JP2000158312A - ブラウン管用パネルのフェース面研磨装置 - Google Patents
ブラウン管用パネルのフェース面研磨装置Info
- Publication number
- JP2000158312A JP2000158312A JP34029098A JP34029098A JP2000158312A JP 2000158312 A JP2000158312 A JP 2000158312A JP 34029098 A JP34029098 A JP 34029098A JP 34029098 A JP34029098 A JP 34029098A JP 2000158312 A JP2000158312 A JP 2000158312A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing tool
- panel
- tool
- face surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34029098A JP2000158312A (ja) | 1998-11-30 | 1998-11-30 | ブラウン管用パネルのフェース面研磨装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34029098A JP2000158312A (ja) | 1998-11-30 | 1998-11-30 | ブラウン管用パネルのフェース面研磨装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000158312A true JP2000158312A (ja) | 2000-06-13 |
| JP2000158312A5 JP2000158312A5 (enExample) | 2005-08-18 |
Family
ID=18335537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34029098A Withdrawn JP2000158312A (ja) | 1998-11-30 | 1998-11-30 | ブラウン管用パネルのフェース面研磨装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000158312A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100370860B1 (ko) * | 1998-11-16 | 2003-02-19 | 한국전기초자 주식회사 | 패널표면연마장치용 연마툴 및 그 제조방법 |
| KR20030031598A (ko) * | 2001-10-15 | 2003-04-23 | (주) 한일씨텍 | 평면브라운관용 패널 연마구의 제조방법 및 그 연마구 |
| KR100370867B1 (ko) * | 1998-11-13 | 2003-05-09 | 한국전기초자 주식회사 | 패널표면연마장치용연마툴 |
| WO2003059576A1 (en) * | 2001-12-27 | 2003-07-24 | Fujitsu Limited | Abrasive grain burying device for lapping device |
| JP2010212040A (ja) * | 2009-03-10 | 2010-09-24 | Stanley Electric Co Ltd | 車両用灯具 |
-
1998
- 1998-11-30 JP JP34029098A patent/JP2000158312A/ja not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100370867B1 (ko) * | 1998-11-13 | 2003-05-09 | 한국전기초자 주식회사 | 패널표면연마장치용연마툴 |
| KR100370860B1 (ko) * | 1998-11-16 | 2003-02-19 | 한국전기초자 주식회사 | 패널표면연마장치용 연마툴 및 그 제조방법 |
| KR20030031598A (ko) * | 2001-10-15 | 2003-04-23 | (주) 한일씨텍 | 평면브라운관용 패널 연마구의 제조방법 및 그 연마구 |
| WO2003059576A1 (en) * | 2001-12-27 | 2003-07-24 | Fujitsu Limited | Abrasive grain burying device for lapping device |
| US7189151B2 (en) | 2001-12-27 | 2007-03-13 | Fujitsu Limited | Embedding tool designed to embed grains into faceplate for lapping apparatus |
| JP2010212040A (ja) * | 2009-03-10 | 2010-09-24 | Stanley Electric Co Ltd | 車両用灯具 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6325709B1 (en) | Rounded surface for the pad conditioner using high temperature brazing | |
| JP3076291B2 (ja) | 研磨装置 | |
| US6764392B2 (en) | Wafer polishing method and wafer polishing device | |
| CN114260820A (zh) | 一种抛光头和抛光设备 | |
| KR20010078222A (ko) | 연마 장치의 연마 헤드 구조 | |
| CN114310627A (zh) | 一种用于对硅片进行抛光的抛光垫和抛光设备 | |
| CN217750990U (zh) | 一种转矩砂碟托盘的扩展缓冲盘 | |
| JP2000158312A (ja) | ブラウン管用パネルのフェース面研磨装置 | |
| TWI847229B (zh) | 拋光設備和拋光方法 | |
| JP2000158312A5 (enExample) | ||
| US6435955B2 (en) | Abrasive machine | |
| JP2005224892A (ja) | 研磨方法 | |
| JPH0236066A (ja) | 研磨布および研磨装置 | |
| US6582288B2 (en) | Diaphragm for chemical mechanical polisher | |
| JP2000061794A (ja) | ブラウン管用パネルの研磨装置 | |
| WO2000024548A1 (en) | Polishing apparatus and a semiconductor manufacturing method using the same | |
| JPH09246218A (ja) | 研磨方法および装置 | |
| JP2003165048A (ja) | 研磨具の整形方法および研磨装置 | |
| JPH10296627A (ja) | 研磨装置及び方法 | |
| JP2003158104A (ja) | 研磨装置 | |
| JP2001053037A (ja) | 半導体ウエハの平坦化装置 | |
| JP3317910B2 (ja) | 研削盤における研削装置 | |
| JPH01268032A (ja) | ウエハ研磨方法および装置 | |
| KR102435926B1 (ko) | 웨이퍼의 연마 장치 및 방법 | |
| JP2005033139A (ja) | 半導体ウェーハ研磨用のウェーハ保持板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Effective date: 20050204 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050204 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20060608 |