JP2000150090A - Socket for electric component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket with its contact pin prevented from deformation even in the case an external force is applied to the contact pin from the outside. SOLUTION: An IC socket 11 for electric component is composed of a socket body 13 to admit placing thereon of an IC package 12 as electric component and a plurality of contact pins 14 mounted on the socket body 13 and having movable side contacting part 14f capable of separating from and contacting with the leads 12b of the IC package 12. A projection 13g as a restriction part to restrict an inward movement of the socket body 13 of each movable side contacting part 14f is provided on the seating surface 13f of the socket body 13 whereto the part 14f abuts in the condition that IC package 12 is not placed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for an electric component for detachably holding an electric component such as a semiconductor device (hereinafter referred to as an "IC package"), and more particularly, to a contact pin electrically connected to the electric component. The present invention relates to an electrical component socket improved to prevent deformation due to external force.

[0002]

2. Description of the Related Art Conventionally, as this type of "electric component socket", there is an IC socket for detachably holding an IC package as an "electric component".

This IC package includes a so-called gull wing type, which is formed by projecting a plurality of IC leads as terminals from a substantially rectangular parallelepiped package body toward the side in a crank shape. Have been.

On the other hand, an IC socket has a socket body,
A mounting portion for mounting the IC package is formed,
A plurality of elastically deformable contact pins which are separated from and connected to the IC leads of the IC package are provided.

[0005] These contact pins have a movable contact piece that can be elastically deformed, and the movable contact portion of the movable contact piece is separated from and connected to the upper surface of the IC lead.

Further, an upper operation member is disposed on the socket main body so as to be vertically movable, and the upper operation member is lowered against the urging force of the movable contact piece of the contact pin to thereby lower the upper operation member. The operation piece of the movable contact piece of the contact pin is pressed outward by the cam portion. As a result, the spring portion of the contact pin is elastically deformed, the movable contact portion is separated from the IC lead, and the upper operating member is raised. And the movable contact portion comes into contact with the upper surface of the IC lead and presses it from above, and the contact pin and the IC lead are electrically connected.

In this state, the IC package is put in, for example, a thermostat, and the quality of the IC package is inspected by applying the same voltage as in an actual use state.

[0008]

However, in such a conventional device, since the contact pins are exposed from between the socket body and the upper operation member, an IC is not provided.
An external force may act on the contact pin from the outside of the socket. In such a case, the contact pin may be deformed inward to cause poor contact with the IC lead, or the cam of the upper operation member may be moved to the tip of the operation piece. When the upper operation member is lowered in this state, the contact pins may be damaged.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a socket for an electric component which prevents deformation of a contact pin even when an external force acts on the contact pin from the outside.

[0010]

In order to achieve the above object, according to the first aspect of the present invention, a socket body on which an electric component is mounted and a terminal of the electric component attached to the socket body are provided. In a socket for an electric component including a plurality of contact pins having a movable contact portion that can be separated and connected, in a state where the electric component is not placed, the movable contact portion abuts on a seating surface of the socket body with which the movable contact portion abuts. An electrical component socket provided with a restricting portion for restricting movement of the movable contact portion to the inside of the socket body.

According to a second aspect of the present invention, in addition to the configuration of the first aspect, the restricting portion is a restricting convex portion to which the movable contact portion is locked.

According to a third aspect of the present invention, in addition to the configuration of the first aspect, the limiting portion is a limiting recess into which the movable contact portion is fitted.

According to a fourth aspect of the present invention, in addition to the configuration of the third aspect, the restricting concave portion is fitted at a position where the movable-side contact portion is slightly moved toward the inside of the socket body. It is characterized by being formed in.

According to a fifth aspect of the present invention, in addition to the configuration of the first aspect, the restriction portion is formed by inclining the seating surface.

According to a sixth aspect of the present invention, there is provided a socket body on which an electric component is mounted, and a plurality of contact pins having a movable contact portion attached to the socket body and detachable from a terminal of the electric component. An electrical component socket comprising: a contact portion provided with a limiting portion for limiting movement of the movable side contact portion to the inside of the socket body in a state where the electrical component is not placed, for an electrical component. It is a socket.

According to a seventh aspect of the present invention, in addition to the configuration of the sixth aspect, the contact pin includes a fixed contact piece having a fixed side contact portion on which a terminal of the electric component is placed, and A movable contact piece having a movable contact portion abutting on the upper surface of the terminal of the component, wherein the limiting portion is a convex portion or a concave portion formed on the fixed contact portion.

[0017]

Embodiments of the present invention will be described below.

[First Embodiment of the Invention] FIGS. 1 to 5 show a first embodiment of the present invention.

First, the structure will be described.
An IC socket as an “electric component socket”. The IC socket 11 is used for performing a performance test of the IC package 12 as an “electric component”.
The purpose of this is to electrically connect the IC lead 12b as the "terminal" 2 and a printed wiring board (not shown) of a measuring instrument (tester).

This IC package 12 is shown in FIGS.
As shown in FIG. 2, a so-called gull wing type is used.
Many IC leads 12b protrude in a crank shape from the side toward the side.

On the other hand, the IC socket 11 has a socket body 13 mounted on a printed wiring board. The socket body 13 is formed with a mounting portion 13a on which the IC package 12 is mounted. With IC package 1
Guide portions 13b for positioning the 2 at a predetermined position are provided corresponding to each corner of the package body 12a. A partition 13c is formed between the guides 13b on two opposing sides around the mounting portion 13a.
A large number of slits 13d are formed at predetermined intervals in 3c.

The socket body 13 is provided with a plurality of elastically deformable contact pins 14 which are separated from and connected to the IC leads 12b.
A quadrangular frame-shaped upper operation member 15 for elastically deforming 4 is disposed movably in a direction in which the upper operation member 15 comes into contact with and separates from the socket body 13, that is, in a vertical direction.

The contact pins 14 are formed of a material having spring properties and excellent conductivity, and
Is press-fitted and disposed at a position outside the mounting portion 13a.

More specifically, these contact pins 14
A fixing portion 14 fixed to the socket body 13 on the lower side
The fixing portion 14a is press-fitted and fixed to the through hole 13e of the socket body 13. A movable contact piece 14b is provided to project upward from the fixed portion 14a.

A spring portion 14c which is curved in an arc shape is formed on the movable contact piece 14b, and a horizontal portion 14d extending substantially horizontally toward the center of the socket body 13 is formed above the spring portion 14c. An inclined portion 14e extending obliquely upward from the horizontal portion 14d is formed.
A movable side contact portion 14f extends from the upper end of e toward the center of the socket body 13. This movable side contact portion 1
4f contacts the upper surface of the IC lead 12b and presses it downward.

An operation piece 14g pressed by an upper operation member 15, which will be described in detail later, branches off from the horizontal portion 14d and extends upward from the contact pin 14. Further, a lead portion 14h connected to a printed wiring board (not shown) is formed below the fixing portion 14a, and protrudes downward from the socket body 13.

In the state where the IC package 12 is not mounted, the movable contact portion 14f is brought into contact with the seating surface 13f of the mounting portion 13a of the socket body 13. It has become.

Then, as shown in FIG.
f, a restricting protrusion 13 serving as a "restrictor" that restricts the movement of the movable contact portion 14f to the inside of the socket body 13 when the IC package 12 is not mounted.
g is formed. The restricting convex portion 13g is a portion where a large number of contact pins 14 are arranged, and is provided continuously between mold guides 13i formed adjacent to the respective guide portions 13b.

As shown in FIG. 1, the IC package 1
A small gap c is set between the movable contact portion 14f that is in contact with the seating surface 13f in a state where the second contact member 2 is not mounted and the restricting convex portion 13g, and the movable contact portion 14f is slightly socketed. In a state of being displaced inward of the main body 13, it is locked to the restricting convex portion 13 g to restrict further inward movement.

The upper operating member 15 has a rectangular frame shape corresponding to the shape of the IC package 12.
The IC package 12 has an opening 15a large enough to allow the C package 12 to be inserted therein. The IC package 12 is inserted through the opening 15a and is placed above the placement portion 13a of the socket body 13. . As shown in FIGS. 1 and 4, the upper operation member 15 is disposed so as to be vertically movable in a direction in which the upper operation member 15 comes into contact with and separates from the socket body 13.
4 and the coil spring 16, and at the highest position, the locking claw 15 b is
The upper operation member 15 is prevented from coming off.

Further, a cam portion 15c is formed on the outer surface of the upper operation member 15 so as to be in sliding contact with the operation piece 14g of the contact pin 14. By lowering the upper operation member 15, the contact pin 14 Operation piece 1
4g is pressed by the cam portion 15c, the spring portion 14c is elastically deformed, and the movable contact portion 14f is
However, it is displaced obliquely outward.

Next, a method of using the IC socket 11 having such a configuration will be described.

First, a plurality of IC sockets 11 are arranged on the printed wiring board by inserting the lead portions 14h of the contact pins 14 of the IC socket 11 into the insertion holes of the printed wiring board and soldering.

At the time of disposing the IC socket 11, for example,
As shown in FIG. 1, when the upper operation member 15 is at the highest position, the contact pins 1
In some cases, an external force P acts on the fourth movable contact piece 14b.

However, since the movable side contact portion 14f of the movable contact piece 14b is locked to the restricting convex portion 13g of the socket body 13, the movement inside the socket body 13 is restricted.

With such a simple structure in which only the limiting protrusion 13g is formed, deformation of the movable contact piece 14b is prevented, and poor contact between the movable contact portion 14f and the IC lead 12b is prevented. .

Then, the IC package 12 is set in the IC socket 11 by, for example, an automatic machine as follows, and is electrically connected.

That is, while the IC package 12 is held by the automatic machine, the upper operating member 15 is pressed downward against the urging force of the contact pin 14 and the coil spring 16 to be lowered. Then, this upper operation member 1
5, the contact pin operation piece 14g is formed by the cam portion 15c.
Is pressed, the spring portion 14c is elastically deformed, and the movable-side contact portion 14f is displaced obliquely upward and is opened to the maximum.
It is retracted from the C package 12 insertion area (see the two-dot chain line in FIG. 1).

In this state, the IC package 12 is released from the automatic machine, and the mounting portion 13a of the socket body 13 is released.
Place on top. At this time, the package main body 12a is guided to a predetermined position by the guide portion 13b of the socket main body 13, and the crank-shaped IC lead 12b rides over the restricting convex portion 13g and the mold guide 13i to the seating surface 13f. You will be seated.

Next, when the pressing force of the upper operating member 15 by the automatic machine is released, the upper operating member 15 is raised by the elastic force of the contact pin 14 and the coil spring 16 and the like, and the elastic force of the spring portion 14c causes the contact pin to rise. The fourteen movable contact pieces 14b begin to return. Then, when the upper operation member 15 is raised to the predetermined position, the movable contact portion 14f of the contact pin 14 is moved to the position I.
The upper surface of the predetermined IC lead 12b of the C package 12 is in contact with and electrically connected to the upper surface.

[Second Embodiment of the Invention] FIG. 6 shows a second embodiment of the present invention.

In the second embodiment, a restricting convex portion 13g as a "restricting portion" is formed at a position outside the mold guide 13i, and when the IC package 12 is not placed on the restricting convex portion 13g. The movement of the movable side contact portion 14f of the contact pin 14 into the socket body 13 is restricted. Therefore, contact pin 14
Of the movable contact piece 14b can be prevented.

Other configurations and operations are the same as those of the first embodiment, and therefore the description is omitted.

[Third Embodiment of the Invention] FIG. 7 shows a third embodiment of the present invention.

In the third embodiment, the IC package 12
The seating surface 1 of the socket body 13 with which the movable side contact portion 14f of the contact pin 14 abuts in a state where the
3f, the "restriction part" to which the movable contact part 14f fits
Is formed.

In the state where the IC package 12 is not mounted, the movable contact portion 1 of the contact pin 14
4f is the limiting recess 1 of the seating surface 13f of the socket body 13.
3j, deformation of the movable contact piece 14b of the contact pin 14 can be prevented even when an external force P acts from outside the IC socket 11.

Other configurations and operations are the same as those of the first embodiment, and therefore the description is omitted.

[Fourth Embodiment of the Invention] FIG. 8 shows a fourth embodiment of the present invention.

Embodiment 4 of the present invention is directed to
Although k is formed, the formation position of the restriction recess 13k is different from that of the second embodiment.

That is, in the state where the external force P is not acting on the movable contact portion 14f, the movable contact portion 14f is not fitted into the limiting recess 13k as shown in FIG. The position of the restricting recess 13k is set so that it fits into the restricting recess 13k when it moves a small amount toward the inside of the main body 13.

Even in this case, when the external force P acts on the contact pin 14, the movable contact piece 1 of the contact pin 14
4b is slightly deformed, and when the movable contact portion 14f moves a small amount toward the inside of the socket body 13, the movable contact portion 14f fits into the restriction recess 13k. Thereby, the deformation of the movable contact piece 14b is prevented.

Of course, a very small amount of the small
4f is set to such a length that it will not be deformed by only a small movement.

Other configurations and operations are the same as those of the first embodiment, and therefore the description is omitted.

[Fifth Embodiment] FIGS. 9 and 10 show a fifth embodiment of the present invention.

In the fifth embodiment of the present invention, the IC lead 12b of the IC package 12 is inclined at an angle θ, and the seating surface 13f of the socket body 13 is also inclined at this angle.

As described above, by tilting the seating surface 13f with which the movable contact portion 14f of the contact pin 14 contacts, a "restriction portion" for restricting the movement of the movable contact portion 14f to the inside of the socket body 13 is provided. It is configured.

In this way, when the IC package 12 is not placed on the socket body 13, the movable contact portion 14f is in contact with the inclined seating surface 13f,
In this state, even when an external force P acts on the movable contact piece 14b of the contact pin 14 from outside, the inclined seating surface 13
The movement of the movable contact portion 14f to the inside of the socket body 13 is restricted by f, and the deformation of the movable contact piece 14b is prevented.

The IC lead 1 of the IC package 12
2b the seating surface 13 of the socket body 13 in accordance with the angle θ.
Since f is also inclined, deformation of the IC lead 12b can be prevented.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

[Sixth Embodiment of the Invention] FIG. 11 shows a sixth embodiment of the present invention.

According to the sixth embodiment of the present invention, the movable contact piece 14b of the contact pin 14 is provided with a restricting projection 14i as a "restricting portion".

The external force P is applied to the contact pin 14.
Is actuated, the restricting projection 14i is moved to the socket body 13
Of the movable side contact portion 14f to the inside of the socket body 13 is restricted, and deformation of the movable contact piece 14b is prevented.

Other structures and operations are the same as those of the first embodiment, and therefore, description thereof will be omitted.

[Seventh Embodiment of the Invention] FIG. 12 shows a seventh embodiment of the present invention.

The contact pin 14 according to Embodiment 7 of the present invention is of a two-point contact type, and is provided with a fixed contact piece 14k in addition to the movable contact piece 14b. The IC lead 12 of the IC package 12 is provided on the upper end of the fixed contact piece 14k.
A fixed side contact portion 14m on which b is placed is formed.
The fixed contact portion 14m and the movable contact portion 14f form I
The C lead 12b is held from above and below.

The upper surface of the fixed-side contact portion 14m is a seating surface 14p on which the IC lead 12b is seated. The movable-side contact portion 14p does not have the IC package 12 mounted thereon. The portion 14f abuts, and a restricting convex portion 14q as a "restricting portion" is formed on the seating surface 14p.

In such a case, when the IC package 12 is not mounted, the movable contact portion 14
f is in contact with the seating surface 14p of the fixed-side contact portion 14m, and when an external force P acts on the movable contact piece 14b from this state, the movable-side contact portion 14f becomes
Lock at 4q. Thereby, the deformation of the movable contact piece 14b is prevented. Instead of the limiting protrusion 14q, a limiting recess may be formed.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

In each of the above embodiments, the present invention is applied to the IC socket 11 as the “socket for electric parts”. However, the present invention is not limited to this and can be applied to other devices. Further, the present invention is applied to an IC socket for mounting an IC package in which an IC socket is provided so as to protrude from two opposite sides of an IC package body.
However, the present invention is not limited to this.
Of course, the present invention can be applied to an IC socket on which a so-called QFP type IC package in which leads are protruded is placed. Further, the shape of the IC lead 12b (terminal) is not limited to the so-called gull-wing type, but may be applied to a straight type or the like.

[0070]

As described above, according to the first to third aspects of the present invention, when the electric component is not mounted, the movable side contact portion is brought into contact with the movable side contact portion. Since the restricting portion that restricts the movement of the contact portion to the inside of the socket body is provided, even when an external force acts on the contact pin from the outside, deformation of the contact pin can be prevented, and poor contact can be prevented.

According to the fourth aspect of the present invention, in addition to the above-described effects, the restriction recess is formed at a position where the movable contact portion is fitted when the movable contact portion is slightly moved toward the inside of the socket body. Does not act, the movable contact part is
Since the terminal is in contact with the seating surface on which the terminal is seated, the amount of displacement that displaces the movable contact portion when the terminal is placed on the seating surface can be reduced as compared with the terminal fitted on the recessed surface.

According to the fifth aspect of the present invention, the first aspect is provided.
In addition to the effect of the above, since the limiting portion is formed by tilting the seating surface, when the terminal of the electric component is tilted, by adjusting the tilting angle of the seating surface to the tilting angle of this terminal. , The deformation of the terminal can be prevented.

According to the sixth aspect of the present invention, since the contact pin is provided with the restricting portion for restricting the movement of the movable contact portion to the inside of the socket body in a state where the electric component is not mounted, Even when an external force acts on the contact pin from the outside, the deformation of the contact pin can be prevented, and poor contact can be prevented.

According to the seventh aspect of the present invention, the contact pin includes a fixed contact piece having a fixed side contact portion on which the terminal of the electric component is placed, and a movable side contacting the terminal of the electric component. A movable contact piece having a contact portion, and the limiting portion is formed as a convex portion or a concave portion formed on the fixed contact portion, thereby preventing the contact pin from being deformed even when an external force acts on the contact pin from the outside. This has the practically useful effect of preventing poor contact.

[Brief description of the drawings]

FIG. 1 is a front view in which a half of an upper operating member of an IC socket according to Embodiment 1 of the present invention at a highest position is sectioned.

FIG. 2 is an enlarged view of a portion X in FIG. 1 according to the first embodiment.

FIG. 3 is a plan view of the IC socket according to the first embodiment.

FIG. 4 is a right side view in which a part of FIG. 3 according to the first embodiment is sectioned.

5A and 5B are diagrams showing an IC package according to the first embodiment, wherein FIG. 5A is a plan view of the IC package, and FIG.
It is a front view of C package.

FIG. 6 is an enlarged view corresponding to FIG. 2 according to Embodiment 2 of the present invention.

FIG. 7 is an enlarged view corresponding to FIG. 2 according to Embodiment 3 of the present invention.

FIG. 8 is an enlarged view corresponding to FIG. 2 according to Embodiment 4 of the present invention.

FIG. 9 is an enlarged view corresponding to FIG. 2 according to Embodiment 5 of the present invention.

FIG. 10 is an enlarged view corresponding to FIG. 9 in a state where an IC package according to the fifth embodiment is mounted.

FIG. 11 is an enlarged view corresponding to FIG. 2 according to Embodiment 6 of the present invention.

FIG. 12 is an enlarged view corresponding to FIG. 2 according to a seventh embodiment of the present invention.

[Explanation of symbols]

 11 IC socket (Electrical component socket) 12 IC package (Electrical component) 12a Package body 12b IC lead (terminal) 13 Socket body 13a Placement section 13f Seating surface 13g Restricted convex part (restricted part) 13j, 13k Restricted concave part (restricted part) 14) Contact pin 14a Fixed part 14b Movable contact piece 14c Spring part 14f Movable contact part 14g Operation piece 14i Restricted protrusion (restricted part) 14k Fixed contact piece 14m Fixed side contact part 14p Seating surface 14q Restricted convex part (restricted part) ) 15 Upper operation member 15c Cam part P External force

Claims (7)

[Claims] 1. A socket body on which an electric component is placed,
An electrical component socket comprising: a plurality of contact pins having a movable contact portion attached to the socket body and detachable from a terminal of the electrical component, wherein the movable component is mounted in a state where the electrical component is not mounted. A socket for an electrical component, wherein a limiter is provided on a seating surface of the socket body with which a side contact portion abuts to limit movement of the movable side contact portion to the inside of the socket body. 2. The electrical component socket according to claim 1, wherein the restricting portion is a restricting convex portion to which the movable contact portion is locked. 3. The electrical component socket according to claim 1, wherein the limiting portion is a limiting recess into which the movable contact portion is fitted. 4. The electrical component socket according to claim 3, wherein the restricting recess is formed at a position where the movable contact portion is fitted when the movable contact portion moves a small amount toward the inside of the socket body. . 5. The electrical component socket according to claim 1, wherein the restricting portion is formed by inclining the seating surface. 6. A socket body on which an electric component is placed,
An electrical component socket comprising: a plurality of contact pins having a movable contact portion attached to the socket body and detachable from a terminal of the electrical component, wherein the movable component is mounted in a state where the electrical component is not mounted. An electrical component socket, wherein a limiting portion for limiting the movement of the side contact portion to the inside of the socket body is provided on the contact pin. 7. The contact pin has a fixed contact piece having a fixed contact portion on which a terminal of the electrical component is placed, and a movable contact having a movable contact portion that is in contact with an upper surface of the terminal of the electrical component. The electrical component socket according to claim 6, further comprising a piece, wherein the restricting portion is a convex portion or a concave portion formed on the fixed-side contact portion.