JP2000146241A - Method for straightening agv(automatic guided vehicle) and air flow - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent whirling of dust in a clean room. SOLUTION: A manufacturing facility 36 is installed in a laminar flow of clean air 25 in a clean room 20. Columnar posts 40 provided at edge sides of a ceiling of the facility 36 are rotated to forcibly feed the air 25 along a surface of the facility 36 to prevent a release of a boundary layer of the facility 36. A runner is moved in the room 20, the posts provided at rear end sides of the runner are rotated to forcibly feed the air moving along a surface of the runner rear of the runner to supplement its momentum, thereby preventing the release in the boundary layer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an AGV and an airflow rectifying method, and more particularly to an AGV and an airflow rectifying method capable of preventing laminar flow disturbance in a clean room.

[0002]

2. Description of the Related Art Conventionally, on a ceiling 1 side, a fan 3 capable of sending air toward a floor 2 and a filter 4 located in front of the fan 3 for collecting dust floating in the air are provided. At the same time, a grating is provided on the floor 2 side.
g) The structure of a clean room 5 having a structure is known. FIG. 7 shows a state diagram in which a semiconductor manufacturing apparatus is installed in a clean room 5 having a grating structure.

In a clean room 5 shown in FIG.
The clean air 6 sent from the ceiling 1 side is sent out to the floor 2 side, and the clean air 6 around the semiconductor manufacturing apparatus 7 is continuously taken in from the floor 2 side to maintain the indoor clean environment. I have.

In the above-described clean room 5, an AGV (Automatic-Guide-VEH) for supplying a semiconductor wafer 8 to the semiconductor manufacturing apparatus 7 is provided.
ICLE) 9 (see FIG. 8). The AG
V9 is capable of running along the guide tape stretched on the floor 2 and the guide tape is transferred to the semiconductor manufacturing device 7.
The AGV 9 can be moved between the devices by being put between them, and the semiconductor wafer 8 is delivered.

[0005]

However, in the semiconductor manufacturing apparatus 7 installed in the clean room 5, the clean air 6 blown out from the ceiling 1 faces the ceiling surface 7 of the semiconductor manufacturing apparatus 7.
When hitting U, the clean air 6 tries to flow around the side surface 7S of the semiconductor manufacturing apparatus 7, but at this time, the clean air 6 near the side surface 7S is separated, and a wake (a so-called speed region) occurs. There was a problem to do. That is, when the wake is generated near the side surface 7S, when the maintenance door 10 provided on the side surface 7S is opened, the dust 11 in the apparatus does not move below the floor surface 2 and is caused by the wake. There was a risk of flying up and scattering inside the clean room 5.

FIG. 8 is an explanatory diagram showing the flow of the airflow when the AGV is running. As shown in the figure, when the AGV 9 runs in the clean room 5, the clean air 6 flowing near the side surface 9 </ b> S of the AGV 9 is separated, and the wake occurs behind the rear end face 9 </ b> B and behind the semiconductor wafer 8. there were. That is, when a turbulent flow occurs behind the rear end face 9B or the like, the dust 11 accumulated on the floor surface 2 soars up and adheres to the semiconductor device 7 or the semiconductor wafer 8, and the yield of the semiconductor manufacturing process may be reduced. .

The present invention focuses on the above-mentioned conventional problems, and prevents the generation of clean air on the side surfaces of the manufacturing equipment and the AGV, thereby preventing the dust from rising.
And a method of rectifying the airflow.

[0008]

The AGV according to the present invention comprises:
It is composed of a traveling body capable of transporting articles, and a cylindrical body is provided on both sides of a rear end of the traveling body so as to be orthogonal to a traveling direction of the traveling body, and a rotation speed of the cylinder according to a traveling speed of the traveling body. Is provided so that the clean air moving along the surface of the traveling body by the rotation of the cylindrical body can be forcibly sent to the rear of the traveling body.

According to the method for rectifying airflow according to the present invention, a manufacturing facility is installed in a laminar flow of clean air in a clean room, and a cylindrical body provided on an edge of a ceiling surface of the manufacturing facility is rotated to produce the clean air. The method is characterized in that forcible feeding is performed along the surface of the manufacturing facility to prevent the separation in the boundary layer of the manufacturing facility.

Further, in the airflow rectifying method according to the present invention, the running body is moved in the clean room, and the blowing means provided on the rear end side of the running body is operated to move along the surface of the running body. It is characterized in that clean air is forcibly sent to the rear of the traveling body to prevent separation at the boundary layer of the traveling body. Preferably, the blowing means is a rotatable cylindrical body, and the clean air adhered to the cylindrical body due to viscosity is forcibly sent to the rear of the traveling body by rotation of the cylindrical body.

[0011]

According to the above-mentioned AGV, the momentum can be given (supplemented) to the clean air passing through the surface of the traveling body by operating the rotating means and rotating the cylindrical body. That is, the moving speed of the clean air is increased by the rotation of the cylindrical body due to the viscosity of the clean air itself, and the momentum can be supplemented to the clean air passing near the AGV.
Therefore, the separation of the clean air from the surface of the traveling body can be prevented, and the generation of the wake can be prevented. Therefore, it is possible to prevent the dust accumulated on the floor or the like from rising and scattering due to the generation of the wake.

According to the air flow rectification method described above, clean air hitting the ceiling surface of the manufacturing facility moves from the center of the ceiling surface to the edge of the ceiling surface. Here, by rotating the cylindrical body provided on the edge of the ceiling surface, the clean air adhered to the cylindrical body due to viscosity is sent to the side surface (front surface) of the manufacturing equipment with the rotation of the cylindrical body. In other words, the clean air that is going to flow to the side of the manufacturing facility is given kinetic energy by the rotation of the cylindrical body, and the momentum is replenished (since the flow velocity increases), the separation occurs on the side of the manufacturing facility. Can be prevented. For this reason, generation of a wake can be prevented, and a laminar flow of clean air is also formed near the side surface of the manufacturing facility. Therefore, when the side door of the manufacturing facility is opened and closed, dust scattered outside the manufacturing facility is drawn into the floor by the laminar flow of clean air and is collected, so that the side door of the manufacturing facility is opened and closed. However, it is possible to prevent dust from being scattered in the clean room.

[0013] When the columnar body provided at the rear end side of the running body running in the clean room is rotated, kinetic energy is given to the clean air passing near the surface of the running body due to the viscosity of the clean air itself, and the momentum is reduced. Since replenishment is performed (the flow velocity is increased), it is possible to prevent separation from occurring on the surface of the traveling body. For this reason, generation of a wake can be prevented, and the laminar flow of clean air can be prevented from being disturbed even when the traveling body is driven. Therefore, even if the traveling body is moved in the clean room, since the wake does not occur, it is possible to prevent dust accumulated on the floor from flying up and scattering.

Further, when the blowing means provided on the rear end side of the running body running in the clean room is operated, the clean air injected from the blowing means and the clean air passing near the surface of the running body are mixed. The kinetic energy is given to the clean air passing near the surface of the traveling body, and the momentum is replenished. For this reason, generation of a wake can be prevented, and dust accumulated on the floor surface can be prevented from flying up and scattering.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention for an AGV and an airflow rectification method according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an explanatory diagram illustrating a manufacturing facility installed in a clean room and a state of an airflow around the manufacturing facility. As shown in the figure, in a clean room 20 applied to the present embodiment, a cleaning device 24 for performing an air cleaning action is provided at a predetermined interval on a ceiling surface 22.

The cleaning device 24 is attached to an air outlet 26 provided on the ceiling surface 22, and an air supply fan 28 for supplying air into the clean room 20 from the air outlet 26,
An air filter 30 is attached to the front of the blower of the air supply fan 28 and collects dust.

The floor of the clean room 20 has a double floor, and the floor 32 on which the manufacturing apparatus and the like are installed has a grating structure. A suction duct (not shown) is arranged below the floor surface 32, that is, in the underfloor pit 34, and the clean air 25 blown out from the cleaning device 24 provided on the ceiling surface 22 is supplied to the floor surface 32.
And is sucked into the suction duct provided in the underfloor pit 34. For this reason, in the clean room 20, the clean air 25 always moves from the ceiling surface 22 toward the floor surface 32, and dust and the like floating in the clean room 20 are removed from the floor surface 32.
Then, the air is discharged to the outside of the clean room 20 through the suction duct.

In the clean room 20, for example, a manufacturing facility 36 for manufacturing semiconductors is installed. A maintenance door 38 is provided on a side wall 36S of the manufacturing facility 36, and the maintenance facility 38 can be opened and closed to perform maintenance and the like of the manufacturing facility 36.

Outside the edge 42 of the ceiling surface 36U of the manufacturing facility 36, a columnar body 40 is provided along the longitudinal direction of the edge 42. The length of the cylindrical body 40 is set to be substantially equal to the length of the edge 42.
The both ends are supported by a stay 44 extended from the drive motor, and a drive motor serving as a rotating means (not shown) is directly connected. By operating the drive motor, the cylindrical body 40 can be arbitrarily moved in the direction of the arrow 46. It is possible to rotate at the speed of. In the present embodiment, the rotation speed of the cylindrical body 40 is set such that its peripheral speed is about 2 to 3 times the moving speed of the clean air 25, and the clean air 2 flowing near the cylindrical body 40 is rotated.
5 is supplemented with exercise.

A method of rectifying the clean air 25 using the manufacturing facility 36 configured as described above will be described. The air supply fan 28 is rotated in the cleaning device 24 installed above the manufacturing equipment 36 described above, and the clean air 25 is blown out from the air outlet 26. In this way, the clean air 2
5, the clean air 25 is supplied to the cleaning equipment 36.
The clean air 25 tends to move along the side surface 36S from the ceiling surface 36U because the path is blocked by the ceiling surface 36U. In this state, the driving motor directly connected to the cylindrical body 40 is operated, and the cylindrical body 40 is rotated in the direction of the arrow 46. When the cylinder 40 is rotated in this manner, the moving speed of the clean air 25 in contact with the cylinder 40 increases with the rotation of the cylinder 40 due to the viscosity of the clean air itself. That is, when the clean air 25 comes into contact with the rotating cylindrical body 40, kinetic energy is given to the clean air 25, and the momentum increases. By the increase in the momentum, the separation phenomenon can be prevented from occurring in the clean air 25 adjacent to the side surface 36S (the generation of the wake can be prevented), and the laminar flow of the clean air 25 in the region adjacent to the side surface 36S. Can be formed. For this reason, manufacturing equipment 3
6, a maintenance door 38 provided on the side surface 36S.
And even if dust jumps out of the manufacturing facility 36 to the outside of the facility, since the laminar flow of the clean air 25 is formed up to the vicinity of the side surface 36S in the manufacturing facility 36,
The dust moves toward the floor surface 32 by the clean air 25 and is collected. Therefore, it is possible to prevent dust from scattering into the clean room 20.

FIG. 2 shows an AG installed in a clean room.
It is an outline view showing the structure of V. As shown in FIG.
(AUTOMATIC-GUIDED-VEHICL
E) 48 mainly includes an oval-shaped carriage unit 50 and a wafer transfer unit 52 installed on the upper surface of the carriage unit 50. The carriage unit 50 includes a sensor (not shown). To detect the identification tape 53 affixed to the floor 32 of the clean room 20.
3 allows the carriage unit 50 to run on its own. Note that the identification tape 53 may be one having a different color tone from the floor surface 32 or a magnetic tape, and the sensor may be any as long as it can detect the identification tape 53. Also, in the figure, the wheels of the bogie unit 50 run on the identification tape 53, but a sensor is arranged between the wheels,
The carriage unit 50 may be caused to travel along one identification tape 53. The AGV according to the present embodiment
The self-running speed of 48 is set to about 0.5 to 1.0 m / S. On the other hand, the wafer transfer unit 52 is capable of holding the semiconductor wafer 54 in the course of manufacturing on the upper surface of the carriage unit 50, and is capable of transferring the semiconductor wafer between manufacturing facilities for manufacturing semiconductors.

In such an AGV 48, the bogie unit 5
At approximately four corners of 0, a columnar body 56 whose axis is aligned in the height direction of the bogie unit 50 is provided. The cylindrical body 56 is supported at both ends by stays 58 pulled out from the upper and lower end surfaces of the bogie unit 50. The cylindrical body 56 is directly connected to a driving motor (not shown), and is operated by operating the driving motor. The body 56 can be rotated at an arbitrary speed in the direction of arrow 60. In the present embodiment, assuming that the moving speed of the AGV 48 traveling in the clean room 20 is V, the rotation speed (linear speed) of the cylindrical body 56 is the AGV.
The moving speed V is set to about 2 to 3 times the moving speed V of the AGV 48.
The momentum can be replenished to the clean air 25 near the cylindrical body 56 that moves in the direction from the front end to the rear end.

A case where the AGV 48 thus configured is moved in the clean room 20 will be described. FIG. 3 shows an AGV 48 running in the clean room 20 and the AGV 4 concerned.
FIG. 8 is an explanatory diagram showing a state of airflow around 8 (provided that the viewpoint moves together with the AGV 48). While rotating the cylinder 56 in the direction of the arrow 60 as shown in FIG.
48 in the clean room 20, the AGV4
8 and the clean air 25 produce a relative velocity,
The V48 pushes through the clean air 25 and proceeds. And A
The clean air 25 on the front surface of the GV 48 is divided right and left at the tip of the AGV 48 and moves to the side surface 48S. However, when it reaches the rear end, it becomes an airflow with inertia and tends to flow as it is. For this reason, a portion with insufficient momentum appears on the back surface of the AGV 48. However, side 48S
A cylindrical body 56 exists on the rear end side of the cylindrical body 5.
6 rotates in the direction of the arrow 60, and when the clean air 25 with reduced momentum touches the cylindrical body 56, kinetic energy is given to the clean air 25 due to the viscosity of the clean air 25, and the momentum is increased. Increase. Then, due to the increase in the momentum, the clean air 25 close to the side surface 48S is formed.
The occurrence of a separation phenomenon can be prevented (the generation of a wake) can be prevented, so that the generation of a wake behind the bogie unit 50 can be prevented. In addition, since the bogie section 50 is formed in an oval shape, the clean air 25 goes around to the rear end, and it is needless to say that the generation of the wake is suppressed.
For this reason, even if the AGV 48 runs in the clean room 20, it is possible to prevent soaring dust accumulated on the floor surface 32 due to generation of a wake. When the AGV 48 is moved backward (in the drawing, in the reverse direction of the traveling direction), the AGV 48
Needless to say, it is sufficient to rotate the columnar body 56 provided on the front end side in the direction opposite to the arrow 60. The rotational speed of the cylinder 56, that is, the momentum given to the clean air 25 is A
Since the speed differs depending on the traveling speed of the GV 48, the optimum rotation speed of the cylindrical body 56 may be set at the site each time.

FIG. 4 shows another embodiment of the AGV 48 shown in FIG. As shown in these figures, a blowing means 62 for blowing out the clean air 25 instead of the cylindrical body 56 may be provided. That is, if the blowing means 62 is provided, the clean air 25 can be blown out near the side surface 48S, so that momentum can be given to the clean air 25 near the side surface 48S. It is possible to prevent a wake behind the 50. Since the strength of the clean air 25 blown out from the blowing means 62 varies depending on the traveling speed of the AGV 48, an optimum blowout amount may be set at the site each time.

FIG. 5 shows the blowing means 62 of the AGV 48.
FIG. 3 is an explanatory view showing the structure of FIG. As shown in the figure, the blowing means 62 is provided with a suction duct 62 provided on the bottom of the AGV 48.
A has a path extending from A to an outlet 62B capable of blowing out the clean air 25. In the middle of the path, a fan 62C for sucking and blowing out the clean air 25, and a HEPA disposed in front of the fan 62C. A filter 62D is provided. Then, the fan 62C is operated, and the suction duct 62A is operated.
Air from the HEPA filter 62D
To remove dust. By blowing out the clean air 25 from which dust has been removed from the outlet 62B, it is possible to give momentum to the clean air 25 near the side surface 48S.

Further, in the present embodiment, the generation of the wake behind the carriage unit 50 is prevented, but it goes without saying that the generation of the wake behind the semiconductor wafer 54 is also desired to be prevented. FIG. 6 shows an application example of the AGV 48 shown in FIG. As shown in the figure, if the overall height before and after the carriage unit 50 is increased so that the wafer transfer unit 52 is accommodated inside the carriage unit 50, the wafer transfer unit 52 and the semiconductor wafer 5
4 can be prevented from occurring behind the wake.
In the case of this application example, a slide door 64 may be attached above the side surface 48S to surround the semiconductor wafer 54 and prevent the clean air 25 from getting into the wafer transfer section 52.

[0027]

As described above, according to the present invention, the present invention comprises a traveling body capable of carrying articles, and is provided with a columnar body at both rear ends of the traveling body so as to be orthogonal to the traveling direction of the traveling body. Rotating means for adjusting the rotation speed of the columnar body in accordance with the traveling speed of the traveling body, and the clean air moving along the surface of the traveling body due to the rotation of the columnar body is provided behind the traveling body. Since it is possible to forcibly send the air to the vehicle, it is possible to prevent the clean air from peeling off on the side surface of the traveling body, and to prevent dust from rising. Therefore, the yield of the semiconductor manufacturing process can be improved.

In addition, a manufacturing facility is installed in a laminar flow of clean air in a clean room, and a column provided on a periphery of a ceiling surface of the manufacturing facility is rotated to force the clean air along the surface of the manufacturing facility. To prevent the occurrence of peeling in the boundary layer of the manufacturing equipment,
It is possible to prevent the clean air from peeling off on the side of the manufacturing equipment, and to prevent dust from rising. Therefore, the yield of the semiconductor manufacturing process can be improved.

Further, the traveling body is moved in the clean room, and the cylinder provided at the rear end side of the traveling body is rotated to force the clean air moving along the surface of the traveling body to the rear of the traveling body. To replenish the momentum and prevent the occurrence of separation in the boundary layer,
Prevent separation of clean air from occurring on the side of the vehicle,
It is possible to prevent dust from rising. Therefore, the yield of the semiconductor manufacturing process can be improved.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a manufacturing facility installed in a clean room and the state of airflow around the manufacturing facility.

FIG. 2 is an external view showing a structure of an AGV installed in a clean room.

FIG. 3 is an explanatory diagram illustrating an AGV running in a clean room 20 and a state of airflow around the AGV.

FIG. 4 shows another embodiment of the AGV 48 shown in FIG.

FIG. 5 is an explanatory diagram showing a structure of a blowing means 62 in the AGV 48.

FIG. 6 shows an application example of the AGV 48 shown in FIG.

FIG. 7 is a clean room 5 having a grating structure.
1 shows a state diagram in which a semiconductor manufacturing apparatus is installed.

FIG. 8 is an explanatory diagram showing the flow of airflow when the AGV is traveling.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ceiling 2 Floor surface 3 Fan 4 Filter 5 Clean room 6 Clean air 6 Semiconductor manufacturing equipment 8 Semiconductor wafer 9 AGV 10 Maintenance door 11 Dust 20 Clean room 22 Ceiling surface 24 Cleaning device 25 Clean air 26 Air outlet 28 Air supply fan 30 Air filter 32 Floor surface 34 Underfloor pit 36 Cleaning device 38 Maintenance door 40 Cylindrical body 42 Edge 44 Stay 46 Arrow 48 AGV 50 Bogie section 52 Wafer carrying section 53 Identification tape 54 Semiconductor wafer 56 Cylindrical body 58 Stay 60 Arrow 62 Blowing means 64 Slide door

Claims (4)

[Claims] 1. A traveling body capable of carrying articles,
Along with providing a cylindrical body on both sides of the rear end of the running body so as to be orthogonal to the traveling direction of the running body, a rotating unit is provided which can adjust the rotation speed of the cylindrical body according to the running speed of the running body, An AGV characterized in that clean air moving along the surface of the traveling body by rotation of the columnar body can be forcibly sent to the rear of the traveling body. 2. A manufacturing facility is installed in a laminar flow of clean air in a clean room, and a cylindrical body provided on an edge of a ceiling surface of the manufacturing facility is rotated to force the clean air along a surface of the manufacturing facility. A method of rectifying airflow, characterized in that momentum is replenished by selective delivery to prevent separation in the boundary layer. 3. A traveling body is moved in a clean room, and a cylindrical body provided on a rear end side of the traveling body is rotated to move clean air moving along a surface of the traveling body to a rear side of the traveling body. A method of rectifying airflow, characterized by replenishing momentum by forcibly sending out air, thereby preventing separation in a boundary layer. 4. The method according to claim 1, wherein the cylindrical body is changed to a blowing unit, and by operating the blowing unit, clean air moving along the surface of the traveling body is forcibly sent to the rear of the traveling body. 4. The method for rectifying airflow according to claim 3, wherein separation is prevented from occurring in the boundary layer.