, such as a long print head.

Further, as in the second embodiment, if an orifice layer on which a metal mask or a metal film for a mask is formed in advance is similarly pasted on a main body substrate on which an internal structure is formed in advance, Compared to the case where a metal mask is formed after the orifice layer is attached to the main body substrate, it is possible to eliminate the possibility that the high temperature at the time of forming the mask metal film by sputtering has an adverse effect on the internal structure of the main body glass substrate. .

Further, as in the third embodiment, if an orifice layer having a discharge nozzle formed in advance is pasted on the main body substrate, the discharge nozzle is formed after the orifice layer is pasted on the main body substrate. As compared with the above, it is possible to eliminate the possibility that high-temperature plasma generated by dry etching at the time of processing of the discharge nozzle adversely affects the internal structure of the main body substrate. In particular, when the main body substrate is a substrate in which a driving circuit using a diffusion layer is formed monolithically, there is an advantage that an adverse effect on the diffusion layer can be avoided.

In the case where the discharge nozzles are formed in advance before being attached to the main body substrate, a wet etching method can be used for forming the discharge nozzles. A smooth inner wall of the nozzle can be formed, and therefore, a print head having a discharge nozzle with good discharge performance of ink droplets can be formed.

In the case of the method according to the fourth embodiment, the sealing material in which the gap member is dispersed in advance is formed by the orifice layer formed so as to correspond to the scribe line on the main body substrate side. Is adhered on the main body substrate on which the pillars formed are formed, and a predetermined gap is firmly maintained by these sealing materials and the gap members included in the pillars. Can be increased, whereby the orifice layer can be stuck more uniformly and reliably.

Further, according to the method of the fifth and sixth embodiments, the orifice layer in which the reinforcing beam is formed in advance at the portion corresponding to the portion distant from the partition wall is attached to the main body substrate.
The orifice layer does not flex and fall into the interior even on the ink supply groove, which is a part away from the partition wall, so that the orifice layer having a flatter surface without flexing and wrinkles is bonded. Can be installed.

Further, according to the method of the seventh embodiment,
In the vicinity of the edge on the ejection nozzle side of the ink supply groove previously drilled in the main body glass substrate, a support is arranged, and since this support supports the orifice layer from the internal configuration side,
The orifice layer, which is located above the ink supply groove and is not supported by the partition, is kept horizontal without warping, thereby preventing the orifice layer from falling into the inside.

According to the method of the eighth embodiment,
After the upper transparent film substrate is formed on the support glass substrate, this is turned upside down, and the support glass substrate is removed after being laminated and pasted on the lower transparent film substrate via a sealing material, The upper transparent film substrate and the lower transparent film substrate can be easily bonded together with a predetermined gap maintained without dropping, and a stable liquid crystal display cell consisting of a thin film substrate with the predetermined substrate gap maintained uniformly It becomes possible to manufacture.

[Brief description of the drawings]

FIG. 1 is a flowchart of a manufacturing process of a print head formed by a method of installing a thin film as a first embodiment.

FIGS. 2A, 2B, 2C, and 2D are diagrams schematically showing the configuration of a print head according to the first embodiment in the order of manufacturing steps.

FIG. 3 is a flowchart of a manufacturing process of a print head formed by a method of installing a thin film member according to a second embodiment.

FIGS. 4A to 4E are diagrams schematically showing the configuration of a print head according to a second embodiment in the order of manufacturing steps.

FIG. 5 is a flowchart of a manufacturing process of a print head formed by a method of installing a thin film member according to a third embodiment.

FIGS. 6A to 6F are diagrams schematically illustrating the configuration of a print head according to a third embodiment in the order of manufacturing steps.

FIG. 7 is a flowchart of a manufacturing process of a print head formed by a method of installing a thin film member according to a fourth embodiment.

FIGS. 8A to 8F are diagrams schematically showing the configuration of a print head according to a fourth embodiment in the order of manufacturing steps.

FIG. 9 is a flowchart of a manufacturing process of a print head formed by a method of installing a thin film body according to a fifth embodiment.

FIGS. 10A to 10E are diagrams schematically showing the configuration of a print head according to a fifth embodiment in the order of manufacturing steps, and FIG. 10F is a cross-sectional view of a completed product viewed from the side. .

FIG. 11 is a flowchart of a manufacturing process of a print head formed by a method of installing a thin film member according to a sixth embodiment.

12A to 12E are diagrams schematically showing the configuration of a print head according to a sixth embodiment in the order of manufacturing steps, and FIG. 12F is a cross-sectional view of a completed product as viewed from the side. .

13A is a flowchart of a manufacturing process of a print head formed by the method of installing a thin film member according to the seventh embodiment, and FIGS. 13B and 13C are diagrams of a print head of the seventh embodiment. FIG. 4D is a diagram schematically showing an initial manufacturing process sequence, and FIG. 4D is a cross-sectional view of the finished product viewed from the side.

FIGS. 14A to 14E are diagrams showing a manufacturing process of the liquid crystal display cell according to the eighth embodiment.

[Explanation of symbols]

 Reference Signs List A Supporting substrate B Main substrate 1 Supporting glass substrate 2 Orifice layer 3 Adhesive layer 4 Internal structure 5 Main glass substrate 6 Supporting Al substrate 7 Ti thin film 8 Orifice layer 9 Adhesive layer 11 Supporting glass substrate 12 Protective film 13 Orifice layer 14 Adhesive layer 15 Discharge nozzle 16 Support glass substrate 17 Orifice layer 18 Adhesive layer 19 Sealing material 20 Main body glass substrate 21 First internal configuration 22 Second internal configuration 23 Support glass substrate 24 Orifice layer 25 Partition / reinforcement beam layer 26 Adhesive Layer 27 Partition wall 28 Reinforcement beam 30 Main body glass substrate 31 Discharge nozzle 32 Ink supply groove 33 Support glass substrate 34 Orifice layer 35 Reinforcement beam 36 Adhesive layer 37 Internal structure 38 Main body glass substrate 39 Discharge nozzle 41 Ink supply groove 42 Support glass substrate 43 Orifice layer 44 Prop 45 A glass substrate 46 internal structure 47 adhesive layer 48 discharge nozzles 49 ink feed channel 51 supporting the glass substrate 52 on the transparent film substrate 53 base plate 54 under the transparent film substrate 55 sealant 56 liquid crystal display cell

Claims (12)

[Claims] A step of providing a thin film on a support; a step of preparing a substrate having a convex portion on the surface; and a step of contacting the thin film on the support with the surface of the convex portion of the substrate. A step of installing the support on the substrate; and a step of removing the support installed on the substrate. 2. The method according to claim 1, wherein the thin film is formed on the support by coating. 3. The method according to claim 1, wherein the support is removed by etching. 4. The thin film body is an orifice layer in which a discharge nozzle of a jet print head for ejecting the ink in a predetermined direction by applying a pressure to the ink is formed, and the substrate is provided with the convexities defining an ink flow path. 2. The method according to claim 1, wherein the partition is a head substrate having a partition wall. 5. The method according to claim 4, wherein the discharge nozzle is formed in the orifice layer after the support is removed. 6. The method according to claim 4, wherein the orifice layer is laminated on the mask film after forming a mask film for etching the discharge nozzle on the support. How to install thin film. 7. The method according to claim 4, wherein the discharge nozzle is formed in the orifice layer formed on the support. 8. The method according to claim 4, wherein the orifice layer is laminated on the protective film after forming a protective film as an etching resist on the support. 9. A gap holding layer containing particles having a particle size corresponding to the height of an ink flow path for guiding ink to the discharge nozzle is selectively formed in a predetermined area on the surface of an orifice layer formed on the support. 5. The method according to claim 4, wherein the layers are stacked. 10. The method according to claim 4, wherein a reinforcing layer is selectively formed in a predetermined region on the surface of the orifice layer formed on the support. 11. A column corresponding to the height of an ink flow path for guiding ink to the discharge nozzle is selectively formed in a predetermined region on the surface of an orifice layer formed on the support. Item 5. The method for setting a thin film according to Item 4. 12. The thin film body is one transparent substrate of a liquid crystal display cell in which liquid crystal is sealed between a pair of substrates, the substrate is the other transparent substrate of the liquid crystal display cell, and the projection is 2. The method according to claim 1, further comprising a sealing material for sealing a liquid crystal erected on the other transparent substrate.